JPH0833242A - Microwave power transmission / reception device and mounting method thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] A microwave power transmission / reception device that has less variation in performance, can be mass-produced, and has a lighter weight, and facilitates mounting of the microwave power transmission / reception device on an aircraft or other body. A method for mounting a microwave power transmitting / receiving device is provided. [Structure] The multilayer laminated plate 1 which is a microwave power receiving device,
An antenna part layer 4 including an antenna element 2 formed of a microstrip line which is a conductor and an antenna substrate 3 made of Teflon glass fiber which is a dielectric, and a ground conductor layer 5 which is a conductor (copper foil) and serves as a voltage reference. Each layer of the rectifying circuit part layer 9 including the circuit substrate 6 made of Teflon glass fiber, which is a dielectric, and the rectifying circuit pattern 7 composed of a diode or the like for rectifying the high frequency signal received by the antenna element 2 is arranged in this order. It has a basic structure in which the layers are laminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to microwave transmission for transmitting electric power to a moving object such as outer space, an airship or an airplane, or an isolated object by microwave, and for receiving the electric power sent by microwave. The present invention relates to a power receiving device and a method of mounting the power receiving device.

[0002]

2. Description of the Related Art Microwave power transmission and reception technology
Energy can be sent to places such as outer space where power lines cannot be drawn, flying moving objects such as airships and airplanes, and isolated objects.

Currently, various researches and developments are being carried out to establish a technique for transmitting and receiving electric power by means of microwaves. For example, as shown in FIG. There is a technique in which electric power is transmitted, power is received by a microwave power receiving device provided on the bottom surface of an airplane and rectified into direct current, and thereby the power energy necessary for flight is sent to the airplane to fly.

As a microwave power receiving device provided in such a flying object as an airplane, a device as shown in FIG. 4 is known.

In the microwave power receiving device of FIG. 4, an antenna substrate 102, which is a dielectric material, on which an antenna element 101, which is a conductor for receiving microwaves, is attached to the upper surface, a paper honeycomb 103, and copper used as a voltage reference. Ground conductor 104 made of foil and rectifier circuit pattern 10
6 and a rectifying diode 107, which is a multilayer laminated plate made of a substrate 109 which is a dielectric material and is attached to the lower surface of the rectifying circuit 108. The antenna substrate 102 and the paper honeycomb 103 are bonded to each other. Bonding of the paper honeycomb 103 and the ground conductor 104 and bonding of the ground conductor 104 made of copper foil and the substrate 109 are performed using an adhesive.

In the microwave power receiving device of FIG. 4, the grounding conductor 104 made of copper foil is provided with a power feeding slot 10.
4a are formed.

The high-frequency signal received by the antenna element 101 is transmitted through the antenna element 101 and the rectifying circuit pattern 106 to the paper honeycomb 103 and the substrate 10.
The rectifying diode 1 of the rectifying circuit 108 is electromagnetically coupled via the feeding slot 104a formed in the ground conductor 104 made of copper foil via 2 and 109.
It is rectified by 07 and converted into a DC output.

The above method is usually called an electromagnetic coupling slot method.

In this electromagnetic coupling slot system, in order to efficiently convert a high frequency signal received by the antenna element 101 into a DC output, a certain amount of cavity is provided between the antenna element 101 and the copper foil 106 of the rectifier circuit 108. Although necessary, the paper honeycomb 103 having a relatively high specific strength is adopted because the weight increases as the thickness of the substrate or the copper foil increases.

Further, by adopting the paper honeycomb 103, it is possible to improve the strength when the microwave power receiving device is mounted on a flying body or the like.

[0011]

However, in such a conventional electromagnetic coupling slot type microwave power receiving device, since the substrates are bonded together by using an adhesive when forming a multi-layer laminated board, the antenna is used. There is a problem in that the permittivity between the element 101 and the copper foil 106 of the rectifier circuit 108 becomes nonuniform and the performance may vary.

Further, since the paper honeycomb 103 is used inside the multi-layer laminate, there is a problem that the electrical performance fluctuates greatly due to environmental conditions (particularly humidity), which makes it difficult to form an array or mass-produce it.

In addition, in order to equip the body of an airplane or the like,
Strong demand for a lighter microwave power receiving device,
Furthermore, when the outfitting surface of an aircraft or the like is a curved surface, it is difficult to outfit because this multilayer laminate is thin and easily broken,
There is a problem that the multi-layer laminated plate may be damaged if it is directly mounted on the machine body by a mounting means such as a screw.

On the other hand, by changing the rectifying circuit in the microwave power receiving device to a high frequency module circuit necessary for generating a high frequency signal radiated from the antenna element 101, it can be used as a microwave power transmitting device. The above-described problems also exist in the wave power transmission device, and it is also a problem to solve these problems.

[0015]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and is capable of being mass-produced with less variation in performance, and being a lighter and thinner microwave power transmitting / receiving device,
Another object of the present invention is to provide a method for mounting a microwave power transmitting / receiving device that facilitates mounting of the microwave power transmitting / receiving device on a body such as an airplane.

[0016]

A microwave power receiving device according to the present invention includes an antenna section layer comprising an antenna element which is a conductor and an antenna substrate which is a dielectric, and a ground conductor which is a conductor and serves as a voltage reference. Layer and a rectifying circuit section layer composed of a rectifying circuit for rectifying a high frequency signal received by a circuit board and an antenna element, which are dielectrics, are basically formed by a multilayer laminate plate in this order A microwave power receiving device that receives the transmitted power is characterized in that a ground conductor layer that is a conductor and a circuit board that is a dielectric are thermocompression bonded via a dielectric sheet. I am trying.

In the embodiment of the microwave power receiving device according to the present invention, the antenna in the multilayer laminated plate is used for electrically connecting the antenna element and the rectifier circuit and electrically connecting the ground conductor layer and the rectifier circuit. Through-hole plating may be formed between the element and the rectifying circuit and between the ground conductor layer and the rectifying circuit.

The microwave power transmission device according to the present invention includes an antenna part layer comprising an antenna element which is a conductor and an antenna substrate which is a dielectric, a ground conductor layer which is a conductor and serves as a voltage reference, and a dielectric. The circuit board and the high-frequency module circuit section layer composed of the high-frequency module circuit required to generate the high-frequency signal radiated from the antenna element are basically laminated in this order to generate electric power. A microwave power transmission device that transmits power by microwaves is characterized in that a ground conductor layer that is a conductor and a circuit board that is a dielectric are thermocompression bonded via a dielectric sheet.

In the embodiment of the microwave power transmission device according to the present invention, the multilayer laminated board is used to electrically connect the antenna element and the high frequency module circuit and electrically connect the ground conductor layer and the high frequency module circuit. Through-hole plating may be formed between the antenna element and the high-frequency module circuit and between the ground conductor layer and the high-frequency module circuit.

In the method for mounting the microwave power transmitting / receiving device according to the present invention, when the microwave power transmitting / receiving device is mounted on the surface of a flying body or the like to transmit / receive power, the multilayer laminated plate is a cushioning material such as foamed plastic. And is attached to the surface of a flying body or the like using a separable surface fastener made of a flexible member that is reinforced by a lightweight reinforcing member such as a paper honeycomb and has a hooking member that can be hung on each other. It is characterized by being configured.

[0021]

The microwave power receiving device according to the present invention has the above-mentioned structure, and when forming the multilayer laminated plate, the ground conductor layer as the conductor and the circuit board as the dielectric are used as the dielectric sheet. By bonding by thermocompression bonding via, the surface bonded by thermocompression bonding via the dielectric sheet becomes a uniform surface, which results from bonding substrates using an adhesive as in the past. The variation in performance due to the non-uniformity of the dielectric constant between the antenna element and the copper foil of the rectifying circuit will be eliminated, and since there will be no variation in performance, arraying and mass production will be easier. Moreover, since the paper honeycomb is not used in the multilayer laminate, the problem that the electric performance greatly varies due to the environmental conditions (particularly humidity) caused by the paper honeycomb is solved. That.

Furthermore, for electrical connection between the antenna element and the rectifying circuit and between the ground conductor layer and the rectifying circuit, between the antenna element and the rectifying circuit in the multilayer laminate and the ground conductor layer. By forming through-hole plating with the rectifier circuit, this through-hole plating becomes a conductive path, and the high frequency signal received by the antenna element is sent directly to the rectifier circuit. Since the cavity between the antenna element and the direct rectifying circuit is not required, the paper honeycomb is not required, and the multilayer laminated plate can be made thinner and lighter.

Further, since the microwave power transmitting device according to the present invention becomes a microwave power transmitting device by changing the rectifier circuit of the microwave power receiving device according to the present invention to a high frequency module circuit, the conventional microwave power transmitting device is The problem can be solved similarly to the operation in the microwave power receiving device according to the present invention.

In the method for mounting a microwave power transmitting / receiving device according to the present invention, when the microwave power transmitting / receiving device is mounted on the surface of a flying body or the like for power transmission / reception, the multilayer laminated plate is a cushioning material such as foamed plastic. By reinforcing with a lightweight reinforcing member such as a paper honeycomb and a paper honeycomb, it is possible to prevent the strength of the multilayer laminated plate from being reduced because the paper honeycomb is no longer used in the multilayer laminated plate, and the paper honeycomb is embedded in the multilayer laminated plate. By not using it, deterioration of the electric characteristics of the microwave power transmitting and receiving device due to the paper honeycomb can be prevented.

Also, a separable surface fastener (for example, usually called a magic tape or a magic fastener or a velcro fastener) which is made of a flexible member having a hooking member adapted to be hooked on each other. By attaching the microwave power transmission / reception device to the airframe such as a flying object, it is easy to install and remove, and when the microwave power reception device consisting of multiple antenna elements is made into several sub-arrays, Even if the surface is a curved surface, it will be fitted along this curved surface.

[0026]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional structural view of a multilayer laminated plate showing an embodiment of the microwave power receiving device according to the present invention.

In FIG. 1, a multi-layer laminated plate 1 which is a microwave power receiving device is an antenna portion which includes an antenna element 2 formed of a microstrip line which is a conductor and an antenna substrate 3 which is a dielectric and made of Teflon glass fiber. A layer 4, a ground conductor layer 5 which is a conductor (copper foil) and serves as a voltage reference, a circuit board 6 made of Teflon glass fiber which is a dielectric, a diode which rectifies a high frequency signal received by the antenna element 2, and the like. Each layer of the rectifier circuit part layer 9 including the rectifier circuit pattern 7 and the ground pattern 8 is laminated in this order.

Reference numeral 7a is a rectifying diode.

Then, the ground conductor layer 5 and the circuit board 6 are thermocompression bonded by using the dielectric adhesive sheet 10.

Furthermore, in order to electrically connect the antenna element 2 and the rectifier circuit pattern 7 and electrically connect the ground conductor layer 5 and the rectifier circuit pattern 7, through holes 11 are provided in the multilayer laminate 1. , 12 are respectively formed and through-hole plating is performed, and the through-hole plating serves as a conductive path to directly electrically connect the antenna element 2 to the rectifier circuit pattern 7 and the ground conductor layer 5 to the ground pattern 8. ing. The ground conductor layer 5 is provided with holes 13 so as not to short-circuit with the through-hole plating.

The high frequency signal received by the antenna element 2 is sent to the antenna element 2 and the rectifying circuit pattern 7, and the rectifying diode 7a and the rectifying circuit pattern 7 are sent.
It is rectified by a stub (not shown) that functions as a capacitor provided in the converter, converted into a DC output, and output to the outside of the multilayer laminate 1.

In the microwave power receiving device of FIG. 1, when forming the multilayer laminate 1, the ground conductor layer 5 and the circuit board 6 are bonded by thermocompression bonding via the dielectric sheet 10. Therefore, since the surface joined via the dielectric sheet 10 becomes a uniform surface, there is less variation in the dielectric constant at this joined surface. This reduces variations in the dielectric constant between the antenna element and the rectifying circuit pattern 7, and stabilizes the power receiving performance of the microwave power receiving device.

Furthermore, the stable power receiving performance of the microwave power receiving device facilitates arraying and mass production.

Further, as compared with the conventional microwave power receiving device, since the paper honeycomb is not used in the multilayer laminated plate 1, the electric performance fluctuates largely due to the environmental conditions (particularly humidity) caused by the paper honeycomb. This problem is solved, the multilayer laminate 1 can be made thinner and lighter, and the peel strength of the multilayer laminate 1 is increased. .

The method of directly supplying a high frequency signal from the antenna element 2 to the rectifying circuit, which is performed in the microwave power receiving apparatus of FIG. 1, is usually called a direct power feeding method. By adopting the method, the electromagnetic coupling slot method requires a certain amount of cavity between the antenna element 2 and the ground conductor layer 5 as compared with the direct power feeding method, but since this is not necessary, the multilayer laminated board 1 It is possible to reduce the thickness and weight of the product at the same time.

When a connecting cable, a connector or the like is used to electrically connect the antenna element 2 and the rectifying circuit pattern 7, the transmission loss of the microwave signal is caused by the bending of the cable or the contact resistance of the connector. However, there is a possibility that the phase fluctuation may occur and the power receiving efficiency of the microwave power receiving device may decrease, but the through holes 11 and 12 are formed in the multilayer laminate 1.
And the through holes are plated for electrical connection, the above problems do not occur.

Although the microwave power receiving device has been described with reference to FIG. 1, the rectifier circuit pattern 7 of FIG. 1 is used to convert the power supplied from the outside into a high-frequency signal and send the signal to the antenna element 2. If it changes to a high frequency module circuit that transmits microwaves, it becomes a microwave power transmission device.

FIG. 2 shows an embodiment of a mounting method according to the present invention on the surface of a machine body such as a flying body when transmitting and receiving power by mounting the above microwave power transmitting and receiving apparatus on the surface of the machine body such as a flying body. FIG.

In FIG. 2, a plurality of columnar expandable plastics 15 are formed on the surface of the rectifying circuit pattern 7 of the multilayer laminated plate 1.
Then, a paper honeycomb 16 which is a lightweight member having a relatively large specific strength is mounted on the foamable plastic 15. Although the multilayer laminate 1 is thin and easily broken, it is reinforced by doing so and is safe to some extent even when a force such as bending is applied to the multilayer laminate 1.

Then, a separable surface fastener (for example, usually called a magic tape or a magic fastener) is formed of a flexible member having a hooking member adapted to hang the upper surfaces of the paper honeycombs 16 from each other. Hereinafter, the multilayer laminated plate 1 is attached to the surface of a machine body such as a flying body using 17 and 17.

By doing so, it becomes easy to mount and remove the multi-layer laminated plate 1 on the surface of the body such as a flying body,
Further, if the velcro tape 17 is not attached to the entire paper honeycomb 16 but used in a scattered manner at a plurality of places, it is possible to cope with a curved surface having a certain degree of curvature.

Further, when the microwave power receiving device in FIG. 1 is formed into an array, if this is divided into a plurality of sub-arrays and the sub-arrays are mounted using the magic tape 17, even if the mounting surface is a curved surface, it is curved. You can outfit along.

[0044]

As described above, according to the microwave power transmission / reception device of the present invention, the ground conductor layer, which is a conductor, and the circuit board, which is a dielectric, are formed when a multilayer laminated plate is formed. It is possible to make the surface bonded through the dielectric sheet a uniform surface by thermocompression bonding and bonding through the dielectric sheet. It is possible to eliminate performance variation due to discontinuity in permittivity between the antenna board and rectifier circuit board due to bonding, and to stabilize the performance, so array and mass production Will be possible.

Further, since the paper honeycomb is not used in the multilayer laminated plate, it is possible to solve the problem that the electric performance fluctuates greatly due to the environmental conditions (particularly humidity) caused by the paper honeycomb.

In order to electrically connect the antenna element to the rectifying circuit pattern and to electrically connect the ground conductor layer to the ground pattern, between the antenna element and the rectifying circuit pattern in the multilayer laminate, and By forming a through-hole between the ground conductor layer and the ground pattern and performing through-hole plating, the through-hole plating serves as a conductive path to directly rectify the high-frequency signal received by the antenna element. It is possible to transmit power to the device, and because through-hole plating does not require wiring, it is possible to simplify and stabilize the performance, and a cavity between the antenna element and the direct rectification circuit required in the electromagnetic coupling slot system is required. By eliminating the need for paper honeycombs, it is possible to reduce the thickness and weight of multilayer laminates. Excellent effect that can be obtained.

According to the method for mounting a microwave power transmission / reception device of the present invention, when the microwave power transmission / reception device is mounted on the surface of a flying body or the like for power transmission / reception, a multilayer laminated plate is used as a cushioning material such as styrofoam, and By reinforcing the paper honeycomb with a lightweight reinforcing member such as a paper honeycomb, it is possible to prevent the strength of the multilayer laminate from being reduced due to the fact that the paper honeycomb is no longer used in the multilayer laminate. Since it is not used for the above, the electric characteristics of the microwave power transmitting and receiving device due to the paper honeycomb are not deteriorated.

Further, by attaching the microwave power transmission / reception device to a body such as a flying object using a surface fastener (velcro tape), it is easy to install and remove the microwave power transmission / reception device, and a microwave power reception device composed of a plurality of antenna elements is used. When the sub-array is made up of several sub-arrays, even if the fitting surface is a curved surface, it is possible to effect the fitting along the curved surface.

[Brief description of drawings]

FIG. 1 is a cross-sectional explanatory view showing an embodiment of a microwave power transmitting / receiving device according to the present invention.

FIG. 2 is an explanatory diagram showing an example of a method of mounting a flying body such as an airplane on a body surface of a microwave power transmission / reception device according to the present invention.

FIG. 3 is an explanatory diagram showing a state of power reception by a microwave power transmission / reception device in an airplane.

FIG. 4 is a cross-sectional explanatory view showing a conventional microwave power transmission / reception device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer laminated board (microwave power transmission / reception device) 2 Power receiving element 3 Antenna substrate 4 Antenna part layer 5 Ground conductor layer 6 Circuit board 7 Rectifier circuit pattern 7a Rectifier diode 8 Ground pattern 9 Rectifier circuit part layer 10 Dielectric Body sheet 11 Through hole (antenna element side) 12 Through hole (ground conductor layer side) 13 Hole provided in the ground conductor layer 15 Foamable plastic 16 Paper honeycomb 17 Velcro (velcro fastener)

Claims (5)

[Claims] 1. An antenna section layer comprising an antenna element which is a conductor and an antenna substrate which is a dielectric, a ground conductor layer which is a conductor and serves as a voltage reference, a circuit board and an antenna element which are dielectrics. In a microwave power receiving device that basically receives a power transmitted by a microwave, which is basically configured by a multi-layer laminated plate in which a rectifying circuit section layer configured by a rectifying circuit that rectifies a high-frequency signal received by A microwave power receiving device, wherein a ground conductor layer which is a conductor and a circuit board which is a dielectric are thermocompression bonded via a dielectric sheet. 2. An electrical connection between an antenna element and a rectifier circuit and an electrical connection between a ground conductor layer and a rectifier circuit are provided between an antenna element and a rectifier circuit in a multilayer laminate and a ground conductor layer. The microwave power receiving device according to claim 1, wherein through-hole plating is formed between the microwave receiving device and the rectifying circuit. 3. An antenna section layer comprising an antenna element which is a conductor and a substrate for an antenna which is a dielectric, a ground conductor layer which is a conductor and serves as a voltage reference, a circuit board which is a dielectric and an antenna element. Microwave power transmission, which basically consists of a multi-layer laminate board in which a high-frequency module circuit section layer composed of a high-frequency module circuit required to generate a high-frequency signal emitted from In the device, a ground conductor layer that is a conductor and a circuit board that is a dielectric are thermocompression-bonded via a dielectric sheet. 4. An electrical connection between an antenna element and a high-frequency module circuit and an electrical connection between a ground conductor layer and a high-frequency module circuit are provided between the antenna element and the high-frequency module circuit in the multilayer laminated board and the ground. The microwave power transmission device according to claim 3, wherein through-hole plating is formed between the conductor layer and the high-frequency module circuit. 5. A cushioning material such as foamable plastic and a multi-layer laminate when a microwave power transmission / reception device according to any one of claims 1 to 4 is mounted on a surface of a flying body or the like for power transmission / reception. Using a separable hook-and-loop fastener made of a flexible member, which is reinforced by a lightweight reinforcing member such as a honeycomb and has a hooking member adapted to be hung on each other, to be mounted on the surface of a projectile or the like. A method for mounting a microwave power transmission / reception device characterized by the above.