JPH08335656A - Heat dissipation device and electronic device using the same - Google Patents

Abstract

(57) [Abstract] [Purpose] It is an object to provide a heat dissipation device for an IC of a printed circuit board mounted with high density. According to another aspect of the present invention, there is provided a heat dissipation device which sandwiches a heat dissipating body that is in contact with a heat dissipating body provided on a substrate and dissipates heat generated by the heat dissipating body with the heat dissipating body and the heat generating body being in contact with each other. It has a structure having a body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device for an IC of a printed circuit board mounted in high density and an electronic device using the same.

[0002]

2. Description of the Related Art Printed circuit boards used in electronic equipment are
With the progress of digital circuits and the demand for high-density mounting, heat dissipation in heat-generating components of ICs has become a problem.

A conventional heat dissipation device for a printed circuit board will be described below. FIG. 5: is a figure explaining the structure of the conventional heat dissipation device. Fixing slots 14 and 15 are formed on the printed board 1 in order to fix the heat sink 17 to the IC 2 which is a heating element mounted on the printed board 1 which is a board. The heat radiating plate 17 and the fixing spring 13 are pre-compressed with each other. After mounting the semiconductor element on the printed circuit board, the heat radiating plate tip portion 16 is inserted into the fixing long hole 14 from the upper part of the board, and the other is fixed to the fixing long hole 15. Hold down while inserting. At this time, the heat dissipation plate 17 and the IC2 come into close contact with each other, and the heat dissipation of the IC2 can be achieved.

[0004]

In the conventional structure described above, a fixing slot for mounting the heat dissipation device is required on the printed circuit board, and therefore a space for providing the slot is required on the board. It was Therefore, there is a problem that the area of the substrate becomes large and it is difficult to reduce the cost, and it is difficult to design when wiring a multi-pin device such as QFP and LSI.

In the case of double-sided mounting, it is difficult to dissipate heat from both sides of the printed circuit board.

[0006]

In order to solve the above-mentioned problems, a heat dissipation device of the present invention includes a heat dissipation body which comes into contact with a heat generation body provided on a substrate and radiates heat generated by the heat generation body, and the heat radiation body. And a heating element that holds the heating element in contact with the heating element.

[0007]

With the above structure, the semiconductor element can be easily cooled through the radiators formed on both sides of the semiconductor element.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIG. An IC 2 that serves as a heating element is attached to one surface of a printed board 1 that serves as a board. Here, in order to dissipate the heat generated from the IC2, the radiator 3 is brought into contact with the IC2. As the method, a sandwiching body including a sandwiching piece 6 and a pressurizing portion 4 provided at an end portion of the sandwiching piece 6 for pressurizing so that the heat radiator 3 and the IC 2 can be sandwiched is used.
That is, a sandwiching body 6a capable of sandwiching the radiator 3 is formed at one end of the sandwiching piece, and the pressing portion 4 is formed at the other end. Examples of the pressing unit 4 include, for example, various elastic bodies,
Specifically, a spring or the like can be given. With this configuration, heat dissipation of the IC 2 mounted on the substrate becomes easy.

Further, in the present invention, the heat dissipating device comprising the heat dissipating body 3 and the sandwiching body is provided with the notch 5 formed on the printed circuit board.
I wear more. As a result, the heat dissipating device can be effectively prevented from being displaced, and the sandwiching body can be prevented from protruding laterally from the printed circuit board 1.

To summarize the differences from the conventional example shown in FIG. 5, first, the fixing slots 14 and 15 for fixing the heat dissipation device to the printed circuit board 1 are not required, so that the printed circuit board is reduced in size and mounted at a high density. Can be easily achieved.

Further, since it is only necessary to sandwich the IC, it becomes easy to attach the radiator, and the productivity in the assembly process is improved.

Further, by making a notch in the printed board 1 and mounting the notch in the notch, it is possible to easily prevent the problem of displacement of the heat dissipation device.

Next, a second embodiment of the present invention will be described with reference to FIG. ICs 2 serving as heating elements are mounted on both surfaces of a printed board 1 serving as a board. The structure of the heat dissipation device is the same as that of the first embodiment. With this configuration, even when the ICs 2 are mounted on both sides of the printed circuit board 1, the ICs can be easily mounted.
2 can be dissipated, and the heat dissipation of the double-sided mounting board, which is an example of a high-density mounting board in recent years, becomes easy.

Further, since it is only necessary to sandwich the IC, it becomes easy to attach the radiator, and the productivity in the assembly process is improved.

Further, as in the first embodiment, by mounting the heat dissipating device through the notch 5 formed on the printed circuit board, it is possible to effectively prevent the heat dissipating device from being displaced, and the sandwiching body is moved laterally. Further, it is possible to prevent it from protruding from the printed circuit board 1.

A third embodiment of the present invention is shown in FIG. Second
Similar to the embodiment described above, the ICs 2 serving as heating elements are mounted on both surfaces of the printed board 1 serving as a board. Here, as the heat dissipation device, the sandwiching piece 6, the pressing portion 4, and the heat dissipation body 3 are provided.
The one that is integrated is used. That is, the heat dissipation device has a configuration in which the heat dissipation body 3 is attached to the tip of a sandwiching body made of a material having elasticity formed in a U shape or a V shape, for example. Further, a heat radiation sheet 7 is attached to the surface of the heat radiator 3. With this configuration, even when the ICs 2 are mounted on both sides of the printed board 1, the IC 2 can easily radiate heat, and the double-sided board, which is an example of a recent high-density mounting board, can easily radiate heat.

Further, since the heat radiator is integrated, the heat radiator can be attached more easily than in the first and second embodiments, and the productivity in the assembly process is further improved.

Further, as in the first embodiment, by mounting the heat dissipating device through the notch 5 formed on the printed circuit board, it is possible to effectively prevent the heat dissipating device from being displaced, and the sandwiching body is moved laterally. Further, it is possible to prevent it from protruding from the printed circuit board 1.

A fourth embodiment of the present invention is shown in FIG. A heat radiating hole 9 is provided in a mounting portion of an IC 2 which is a heating element of a printed circuit board 1 which is a substrate, and a heat radiating sheet 7 is provided above the IC 2.
Are closely contacted with each other to form a heat dissipation plate / shield case A12. At the bottom of IC2, there is a heat sink and shield case B10.
The convex portion 11 of the shield case formed in the above is brought into contact.

With this structure, heat can be easily radiated from both sides of the IC even when mounted on one side. That is, by radiating heat from both sides of the IC2, the temperature rise of the IC2 can be made smaller than the conventional heat radiating from one side, so that it is possible to improve the quality such as reliability of a semiconductor element represented by the IC. Become.

Further, as in the case of the first embodiment, FIG.
The elongated slots 14 and 15 for fixing the heat dissipation device to the printed circuit board in the conventional example shown in (3) are not required, and the printed circuit board can be easily reduced in size and mounted in high density.

By using the heat dissipation device of the first to fourth embodiments described above, the reliability of each IC mounted on each substrate can be improved, and as a result, an electronic device using it can be obtained. The reliability of the device can be greatly improved.

Further, since the heat dissipation device can be easily attached to each substrate, the productivity of the electronic equipment as a whole can be improved and the cost of the electronic equipment can be reduced.

[0024]

According to the present invention, the heat dissipation of the semiconductor element is facilitated and the printed circuit board can be downsized. Further, since heat can be radiated from both sides of the printed circuit board, the quality such as reliability of the semiconductor element can be improved.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a heat dissipation device according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a heat dissipation device according to a second embodiment of the present invention.

FIG. 3 is a diagram illustrating a heat dissipation device of a third embodiment of the present invention.

FIG. 4 is a diagram illustrating a heat dissipation device according to a fourth embodiment of the present invention.

FIG. 5 is a diagram illustrating a structure of a conventional heat dissipation device.

[Explanation of symbols]

 1 Printed Circuit Board (Substrate) 2 IC (Heating Element) 3 Heat Dissipator 4 Pressing Section 5 Notch Section 6 Clamping Piece 6a Clamping Body 7 Radiating Sheet 8 Surface Mount Component 9 Radiating Hole 10 Radiating Plate / Shield Case B 11 Shield Case Convex Section 12 Radiating Plate / Shield Case A 13 Fixing Springs 14, 15 Fixing Long Hole 16 Radiating Plate Tip 17 Radiating Plate

Claims (6)

[Claims] 1. A heat dissipating body including a heat dissipating body that is in contact with a heat generating body provided on a substrate and that dissipates heat generated by the heat generating body, and a sandwiching body that sandwiches the heat dissipating body and the heat generating body in contact with each other. apparatus. 2. A heat-dissipating body which is in contact with a heat-generating body provided on the front and back surfaces of a substrate and dissipates heat generated by the heat-generating body, and a sandwiching body which sandwiches the heat-dissipating body and the heat-generating body in contact with each other. A heat dissipation device. 3. The sandwiching body has a sandwiching portion sandwiching a heat radiating body and a heat generating body at one end of the two sandwiching pieces, and both sandwiching pieces are connected to the other ends of the two sandwiching pieces and both sandwiching pieces are connected. The heat radiating device according to claim 1 or 2, further comprising a pressurizing portion for pressurizing one end of the heat dissipating member to sandwich the heat dissipating member and the heat generating member. 4. The heat dissipation device according to claim 3, wherein the sandwiching body and the heat dissipating body are integrated. 5. A first heat radiating body which is in contact with a heat radiating body provided on the substrate and radiates heat generated by the heat radiating body,
A heat dissipating device comprising: a second heat dissipating body that is in contact with the heat generating body through a through hole provided in the lower portion of the heat generating body of the substrate. 6. A heat dissipation device according to claim 1, further comprising a substrate provided with an electronic component that generates heat, and radiating the heat generated by the electronic component of the substrate. Electronic device provided with.