JPH08330635A - Light emitting device - Google Patents

Light emitting device

Info

Publication number
JPH08330635A
JPH08330635A JP15720595A JP15720595A JPH08330635A JP H08330635 A JPH08330635 A JP H08330635A JP 15720595 A JP15720595 A JP 15720595A JP 15720595 A JP15720595 A JP 15720595A JP H08330635 A JPH08330635 A JP H08330635A
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting device
optical element
transparent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15720595A
Other languages
Japanese (ja)
Inventor
Akira Ishizuka
公 石塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP15720595A priority Critical patent/JPH08330635A/en
Publication of JPH08330635A publication Critical patent/JPH08330635A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses

Landscapes

  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)

Abstract

(57)【要約】 【目的】 モールド光源を用いて装置全体の小型化を図
ると共に高品位の光束が得られる発光装置を得ること。 【構成】 電子基板上に窓部材で覆った発光素子と、該
発光素子からの光束を所定の状態に変換し出射する光学
素子とを設けた発光装置において、該窓部材と該光学素
子との間の空間を透明樹脂で充填したこと。
(57) [Abstract] [Purpose] To obtain a light-emitting device using a molded light source to downsize the entire device and obtain a high-quality luminous flux. A light-emitting device comprising a light-emitting element covered with a window member on an electronic substrate, and an optical element for converting a light beam from the light-emitting element into a predetermined state and emitting the light beam, wherein the window member and the optical element are provided. The space between them was filled with transparent resin.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は発光装置に関し、特に電
子基板上にレーザーダイオードや発光ダイオード(LE
D)等の発光素子と、それから放射した光束を集光又は
回折等、所定の光束に変換して出射させる光学素子とを
実装した構成の装置全体の小型化を図った発光装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly to a laser diode or a light emitting diode (LE) on an electronic substrate.
The present invention relates to a light emitting device having a structure in which a light emitting element such as D) and an optical element for converting a light beam emitted from the light emitting element into a predetermined light beam such as condensing or diffracting and emitting the light beam are miniaturized. .

【0002】[0002]

【従来の技術】従来よりレーザーダイオードや発光ダイ
オード(LED)等の発光素子を用いた発光装置がCD
等の光データ記録装置,光通信装置や光計測装置等で使
用されている。
2. Description of the Related Art Conventionally, a light emitting device using a light emitting element such as a laser diode or a light emitting diode (LED) is a CD.
It is used in optical data recording devices, such as optical communication devices and optical measuring devices.

【0003】図5は従来の発光素子LGTaからの光束
の取り出し面を透明部材Wとで覆った金属CANパッケ
ージの発光装置LGTの要部概略図である。同図におい
てCBは電子基板、CP1,CP2は各々回路パターン
であり、電子基板CBに設けられている。LGTaは発
光素子であり、ボンドワイヤBWとリードRを介して回
路パターンCP1,CP2に連結されている。
FIG. 5 is a schematic view of a main part of a light emitting device LGT of a metal CAN package in which a light extraction surface of a conventional light emitting element LGTa is covered with a transparent member W. In the figure, CB is an electronic substrate, and CP1 and CP2 are circuit patterns, which are provided on the electronic substrate CB. LGTa is a light emitting element, and is connected to the circuit patterns CP1 and CP2 via the bond wire BW and the lead R.

【0004】CANは発光素子LGTaを保護する壁筒
である。Wは透明部材である。発光素子LGTaは透明
部材Wと壁筒CANで形成される空間内に収納してい
る。Dは集光作用をする光学素子であり、発光素子LG
Taからの光束を集光し、所定方向に導光している。
CAN is a wall cylinder that protects the light emitting element LGTa. W is a transparent member. The light emitting element LGTa is housed in the space formed by the transparent member W and the wall cylinder CAN. D is an optical element having a light-collecting function, and is a light emitting element LG
The light flux from Ta is condensed and guided in a predetermined direction.

【0005】[0005]

【発明が解決しようとする課題】従来の発光装置は、発
光素子からの光束をガラス板(透明部材)を通して取り
出している為に光量ムラや散乱、そして光束の乱れが比
較的少なく、光束の出射品質が優れている。この為、発
光装置としては直径5mm程度のサイズの金属CANパ
ッケージを用いたものが多く用いられている。
In the conventional light emitting device, since the luminous flux from the light emitting element is taken out through the glass plate (transparent member), the unevenness of the light quantity, the scattering and the disturbance of the luminous flux are relatively small, and the luminous flux is emitted. The quality is excellent. Therefore, a light emitting device using a metal CAN package having a diameter of about 5 mm is often used.

【0006】一方最近、発光装置として装置全体の小型
化を図ったものが要望されている。発光装置として金属
CANパッケージを用いると構成上、小型化が難しくな
る。これに対してLED等の発光素子自体の大きさは数
100μmのチップサイズであるので、樹脂モールドパ
ッケージ技術を用いれば発光装置全体の小型化が実現で
きる。
On the other hand, recently, there has been a demand for a light emitting device which is downsized as a whole. When a metal CAN package is used as the light emitting device, it is difficult to reduce the size because of the structure. On the other hand, since the size of the light emitting element such as the LED itself is a chip size of several 100 μm, the size of the entire light emitting device can be reduced by using the resin mold packaging technology.

【0007】しかしながら樹脂モールドパッケージは各
種金属型等によるインジェクション等の成形技術で作成
する為に、樹脂表面に微小な凹凸が生じやすい。この為
これらの面(窓部材面)を介して取り出される光束は散
乱したり、光路がずれたり、波面が乱れる為に、その後
に高精度な光学素子を組み合わせても所望の光学特性が
得られにくいという問題点があった。
However, since the resin mold package is produced by a molding technique such as injection using various metal molds, minute irregularities are likely to occur on the resin surface. For this reason, the light flux extracted through these surfaces (window member surface) is scattered, the optical path is deviated, and the wavefront is disturbed, so that the desired optical characteristics can be obtained even after combining high-precision optical elements. There was a problem that it was difficult.

【0008】本発明は、樹脂モールドパッケージを利用
して装置全体の小型化を図るときに発生しやすい窓部材
の凹凸等による光散乱や波面の乱れを効果的に減少さ
せ、高品位の光束を出射させることのできる発光装置の
提供を目的とする。
The present invention effectively reduces the light scattering and the wavefront disturbance due to the unevenness of the window member which tends to occur when the size of the entire device is reduced by using the resin mold package, and the high-quality light flux is generated. An object is to provide a light emitting device that can emit light.

【0009】[0009]

【課題を解決するための手段】本発明の発光装置は、電
子基板上に窓部材で覆った発光素子と、該発光素子から
の光束を所定の状態に変換し出射する光学素子とを設け
た発光装置において、該窓部材と該光学素子との間の空
間を透明樹脂で充填したことを特徴としている。
A light emitting device of the present invention is provided with a light emitting element covered with a window member on an electronic substrate, and an optical element for converting a light beam from the light emitting element into a predetermined state and emitting the light beam. In the light emitting device, the space between the window member and the optical element is filled with a transparent resin.

【0010】特に、前記光学素子は前記透明樹脂側が平
面又は曲面より成り、その反対側が曲面又は回折格子面
上より成っていることや、前記窓部材の材質の屈折率と
前記透明樹脂の材質の屈折率が略等しいこと等を特徴と
している。
Particularly, in the optical element, the transparent resin side is a flat surface or a curved surface and the opposite side is a curved surface or a diffraction grating surface, and the refractive index of the window member material and the transparent resin material are different from each other. It is characterized in that the refractive indices are substantially equal.

【0011】[0011]

【実施例】図1は本発明の実施例1の要部断面図であ
る。図中、LGTは樹脂モールド型の発光ダイオードで
あり、ボンドワイヤで連結された発光部LGTaを有し
ている。Wは透明の窓部(窓部材)であり、発光ダイオ
ードLGTを覆っている。CBはプリント基板(電子基
板)であり、その面上には回路パターンCP1,CP2
が形成されている。回路パターンCP1,CP2はプリ
ント基板CB上に設けた透明の窓部Wで覆った発光ダイ
オードLGTとボンドワイヤやリード線を介してクリー
ム半田等で電気的及び機械的に接続されている。
Embodiment 1 FIG. 1 is a sectional view of the essential portions of Embodiment 1 of the present invention. In the figure, LGT is a resin mold type light emitting diode and has a light emitting portion LGTa connected by a bond wire. W is a transparent window portion (window member), which covers the light emitting diode LGT. CB is a printed circuit board (electronic board), and circuit patterns CP1 and CP2 are provided on the surface thereof.
Are formed. The circuit patterns CP1 and CP2 are electrically and mechanically connected to the light emitting diode LGT covered with the transparent window portion W provided on the printed circuit board CB with cream solder or the like via a bond wire or a lead wire.

【0012】Hは円筒又は角筒の壁状部材であり、発光
ダイオードLGTを囲んでおり、プリント基板CBに固
定している。Gは透明基板であり、ガラス材やプラスチ
ック材等から成り、壁状部材H上に載置されている。プ
リント基板CBと透明基板G、そして該壁状部材Hによ
り発光ダイオードLGTが位置している空間(発光ダイ
オード空間)を密封空間としている。Lは球面レンズや
シリンドリカルレンズやトーリックレンズ等の光学素子
(レンズ)であり、透明基板G上に設けており、発光ダ
イオードLGTの発光面LGTaからの光束を集光して
所定方向に導光している。
Reference numeral H denotes a cylindrical or rectangular wall member, which surrounds the light emitting diode LGT and is fixed to the printed circuit board CB. G is a transparent substrate, which is made of a glass material, a plastic material, or the like, and is placed on the wall-shaped member H. The printed board CB, the transparent board G, and the wall-shaped member H form a sealed space in which the light emitting diode LGT is located (light emitting diode space). L is an optical element (lens) such as a spherical lens, a cylindrical lens, or a toric lens, which is provided on the transparent substrate G and collects a light beam from the light emitting surface LGTa of the light emitting diode LGT and guides it in a predetermined direction. ing.

【0013】尚、本実施例においてレンズLと透明基板
Gとを同質材料でモールド加工等により一体形成しても
良い。
In this embodiment, the lens L and the transparent substrate G may be integrally formed of the same material by molding or the like.

【0014】MOは透明樹脂であり、発光ダイオード空
間内部を充填している。尚、透明樹脂MOは透明窓部W
の材質の屈折率と略同じ(±10%以内)材質を用いる
のが光束を効率良く導光することができるので好まし
い。
MO is a transparent resin and fills the inside of the light emitting diode space. The transparent resin MO is the transparent window W
It is preferable to use a material having substantially the same refractive index as that of the material (within ± 10%) because the light flux can be efficiently guided.

【0015】本実施例では透明樹脂MOの代わりに同様
の屈折率の透明液体や透明気体を用いても良い。
In this embodiment, a transparent liquid or a transparent gas having the same refractive index may be used instead of the transparent resin MO.

【0016】本実施例では以上のような構成により発光
ダイオード空間内を透明樹脂MOで充填することにより
窓部Wの表面の凹凸や透明基板Gの光透過面の凹凸等を
透明樹脂MOで埋め、これにより各面での光の散乱を防
止しつつ、発光ダイオードLGTからの光束をレンズL
により効率良く、所定方向に導光している。
In the present embodiment, by filling the inside of the light emitting diode space with the transparent resin MO with the above-described structure, the irregularities on the surface of the window W or the light transmitting surface of the transparent substrate G are filled with the transparent resin MO. , Thereby preventing the light from being scattered on each surface and allowing the light flux from the light emitting diode LGT to pass through the lens L.
The light is efficiently guided in a predetermined direction.

【0017】特に本実施例では光束射出面が樹脂モール
ド型の発光ダイオードLGTの窓部Wの凹凸等が充填さ
れた透明樹脂MOによって埋められ、光学的境界面が実
質的に(ガラス)板状のレンズLの面になり、面精度が
確保され、光束の乱れを効果的に防止している。
In particular, in this embodiment, the light exit surface is filled with the transparent resin MO filled with the irregularities of the window W of the resin-molded light emitting diode LGT and the optical boundary surface is substantially (glass) plate-like. The surface accuracy is ensured and the turbulence of the light flux is effectively prevented.

【0018】図2〜図4は各々本発明の実施例2〜4の
要部断面図である。図中、図1で示した要素と同一要素
には同符号を付している。図2の実施例2においてDは
一方の面に回折格子Da等を有する透明板状の光学素子
であり、ガラス材やプラスチック材等から成っている。
2 to 4 are cross-sectional views of the essential portions of Embodiments 2 to 4 of the present invention. In the figure, the same elements as those shown in FIG. 1 are designated by the same reference numerals. In Example 2 of FIG. 2, D is a transparent plate-shaped optical element having a diffraction grating Da and the like on one surface, and is made of a glass material, a plastic material, or the like.

【0019】本実施例は発光ダイオードLGTを覆う窓
部Wの上面に光学素子Dを接着剤等の透明樹脂MOで接
着固定している。透明樹脂MOの屈折率は発光素子LG
Tの窓部Wの材質の屈折率と略同一としている。
In this embodiment, the optical element D is adhered and fixed to the upper surface of the window portion W that covers the light emitting diode LGT with a transparent resin MO such as an adhesive. The refractive index of the transparent resin MO is the light emitting element LG.
The refractive index of the material of the window portion W of T is substantially the same.

【0020】このように本実施例では窓部Wと光学素子
Dとの間の空間内に接着性のある透明樹脂MOを挟入す
ることにより、双方を固着して実施例1と同様に窓部W
の表面の凹凸や光学素子Dの面の凹凸等による光の散乱
を防止しつつ、発光ダイオードLGTからの光束を光学
素子Dに効率良く導光して、例えば回折格子Daで光束
を回折させている。
As described above, in this embodiment, the transparent resin MO having adhesiveness is sandwiched in the space between the window portion W and the optical element D so as to fix the both, and the window is the same as in the first embodiment. Department W
The light flux from the light emitting diode LGT is efficiently guided to the optical element D while diffracting the light flux by the diffraction grating Da, for example, while preventing the scattering of light due to the unevenness of the surface of the optical element D and the unevenness of the surface of the optical element D. There is.

【0021】図3の実施例3は図2の実施例2に比べて
発光ダイオードLGTを覆う窓部Wの上面に光学素子D
を接合した板状の透明部材(例えば光学フィルターや内
部にハーフミラー面を有する光分割部材等)Pを接着剤
等の透明樹脂MOで接着固定している点が異なっている
だけであり、この他の構成は同じである。透明樹脂MO
の屈折率は発光素子LGTの窓部Wの材質の屈折率と略
同一である。
The third embodiment shown in FIG. 3 is different from the second embodiment shown in FIG.
It is different only in that a plate-shaped transparent member (for example, an optical filter or a light splitting member having a half mirror surface inside) P bonded to each other is bonded and fixed with a transparent resin MO such as an adhesive. Other configurations are the same. Transparent resin MO
Is substantially the same as the refractive index of the material of the window portion W of the light emitting element LGT.

【0022】本実施例では以上のような構成により実施
例2と同様の効果を得ている。
In this embodiment, the same effect as that of the second embodiment is obtained with the above-mentioned structure.

【0023】図4の実施例4においてDLは光学素子で
あり、一方にレンズ部DLaを有し、他方に発光ダイオ
ードLGTを収納する凹部を有した、樹脂成形の透明部
材より成っている。該凹部に発光ダイオードLGTを収
納している。そして該凹部と窓部W、そして基板CBと
で形成される空間内を透明樹脂MOで充填している。透
明樹脂MOの屈折率は発光素子LGTの窓部Wの材質の
屈折率と略同一である。
In Example 4 of FIG. 4, DL is an optical element, which is made of a resin-molded transparent member having a lens portion DLa on one side and a concave portion for accommodating the light emitting diode LGT on the other side. A light emitting diode LGT is housed in the recess. Then, the space formed by the recess, the window W, and the substrate CB is filled with the transparent resin MO. The refractive index of the transparent resin MO is substantially the same as the refractive index of the material of the window W of the light emitting element LGT.

【0024】本実施例では発光素子を樹脂封止するパッ
ケージ用の成形型に比べて単品の光学素子DLを成形す
る型の方が光学面精度が出しやすいという特長を利用で
きる。
In the present embodiment, it is possible to utilize the feature that the optical surface precision is more easily obtained in the mold for molding the single optical element DL as compared with the molding mold for the package in which the light emitting element is sealed with resin.

【0025】[0025]

【発明の効果】本発明によれば以上のように、発光素子
を覆う窓部材と光学素子との間の空間を透明樹脂で充填
させることにより樹脂モールドパッケージを利用して装
置全体の小型化を図るときに発生しやすい窓部材の凹凸
等による光散乱や波面の乱れを効果的に減少させ、高品
位の光束を出射させることのできる発光装置を達成する
ことができる。
As described above, according to the present invention, the space between the window member covering the light emitting element and the optical element is filled with the transparent resin, so that the size of the entire device can be reduced by using the resin mold package. It is possible to achieve a light emitting device that can effectively reduce light scattering and disturbance of the wavefront due to the unevenness of the window member that tends to occur when attempting to emit a high-quality light flux.

【0026】特に本発明によれば、例えば光束射出面が
樹脂モールド型の発光ダイオードLGTの窓部Wの凹凸
等が透明樹脂MOによって埋められ、光学的境界面が実
質的に板状の光学素子Dの平面になり、面精度が確保さ
れ、光束の乱れを効果的に防止した発光装置を得ること
ができる。
In particular, according to the present invention, for example, the unevenness of the window W of the resin-molded light emitting diode LGT on the light exit surface is filled with the transparent resin MO, and the optical interface has a substantially plate-like optical element. It is possible to obtain a light emitting device having a flat surface of D, ensuring the surface accuracy, and effectively preventing the disturbance of the light flux.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例1の要部断面図FIG. 1 is a sectional view of a main part of a first embodiment of the present invention.

【図2】本発明の実施例2の要部断面図FIG. 2 is a sectional view of a main part of a second embodiment of the present invention.

【図3】本発明の実施例3の要部断面図FIG. 3 is a sectional view of a main part of a third embodiment of the present invention.

【図4】本発明の実施例4の要部断面図FIG. 4 is a sectional view of a main part of a fourth embodiment of the present invention.

【図5】従来の発光装置の要部断面図FIG. 5 is a sectional view of a main part of a conventional light emitting device.

【符号の説明】[Explanation of symbols]

LGT 発光ダイオード LGTa 発光素子 MO 透明樹脂 L レンズ H 壁状部材 W 窓部材 CB 電子基板 CP1,CP2 回路パターン D 光学素子 G,P 透明基板 LGT light emitting diode LGTa light emitting element MO transparent resin L lens H wall member W window member CB electronic substrate CP1, CP2 circuit pattern D optical element G, P transparent substrate

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 電子基板上に窓部材で覆った発光素子
と、該発光素子からの光束を所定の状態に変換し出射す
る光学素子とを設けた発光装置において、該窓部材と該
光学素子との間の空間を透明樹脂で充填したことを特徴
とする発光装置。
1. A light emitting device comprising an electronic substrate, a light emitting element covered with a window member, and an optical element for converting a light beam from the light emitting element into a predetermined state and emitting the light beam, the window member and the optical element. A light emitting device characterized in that a space between and is filled with a transparent resin.
【請求項2】 前記光学素子は前記透明樹脂側が平面又
は曲面より成り、その反対側が曲面又は回折格子面上よ
り成っていることを特徴とする請求項1の発光装置。
2. The light emitting device according to claim 1, wherein in the optical element, the transparent resin side is a flat surface or a curved surface, and the opposite side is a curved surface or a diffraction grating surface.
【請求項3】 前記窓部材の材質の屈折率と前記透明樹
脂の材質の屈折率が略等しいことを特徴とする請求項1
又は2の発光装置。
3. The refractive index of the material of the window member and the refractive index of the material of the transparent resin are substantially equal to each other.
Or the light emitting device of 2.
JP15720595A 1995-05-30 1995-05-30 Light emitting device Pending JPH08330635A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15720595A JPH08330635A (en) 1995-05-30 1995-05-30 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15720595A JPH08330635A (en) 1995-05-30 1995-05-30 Light emitting device

Publications (1)

Publication Number Publication Date
JPH08330635A true JPH08330635A (en) 1996-12-13

Family

ID=15644509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15720595A Pending JPH08330635A (en) 1995-05-30 1995-05-30 Light emitting device

Country Status (1)

Country Link
JP (1) JPH08330635A (en)

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KR100505308B1 (en) * 1998-11-05 2005-08-04 루미리즈 라이팅 유에스 엘엘씨 A surface mountable led package
WO2006064996A1 (en) * 2004-12-17 2006-06-22 Lg Innotek Co., Ltd Package for light emitting device and method for packaging the same
US8487519B2 (en) 2002-11-13 2013-07-16 Heptagon Micro Optics Pte. Ltd. Light emitting device
EP1743358A4 (en) * 2004-04-26 2014-03-26 Ge Lighting Solutions Llc ELECTROLUMINESCENT DIODE COMPONENT
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100505308B1 (en) * 1998-11-05 2005-08-04 루미리즈 라이팅 유에스 엘엘씨 A surface mountable led package
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US10309587B2 (en) 2002-08-30 2019-06-04 GE Lighting Solutions, LLC Light emitting diode component
US8487519B2 (en) 2002-11-13 2013-07-16 Heptagon Micro Optics Pte. Ltd. Light emitting device
EP1743358A4 (en) * 2004-04-26 2014-03-26 Ge Lighting Solutions Llc ELECTROLUMINESCENT DIODE COMPONENT
US8357947B2 (en) 2004-12-17 2013-01-22 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US8415696B2 (en) 2004-12-17 2013-04-09 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US8076691B2 (en) 2004-12-17 2011-12-13 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US9671099B2 (en) 2004-12-17 2017-06-06 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US8035121B2 (en) 2004-12-17 2011-10-11 Lg Innotek Co., Ltd. Package for light emitting device having a lens spaced from a light emitting device module
WO2006064996A1 (en) * 2004-12-17 2006-06-22 Lg Innotek Co., Ltd Package for light emitting device and method for packaging the same
US10677417B2 (en) 2004-12-17 2020-06-09 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US10139095B2 (en) 2012-05-04 2018-11-27 GE Lighting Solutions, LLC Reflector and lamp comprised thereof
WO2025142129A1 (en) * 2023-12-28 2025-07-03 ソニーグループ株式会社 Light-emitting device and image display device

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