JPH08329807A - Molded mold temperature switch - Google Patents
Molded mold temperature switchInfo
- Publication number
- JPH08329807A JPH08329807A JP15693995A JP15693995A JPH08329807A JP H08329807 A JPH08329807 A JP H08329807A JP 15693995 A JP15693995 A JP 15693995A JP 15693995 A JP15693995 A JP 15693995A JP H08329807 A JPH08329807 A JP H08329807A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- temperature switch
- lead frame
- mold type
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/58—Thermally-sensitive members actuated due to thermally controlled change of magnetic permeability
- H01H37/585—Thermally-sensitive members actuated due to thermally controlled change of magnetic permeability the switch being of the reed switch type
Landscapes
- Manufacture Of Switches (AREA)
- Thermally Actuated Switches (AREA)
Abstract
(57)【要約】
【目的】 温度スイッチ素子と取付面との樹脂厚にばら
つきが生ぜず、絶縁特性が劣化しない、その上外観不良
が発生しない高品質の封止成形型温度スイッチを提供す
ること。
【構成】 環状の感温磁性体の両側に、磁気ギャップス
ペーサ3a,3bを介して永久磁石1a,1bを設け
て、筒状体を形成し、この筒状体にリードスイッチ4を
挿入し、このリードスイッチのリード4a,4bをリー
ドフレーム5に接続した温度スイッチ素子を成形樹脂に
て封止成形し、前記リードフレーム5の信号引き出し用
リードを同一方向に導き出した封止成形型温度スイッチ
において、前記リードフレーム5の信号引き出し用リー
ドのある面と反対側の永久磁石1aの端面に、この永久
磁石1aの外径寸法よりも大きく、かつ成形樹脂と同一
材質のガイドスペーサ7を設ける。
(57) [Abstract] [Purpose] To provide a high-quality sealed mold type temperature switch in which the resin thickness between the temperature switch element and the mounting surface does not fluctuate, the insulation characteristics do not deteriorate, and in addition the appearance defect does not occur. thing. [Structure] Permanent magnets 1a and 1b are provided on both sides of an annular temperature-sensitive magnetic body via magnetic gap spacers 3a and 3b to form a tubular body, and a reed switch 4 is inserted into the tubular body. In a sealed mold type temperature switch in which the temperature switch element in which the leads 4a and 4b of the reed switch are connected to the lead frame 5 is sealed and molded with molding resin and the signal lead-out lead of the lead frame 5 is led out in the same direction. On the end surface of the permanent magnet 1a on the side opposite to the surface of the lead frame 5 on which the lead for signal extraction is provided, a guide spacer 7 having a larger outer diameter than the permanent magnet 1a and made of the same material as the molding resin is provided.
Description
【0001】[0001]
【産業上の利用分野】本発明は、家電機器・産業機器等
の過熱監視等に用いられる封止成形型温度スイッチに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealed mold type temperature switch used for monitoring overheating of home electric appliances and industrial equipment.
【0002】[0002]
【従来の技術】図3に従来の封止成形型温度スイッチの
斜視図、図4にそれに使用される温度スイッチ素子の斜
視図を示した。図4に示すように、従来の封止成形型温
度スイッチに使用される温度スイッチ素子は、永久磁石
1a、1b、感温磁性体2及び磁気ギャップスペーサ3
a、3bとをリードスイッチ4の外周部に配置し、リー
ドスイッチのリード4a、4bをリードフレーム5に接
合して構成されている。2. Description of the Related Art FIG. 3 shows a perspective view of a conventional sealed mold type temperature switch, and FIG. 4 shows a perspective view of a temperature switch element used therein. As shown in FIG. 4, the temperature switch element used in the conventional sealed mold type temperature switch includes permanent magnets 1 a and 1 b, a temperature-sensitive magnetic body 2, and a magnetic gap spacer 3.
a and 3b are arranged on the outer peripheral portion of the reed switch 4, and the leads 4a and 4b of the reed switch are joined to the lead frame 5.
【0003】また、図3に示すように、従来の封止成形
型温度スイッチは、このようなリードスイッチ素子を成
形樹脂6により封止成形して構成されている。Further, as shown in FIG. 3, a conventional sealed mold type temperature switch is formed by molding such a reed switch element with a molding resin 6.
【0004】[0004]
【発明が解決しようとする課題】しかし、この温度スイ
ッチ素子を封止成形する場合、成形金型にリードフレー
ム5により、片持ちで固定されているため金型内での温
度スイッチ素子の位置決めが難しく、封止成形した後、
永久磁石1a、1b、感温磁性体2及び磁気ギャップス
ペーサ3a、3bと取付面との間の樹脂の厚さにばらつ
きが生じ、絶縁特性の劣化及び外観不良が生じるという
問題があった。However, when the temperature switch element is sealed and molded, since the lead frame 5 is fixed to the molding die in a cantilever manner, the positioning of the temperature switching element in the die is possible. Difficult, after sealing molding,
There is a problem in that the thickness of the resin between the permanent magnets 1a and 1b, the temperature-sensitive magnetic body 2, the magnetic gap spacers 3a and 3b, and the mounting surface varies, which causes deterioration of insulation characteristics and poor appearance.
【0005】本発明は、これらの問題点を除去し、温度
スイッチ素子と取付面との樹脂厚にばらつきが生ぜず、
絶縁特性が劣化しない、その上、外観不良が発生しない
高品質の封止成形型温度スイッチを提供することを目的
とする。The present invention eliminates these problems and does not cause variations in the resin thickness between the temperature switch element and the mounting surface.
It is an object of the present invention to provide a high-quality sealed mold temperature switch in which the insulation characteristics are not deteriorated and the appearance is not defective.
【0006】[0006]
【課題を解決するための手段】上記課題を解決するため
に、本発明による封止成形型温度スイッチは、永久磁石
の端面、特に、温度スイッチ素子のリードフレーム引き
出し側とは逆側に、永久磁石の外径寸法よりも大きく、
かつ成形樹脂と同一材質のスペーサを設けている。In order to solve the above-mentioned problems, a sealed mold type temperature switch according to the present invention is provided with a permanent magnet on an end face of a permanent magnet, particularly on a side opposite to a lead frame lead-out side of a temperature switch element. Larger than the outer diameter of the magnet,
Moreover, a spacer made of the same material as the molding resin is provided.
【0007】即ち、本発明は、環状の感温磁性体の両側
に磁気ギャップスペーサを介して永久磁石を設けて、筒
状体を形成し、この筒状体にリードスイッチを挿入し、
このリードスイッチのリードをリードフレームの信号引
き出し用リードに接続し、前記リードフレームの信号引
き出し用リードを同一方向に導き出し、温度スイッチ素
子を絶縁性樹脂にて封止成形してなる封止成形型温度ス
イッチにおいて、前記温度スイッチ素子のリードフレー
ムの信号引き出し用リードのある側に対して反対側の永
久磁石の端面に、この永久磁石の外径寸法よりも大き
く、かつ、成形樹脂と同一材質のガイドスペーサを設け
たことを特徴とする封止成形型温度スイッチである。That is, according to the present invention, permanent magnets are provided on both sides of an annular temperature-sensitive magnetic body via magnetic gap spacers to form a tubular body, and a reed switch is inserted into the tubular body.
A sealing molding die in which the lead of the reed switch is connected to the lead for signal lead-out of the lead frame, the lead of signal lead-out of the lead frame is led out in the same direction, and the temperature switch element is sealed and molded with an insulating resin. In the temperature switch, on the end surface of the permanent magnet on the side opposite to the side on which the lead for signal extraction of the lead frame of the temperature switch element is present, the outer diameter of the permanent magnet is larger than that of the permanent magnet, and the same material as the molding resin is used. A sealed mold type temperature switch characterized in that a guide spacer is provided.
【0008】[0008]
【作用】温度スイッチ素子のリードフレーム引き出し側
とは逆側の永久磁石の端面に、前記永久磁石の外径寸法
より大きく、かつ成形樹脂と同一材質のスペーサを設け
て、成形時の樹脂圧で1番振れる部分を規制することに
より、温度スイッチ素子の上下、右左への振れが限定さ
れるため、永久磁石、感温磁性体、磁気ギャップスペー
サの露出を防止することができ、最小限度の距離は確保
することができる。なお、スペーサが露出しても成形樹
脂と同一の材質でできているため、絶縁性樹脂で一体と
なって各素子が覆われるので、絶縁は確保される。Function: A spacer, which is larger than the outer diameter of the permanent magnet and is made of the same material as the molding resin, is provided on the end surface of the permanent magnet on the side opposite to the lead frame lead-out side of the temperature switching element, so that the resin pressure during molding By restricting the first swinging part, the swinging of the temperature switch element up and down, right and left is limited, so that it is possible to prevent exposure of the permanent magnet, the temperature sensitive magnetic body, and the magnetic gap spacer, and the minimum distance. Can be secured. Even if the spacer is exposed, since it is made of the same material as the molding resin, the insulating resin integrally covers each element, so that insulation is ensured.
【0009】[0009]
【実施例】本発明による封止成形型温度スイッチの実施
例を以下に図面を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a temperature-sealing mold type temperature switch according to the present invention will be described below with reference to the drawings.
【0010】図2は、本発明の温度スイッチ素子の一実
施例を示した平面図及び正面図である。FIG. 2 is a plan view and a front view showing an embodiment of the temperature switching element of the present invention.
【0011】図2に示すように、温度スイッチ素子は、
永久磁石1a,1b、感温磁性体2、磁気ギャップスペ
ーサ3a,3b、ガイドスペーサ7、リードスイッチ
4、リードフレーム5により構成されている。As shown in FIG. 2, the temperature switch element is
The permanent magnets 1a and 1b, the temperature-sensitive magnetic body 2, the magnetic gap spacers 3a and 3b, the guide spacer 7, the reed switch 4, and the lead frame 5.
【0012】リードフレーム5は、永久磁石1a,1
b、感温磁性体2、磁気ギャップスペーサ3a,3b、
ガイドスペーサ7とを外周部に配置したリードスイッチ
4のリード4a,4bに接合されている。The lead frame 5 includes permanent magnets 1a, 1a.
b, temperature-sensitive magnetic body 2, magnetic gap spacers 3a, 3b,
The guide spacer 7 is joined to the leads 4a and 4b of the reed switch 4 arranged on the outer peripheral portion.
【0013】図1は、本発明による封止成形型温度スイ
ッチの一実施例を示す平面図及び正面図である。FIG. 1 is a plan view and a front view showing an embodiment of a sealed mold type temperature switch according to the present invention.
【0014】図1に示すように、封止成形型温度スイッ
チは、前記永久磁石1a,1b、感温磁性体2、磁気ギ
ャップ3a,3b、ガイドスペーサ7、リードスイッチ
4、リードフレーム5からなる前記温度スイッチ素子を
成形樹脂にて封止成形して構成されている。As shown in FIG. 1, the sealed mold type temperature switch comprises the permanent magnets 1a and 1b, the temperature sensitive magnetic body 2, magnetic gaps 3a and 3b, a guide spacer 7, a reed switch 4 and a lead frame 5. The temperature switch element is formed by molding with a molding resin.
【0015】この封止成形型温度スイッチ4に用いる温
度スイッチ素子のリードフレーム5の引き出し側とは逆
側の永久磁石1aの端面に、前記永久磁石1aより外径
寸法の大きいガイドスペーサ7を設けている。A guide spacer 7 having an outer diameter larger than that of the permanent magnet 1a is provided on the end surface of the permanent magnet 1a on the side opposite to the lead-out side of the lead frame 5 of the temperature switch element used in the sealed mold type temperature switch 4. ing.
【0016】成形時の上下・左右への振れが最小限にお
さえられるため、永久磁石1a,1b、感温磁性体2、
磁気ギャップスペーサ3a,3bが樹脂表面に露出せ
ず、最低限の距離を保つことができる。Since the vertical and horizontal swings during molding are minimized, the permanent magnets 1a, 1b, the temperature-sensitive magnetic body 2,
The magnetic gap spacers 3a and 3b are not exposed on the resin surface, and the minimum distance can be maintained.
【0017】又、ガイドスペーサ7が露出しても、成形
樹脂と同一の材質のため、リードフレームとの間で絶縁
は確保され、又、外観上、異常はみられない。Even if the guide spacer 7 is exposed, since it is made of the same material as the molding resin, the insulation between the lead frame and the lead frame is ensured, and no abnormality is observed in appearance.
【0018】[0018]
【発明の効果】以上、述べた如く、本発明によれば、リ
ードフレームの引き出し側に対して逆側の永久磁石の端
面にガイドスペーサを設けることにより、成形時の温度
スイッチ素子の位置ずれをなくし、温度スイッチ素子と
取付面との樹脂厚及び絶縁特性が確保され、外観上も安
定した封止成形型温度スイッチを提供できるものであ
る。As described above, according to the present invention, by disposing the guide spacer on the end surface of the permanent magnet on the side opposite to the lead-out side of the lead frame, the positional shift of the temperature switch element during molding can be prevented. It is possible to provide a sealed mold type temperature switch that is stable in appearance and that secures the resin thickness and insulation characteristics between the temperature switch element and the mounting surface.
【図1】本発明における封止成形型温度スイッチの説明
図。図1(a)は平面図。図1(b)は正面図。FIG. 1 is an explanatory view of a sealing mold type temperature switch according to the present invention. FIG. 1A is a plan view. FIG.1 (b) is a front view.
【図2】本発明における封止成形型温度スイッチに使用
される温度スイッチ素子の説明図。図2(a)は平面
図。図2(b)は正面図。FIG. 2 is an explanatory diagram of a temperature switch element used in the sealed mold type temperature switch according to the present invention. FIG. 2A is a plan view. FIG. 2B is a front view.
【図3】従来の封止成形型温度スイッチの斜視図。FIG. 3 is a perspective view of a conventional sealed mold type temperature switch.
【図4】従来の封止成形型温度スイッチに使用される温
度スイッチ素子の斜視図。FIG. 4 is a perspective view of a temperature switch element used in a conventional sealed mold temperature switch.
1a,1b 永久磁石 2 感温磁性体 3a,3b 磁性ギャップスペーサ 4 リードスイッチ 4a,4b リードスイッチのリード 5 リードフレーム 6 成形樹脂 7 ガイドスペーサ 8 信号引き出し用リード 1a, 1b Permanent magnet 2 Temperature-sensitive magnetic material 3a, 3b Magnetic gap spacer 4 Reed switch 4a, 4b Reed switch lead 5 Lead frame 6 Molding resin 7 Guide spacer 8 Signal lead
Claims (1)
スペーサを介して永久磁石を設けて、筒状体を形成し、
この筒状体にリードスイッチを挿入し、このリードスイ
ッチのリードをリードフレームの信号引き出し用リード
に接続し、前記リードフレームの信号引き出し用リード
を同一方向に導き出し、温度スイッチ素子を絶縁性樹脂
にて封止成形してなる封止成形型温度スイッチにおい
て、前記温度スイッチ素子のリードフレームの信号引き
出し用リードのある側に対して反対側の永久磁石の端面
に、この永久磁石の外径寸法よりも大きく、かつ、成形
樹脂と同一材質のガイドスペーサを設けたことを特徴と
する封止成形型温度スイッチ。1. A tubular body is formed by providing permanent magnets on both sides of an annular temperature-sensitive magnetic body via magnetic gap spacers,
Insert the reed switch into this tubular body, connect the lead of this reed switch to the lead for signal lead-out of the lead frame, lead out the lead for signal lead-out of the lead frame in the same direction, and use the insulating resin for the temperature switch element. In the sealed mold type temperature switch formed by sealing and molding, the end surface of the permanent magnet on the side opposite to the side having the signal lead-out lead of the lead frame of the temperature switch element is Sealing mold type temperature switch characterized in that a guide spacer made of the same material as the molding resin is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15693995A JPH08329807A (en) | 1995-05-30 | 1995-05-30 | Molded mold temperature switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15693995A JPH08329807A (en) | 1995-05-30 | 1995-05-30 | Molded mold temperature switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08329807A true JPH08329807A (en) | 1996-12-13 |
Family
ID=15638659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15693995A Pending JPH08329807A (en) | 1995-05-30 | 1995-05-30 | Molded mold temperature switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08329807A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0907197A1 (en) * | 1997-10-02 | 1999-04-07 | Tokin Corporation | Thermal switch device comprising reed switch and temperature-sensitive magnetic structure, supported in and outwardly by the inner cylindrical casing |
-
1995
- 1995-05-30 JP JP15693995A patent/JPH08329807A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0907197A1 (en) * | 1997-10-02 | 1999-04-07 | Tokin Corporation | Thermal switch device comprising reed switch and temperature-sensitive magnetic structure, supported in and outwardly by the inner cylindrical casing |
| US5990773A (en) * | 1997-10-02 | 1999-11-23 | Tokin Corporation | Thermal switch devise comprising reed switch and temperature-sensitive magnetic structure supported in and out, respectively, of an inner cylinder of case |
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