JPH083496B2 - Prober - Google Patents

Prober

Info

Publication number
JPH083496B2
JPH083496B2 JP63185941A JP18594188A JPH083496B2 JP H083496 B2 JPH083496 B2 JP H083496B2 JP 63185941 A JP63185941 A JP 63185941A JP 18594188 A JP18594188 A JP 18594188A JP H083496 B2 JPH083496 B2 JP H083496B2
Authority
JP
Japan
Prior art keywords
prober
needle
wafer
polyhedron
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63185941A
Other languages
Japanese (ja)
Other versions
JPH0236368A (en
Inventor
知行 森井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63185941A priority Critical patent/JPH083496B2/en
Publication of JPH0236368A publication Critical patent/JPH0236368A/en
Publication of JPH083496B2 publication Critical patent/JPH083496B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明はポジショナー取付台を多層構造し、ウェハー
内の任意の時点をウェハーの広い領域にわたってプロー
ビングすること、又、針を多面体面上に設置し、多面体
周辺から面に向うウェハーを移動させ、立体的にプロー
ビングし、ウェハー処理枚数を向上させることに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a multilayer structure of a positioner mount, probing an arbitrary time point in a wafer over a large area of the wafer, and placing a needle on a polyhedral surface. The present invention relates to moving a wafer from the periphery of a polyhedron toward a surface and probing it three-dimensionally to improve the number of wafers to be processed.

従来の技術 従来、ポジショナー取付台は1枚であり、マニュアル
プローバーの場合は通常マニピュレータが4〜5ケ且
つ、針の移動範囲も10平方ミリメートル程度のものがあ
る。
2. Description of the Related Art Conventionally, there is one positioner mount, and in the case of a manual prober, there are usually 4 to 5 manipulators and a needle moving range of about 10 mm 2.

オートプローバーの場合は、1枚のプローブカードを
使用し、1チップごとにプロービングするものがある。
In the case of an auto prober, there is one that uses one probe card and performs probing for each chip.

発明が解決しようとする課題 1層のポジショナー取付台から成るプローバーでは、
装着できるポジショナー,マニピュレータに制限があり
且つ、針の移動範囲にも制限があるため、プロービング
できるパターン数が限られる。更に、プローバーガード
を用いるとリーク,ノイズの問題が生じる。
Problems to be Solved by the Invention In a prober including a single-layer positioner mount,
Since the number of positioners and manipulators that can be mounted is limited and the range of movement of the needle is also limited, the number of patterns that can be probed is limited. Furthermore, if a prober guard is used, problems of leak and noise occur.

又、ウェハーに対し針を近づける形式では、ウェハー
処理枚数に制限があり(通常1枚)大量処理に不向きで
ある。
Further, in the type in which the needle is brought closer to the wafer, the number of wafers to be processed is limited (usually one wafer), which is not suitable for large-scale processing.

本発明は以上のような従来のプローバーの諸欠点に鑑
みてなされたもので、より精度良く大量にウェハーを処
理するプローバーを提供することを目的としている。
The present invention has been made in view of the above drawbacks of the conventional prober, and an object thereof is to provide a prober that processes a large number of wafers with high accuracy.

課題を解決するための手段 本発明は、多面体の面上に針を設けウェハーを針に向
けて移動することを特徴とする積層型プローバー及び立
体型プローバーである。
Means for Solving the Problems The present invention is a stacked prober and a three-dimensional prober, characterized in that a needle is provided on the surface of a polyhedron and a wafer is moved toward the needle.

作用 多面体の面上に針を設け、ウェハーを針に向けて移動
させ針と接触させることにより一度に多数枚のウェハー
をプロービングすることができる。
Action By providing a needle on the surface of the polyhedron and moving the wafer toward the needle to bring it into contact with the needle, it is possible to probe a large number of wafers at once.

実施例 以下に本発明の一実施例について図面とともに説明す
る。
Embodiment An embodiment of the present invention will be described below with reference to the drawings.

第1図は、積層型プローバーの全面から見た場合の断
面図であり、グローバルボード2−A,2−B,2−Cが固定
柱3に装着されていてる。各グローバルボード2−A,2
−B,2−Cは、固定柱3上のストッパー4間を上下移動
することにより、ウェハーステージ5上のウェハー6を
プロービングする。各グローバルボード2−A,2−B,2−
Cは、独立に移動できるため、必要なウェハー6上の地
点のみをプロービングすることができる。グローバルボ
ード2−A,2−B,2−Cには、ポジショナー7及びマニピ
ュレータ8が装着されており、1つのマニピュレータ8
の先にローカルボード9を装着することにより、固定さ
れたパターンのプロービングを容易にする。
FIG. 1 is a cross-sectional view of the laminated prober as viewed from the entire surface, in which the global boards 2-A, 2-B, 2-C are mounted on the fixed column 3. Each global board 2-A, 2
-B and 2-C move up and down between the stoppers 4 on the fixed column 3 to probe the wafer 6 on the wafer stage 5. Each global board 2-A, 2-B, 2-
Since C can move independently, it is possible to probe only the point on the wafer 6 that is necessary. A positioner 7 and a manipulator 8 are mounted on the global boards 2-A, 2-B, 2-C, and one manipulator 8 is installed.
By mounting the local board 9 at the tip of the, the probing of the fixed pattern is facilitated.

第2図は、積層型プローバーを上面から見た図であり
上層のグローバルボード2−Aの開口半径を小さくする
ことにより、マニピュレータどおしの接触を防ぐ構造と
なっている。
FIG. 2 is a view of the laminated prober as seen from the top, and the structure is such that the contact between the manipulators is prevented by reducing the opening radius of the upper global board 2-A.

又、各層ごとに、ポジショナー7の位置をずらせるこ
とによりマニピュレータどおしの接触を防ぐことができ
る。
Further, by shifting the position of the positioner 7 for each layer, it is possible to prevent contact between the manipulators.

第3図は、針11を立方体箱12に露出させ、外部からウ
ェハー13−A〜13−Fを吸着装置14−A〜14−Fで吸着
しながら針11の方向に移動させプロービングするもので
ある。このとき、立方体箱12の面は6面あるので一度に
6枚のウェハー13−A〜13−Fのプロービングを行うこ
とができる。
In FIG. 3, the needle 11 is exposed in the cubic box 12, and the wafers 13-A to 13-F are moved from the outside to the needle 11 while being adsorbed by the adsorption devices 14-A to 14-F and probing. is there. At this time, since the cube box 12 has six surfaces, six wafers 13-A to 13-F can be probed at one time.

発明の効果 本発明は、多面体表面に針を露出させ、ウェハーを針
の方向に移動させプロービングすることにより、多数枚
のウェハーのプロービング処理を可能にするものであ
る。
EFFECTS OF THE INVENTION The present invention enables probing processing of a large number of wafers by exposing a needle on the surface of a polyhedron and moving the wafer in the direction of the needle for probing.

【図面の簡単な説明】[Brief description of drawings]

第1図は、本発明の一実施例における積層型プローバー
の断面図、第2図は同プローバーの上面図、第3図は本
発明の一実施例における立体型プローバーの外観図であ
る。 1……積層型プローバー、2……グローバルボード、3
……固定柱、4……ストッパー、5……ローカルボー
ド、6……ウェハー、7……ポジショナー、8……マニ
ピュレータ、9……小型プローブカード。
FIG. 1 is a sectional view of a laminated prober in one embodiment of the present invention, FIG. 2 is a top view of the same prober, and FIG. 3 is an external view of a three-dimensional prober in one embodiment of the present invention. 1 ... Stacked prober, 2 ... Global board, 3
...... Fixed column, 4 ... Stopper, 5 ... Local board, 6 ... Wafer, 7 ... Positioner, 8 ... Manipulator, 9 ... Small probe card.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】多面体の表面に前記多面体の内部から外部
方向に向いて形成された針と、ウエハーを前記多面体周
辺から前記針に対して垂直に移動させるとともに前記ウ
エハと前記針とを接触させる手段とを有するプローバ
ー。
1. A needle formed on the surface of a polyhedron facing from the inside to the outside of the polyhedron, a wafer is moved vertically from the periphery of the polyhedron to the needle, and the wafer and the needle are brought into contact with each other. A prober having means.
【請求項2】多面体の複数の面に針を形成し、同時に複
数枚のウエハーをプロービングすることを特徴とする特
許請求の範囲第1項記載のプローバー。
2. A prober according to claim 1, wherein needles are formed on a plurality of surfaces of the polyhedron and a plurality of wafers are simultaneously probed.
JP63185941A 1988-07-26 1988-07-26 Prober Expired - Fee Related JPH083496B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63185941A JPH083496B2 (en) 1988-07-26 1988-07-26 Prober

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63185941A JPH083496B2 (en) 1988-07-26 1988-07-26 Prober

Publications (2)

Publication Number Publication Date
JPH0236368A JPH0236368A (en) 1990-02-06
JPH083496B2 true JPH083496B2 (en) 1996-01-17

Family

ID=16179561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63185941A Expired - Fee Related JPH083496B2 (en) 1988-07-26 1988-07-26 Prober

Country Status (1)

Country Link
JP (1) JPH083496B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04314347A (en) * 1991-04-12 1992-11-05 Nec Kyushu Ltd Ic inspection device
WO2009099122A1 (en) * 2008-02-05 2009-08-13 Nec Corporation Semiconductor inspecting device, and semiconductor inspecting method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236139Y2 (en) * 1986-08-06 1987-09-14

Also Published As

Publication number Publication date
JPH0236368A (en) 1990-02-06

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