JP2000077687A - Optical semiconductor device - Google Patents

Abstract

(57) [Problem] To make the outer shape of a light emitting element or a light receiving element as thin as possible, and to reduce the size of a module or set incorporating the same. SOLUTION: There are semiconductor chips 23 and 24 as a light emitting element and a light receiving element, and a resin sealing body 25 for sealing them.
Is made of a material that is transparent to light. Further, a groove 27 is formed on a region where light is emitted from the element and on a region where light is incident on the element, and the reflection surface 26 is formed here.
As a result, light can be emitted and incident through the side surface E. Further, since the island is supported by the suspension lead TL, the positional accuracy of the optical path can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device and an optical semiconductor module mounting the same.
In particular, the structure of the optical semiconductor device is made thinner, and light is emitted (or made incident) from the thinner side surface, thereby realizing miniaturization and thinning of a device using the same.

[0002]

2. Description of the Related Art Recently, multimedia equipment such as a sub-notebook personal computer, a portable information terminal, and an electronic still camera has been remarkably developed.

[0003] Moreover, 7 million portable devices are sold annually, and about 80% adopt the infrared system of the IrDA (InfraredData Association) standard. That is, transmission / reception between the external device and the main body via an infrared signal is required, and a light emitting element that emits infrared light and a light receiving element that receives infrared light are required.

An optical head used in an optical recording / reproducing apparatus such as an MD or a CD irradiates a beam onto an optical recording medium to detect a modulated beam from the optical recording medium, thereby recording and reproducing information. I do. Also here, a light emitting element and a light receiving element are required.

However, these light emitting elements and light receiving elements have not been reduced in size. For example, FIG.
The semiconductor laser 1 is directly disposed on a semiconductor substrate 2, and a prism 3 having a trapezoidal cross section is fixed to the semiconductor substrate 2. FIG. 4 is an optical recording medium. The inclined surface 5 of the prism 3 facing the semiconductor laser 1 is a semi-transmissive reflecting surface, and the prism surface 6 in contact with the semiconductor substrate 2 has a portion other than the photodetector (light receiving element) 7. The prism surfaces 8 facing each other are reflection surfaces.

A beam 9 emitted from the semiconductor laser 1 and incident on the prism 3 from the inclined surface 5 is reflected by the reflecting surfaces 6 and 8 and detected by the photodetector 7.

FIG. 16 shows an infrared data communication module 11, which includes an infrared LED, an LED driver, a PIN photodiode, an amplifier, and the like. For example, the LED 12 is mounted on a substrate, and light emitted from the LED 12 is emitted to the outside via the lens 13. The photodiode 14 mounted on the substrate has a lens 15
And enters the mold 11.

[0008]

In the above-mentioned module, the optical equipment is mounted above the semiconductor substrate in FIG. 15, so that a very advanced technique is required and the price is high. . In FIG. 16, light needs to be put in and out of the mold, and another optical semiconductor device needs to be set at the opposing position. Therefore, the set incorporating these has a thickness and cannot be miniaturized. There was a problem.

If the light is to be taken in and out in the horizontal direction in FIG. 16, the lead 16 of the optical semiconductor device 11 must be bent at 90 degrees as shown in FIG.
Depending on how the optical semiconductor device 11 is bent,
There was a problem with stability.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the aforementioned problems, and firstly, a semiconductor chip having a light receiving surface,
A sealing body for sealing the semiconductor chip, and a reflecting surface provided on the sealing body, which intersects a perpendicular line of the light receiving surface at a predetermined angle, and mounts the semiconductor chip on a lead frame. The problem is solved by extending a suspension lead of the island from a corner or a vicinity of the corner of the island.

Second, a semiconductor chip having a light emitting surface;
A substrate having a sealing body for sealing the semiconductor chip and a reflection surface provided on the sealing body so as to intersect the light emitting surface at a predetermined angle, and mount the semiconductor chip on a lead frame. The problem is solved by forming the island as a component, and extending the suspension lead of the island from the corner or the vicinity of the corner of the island.

In both cases, by providing means having a reflecting surface on the sealing body separately or integrally, it is possible to level the incident light or the emitted light while keeping the optical semiconductor device horizontal. If the position accuracy of the optical path of the light is improved, and these optical semiconductor devices are placed at opposing positions, optical communication becomes possible in the horizontal direction.

In addition, since the island is supported by the so-called four-direction hanging leads, when the resin is injected, the position accuracy of the island and the semiconductor chip mounted thereon can be improved, and the accuracy of the optical path of light can be improved. be able to.

In both the third and fourth embodiments, the problem is solved by forming the substrate on which the semiconductor chip is mounted from islands, which are one component of the lead frame, and extending the suspension leads to the opposite sides of the islands. Things.

As described above, since the suspension leads are provided on the island, when the resin is injected, the position accuracy of the island and the semiconductor chip mounted thereon can be improved, and the accuracy of the optical path of light can be improved. Can be enhanced.

Fifth, diffused reflection of light can be prevented by extending the suspension lead at the end of the lens.

Sixth, the lead led out from the island is led out from a surface facing the side surface on which the light is incident (or emitted), thereby preventing the light from being diffusely reflected as described above. Malfunction can be suppressed.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

For the sake of comprehension, the figures are made by integrating the three figures, wherein the upper left is a plan view of the optical semiconductor device, the lower left is a cross-sectional view taken along line AA of the plan view, and the upper right is the plan view. B-
It is sectional drawing in the B line.

First, there is a lead frame. This lead frame includes an island 21 and a lead 22 indicated by a two-dot chain line.
And a suspension lead TL, made of Cu here, and a semiconductor chip 23 indicated by a dashed line serving as a light emitting portion, and a semiconductor chip 2 indicated by a dashed line serving as a light receiving portion.
4 is fixed via fixing means such as solder.

The semiconductor chip 23 is, for example, an infrared LE.
D, a light emitting element such as a laser, and a driving circuit may be integrated. Infrared LEDs are arranged horizontally on the island as shown in FIG. 1 because they come out from the top surface of the chip. However, in the case of a semiconductor laser, light is emitted from the side surface of the chip, so a groove as shown is necessary. And not. However, in terms of manufacturing, it is simpler to provide the groove from one side to the other side as shown in FIG. 12 than to form the groove as shown in FIG. 3, and the groove may be formed thereon.

The semiconductor chip 24 is a photo sensor, such as a PIN diode, and the driving circuit of the PIN diode may be an integrated circuit.
Alternatively, a laser driving circuit may be integrally formed. Bonding pads are formed around these semiconductor chips. Correspondingly, a plurality of leads 22 extend from the periphery of the chips to the outside, and these are connected by thin metal wires. Here, the sealing material only needs to be transparent to light, and the material is not particularly limited. Further, since the light emitted from the LED is infrared light, any resin that transmits this infrared light may be used. In other words, it suffices to transmit at least the predetermined light, and the tip of the lead and the semiconductor chip are sealed with the sealing body 25 transparent to the light. The sealing body 25 has a groove 27 having a reflection surface 26.

A feature of the present invention resides in the reflection surface 26,
The reflecting surface is formed by forming a groove in the sealing body 25, whereby light can be emitted from the side surface E of the sealing body 25 and incident on the side surface E as indicated by a dotted arrow.

Conventionally, a semiconductor chip that constitutes a light emitting section and a light receiving section forms a semiconductor device by forming a prism and a lens on the semiconductor chip. Therefore, a module or set using the semiconductor chip has a thickness in the vertical direction of the set itself. However, since optical devices are arranged on and around the device, it is difficult to make the device thin and small. However, the reflecting surface 26 which is a part of the groove of the sealing body
By adopting the above structure, light can enter and exit from the side surface E of the sealing body. Therefore, a prism is unnecessary, and a lens can be formed on the side surface E if necessary. That is, as shown in FIG. 3, the convex lens L can be integrally molded on the side surface of the transparent sealing body, or a separate lens may be attached here. Therefore, the thickness of the device itself can be reduced.

The lead frame is made of Cu, the thickness is about 0.125 mm, and the thickness of the semiconductor chip is, for example, about 250 to 300 μm. The sealing body 25 is
It is made of a transparent epoxy material, for example, by transfer molding, and has a total thickness of about 1 mm to 1.5 mm. It goes without saying that if the thickness of the chip is reduced, it can be further reduced. The mold is also provided with a portion for forming a groove, and when the semiconductor chip is transfer-molded with a transparent resin sealing body, the groove is formed at the same time.

Here, the groove 27 may have a reflection surface without exposing the semiconductor chip. For example, the groove 27 has a depth of about half of the sealing thickness, here about 750 μm. The constituent part is at 45 °. The reflecting surface here becomes a reflecting surface due to the difference in the refractive index between the air on both sides of the interface and the transparent resin. However, since not all light is reflected, a metal film may be formed on the reflection surface.

As the coating method, vapor deposition and sputter deposition used in semiconductor technology can be considered, and in addition, plating can be considered. A point to be noted here is a short circuit with the coating material formed on the sealing body 25. The former two coating methods require a mask. When the whole is dipped in a solution by, for example, electroless plating, a resin is applied to a lead 22 of a lead-out part and a sealing body 25 around the lead-out part, and thereafter, plating is performed to remove the resin. I just need. In addition to the dip, this solution may be dropped only on the groove to perform plating. As the metal material, gold, Al, nickel and the like can be considered.

Since the mold is formed by electrical discharge machining, and is matte-finished in consideration of the releasability of a molded product, the portion corresponding to the reflection surface is mirror-polished, and the above-described reflection is performed. The film may be substituted for the surface, or the surface may be subjected to a film treatment. Further, since the light is incident or emitted from the side surface E, it is preferable that this portion is also subjected to mirror finishing.

In this embodiment, the leads can be arranged on the side E where light enters and exits (emission and incidence), particularly on the side F, G and H excluding the region where the lens is arranged.

The feature of the present invention lies in the suspension lead TL.
Since the optical semiconductor device requires precision in the optical path, the horizontal level of the island 21 is particularly required. Therefore, when the suspension leads TL are provided from the corners of the island or the vicinity thereof as shown in the figure, the horizontality of the island is maintained, the accuracy of the optical path can be maintained, and the accuracy of emitting light and the accuracy of capturing light are improved. You.

In the figure, the back surface of the island is exposed. When this back surface is also covered with resin, it is necessary to separate the island from the mold. In this case, too, the positional accuracy is reduced by the sealing pressure of the resin. Deteriorated, so-called 4 suspension lead T
Since L is used, the position accuracy of the island can be improved, and the accuracy of the optical path can be improved.

In consideration of reflection by a thin metal wire or a lead, only a hanging lead is arranged on the side surface E as much as possible, and no lead is arranged in a portion serving as an optical path of light.

In the plan view, a semiconductor chip as a light receiving portion has a light receiving element region (first region) formed substantially on the right side and a driving element region (second region) for driving the light receiving element region on the left side.
Is formed. That is, since the second semiconductor region does not serve as a light path, this region is defined as a region from which leads are led out,
It can be used as an area of a thin metal wire, and prevents noise due to light reflection or the like from entering the first area. Since the first region is shifted to the right, the groove 27 is also shifted to the right, and the region on the left from the groove can be secured as a region for extending the wire. If there is a first region on the left or center, the wire can be exposed from the groove.

Here, the two chips of the light emitting element and the light receiving element are individually mounted on each island.
It may be implemented on one island. In addition to the two chips, a passive element or an active element may be mounted.

When the optical semiconductor device described above is mounted on a resin film such as a printed circuit board, a ceramic substrate, an insulating metal substrate, or a TAB, for example, it is arranged horizontally as shown in the lower left sectional view of FIG. Modules and devices can be formed.

For example, when mounted on an IC card or the like, the thickness of the card itself can be reduced and optical signals can be exchanged in the lateral direction.

As described above, the island 21 is composed of two islands as shown by a two-dot chain line, but may be constituted integrally. Further, the resin sealing body 25 is formed by integrally molding two semiconductor chips, but may be individually formed. Naturally, two semiconductor chips may be fixed to one island and each of them may be individually molded, or may be separately molded like a discrete component separately from the lead frame.

The smallest rectangle surrounded by a dotted line indicates a portion where light is irradiated or light is emitted.

On the other hand, in FIG. 2, the surface 30 of the groove 27 other than the reflection surface 26 is made vertical. In this case, a region from the groove to the side surface can be secured as compared with FIG. However, if the surface is vertical, the releasability from the mold deteriorates. Therefore, it is better to incline slightly to the left.

FIG. 3 is a plan view of the optical semiconductor device actually formed. The center left is a plan view seen from above, the center right is a plan view of the plan view seen from the left, and the upper part is an AA of the plan view. It is a photo IC part in the sectional view of the line. The lower part is a plan view taken along the line BB, and shows a light emitting diode portion. Also, FIG.
It is the drawing which mounted the photodiode and LED on the lead frame.

Referring first to FIG. 4, the leads 22 extend only on the left side of the island 21 here.
In order to maintain the island level, the suspension leads T
L extends from a corner or near the corner of the island 21.

An extended portion 30 for bonding is formed at the tip of the lead, a bonding pad is formed on the left side and lower side of the IC chip, and the extended portion 30 and the bonding pad are electrically connected by wire bonding. Connected.

Reference numeral 31 denotes a chip mounted on a cup-shaped member as shown in the lower part of FIG. 3 for transmitting light upward. This cup is formed with a slanted side surface, and condenses the light that has flown to a position other than the upper portion at the inclined portion to efficiently fly upward. For example, it is a reflector (collector) formed around a bean ball of a portable lamp.

The cup may be fixed to an island provided with the suspension lead TL '. In this case, the cup is prepared as a separate component and soldered onto the island. The suspension leads here are also provided to maintain the horizontal accuracy of the island.

A PIN photodiode is formed in the light receiving section 24, and an IC circuit for driving is formed around the PIN photodiode. An LED driving circuit is built in the vicinity of the connection between the two wires extending from the LED. A rectangle indicated by a dotted line is a portion indicating a resin sealing region.

Referring to FIG. As can be seen from the left side of the center, two grooves having the reflection surface 26 are formed, and a wall 32 is formed between the grooves so as to block the gap. This groove may be formed continuously from one side to the other side as shown in FIG. 12, but with this structure, when an external force is applied, cracks are formed around the bottom of the groove. May occur. Therefore, when viewed in plan, the photo IC and LED
Are formed so as to surround the frame, thereby improving the strength against the destruction. Except for the reflection surface of the groove, a certain angle is provided to improve the mold release after molding (pulling characteristics of the optical semiconductor device). Naturally, the outer shape is also angled so as not to be parallel to the drawing direction in order to improve the release characteristics.

On the side surface E, a lens L having a spherical surface is provided. However, the lens L may be an elliptical lens. This optical semiconductor device is formed in an IrDA-like manner, and the lens L where the upper light receiving element is formed efficiently receives an external optical signal so that light shines on the light detection area of the light receiving element. Designed for The lower LED is designed so that emitted light reaches a detection area of another optical semiconductor device.

FIG. 5 illustrates another method of forming the reflecting surface, and the light is reflected on a substantially rectangular parallelepiped resin sealing body (a tapered surface may be formed in consideration of releasability as described above). A means having a surface 26 (hereinafter, referred to as a prism body 40) is fixed thereto. The prism body 40 and the resin sealing body need to be made of a material having at least an optical path indicated by a dotted line having transparency to predetermined light. Considering refraction, it is preferable that both are integrated as shown in FIG. However, they may be fixed as individual parts. In this case, those having substantially the same refractive index including the adhesive to be fixed are preferable.

FIG. 6 describes the substrate 41. As described above, it can be mounted on a resin film such as a printed board, a ceramic substrate, an insulating metal substrate, or TAB.

These are employed as so-called hybrid substrates, and include active elements such as semiconductor bare chips,
The passive element is fixed by solder or the like, and a predetermined function including the optical semiconductor device is realized. Further, the printed circuit board may be constituted by a molded chip.

For example, a metal substrate or the like generally has a frame member formed around the substrate and filled with an epoxy resin or the like. The area on the right side of the dotted line is at least a predetermined light. Materials that are permeable to them are preferred. In this case, the portion corresponding to the optical path of light needs to be made of a material that transmits light. Further, in the case of forming by a full mold, it is necessary that all are formed of a material that transmits light.

In many cases, the ceramic substrate is sealed with a full mold as in FIG. 2, and in this case, it is preferable that all of the material be transparent to predetermined light. In addition, for printed circuit boards, etc., to use general molded chips,
Only the right side from the dotted line may be sealed. However, it is more reasonable to simply mount the optical semiconductor device of FIG. 1 as shown in FIG.

FIGS. 7 and 8 show a case where the present invention is applied to a can type made of a ceramic package and a metal. FIG. 43 shows a ceramic package and a can 44 made of a metal. It is a permeable material and the inside has a hollow structure. Therefore, in this case, prisms 45 and 46 that transmit light having a reflection surface are provided in a portion serving as a lid, and the light is bent 90 degrees as indicated by a dotted line, and is emitted or incident in the horizontal direction. Since the drawings are used for describing the sealing body, specific leads, electrodes, fine metal wires, and the like are omitted.

In FIG. 4, the lead frame has been described. However, other than this lead frame, all lead frames used in the semiconductor field can be used. However, considering the stability of the island due to the resin pressure at the time of molding, it is preferable that the suspension leads are on the opposite sides.
The so-called four-way suspension leads extending from the four corners of the island are also important structures for improving the stability of the island and keeping the light directivity of the product constant.

Also, various sealing structures can be applied. For example, Electronics (October 1997, p. 74-)
As described in the above, the type in which the lead of the package is inserted into the through hole of the substrate, that is, the lead insertion type is inline type SIP, HSIP, ZIP, dual line type DIP, HDIP, SDIP, WDI.
P, PGA (pin grid array), and surface mount types that are directly soldered to the surface of the substrate using solder cream, etc. are SVP, SOP, SSOP, TSOP, HSO
P, QFP, TQFP, HQFP, QFN, SOJ, Q
FJ, BGA, LGA, DTP, QTP and the like can be considered.

Of course, face-up and face-down can be adopted, and CSP, B
GA is also possible.

FIGS. 9, 10 and 11 illustrate an IC card. This is a case in which a printed circuit board 48 to which circuit elements are soldered is placed in a metal case 47, and the entrance of light from the case 47 is open or a transparent material such as glass or plastic. Is provided. Although the optical semiconductor device 50 is shown here molded together with the substrate,
A component as shown in FIG. 1 may be mounted. FIG.
FIG. 1 is a schematic plan view of an IC card, in which light is emitted from the right side and emitted to the outside, and light from outside is taken in, and an optical signal is converted into an electric signal by an optical IC. The converted signal is stored in a memory such as a flash memory and an FRAM.

FIG. 11 illustrates a method of using an IC card.
9 realizes IrDA. As a power source of the IC card, a power source in which a battery is built in the IC card, a power source in which electromagnetic induction is performed using a coil, and the like can be considered. In addition, light has a large amount of data and a high speed, so that high-speed optical communication is possible. Furthermore, unlike the exchange of electrical signals,
Since electrical connection for signals is not required, there is no reduction in reliability due to poor electrical connection.

FIG. 12 shows a structure in which the present optical semiconductor devices 52, 53 are mounted on circuit boards 50, 51, and a signal exchange between the boards is realized. The optical signal is also transmitted upward using the reflection surface of FIG. 1 as a half mirror. The optical semiconductor device 55 is also mounted on the board 54, and realizes optical communication with the optical semiconductor device 56 on the back surface of the board in the vertical direction. Therefore, electrical wirings necessary for exchanging signals between circuit boards arranged horizontally and vertically are not required.

FIG. 13 is a reproduction of the reading of the optical medium of FIG. The light emitted from the laser 60 jumps once to the recording medium 62 via the reflection surface of the half mirror of the optical semiconductor device 61, and this light is reflected to the optical IC of the optical semiconductor device via the reflection surface of the half mirror. Then, the status of the recording medium 1 or 0 is determined.

FIG. 14 shows an optical semiconductor device 63 in which a laser 64 is integrally sealed in a sealing body, and a light emitting surface, a light receiving surface and a medium are arranged on a straight line. Further, in a triangle structure in which a laser and a light receiving element are attached as shown in the upper left of FIG.

[0062]

According to the present invention, first, a semiconductor chip having a light receiving surface, a sealing body for sealing the semiconductor chip, and the sealing member intersecting a perpendicular to the light receiving surface at a predetermined angle. Having a reflection surface provided on the stationary body, the optical path of light is incident from the side surface of the sealing body, is bent through the reflection surface,
By being incident on the light receiving surface, a semiconductor chip having a light emitting surface, a sealing body for sealing the semiconductor chip, and the light emitting surface intersecting at a predetermined angle are provided on the sealing body. A reflecting surface, and the optical path of the light is emitted from a side surface of the sealing body through the reflecting surface, so that a means having a reflecting surface in the sealing body is provided separately or integrally. Since the incident light or the outgoing light can be made horizontal while the optical semiconductor device is placed horizontally, the positional accuracy of the optical path of this light is improved, and if these optical semiconductor devices are placed at the opposing positions, Optical communication becomes possible in the horizontal direction.

Moreover, since the island is supported by the so-called four-direction hanging leads, when the resin is injected, the position accuracy of the island and the semiconductor chip mounted thereon can be improved, and the accuracy of the optical path of light can be improved. be able to.

In both the third and fourth embodiments, the substrate on which the semiconductor chip is mounted is made up of islands, which are one component of a lead frame, and the suspension leads are extended to opposing sides of the islands, so that the resin Injecting the island, the position accuracy of the island and the semiconductor chip mounted thereon can be improved, and the accuracy of the optical path of light can be improved.

Fifth, by extending the suspension lead at the end of the lens, irregular reflection of light can be prevented.

Sixth, the leads led out from the islands are led out from the surface opposite to the side surface on which the light is incident (or emitted), thereby preventing diffused reflection of the light as described above. Malfunction can be suppressed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of an optical semiconductor device according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a groove in FIG. 1;

FIG. 3 is an explanatory diagram of an optical semiconductor device according to an embodiment of the present invention.

FIG. 4 is a diagram illustrating a lead frame used in FIG. 3;

FIG. 5 is a view for explaining means for forming a reflection surface.

FIG. 6 is a diagram when applied to a hybrid substrate.

FIG. 7 is a drawing when applied to a ceramic package.

FIG. 8 is a drawing when applied to a can type package.

FIG. 9 is a diagram when applied to an IC card.

FIG. 10 is a schematic plan view of FIG. 9;

FIG. 11 is a diagram illustrating a relationship between an IC card and a computer.

FIG. 12 is a diagram in which the present optical semiconductor device is mounted on a circuit board arranged three-dimensionally.

FIG. 13 is a diagram in which the optical semiconductor device of the present invention is applied to an optical pickup.

FIG. 14 is a diagram in which the optical semiconductor device of the present invention is applied to an optical pickup.

FIG. 15 is a schematic view showing a combination of a conventional optical semiconductor device and an optical device.

FIG. 16 is a schematic view of a conventional optical semiconductor device.

FIG. 17 is a diagram in which a conventional optical semiconductor device is mounted on a circuit board.

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Hiroshi Inoguchi 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Inventor Tsutomu Ishikawa 2-5-2 Keihanhondori, Moriguchi-shi, Osaka No. 5 Sanyo Electric Co., Ltd. (72) Inventor Masatoshi Arai 2-5-2-5 Keihanhondori, Moriguchi-shi, Osaka Prefecture Sanyo Electric Co., Ltd. (72) Inventor Hiroshi Kobori, Keihanhondori, Moriguchi-shi, Osaka 2-5-5 Sanyo Electric Co., Ltd. (72) Inventor Hiroki Seyama 2-5-5 Keihanhondori, Moriguchi-shi, Osaka F-term in Sanyo Electric Co., Ltd. 5F041 AA37 DA03 DA07 DA17 DA17 DA22 DA25 DA26 DA43 DA55 DA57 DA83 EE17 5F088 AA03 BA20 JA06 JA10

Claims (6)

[Claims] 1. A semiconductor chip having a light receiving surface, a sealing body for sealing the semiconductor chip, and a reflecting surface provided on the sealing body at a predetermined angle with a perpendicular to the light receiving surface. An optical semiconductor device characterized in that the substrate on which the semiconductor chip is mounted is composed of an island, which is a component of a lead frame, and that a suspension lead of the island extends from a corner of the island or in the vicinity thereof. . 2. A semiconductor chip having a light emitting surface, a sealing body for sealing the semiconductor chip, and a reflecting surface provided on the sealing body at a predetermined angle with the light emitting surface. An optical semiconductor device, wherein the substrate on which the semiconductor chip is mounted is composed of an island, which is a component of a lead frame, and a suspension lead of the island extends from a corner of the island or in the vicinity thereof. 3. A semiconductor chip having a light receiving surface, a sealing member for sealing the semiconductor chip, and a reflecting surface provided on the sealing member so as to intersect a perpendicular to the light receiving surface at a predetermined angle. An optical semiconductor device, wherein the substrate on which the semiconductor chip is mounted is composed of an island, which is a component of a lead frame, and suspension leads are extended to opposing sides of the island. 4. A semiconductor chip having a light emitting surface, a sealing body for sealing the semiconductor chip, and a reflecting surface provided on the sealing body at a predetermined angle with the light emitting surface. An optical semiconductor device, wherein a substrate on which the semiconductor chip is mounted is composed of an island, which is a component of a lead frame, and suspension leads are extended to opposing sides of the island. 5. The lens according to claim 1, wherein a lens is provided on a side surface of the sealing body on which light of the optical semiconductor device enters and / or emits, and the suspension lead extends to an end of the lens. 5. The optical semiconductor device according to 3 or 4. 6. The lead according to claim 1, wherein the lead led out from the island is led out from a surface facing a side on which the light is incident (or emitted). Optical semiconductor device.