JPH0834363B2 - Positioning method for electronic components - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, assembly of a leadless electronic component when mounting a minute leadless electronic component on an electronic circuit board, or positioning of an electronic component generally used for a taping device. It is about the method.

2. Description of the Related Art Conventionally, leadless electronic components (hereinafter referred to as components) that have been attracted to a suction nozzle are moved to a prescribed setting location, and the two orthogonal directions are set by two pairs of claws, and then the components are mounted sequentially. The method of transferring to the position is adopted. In the supply direction, the components are generally rectangular in shape, and the long side direction is unified, and taped products are sequentially separated and supplied by a suction nozzle. At that time, the method of setting the parts is that the setting claws stand by at equal size positions toward the center of the part, or the setting claws in the long side direction of the part stand by at a position closer to the part. It was Therefore, the two pairs of setting claws set the short side surface of the component first. Alternatively, even if the direction is set in one direction first, if the longitudinal direction is reversed in the taping state, the face of the short side is set first.

Problems to be Solved by the Invention As described above, when the longitudinal adjustment of the component, that is, the face of the short side of the component is performed first, as shown in FIG. In the stable case, for example, in the case where the long side / short side ratio is 2/1, there is a drawback in that if there is an inclination of about 30 °, the direction of the component is rotated by 90 °.

In view of the above-mentioned problems, the present invention proposes a method for performing more accurate position regulation regardless of the component supply direction even when the suction posture of the component is relatively unstable.

Means for Solving the Problems In order to solve the above problems, the component position regulating method of the present invention has a plurality of suction nozzles that intermittently move in synchronization with a fixed path to sequentially suck electronic components. In the position regulating method of the electronic component in which the electronic component is regulated in two directions orthogonal to each other by the position regulating means arranged at the position regulating position in the middle of performing the transfer. To the position regulating means, which has two pairs of adjusting claws, and the pair of adjusting claws are closed before the other pair of adjusting claws, the long side surface of the electronic component sucked by the suction nozzle. After the suction nozzle is rotated in advance to the angle which is regulated first, the long side surfaces of the component are regulated from both sides at the position regulating position, and then the short side surfaces are regulated from both sides.

Action The present invention has the above-described configuration, and when the state of picking up a component is unstable, for example, when the long side / short side ratio of the previous example is 2/1, 6
Even if there is an inclination of about 0 °, the position can be adjusted in the normal direction.

Example A leadless electronic component mounting apparatus to which the position regulating method for a leadless electronic component according to an embodiment of the present invention is applied will be described below with reference to the drawings.

FIG. 1 shows the configuration of a leadless electronic component mounting apparatus according to an embodiment of the present invention.

The printed circuit board 1 is held in advance on an XY table 2 which can be moved to an arbitrary position in the XY directions, and the parts 3 are set in a cut 4 which sequentially supplies taped parts whose lengthwise directions are unified in advance. They are arranged on a Z table 5 that can be moved to any position in the Z direction. When the suction nozzle 6 picks up the component 3 from the Z table 5 at the suction position A,
By suction holding and specifying in advance, the suction nozzle 6
Is selectively rotated at the rotation position B, and is moved at a predetermined position regulation position C by means provided separately, and bidirectional position regulation is performed. Further, the mounting direction is rotated at the D station to be mounted at the mounting position E. The process configuration is such that mounting is performed on the printed circuit board 1.

As shown in FIG. 2, at the position regulating position C, two pairs of claws 7, that is, the position regulating means are on standby in two directions orthogonal to each other, and when the nozzle 6 moves the component 3, Start moving to the center and position the parts. At that time, a process in which the claw 7b that regulates the long side surface of the component from both sides starts to move first, and after the component 3 is regulated, the claw 7a that regulates the short side surface from both sides moves to the second. Therefore, the feature is that the inclination of the suction posture can be corrected more surely in the normal direction.

As described above, according to the present invention, when the components sucked by the suction nozzles are calibrated from two directions orthogonal to each other, by selectively rotating the suction nozzles before the calibration, the rectangular component is always rotated. It is possible to adopt a method of normalizing the long side face first and the short side face second, so that the inclination in the adsorption state can be regulated more accurately in the normal direction.

[Brief description of drawings]

FIG. 1 is an explanatory view showing an operation explanation for mounting a leadless electronic component in an embodiment of the present invention, FIG. 2 is an explanatory view showing a position regulating process, and FIG. 3 is a positional regulation of a conventional leadless electronic component. It is explanatory drawing which shows a process. 3 ... parts, 6 ... suction nozzle.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Yoshihiko Misawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-58-188200 (JP, A) JP-A-55-65441 (JP, A) JP 59-86299 (JP, A)

Claims (1)

[Claims] 1. A plurality of suction nozzles, which are intermittently moved in synchronization with a fixed path, sequentially pick up electronic components at a suction position and transfer the electronic components to a mounting position. The electronic components are arranged at a position regulating position during the transfer. In the position regulating method of the electronic component, wherein the electronic component is regulated in two directions orthogonal to each other by the position regulating means described above, the electronic component has two pairs of regulating pawls orthogonal to each other, and one pair of regulating pawls is another pair of regulating pawls. With respect to the position regulating means configured to be closed earlier, after rotating the suction nozzle in advance to an angle at which the long side surface of the electronic component attracted to the suction nozzle is regulated first, after the position regulating position. A position regulating method for electronic components, characterized in that the long side surface of a component is regulated from both sides and then the short side surface is regulated from both sides.