JPH0837228A - Jig for semiconductor manufacturing - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] In wafer cleaning during wafer processing in semiconductor device manufacturing, to prevent contamination from water droplets generated when a wafer is taken out from a cleaning tank. In a semiconductor manufacturing jig for processing a semiconductor wafer 6, a wafer accommodating container portion 4 having at least opposing wall surfaces and a handle 2 having a hook 5 engaging with the wall surface of the accommodating container 4 are provided. This is a semiconductor manufacturing jig in which the handle has no convex portion in the wafer upper surface in the wafer direction. [Effect] Since the convex portion does not exist on the wafer storage container side, even if the handle is wet with liquid, the liquid of the handle is not transmitted from the convex portion and is not dropped on the semiconductor wafer, so that the contamination of the semiconductor wafer is prevented. It becomes possible.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing jig, and more particularly to a technique effectively applied to a semiconductor wafer jig used for cleaning a semiconductor wafer.

[0002]

2. Description of the Related Art In manufacturing a semiconductor device, various treatments on a semiconductor wafer are required. Among these processes, there is a cleaning step for cleaning the semiconductor wafer. In the cleaning step, the semiconductor wafer is put into a jig with a detachable handle and cleaned in pure water. Japanese Patent Application Laid-Open No. 60-177642 discloses an example of a jig for cleaning such a semiconductor wafer.

[0003]

Although not described in detail in the above-mentioned technique, when the handle attached to such a jig is removed, the handle serves as a spring so that the handle can be easily removed. It is provided below, and its shape is generally extended in parallel with the handle and is generally warped upward and has a convex portion so that it can be easily grasped in the wafer direction.

The spring portion having such a shape gets wet when it is immersed in pure water during cleaning of the semiconductor wafer with pure water. There is a problem that water droplets may drop on the surface and stains may be generated, and the vapor deposition layer may be peeled off, and foreign matter may be generated or abnormal oxidation may occur.

An object of the present invention is to solve the above problems and to provide a semiconductor manufacturing jig which does not cause such problems even after cleaning with pure water.

[0006]

Means for representing a typical one of the inventions disclosed in the present application will be described as follows.

That is, in a semiconductor manufacturing jig for processing a semiconductor wafer, it comprises a wafer storage container portion for holding a wafer and a handle having a portion which engages with a hook formed in the storage container. The semiconductor manufacturing jig is such that there is no convex portion in the wafer direction in the portion on the wafer.

[0008]

According to the above-mentioned means, even if the spring portion of the handle is immersed in pure water during washing with pure water, water drops will not adhere to the handle and fall to the center due to its shape.

[0009]

[Embodiment 1] FIG. 1 is a schematic perspective view showing a wafer processing jig for semiconductor manufacturing according to a first embodiment of the present invention.
FIG. 2 is a schematic side sectional view showing a state where the handle and the wafer storage container are combined in this embodiment, FIG. 3 is a view showing the handle of another embodiment, and FIG. 4 is a handle and the wafer storage of this embodiment. It is explanatory drawing which showed the movement of the structure at the time of removing a container.

In this jig, the handle 1 comprises a handle 1 formed in a U-shape reversed, and a bridge-shaped spring portion 2 formed by connecting to the handle 1.
The handle 2 has a structure in which the spring 2 and the handle 1 are connected in the vicinity of a portion 3 where the handle 1 is connected to the wafer storage container 4. The highest point at the center of the bridge of the spring portion 3 is the force point of the spring, and the portion attached to the hook is the fulcrum of the spring.

The wafer container 4 may be the same as a commonly used wafer container. The wafer storage container 4 has a structure in which a wafer holding groove is formed on the side surface and a plurality of wafers 6 are stored and held, and a hook 5 is formed at an end of the wafer storage container 4 to interlock with a handle. Both the handle and the wafer storage container are made of fluorine resin.

As shown in FIG. 2, when the handle 1 is engaged with the hook of the wafer container 4 as shown in FIG. 2, the spring portion 2 has a bridge shape which becomes a semicircle toward the wafer container 4 side. The wafer storage container side is not provided with a convex portion. As shown in FIG. 4, when detaching the handle from the wafer storage container, by pushing the force point at the center of the spring portion toward the wafer storage device, the connection part attached to the hook of the handle can be opened and removed. Become.

In this way, when the wafer is stored in the jig of this embodiment and the steps such as cleaning with pure water are performed in the cleaning tank or the like, even if the spring portion gets wet, the water droplets travel along the spring portion and the end portion of the wafer container. Water drops do not fall on the wafers stored under the handle. Further, the handle having such a structure has an effect that it is firmly fixed by gripping the handle and holding the container when carrying the storage container.

Although the present invention has been described above with respect to the technology which is the subject of the present embodiment, it is needless to say that the present invention is not limited to the above-mentioned embodiment and can be variously modified without departing from the technical scope thereof. Nor. That is, the present invention only needs to be such that a convex portion is not formed above the wafer when the wafer is stored, and may have a trapezoidal spring portion 8 as shown in FIG. 3, for example.

[0015]

The effects of the invention obtained by the invention disclosed in the present application are as follows.

That is, since there is no convex portion on the side of the wafer container, even if liquid such as water droplets adheres to the handle portion, the liquid does not drop on the wafer, so that the contamination of the wafer by the liquid is prevented. Is possible. Further, since the wafer is not contaminated, there is no problem such as peeling of the vapor deposition layer and abnormal oxidation, and the yield is improved.

[Brief description of drawings]

FIG. 1 is a wafer processing jig for manufacturing a semiconductor according to a first embodiment of the present invention.

FIG. 2 is a schematic side sectional view showing a state in which a handle and a wafer storage container are combined with each other in the present embodiment,

FIG. 3 is a diagram showing a handle according to another embodiment.

FIG. 4 is an explanatory diagram showing a structural movement when a handle and a wafer storage container are removed.

[Explanation of symbols]

1, 7. ． Handle, 2, 8. ． Spring part, 3. ． Clerks, 4. ． Wafer storage container, 5. ． Hook part, 6. ． Wafer,

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Claims (1)

[Claims] 1. A semiconductor manufacturing jig for processing a semiconductor wafer, comprising: a wafer storage container portion for holding a wafer; and a handle having a portion that engages with a hook formed in the storage container. Is a jig for semiconductor manufacturing, characterized in that there is no convex portion in the direction of the held wafer in the portion on the wafer.