JPH10340983A - Heat sink for heat-generating components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink, in which the usable area in a board is made maximum and at the some time to enable use of a high-speed CPU. SOLUTION: A heat sink 16 is provided along the plane of a printed circuit board 1 and contacted with a heating part mounted on the printed circuit board to radiate the heat front the heating part. In this case an end part of the printed circuit board 1 is held by the heat sink 16. The heat sink 16 has a groove 17 for inserting one edge of the printed circuit board 1. The edge of the other side of the heat sink 16 is fixed by a fixing member 21, and the edge of the heat sink 16 has a plate-shaped projected part along the edge part of the printed circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink mounting structure for dissipating heat on components on a substrate in a component of an electronic device, and more particularly to a heat sink for a heat-generating component which makes effective use of the surface area of a substrate having a relatively small area. About.

[0002]

2. Description of the Related Art In recent years, with the demand for miniaturization of electronic devices, printed circuit boards have also been miniaturized. For example, there is an increasing demand for a cache size in which electronic components such as a CPU chip and a memory are mounted on a board of a cash card size and the functions of a personal computer are realized in a card size. In addition, there is a demand for speeding up of electronic devices, and the heat generation amount of the CPU tends to increase with the speeding up. Therefore, cooling of the CPU is an essential condition.

FIG. 3 is a perspective view of a cash card-sized printed circuit board 1 on which a CPU 2, a memory 3, and an interface connector 4 are mounted. FIG. 4 is a side view showing such a printed board 1 and a heat sink for cooling the CPU 2 mounted on the board.
Is fixed to the portion where is located via an adhesive 5 having good thermal conductivity.

By the way, such a CPU having a large heat generation amount
, It is necessary to use a heavy heat sink or a large heat sink. In that case, a hole for fixing the heat sink is formed in the substrate so that the adhesive 5 does not peel off even if vibration or impact is applied to the heat sink,
The heat sink corresponding to this hole is also provided with a screw hole and fixed with screws or the like. 5A and 5B, holes 8 are formed in four corners of the board 1 excluding the connector mounting portion (see FIG. 5B), and a screw hole 9 is formed in the heat sink 6a at a position corresponding to the hole 8 to form a screw. Reference numeral 11 denotes a fixed state.

[0005]

However, when a heat sink is mounted on a miniaturized substrate, it is difficult to make a hole in the substrate due to restrictions on component mounting. In practice, only a small and lightweight heat sink can be mounted. However, there was a limit to heat radiation (the higher the CPU speed, the greater the amount of heat generated). An object of the present invention is to solve such a drawback, and an object of the present invention is to provide a heat sink that can use a high-speed CPU while maximizing the area of a substrate.

[0006]

In order to achieve the above object, according to the present invention, a heat-generating component is provided along a plane of a printed circuit board, and contacts a heat-generating component attached to the substrate to release heat from the heat-generating component. A heat sink to be performed, wherein the heat sink is adapted to support an end of the printed circuit board, a groove is formed on one side into which one end of the printed circuit board is inserted, and the other end is The one end of the heat sink is fixed by a fixing member, and the end of the heat sink is provided with a long plate-shaped projection in a direction along the end of the printed circuit board.

[0007]

Since the heat sink supports the end of the printed circuit board, it is not necessary to make a hole in the circuit board. Since the groove is formed on one side of the heat sink and fixed by the fixing member, the mounting is easy. Further, since the long plate-shaped projection is provided in the direction along the end of the printed circuit board, the mounting to the housing is easy.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1A and 1B show an example of an embodiment of a heat sink of a heat generating component according to the present invention, wherein FIG. 1A is a perspective view and FIG. 1B is a side view. In the drawing, 1 is a printed board having a thickness t, 2 is a CPU having a height h, and 4 is a board 1
Is an interface connector attached near the end of the connector. a is the vertical width, and b is the horizontal width from the end of the board to the vicinity of the interface connector. Reference numeral 16 denotes a heat sink, and the material of the heat sink is formed of a metal having a high thermal conductivity (for example, a copper alloy or an aluminum alloy).

Reference numeral 17 denotes a groove, and the width t 'of the groove is
Is formed slightly larger than the thickness t, and the depth c is formed as shallow as possible so as not to shift when the substrate 1 is mounted on the heat sink 16. Numeral 18 is a step formed at two places above and below, and the height h ′ is formed to be the same as or slightly lower than the height h of the CPU in consideration of the height h of the CPU and the height of the adhesive 5. .

The height c 'of the step 18 located at the bottom is
7 corresponds to a depth c. 19 is a bottom plate having two holes 20, 21 is a fixing plate in which a screw hole 20 ′ corresponding to the hole 20 is formed, and the plate thickness of the fixing plate 21 is a thickness corresponding to the height c of the step portion 18. Become. In the drawing, a 'corresponds to the vertical width a of the board 1, and b' corresponds to the horizontal width b from the end of the board to the vicinity of the interface connector, and is slightly larger than the dimensions of a and b. Reference numeral 25 denotes a convex portion formed in a long plate shape along the horizontal width direction on the upper and lower portions of the heat sink, and the function of this convex portion will be described later.

FIG. 1B is a side view showing a state where the printed circuit board 1 is mounted on a heat sink 16 (an interface connector is omitted). As shown in the figure, the printed circuit board 1 is inclined, the upper part thereof is inserted into the groove 17, and the fixing plate 21 is fixed to the bottom plate 19 by screws 22 while pressing the lower part of the substrate against the lower step 18. At this time, the head of the CPU 2 comes into contact with the adhesive 5.

According to the above configuration, when the printed circuit board 1 is mounted on the heat sink 16, it is not necessary to form the holes 8 as shown in FIG. 5, and the depth of the groove 17 and the heights c and c 'of the step portion 18 are eliminated. The substrate can be made effective by minimizing the value of. In addition, a heat sink made of a heavy material such as copper or aluminum having a good thermal conductivity can be attached even to a small substrate such as a cache size. As a result, it is possible to mount a CPU that increases the cooling effect and generates a large amount of heat.

FIG. 2 shows an example of an embodiment in which the heat sink of the present invention having a printed board is mounted on a chassis 30. The chassis 30 has a pair of guide rails 31a, 31a, 31b, 32
a, 32b are formed. The groove width D of these guide rails is formed slightly larger than the width d of the protrusion 25 of the heat sink, and the entire heat sink 16 can be housed in the chassis 30 along the upper and lower grooves.

Reference numeral 35 denotes a printed circuit board to which a connector 4a connected to the connector 4 fixed to the printed circuit board 1 is fixed.
It is designed so that it can be inserted into. 36 is a cover of the chassis. According to such a configuration, since the guide rails in the chassis 30 support the heat sink 16, it is possible to improve environmental resistance against vibration, impact, and the like.

The shape of the heat sink is not limited to the illustrated example. For example, the mounting and disposition of electronic components on the printed circuit board is arbitrary, and the shape of the heat sink may be reversed, for example, the positions of the grooves and the bottom plate. In short, the end of the board is supported without making holes in the printed circuit board. Any shape is possible.

As described above, according to the present invention, there is provided a heat sink which is provided along the plane of a printed circuit board and contacts a heating element mounted on the board to radiate heat of the heating element. The heat sink supports the end of the printed circuit board, a groove for inserting one end of the printed circuit board is formed on one side, and the other end is fixed by a fixing member for fixing one end of the heat sink. A long plate-shaped protrusion is provided at the end of the printed circuit board in the direction along the edge of the printed circuit board. As a result, it is possible to use a high-speed CPU while maximizing the area of the board. We were able to.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing one embodiment of a heat sink of a heat generating component according to the present invention.

FIG. 2 is a perspective view showing a state where a heat sink to which a printed board is attached is attached to a chassis.

FIG. 3 is a perspective view of a printed circuit board 1 on which a CPU, a memory, and an interface connector are mounted.

FIG. 4 shows a printed board and a CP mounted on the board.
It is a side view which shows the heat sink for cooling U.

5A and 5B are a side view and a perspective view of a state in which holes are formed at four corners of a substrate, screw holes 9 are formed in heat sinks at positions corresponding to the holes, and the holes are fixed by screws 11. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 CPU chip 3 Memory 4 Interface connector 5 Adhesive 16 Heat sink 17 Groove 18 Step part 19 Bottom plate 20 Hole 21 Fixing plate 22 Screw 25 Convex part

Claims (4)

[Claims] 1. A printed circuit board is provided along a plane of the printed circuit board,
A heat sink for contacting a heat-generating component attached to the substrate to radiate heat of the heat-generating component, wherein the heat sink is configured to support an end of the printed circuit board. . 2. The method according to claim 1, wherein a groove into which one end of the printed circuit board is inserted is formed on one side, and the other end is fixed by a fixing member fixing one end of the heat sink. Item 2. A heat sink for a heat generating component according to item 1. 3. A heat sink for a heat-generating component according to claim 1, wherein a long plate-shaped projection is provided at an end of said heat sink along a direction along an end of said printed circuit board. 4. The heat sink according to claim 1, wherein the printed circuit board has at least a pair of parallel sides.