JPH0837208A - Semiconductor element mounting method and device - Google Patents

Abstract

(57) [Summary] [Object] To provide a semiconductor element mounting apparatus for mounting a semiconductor element at a predetermined position on a substrate by using a film adhesive member. [Structure] The mounting tool 25 has a support surface at a temporary mounting position with the support surface facing upward, mounts the opposite side of the mounting surface of the bare IC13, operates a vacuum mechanism to suck and hold the bare IC13, and 90 ° C to 1 ° C.
Heat to 30 ° C. The pressurizing tool 27 is moved down to push down the anisotropic conductive film 12 supported by the support member 26 with a predetermined tension, so that the anisotropic conductive film 12 is pressed against the mounting surface of the bare IC 13. Only a part of the anisotropic conductive film 12 pressed against the mounting surface in the heated state remains. By heating and pressurizing by the mounting tool 25, the thermosetting anisotropic conductive film 12 is once melted and then cured. The bare IC 13 is mechanically fixed on the substrate 11, and the bare I
The mounting is completed by conductively connecting the connection electrode of C13 and the wiring pattern on the substrate 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element mounting method and apparatus for mounting a semiconductor element at a predetermined position on a substrate using a film adhesive member.

[0002]

2. Description of the Related Art Generally, when a semiconductor element such as a bare IC is directly mounted face down at a predetermined position on a substrate, a film adhesive member such as an anisotropic conductive film (ACF) or a sheet adhesive is used. It is known to be implemented using.

In this mounting method, an anisotropic conductive film cut out a little larger than the semiconductor device mounted on the mounting portion of the substrate is positioned, and the semiconductor device mounted on this anisotropic conductive film. The mounting surfaces are stacked and the semiconductor element is heated and pressed to melt and cure the anisotropic conductive film, and the semiconductor element is mechanically and electrically integrated and mounted on the substrate. is there.

In this mounting, first, as shown in FIGS. 6 and 7, an anisotropic conductive film 12 as a film adhesive member is positioned on a predetermined mounting portion of the substrate 11. The anisotropic conductive film 12 is cut out to be slightly larger than the mounting surface area of the bare IC 13 as a semiconductor element shown in FIGS. 10 and 11, and the separator 12a is attached to the upper surface of the anisotropic conductive film 12. It is attached so that the opposite side of the separator 12a is in contact with the substrate 11.

Next, as shown in FIG.
To press the anisotropic conductive film 12 from above the separator 12a, or to press and heat the anisotropic conductive film 12 to form the anisotropic conductive film 12 on the substrate 11a.
Paste on top. After this, as shown in FIG.
12a is stripped from the anisotropic conductive film 12.

Next, as shown in FIG.
This sucks and holds the non-mounting surface of the bare IC 13 to be mounted and heats the bare IC 13 to a predetermined temperature. Then, the mounting surface of the heated bare IC 13 provided with the bumps 16 is brought into pressure contact with a predetermined mounting position on the substrate 11 where the anisotropic conductive film 12 is attached. At this time, bare IC13
Is heated to a predetermined temperature, and the anisotropic conductive film 12 is once hardened and then hardened due to the thermosetting property. By this operation, the bare IC 13 is mechanically fixed to the substrate 11, and the conductive particles in the anisotropic conductive film 12 form the wiring pattern (not shown) formed on the substrate 11 via the bumps 16. Conductive connection.

After that, as shown in FIG.
The mounting operation is completed by removing 15 from the bare IC 13.

However, in the mounting method described above, the substrate
The bare IC 13 is mounted on the anisotropic conductive film 12 pasted on 11. However, considering the positional accuracy, the anisotropic conductive film is
It is necessary to use a device 12 having a size slightly larger than the mounting surface of the bare IC 13. Therefore, when mounting, the bare I
When the anisotropic conductive film 12 is pressed by C13, bare IC13
The part directly below the IC hardens after melting, but bare IC
Since the heat from the bare IC 13 is not sufficiently transmitted, the portion of the portion 13 protruding outside the mounting surface remains in an uncured state.

As described above, when a portion of the anisotropic conductive film 12 remains uncured, impurities contained in the uncured portion of the resin of the anisotropic conductive film 12 corrode the wiring pattern on the substrate 11. However, there is a problem in that the adhesiveness with the protective resin applied on or around the bare IC 13 is hindered after mounting. In particular, when the precise positioning of the anisotropic conductive film 12 with respect to the substrate 11 is omitted, it is necessary to attach the anisotropic conductive film 12 that is considerably larger than the outer shape of the bare IC 13, and the above-mentioned problem becomes more remarkable. Significant waste of material occurs.

Further, at the time of temporary attachment shown in FIG. 8, a separator 12a needs to be attached to the side in contact with the temporary attachment tool 14, and a step of peeling off the separator 12a immediately before mounting the bare IC 13 is required. Become. However, it is difficult to automate the process of peeling the separator 12a, and it is also difficult to incorporate it into the mounting machine.

[0011]

As described above, according to the conventional method, the anisotropic conductive film larger than the bare IC 13 to be mounted is used.
12 is required. Therefore, an uncured portion is generated in the anisotropic conductive film 12, and the anisotropic conductive film 12 remains on the substrate 11, resulting in corrosion of the wiring pattern and deterioration of adhesion of the protective resin. And wastes material. Further, in the temporarily attached state, it is necessary to attach the separator 12a to the anisotropic conductive film 12, and therefore the separator 12a must be peeled off immediately before mounting, which makes automation of the entire device difficult. .

An object of the present invention is to use a film adhesive member having a size substantially the same as the mounting surface of a semiconductor element to be mounted,
An object of the present invention is to provide a semiconductor element mounting method and an apparatus thereof, in which an uncured portion of the film-like adhesive member does not occur and materials are not wasted, and the separator peeling work immediately before the mounting work is unnecessary.

[0013]

According to a first aspect of the present invention, there is provided a method for mounting a semiconductor element, wherein a sheet-shaped separator is attached to one surface of a mounting surface of the semiconductor element heated to a predetermined temperature. Is pressed from the opposite side of the separator, and after this pressure is applied, the other part of the film-shaped adhesive member including the separator is separated from the mounting surface to transfer the film-shaped adhesive member onto the mounting surface, and the transfer After that, the mounting surface of the semiconductor element to which the film-shaped adhesive member is transferred is pressed and heated at a predetermined mounting position on the substrate to be bonded.

A mounting device for a semiconductor element according to a second aspect is
In a semiconductor element mounting device for mounting a semiconductor element at a predetermined position on a substrate via a film-like adhesive member, the semiconductor element is detachably held, and the semiconductor element is heated to a predetermined temperature in this holding state, A mounting tool for pressing the semiconductor element to a predetermined position on the substrate and a temporary attachment position different from the predetermined mounting position of the mounting tool on the opposite side of the separator of the film-like adhesive member having the separator attached to one surface thereof. A supporting member facing the mounting surface of the semiconductor element held by the mounting tool at a predetermined interval, and the film-like adhesive member supported by the supporting member are pressed against the mounting surface of the semiconductor element, and the mounting is performed. And a pressing tool for transferring a portion corresponding to the surface onto the mounting surface.

[0015]

According to the method of mounting a semiconductor element of claim 1, only a portion corresponding to the mounting surface of the film adhesive member is transferred onto the mounting surface of the semiconductor element, and the semiconductor is transferred via the transferred film adhesive member. Since the element is mounted on the substrate, the uncured portion of the film-like adhesive member is not generated and the material is not wasted.The separator is peeled off from the film-like adhesive member during transfer. Eliminates the need for peeling work and facilitates automation.

According to a second aspect of the present invention, there is provided a mounting device for a semiconductor element, wherein the mounting surface of the semiconductor element, which is held by a mounting tool and heated to a predetermined temperature, is attached to the side opposite to the separator of the film-like adhesive member by a pressing tool. By pressing and separating the other part of the film adhesive member including the separator from the mounting surface, only the part corresponding to the mounting surface of the film adhesive member can be transferred onto the mounting surface, and the separator is automatically transferred from this transfer part. Can be stripped off. Therefore, the uncured portion of the film-like adhesive member and the waste of the material are not generated, and the separator peeling work immediately before the mounting work is unnecessary.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor element mounting apparatus of the present invention will be described below with reference to the drawings. The parts corresponding to the conventional example will be described with the same reference numerals.

1 to 3, reference numeral 25 denotes a mounting tool, which is a bare IC as a semiconductor element.
This bare IC 13 holds the 13 detachably.
Are provided with bumps 16 for conductive connection on the mounting surface. The mounting tool 25 is at a temporary mounting position different from the predetermined mounting position on the substrate 11, that is, the mounting tool 25 holds the bare IC 13 at the temporary mounting position with the mounting surface having the bumps 16 facing upward. are doing.

The mounting tool 25 has a heater (not shown) for heating the suction-held bare IC 13 to a predetermined temperature. The bare IC 13 may be heated by a constant heating method or a so-called pulse heating method that heats rapidly when necessary.
In this embodiment, the pulse heating method is used.

On the other hand, 26 is a roller-shaped support member, and this support member 26 has an anisotropic conductive film (ACF) 12 which is a thermosetting film-like adhesive member having conductive particles having a separator 12a attached to one surface thereof. Is supported so that the opposite side of the separator 12a faces the mounting surface of the bare IC 13 held by the mounting tool 25 at a predetermined interval. Here, the anisotropic conductive film 12 may be in a sheet shape or a tape shape, but here, the tape shape is used.

Although the anisotropic conductive film 12 is intermittently fed in the lengthwise direction by a supply mechanism (not shown), the support member 26 keeps the anisotropic conductive film 12 upward by a predetermined tension. In this state, the bare IC 13 is supported so as to maintain a predetermined distance from the mounting surface of the bare IC 13.

Further, 27 is a pressurizing tool, which presses the anisotropic conductive film 12 supported by a supporting member 26.
The bare IC 13 is pressed against the mounting surface against the tension, and a part of the anisotropic conductive film 12 corresponding to the mounting surface is transferred onto the mounting surface.

Then, in FIG. 4 and FIG.
The mounting tool 25 that has suction-held C13 is reversed to a mounting position different from the temporary mounting position by a reversing mechanism (not shown). That is, the mounting surface of the bare IC 13 that has been sucked and held is
It is in a downward state facing a predetermined mounting position of the board 11 which is a mounting destination.

Next, the mounting of the above embodiment will be described.

First, in the mounting work, as shown in FIG. 1, the bare IC 13 with the bumps 16 is mounted on the mounting tool 25. At this time, the mounting tool 25 is at a temporary mounting position with the supporting surface facing upward, the opposite side of the mounting surface of the bare IC 13 is placed on this supporting surface, and a vacuum mechanism (not shown) is operated to hold the bare IC 13 by suction. . Then, the mounting tool 25 holds the bare IC 13 at 90 ° C. to 13 ° C. at the temporary mounting position.
Heat to 0 ° C.

The thermosetting anisotropic conductive film 12 is supported by a roller-shaped support member 26 so that the opposite side of the separator 12a faces the mounting surface of the bare IC 13 at a predetermined interval.

In this state, the pressing tool 27 is moved down to push down the anisotropic conductive film 12 supported by the support member 26 with a predetermined tension, and as shown in FIG.
It is held on the mounting tool 25 and brought into pressure contact with the mounting surface of the bare IC 13 heated to a predetermined temperature. Thereafter, when the pressure tool 27 is raised, as shown in FIG. 3, the anisotropic conductive film 12 including the separator 12a is entirely raised by tension. However, only a part of the anisotropic conductive film 12 pressed against the mounting surface in the heated state remains on this mounting surface. That is, bare IC
This means that the anisotropic conductive film 12 was transferred onto the mounting surface of 13 with the separator 12a peeled off.

Next, the mounting tool 25 is inverted by an inverting mechanism (not shown) so that the mounting surface of the bare IC 13 faces downward. Then, the mounting surface of the bare IC 13 is aligned with a predetermined mounting position on the substrate 11, as shown in FIG. After this, the mounting tool 25 is lowered to move the anisotropic conductive film.
The mounting surface of the bare IC 13 on which 12 is transferred is brought into pressure contact with a predetermined mounting position on the substrate 11 and heated.

Then, the thermosetting anisotropic conductive film 12 is once melted and hardened by heating and pressurizing by the mounting tool 25, and the bare IC 13 is mechanically fixed on the substrate 11, and anisotropically. Conductive connection between the connection electrode of the bare IC 13 and the wiring pattern on the substrate 11 is completed by conductive particles (not shown) in the conductive conductive film 12, and the mounting is completed.

Here, the anisotropic conductive film transferred to the mounting surface of the bare IC 13 by the temporary attaching process shown in FIGS.
Reference numeral 12 has a size almost equal to the area of the mounting surface, and the mounting tool 25 shown in FIGS. 4 and 5 heats the substrate 11.
By pressing, all of the transferred anisotropic conductive film 12 is melted,
To cure. That is, it is not necessary to provide the ACF larger than the mounting surface of the semiconductor element on the substrate side as in the conventional case, and therefore the portion protruding around the semiconductor element does not remain uncured. Therefore, the uncured anisotropic conductive film 12
The wiring pattern of the substrate 11 will not be corroded by the impurities contained in the portion. After mounting the bare IC13, the board
The adhesion of the protective resin applied to 11 is not hindered by the uncured portion, and a good product can be obtained.

Further, since the anisotropic conductive film 12 is used in the minimum necessary amount, the expensive anisotropic conductive film 12 can be saved and the cost can be reduced.

Further, since the separator 12a is also peeled off at the same time when the anisotropic conductive film 12 is transferred, it is not necessary to peel off the separator just before mounting as in the conventional case, and the full automation of the process can be easily achieved.

Further, since the mounting tool 25 is provided with the function of heating the bare IC 13 and also serves as the pressing tool 27, the transfer device for the anisotropic conductive film 12 can be easily incorporated in the mounting machine. Further automation can be achieved.

In mounting, an alignment mark may be provided on the mounting surface of the bare IC 13, and the alignment mark may be used to align with the substrate 11. However, since the anisotropic conductive film 12 is transferred onto the mounting surface, a window is formed in a portion of the transferred anisotropic conductive film 12 corresponding to the alignment mark so that the alignment mark can be easily recognized after the transfer. Alternatively, you may cut out this part.

[0035]

According to the method of mounting a semiconductor element of the first aspect, only a portion corresponding to the mounting surface of the film adhesive member is transferred to the mounting surface of the semiconductor element, and the transferred film adhesive member is used. Since the semiconductor element is mounted on the substrate by means of the above, the size of the film-shaped adhesive member can be made substantially the same as the mounted semiconductor element, and no waste of material occurs. Since the separator is peeled off from the film adhesive member, there is no uncured portion of the film adhesive member and no waste of material.Furthermore, the separator peeling work just before mounting work is unnecessary, and the whole automation is easy. Can be achieved.

According to a second aspect of the present invention, there is provided a mounting device for a semiconductor element, wherein the mounting surface of the semiconductor element, which is held by a mounting tool and heated to a predetermined temperature, is attached to the side opposite to the separator of the film-like adhesive member by a pressing tool. By pressing and separating the other part of the film adhesive member including the separator from the mounting surface, only the part corresponding to the mounting surface of the film adhesive member can be transferred onto the mounting surface, and the separator is automatically transferred from this transfer part. Can be stripped off. Therefore, the uncured portion of the film-like adhesive member and the waste of the material are not generated, and the separator peeling work immediately before the mounting work is unnecessary, and the whole automation can be easily achieved.

[Brief description of drawings]

FIG. 1 is a front view showing a temporary attaching step of transferring a film adhesive member of an embodiment of a semiconductor device mounting apparatus according to the present invention.

FIG. 2 is a front view showing the next temporary attachment step shown in FIG. 1 of the step of transferring the above film-shaped adhesive member.

FIG. 3 is a front view showing the next temporary attachment step shown in FIG. 2 of the step of transferring the above film-shaped adhesive member.

FIG. 4 is a diagram showing a semiconductor element mounting process on the same substrate as FIG.
It is a front view which shows the next temporary attachment process shown in FIG.

FIG. 5 is a view showing a mounting process of the semiconductor element on the substrate.
It is a front view which shows the next temporary attachment process shown in FIG.

FIG. 6 is a front view showing a process of temporarily attaching a film-shaped adhesive member of a conventional example to a substrate.

FIG. 7 is a diagram showing a temporary attaching step of the film adhesive member to a substrate.
It is a front view which shows the next process shown in FIG.

FIG. 8 is a view showing a temporary attaching process of the film adhesive member to a substrate.
It is a front view which shows the next process shown in FIG.

FIG. 9 is a front view showing the next step shown in FIG. 8 of the same separator peeling step.

FIG. 10 is a front view showing the next step shown in FIG. 9 in the step of mounting the semiconductor element on the same.

11 is a front view showing the next step shown in FIG. 10 in the step of mounting the semiconductor element on the same as above. FIG.

[Explanation of symbols]

 11 Substrate 12 Anisotropic Conductive Film (ACF) as Membrane Adhesive Member 12a Separator 13 Bare IC as Semiconductor Element 25 Mounting Tool 26 Supporting Member 27 Pressing Tool

Claims (2)

[Claims] 1. A film-like adhesive member having a sheet-shaped separator attached to one surface of a mounting surface of a semiconductor element heated to a predetermined temperature is pressed from the opposite side of the separator, and after the pressing, the separator is separated. The film-shaped adhesive member is transferred onto the mounting surface by separating the other part of the film-shaped adhesive member from the mounting surface, and after the transfer, the film-shaped adhesive member is transferred onto the mounting surface of the semiconductor element. A method for mounting a semiconductor element, which comprises pressurizing and heating the semiconductor chips to a predetermined mounting position on the substrate to bond them. 2. A semiconductor element mounting apparatus for mounting a semiconductor element at a predetermined position on a substrate via a film adhesive member, wherein the semiconductor element is detachably held, and the semiconductor element is kept at a predetermined temperature in this holding state. Of the film-like adhesive member having a separator attached on one surface at a mounting tool that heats the semiconductor element to a predetermined position on the substrate and presses the semiconductor element at a temporary mounting position different from the predetermined mounting position of the mounting tool. A supporting member that makes the opposite side of the separator face the mounting surface of the semiconductor element held by the mounting tool at a predetermined interval, and the film adhesive member supported by the supporting member on the mounting surface of the semiconductor element. A mounting device for a semiconductor element, comprising: a pressing tool which is brought into pressure contact with and transfers a portion corresponding to the mounting surface onto the mounting surface.