JPH08330342A - Semiconductor resin sealing device - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a device that can cope with variations in the amount of resin without changing the external dimensions required for mounting. [Structure] A lead frame or a tape frame on which a semiconductor element is mounted is inserted into a mold, and a sheet-shaped resin corresponding to a volume to be a cavity after molding is supplied in the mold or by the frame attachment or the mold and frame attachment. In a device in which both bottom surfaces of the upper and lower cavities are plunger surfaces, one of the plungers is a double plunger. As a result, a reliable mounting means can be provided. Also, if there is a large amount of resin shortage due to chipping due to handling of sheet-shaped resin, or if there is a large increase or decrease in resin amount due to a measurement error in the resin manufacturing process, the position of the center side plunger in the initial state and completion of molding The discriminating device discriminates that the molding has not been completed at the predetermined position based on the difference in the position of the immediately preceding center side plunger, and the device is stopped or abnormally output. Therefore, it is possible to surely discriminate an exposed semiconductor device having an extremely deep recess, or a semiconductor device having a convex shape which originally requires a deep recess.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for molding a semiconductor element with resin.

[0002]

2. Description of the Related Art When directly molding a sheet-shaped resin 1a, 1b in a cavity 2, as shown in FIG. 13, a plunger 2 is arranged in either an upper mold 3 or a lower mold 4 to form a single plunger. There is a method of molding with. Also, FIG.
As shown in FIG. 2, the plungers 5a and 5b are arranged in both upper and lower molds, and when the semiconductor device is mounted on a printed circuit board or the like by the user, the plunger forming the lower surface is position-controlled to form the opposite surface. There is a method of forming the plunger by pressure control.

[0003]

According to the above-mentioned prior art, a molded product corresponding to the volume of the sheet-shaped resin charged is molded. However, if the volume of the sheet-shaped resin to be charged is always the same, there is no problem, but the sheet-shaped resin also has a variation in the resin amount. This variation in the amount of resin directly affects the external dimensions of the molded product in the above conventional technique. The variation in the thickness of the cavity causes mounting failure when the semiconductor device is mounted by a user's process. Therefore, it is necessary to reduce the variation of the sheet-shaped resin as much as possible, which increases the material cost. The present invention has been made in view of the above circumstances, and provides an apparatus capable of coping with variations in the amount of resin without disturbing the external dimensions required for mounting.

[0004]

A semiconductor resin encapsulation device of the present invention inserts a lead frame or a tape frame on which a semiconductor element is mounted in a mold, and inserts a sheet-shaped resin of a volume to be a cavity after molding. In a device in which the plungers are provided on both bottom surfaces of the upper and lower cavities, which are supplied in the mold or attached to the frame or attached to the mold and the frame, one of the plungers is a double plunger. An outer peripheral side plunger of the heavy plunger is driven by an actuator, and a central side plunger is biased toward the plunger surface side by an elastic pushing member.

Alternatively, the center side plunger of the double plunger is driven by an actuator, and the outer peripheral side plunger is biased toward the plunger surface side by an elastic pushing member.

Alternatively, both the outer peripheral side plunger and the central side plunger of the double plunger are characterized by being independently driven by an actuator. Furthermore, a plunger position detection device that detects the position of the center plunger or outer peripheral side plunger of the double plunger during molding and a determination device that determines whether the plunger position at the end of molding is at a predetermined position are provided. When finished, the molded product is judged to be good, and the other products are judged to be defective.

[0007]

[Operation] Of the plungers that form the bottom of the cavity,
A single plunger that forms one bottom surface of the cavity by using one of the plungers as a double plunger on the outer circumference side and the center side, compresses the resin to a predetermined position by position control during resin compression molding, and The double plunger that forms the bottom surface is divided into an outer peripheral side plunger and a central side plunger, and when either the outer peripheral side or central side plunger is compression molded, the resin is compressed to a predetermined position by position control, and the other plunger is compressed. It slides against the pressure of the resin during molding, and applies a predetermined pressure to the resin.

As a result, a surface having a predetermined thickness dimension is formed on both surfaces of the cavity regardless of variations in the amount of resin. Therefore, even if there is a variation in the amount of resin, it is possible to secure the required dimensions for mounting by the user. Further, by detecting the position of the pressure control side plunger of the double plunger after the molding, it is possible to surely determine the defective product of the molded product even if an abnormal amount of resin is injected.

[0009]

Embodiments of the present invention will be described below with reference to FIGS. 1 to 12. 1 to 5 will be referred to as a first embodiment. In FIG. 1, the upper mold 3 and the lower mold 4 are opened, and the lead frame F on which the semiconductor element H is mounted on the lower surface is conveyed and supplied into the upper mold 3 and the lower mold 4, and after molding. The sheet-shaped resins 1a and 1b having a resin amount corresponding to the cavity volume of the semiconductor device are placed and put on the upper surface of the lead frame and the cavity molding portion of the lower mold 4, respectively.

The cavity molding portion of the upper die 3 is slidably provided with a single plunger 5a such that the upper bottom surface of the cavity serves as a plunger tip surface, and is position-controlled by an actuator (not shown). The cavity molding portion of the lower mold 4 is slidably provided with a plunger 5b such that the bottom surface of the cavity serves as the plunger tip surface. The plunger 5b is divided into an outer peripheral side and a central side of the lower bottom surface of the cavity, and the outer peripheral side plunger 51 is position-controlled and driven by an actuator (not shown).

The center side plunger 52 is slidably embedded in the outer peripheral side plunger 51, and its tip projects from the tip of the outer peripheral side plunger 51. Center side plunger 52
Is an elastic pushing member 53 that corresponds to the pressure during molding,
It is urged toward the resin contact side. A sensor 54 for detecting the movement (movement position) of the plunger is embedded at the end of the center-side plunger 52, and an output signal of the sensor 54 is a discriminating device for discriminating whether it has stopped at a predetermined position via a position detecting device 55. It is connected to 56.

Next, the operation of the above configuration will be described.
First, the lead frame F on which the semiconductor element H is mounted
Are conveyed and supplied into the upper mold 3 and the lower mold 4. Next, when the sheet-shaped resin 1a is placed on the lead frame F, the upper mold 3 descends and the upper mold 3 and the lead frame F come into contact with each other. At the same time or before a certain time, it is supplied into the cavity of the lower mold 4.

The sheet-shaped resins 1a and 1b start melting immediately after they come into contact with the upper mold 3 and the lower mold 4, respectively. When the sheet-shaped resin 1b is put into the lower die 4, the upper die 3 continues to descend together with the lead frame F, and the lead frame F is sandwiched between the upper die 3 and the lower die 4. After that, tighten one side. Simultaneously with the completion of the one-side tightening, the single plunger 5a in the upper mold 3 descends to a predetermined position and stops. Next, the outer peripheral side plunger 51 in the lower mold 4
Rises and begins to compression mold the resin. The outer peripheral side plunger 51 stops when it rises to a predetermined position. At this time, the injected resin changes the pressure applied to the center side plunger 52.
Is added as a reaction force to. The central plunger 52 is
It stops at a position balanced with this reaction force and the urging force of the elastic pushing member 53 urging to the resin side. Therefore, the elastic pusher 53
It is necessary to set the setting force of 1 as the force calculated by the resin contact projection area of the center side plunger 52 and the resin compression molding force.

With this structure, the semiconductor device compression molded is
If the double plunger side of the outer peripheral side and the center side plunger is the upper surface of the semiconductor device, the shape shown in FIG. 3 is obtained. FIG. 4 is a cross-sectional view of the semiconductor device shown in FIG. 3, where the cavity thickness dimension T is obtained by molding the single plunger 5a in the upper mold 3 and the outer peripheral plunger 51 in the lower mold 4 by position control. It is always constant regardless of the amount of resin. The surface formed by the center side plunger 52 in the lower mold 4 moves up and down due to the variation in the amount of resin, and becomes a molded product in which the recess depth dimension K of the upper surface of the cavity is varied.

FIG. 5 is a sectional view of the semiconductor device in which the double plungers 51 and 52 and the single plunger 5a are turned upside down with respect to the semiconductor device. It is a molded product with different depth dimensions K. Therefore, since the upper surface and the lower surface of the cavity have surfaces having a certain thickness, a reliable mounting means can be provided in mounting the semiconductor device by the user.

According to the configuration of the present invention, when a large amount of resin is insufficient due to chipping due to handling of the sheet-shaped resin, or a large amount of resin is increased or decreased due to a measurement error in the resin manufacturing process, the center of the initial state is obtained. Position S of side plunger 52
1 and the position S2 of the center side plunger 52 immediately before the end of molding
The discriminating device 56 discriminates that the molding is not completed at the predetermined position, and stops the device or outputs an abnormal signal. Therefore, it is possible to surely discriminate a semiconductor element that has an extremely deep recess depth and is exposed, or a semiconductor element that is convex although the original recess depth is required.

A second embodiment is shown in FIGS. 6 to 10.
In the configuration, the driving configurations of the outer peripheral side plunger and the central side plunger of the first embodiment are reversed, and the actions of the respective plungers are also reversed in operation, the position of the central side plunger 52 is controlled, and the outer peripheral side plunger 51. Is designed to work with pressure.

With this configuration, the compression molded semiconductor device is
If the double plunger side of the outer peripheral side and the center side plunger is the upper surface of the semiconductor device, the shape shown in FIG. 8 is obtained. FIG. 9 is a cross-sectional view of the semiconductor device shown in FIG. 8. The cavity thickness dimension T is obtained by molding the single plunger 5a in the upper mold 3 and the outer peripheral plunger 51 in the lower mold 4 by position control. It is always constant regardless of the amount of resin. The surface formed by the center side plunger 52 in the lower mold 4 moves up and down due to the variation in the amount of resin, and becomes a molded product in which the recess depth dimension K of the upper surface of the cavity is varied.

A sectional view of the semiconductor device when the double plungers 51, 52 and the single plunger 5a are turned upside down with respect to the semiconductor device is shown in FIG. 10. As in the above, the cavity thickness dimension T is constant and the cavity bottom has a recess depth. It is a molded product with different dimensions K. Therefore, the same effect as the first embodiment is obtained.

As a third embodiment, the configuration shown in FIG.
The outer peripheral side plunger 51 and the central side plunger 52 are driven by independent actuators, and each actuator is equipped with a position detecting device 55, a discriminating device 56, a load detecting device 57, and a control device 58. The setting of the control plunger can be changed on the outer peripheral side or the central side. The plunger that is not the position control plunger becomes a pressure control plunger, and the action can be the same as in the first or second embodiment. Therefore, the shape of the molded semiconductor device can correspond to all the shapes shown in FIGS. 3 to 5 and 8 to 10.

As another embodiment, as shown in FIG. 12, the shape of the double plunger may be such that the tip of the center side plunger 52 is rectangular, circular or elliptical, and the number of center side plungers 52 is plural. The same effect can be obtained even when divided into.

[0022]

As is apparent from the above description, since the device of the present invention has the surfaces having the constant thickness on the upper surface and the lower surface of the cavity, a reliable mounting means for mounting the semiconductor device by the user. Can be provided.

According to the configuration of the present invention, when a large amount of resin is insufficient due to chipping due to handling of the sheet-shaped resin or a large amount of resin is increased or decreased due to a measurement error in the resin manufacturing process, the center of the initial state is obtained. By the difference between the position of the side plunger and the position of the center side plunger just before the end of molding, the determination device determines that the molding has not been completed at the predetermined position,
Stop the device or output an error. Therefore, it is possible to surely discriminate a semiconductor element that has an extremely deep recess depth and is exposed, or a semiconductor element that is convex although the original recess depth is required.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a semiconductor resin sealing device showing a first embodiment of the present invention,

FIG. 2 is a sectional view showing the operation of the semiconductor resin sealing device showing the first embodiment of the present invention,

FIG. 3 is a semiconductor device diagram molded by the semiconductor resin sealing device of the first embodiment of the present invention,

FIG. 4 is a sectional view of FIG.

FIG. 5 is a sectional view of the semiconductor device according to the first embodiment of the present invention with the double plunger position reversed.

FIG. 6 is a sectional view of a lower die of a second embodiment of the present invention,

FIG. 7 is a sectional view showing the operation of the second embodiment of the present invention;

FIG. 8 is a semiconductor device diagram molded by the semiconductor resin sealing device according to the second embodiment of the present invention;

9 is a sectional view of FIG.

FIG. 10 is a cross-sectional view of the semiconductor device according to the second embodiment of the present invention with the double plunger position reversed.

FIG. 11 is a sectional view of a semiconductor resin sealing device according to a third embodiment of the present invention,

FIG. 12 is a view showing another embodiment of the shape of the double plunger of the present invention,

FIG. 13 is an explanatory view of a conventional technology of a semiconductor resin sealing device,

FIG. 14 is a diagram illustrating a conventional technique of a semiconductor resin sealing device.

[Explanation of symbols]

1a, 1b ... Sheet-shaped resin, 2 ... Cavity, 3 ... Upper mold, 4 ... Lower mold, 5a ... Single plunger, 51 ... Outer peripheral side plunger, 52 ... Central side plunger,
53 ... Elastic pushing member, 54 ... Sensor,
55 ... Position detection device, 56 ... Discrimination device,
57 ... Load detection device, 58 ... Control device, S1 ... Initial dimension, S2 ... Pressurized dimension,
T ... Cavity thickness dimension, K ... Recess depth dimension.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location B29C 45/77 7365-4F B29C 45/77 // B29L 31:34

Claims (5)

[Claims] 1. A lead frame or a tape frame on which a semiconductor element is mounted is inserted into a mold, and a sheet-shaped resin corresponding to a volume which becomes a cavity after molding is attached in the mold or in the frame or in the mold and the frame. Supply,
A semiconductor resin sealing device in which both bottom surfaces of the upper and lower cavities are plunger surfaces, and one of the plungers is a double plunger. 2. The semiconductor resin encapsulation according to claim 1, wherein the outer peripheral side plunger of the double plunger is driven by an actuator, and the central side plunger is biased toward the plunger surface side by an elastic pushing member. apparatus. 3. The semiconductor resin encapsulation according to claim 1, wherein the central plunger of the double plunger is driven by an actuator, and the outer peripheral plunger is urged toward the plunger surface side by an elastic pushing member. apparatus. 4. The semiconductor according to claim 1, wherein both the outer peripheral side plunger and the central side plunger of the double plunger are independently driven by an actuator, and one is formed by position control and the other by pressure control. Resin sealing device. 5. A plunger position detecting device for detecting the position of the center plunger or the outer peripheral plunger of the double plunger during molding, and a discriminating device for discriminating whether or not the plunger position at the end of molding is a predetermined position, The semiconductor resin encapsulation device according to claim 1, wherein when the molding is completed at a predetermined position, the molded product is judged as a good product and the other products are judged as defective products.