JPH08377Y2 - Plating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a plating apparatus. More specifically, the present invention relates to a plating apparatus in which an anode is formed of an insoluble electrode and a distance between electrodes and an object to be plated can be finely adjusted steplessly.

[Prior Art] Plating apparatuses include a mold using a soluble anode and a mold using an insoluble anode.

In the former, as shown in FIG. 4, for example, a large number of copper balls are housed in a titanium mesh-like bottomed cylindrical body to form an anode 2 ′, and a plurality of plating objects 5 are arranged in the width direction. Therefore, although copper ions are automatically supplied, it is difficult to control the concentration and the like, and in order to make the current distribution uniform, the inter-electrode distance 1 is large and the tank length L is also large. Further, the replacement work of the anode 2'is troublesome.

As the latter, as shown in FIG. 5, for example, an anode 2 in which a platinum plate is coated with a platinum group metal oxide is used. Therefore, it is necessary to prepare and replenish copper ions in a separate tank, but since the thickness of the anode can be made small and the pole area can be made large, the interelectrode distance 1 can be made small and the tank length L can also be made small, which is economical. Of course, the replacement work of the anode 2 itself becomes unnecessary. Further, by interposing the diaphragm 6 between the electrodes 2 and 5, it is possible to prevent decomposition of expensive additives and the like.

Here, the plating object 5 is hung and conveyed by the conveyance frame 4 in both types. Further, the anodes 2 ', 2 are suspended and held by a power supply bar or a support rod 3, and the support rod 3 is fixed to a predetermined position by bolting the support rod 3 to the upper end portion of the plating tank 1.

Therefore, in the state shown in FIGS. 4 and 5, if a current is applied between the anode 2 '(2) and the object 5 to be plated, the object 5 to be plated can be subjected to a predetermined plating treatment.

Thus, for example, as shown in JP-A-1-297884, in the case of plating capable of replenishing copper ions prepared in a separate tank, the apparatus is downsized, the current distribution is made uniform, and the anode is complicated and labor intensive. It is more advantageous to use the insoluble anode 2 from the viewpoint of cleaning the 2'replacement work, etc. In particular, it is suitable for copper plating on a printed circuit board, which is required to be large in size and high in quality. Its spread is being tried.

[Problems to be Solved by the Invention] By the way, if the insoluble anode 2 is used, the inter-electrode distance 1 can be reduced as described above, but since the inter-electrode distance 1 is small, the positional distance from the proper inter-electrode distance is somewhat small. If so, the current distribution and the like are greatly changed.

However, the appropriate inter-electrode distance varies depending on the size, shape, plating thickness distribution, etc. of the object 5 to be plated, although it is minute.
Further, it is difficult to accurately determine the proper inter-electrode distance without plating once.

Here, conventionally, the distance between the electrodes has been averaged, and the current distribution and the like have been adjusted by replacing a masking plate having a large single-plate structure, etc., which is troublesome and reduces productivity. .

However, nowadays, it is pointed out that even if the above labor and productivity are tolerated, it is no longer possible to meet the demand by countermeasures such as masking plates even if the above-mentioned high quality is required.

However, removing all bolts and moving each support rod 3 each time requires a large amount of work because of the large weight of the support rod 3 including the suspended insoluble anode 2 and tightening the bolt. Since it is not possible to make fine adjustments due to the structure, it is difficult in practice.

For this reason, there is a main customer overturning phenomenon such as using the insoluble anode 2 while keeping the inter-electrode distance 1 long as a safety side design and limiting the object 5 to be plated. Is the circumstance.

In other words, if the insoluble anode can be easily and steplessly fine-tuned, the size of the plating apparatus can be further reduced and the high-quality plating process can be smoothly performed while dramatically eliminating heavy labor. The applicant recognizes that productivity can be improved.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a plating apparatus capable of easily and quickly steplessly positioning an insoluble anode and finely adjusting the inter-electrode distance.

[Means for Solving the Problem] The present invention provides a movement holding member whose upper and lower positions on both sides of the plating tank are constrained in the vertical direction and which is guided and supported so as to be movable steplessly in the longitudinal direction of the plating tank. A fixing means for fixing the position of the movable holding member after the movement is provided, and the anode is formed of an insoluble anode, and the anode is inserted into both side tanks extending into the plating solution of the movable holding member to be inserted in the plating tank. It is characterized in that the distance between the anode and the object to be plated can be finely adjusted by adjusting the position of the movable holding member.

[Operation] According to the present invention, the fixing means is released and the movement holding means is manually or automatically moved in the longitudinal direction of the plating tank. Then, the insoluble anode held by the moving holding means can be brought close to the object to be plated.

After that, the insoluble anode can be fixed at the position after the movement by tightening the fixing means.

Since the movable holding member is supported by the plating bath in the vertical direction while being guided and moved steplessly in the longitudinal direction, the insoluble anode can be moved and adjusted steplessly. That is, the distance between the electrodes and the object to be plated can be finely adjusted.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

(First Embodiment) The first embodiment is shown in FIG. 1 and FIG.

This plating apparatus has the same basic structure as that of the plating apparatus using the insoluble anode 2 shown in FIG. 5, and is provided with the inter-electrode distance adjusting device 10.

Here, the inter-electrode distance adjusting device 10 is a means for adjusting the distance (inter-electrode distance) between the insoluble anode 2 and the plating object 5 steplessly and subtly, and includes a moving holding member 11 and a fixing means 21. Are formed from.

The movement holding member 11 has a U-shaped appearance, and the vertical position of the movement holding member 11 is restricted by the upper edge portion 1a of the plating tank 1 via the roller 13 provided on the protrusion 12 at the upper portion of the movement holding member 11 and the longitudinal direction of the plating tank 1. It is guided and supported so as to be movable steplessly (toward the object 5 to be plated).

Further, the movement holding member 11 is provided with a vertical groove 14 arranged on both inner sides thereof so as to extend into the plating solution, and a horizontal groove 15 above the protruding portion 12. Further, on the outer side, an outer groove fitted to the guide bar 1b fixed to the inner wall of the plating tank 1
16 are provided. By the cooperation of the guide bar 1b and the outer groove 16, the movement holding member 11 is moved in parallel in the longitudinal direction of the plating tank 1 on both sides. The position of the movable holding member 11 with respect to the plating tank 1 is restricted by the fixing means 21.

The fixing means 21 is composed of a bolt member screwed into the projecting portion 12, and by rotating the bolt member, the projecting amount of the bolt member is changed to engage with the upper edge portion 1a so that the moving holding member 11 is retained. It can be fixed to the plating tank 1 (1a).

In the case of this embodiment, the insoluble anode 2 is a titanium plate coated with iridium oxide, and the arm portions 2a are fitted and locked in the horizontal grooves 15 of the movement holding member 11 on both upper sides. , 2a are provided. Further, the width dimension is such that it can be inserted into and pulled out from the vertical grooves 14,14.

 Next, the operation will be described.

In order to obtain the optimum distance between the electrodes to be applied, such as the size of the object to be plated 5, the fixing means 21 may be loosened and the movement holding member 11 may be pushed or pulled to move the plating tank 1 in the longitudinal direction. At this time, since the movement holding member 11 is rotatably supported by the roller 13 and the outer groove 16 is fitted in the guide bar 1b, it can be moved in parallel with a slight force.

Therefore, the insoluble anode 2 previously fitted in the horizontal groove 15 and the vertical groove 14 can be moved steplessly and the distance between the electrodes can be finely adjusted. The position after the fine adjustment is stably fixed by tightening the fixing means 21.

Therefore, according to this embodiment, the inter-electrode distance adjusting device 10 composed of the movable holding member 11 and the fixing means 21 that can be moved steplessly is provided, and the movable holding member 11 is provided with the insoluble flat plate electrode. Since it has a configuration in which the anode 2 is attached,
Since the inter-electrode distance to the object to be plated 5 can be finely adjusted in a stepless manner, high-quality plating treatment can be performed with an optimum inter-electrode distance, and the plating tank 1 and the like can be made smaller and simpler.

Furthermore, since the anode 2 is configured to be fitted and mounted in the grooves 14 and 15 of the movement holding member 11, the inspection work of the anode 2 is facilitated. The anode 2 itself can be made thin and lightweight.

Further, the moving holding member 11 is rotatably held by the roller 13,
Moreover, since it is fitted to the guide bar 1b, it is possible to make parallel translation quickly and easily with a slight force.

(Second Embodiment) This second embodiment, as shown in FIG. 3, is an insoluble anode.
2, the diaphragm 6, the rib body 34, etc. are integrally formed so that the whole is mounted on the moving holding member 11, and the practical technical matters of the plating apparatus employing the insoluble anode 2 are solved at once. It is configured to be able to.

That is, in the case of the first embodiment, the weak diaphragm 6 is deformed / damaged due to, for example, the collision with the movement holding member 11, the inspection work of the diaphragm 6, the anode 2, etc. is considerably difficult,
Further, there is a possibility that current sneak may occur due to the small distance between the electrodes.

Therefore, in order to prevent these predicted disadvantages, the insoluble anode (2) and the diaphragm 6 are integrally incorporated in the main body case 30 forming the liquid-tight (housing) space S, and the diaphragm 6 is formed. The ribs 34 are covered from the outside by bolts 36 to be integrally connected. In addition, 31 is a seal packing, 32
Is a spacer.

Here, the main body case 30 has a U-shaped cross section and is formed of a vinyl chloride plate material. This body case
The role of 30 is to form a housing space S for housing the insoluble anode 2 and to hold the diaphragm 6. Also,
The whole is easily pulled out of the moving holding member 11 to the outside of the plating tank 1 and is conveniently attached to the inside of the plating tank 1. At the same time, the overall size and weight can be reduced.

Next, the insoluble anode 2 corresponds to the printed circuit board (5) in order to make the plating current distribution constant and increase the effective pole area, since this embodiment is used to perform copper plating on the printed circuit board. The shape is set to

Further, a neutral film is used as the diaphragm 6, and is arranged so as to close the opening surface 33 of the main body case 30 facing the object to be plated 5 via the spacer 32. In the case of this embodiment, the fixing to the main body case 30 is performed by integrally fastening the plurality of bolts 36 through the rib body 34. This allows the accommodation space S to be liquid-tightly separated from the plating liquid in the plating tank 1. That is, the insoluble anode 2 and the plating target 5 can be separated.

The rib body 34 has a primary purpose of protecting the diaphragm 6, but in consideration of making the counter electrode area as large as possible, the rib surface 34 is divided into integers (12 in this embodiment) in a grid pattern. The rib body element 35 is formed so as to project toward the object to be plated 5. In addition, the spacer 32 is also in a corresponding lattice shape.

Therefore, the diaphragm 6 is securely held by the main body case 30, and foreign matter collision can be avoided inside and outside the plating tank 1.

Moreover, the rib body 34 increases the mechanical strength of the whole body together with the main body case 30. Therefore, the insoluble anode 2 itself does not need to have an excessive mechanical strength. And can be lightened. In addition, the structure is such that it can also exhibit functions from the aspect of plating quality.

That is, the box-shaped space S2 formed by each rib element 35 forms a conductive path at right angles to the object 5 to be plated, in other words, to prevent current sneak and to dissolve the insoluble anode 2 (object 5 to be plated). It works so as to make the current distribution per unit area of (1) uniform.

In the diaphragm anode structure having such a configuration, the main body case 30, the insoluble anode 2, the spacer 32, the diaphragm 6, and the rib body 34 are arranged in this order, and the bolt 36 can be integrally assembled by simply tightening the bolt 36. The disassembling and assembling can be performed quickly and easily, and the mounting work on the moving holding member 11, that is, the plating tank 1 is very easy. During the plating operation, the diaphragm 2 is completely protected and the current distribution becomes constant.

Therefore, according to the second embodiment, if the anode structure is attached to the movement holding member 11, the same operational effect as that of the first embodiment is obtained, and further, the main body case 30 and the insoluble flat plate anode 2 are provided.
Since the diaphragm 6 and the rib body 34 are integrally assembled, the diaphragm 6 and the like are maintained perfectly, are easy to handle, and are compact and lightweight. Therefore, it is possible to establish a plating apparatus which can finely adjust the distance between the electrodes and can enjoy advantages such as prevention of decomposition of the additive by adopting the diaphragm anode, and to expand its spread.

In addition, since the whole is small and lightweight, loading and unloading work is easy, and since the storage space S is small, the initial decomposition amount of additives and the like can be minimized, which is economical.

Further, since each component can be disassembled and assembled by tightening and loosening the bolt 36, the work of exchanging the insoluble anode 2 and the diaphragm 6 can be performed quickly and easily, and moreover, the whole can be carried out by a small number of people, which is efficient. Target.

Further, since the rib body 34 is formed in a lattice shape, the mechanical strength of the entire body can be increased, the weight thereof can be reduced, and the insoluble anode 2 can be thinned.

Furthermore, since each rib body element 35 of the rib body 34 forms an upright surface 35a perpendicular to the object 5 to be plated, it is advantageous to prevent current from flowing and to form a uniform plated film.

[Advantages of the Invention] According to the present invention, a movable holding member that is guided steplessly in the longitudinal direction of the plating tank and a fixing means for fixing the position of this moving holding member are provided, and an insoluble anode is attached to the anode. Since it is configured to be used and attached to the moving holding member,
The distance between poles can be finely adjusted quickly and easily by light work in a stepless manner. Therefore, high-quality plating can be efficiently performed under the optimum distance between the electrodes, and the productivity can be dramatically improved, and the applicability is wide.

[Brief description of drawings]

FIG. 1 is an external perspective view showing a first embodiment of the present invention, FIG. 2 is a sectional view taken along the line II--II of FIG. 1, and FIG.
4 is an external perspective view of an anode structure showing an embodiment, FIGS. 4 and 5 are views showing a conventional plating apparatus, FIG. 4 shows a case where a soluble anode is used, and FIG. 5 shows an insoluble anode. This is the case when used. 1-plating tank, 1a-upper edge, 1b-guide bar, 2
…… Insoluble anode, 2´ …… Soluble anode, 5 …… Plate object, 6 …… Separating membrane, 10 …… Polar distance adjusting device, 11 ……
Movable holding member, 13 ... Roller, 14 ... Vertical groove, 15 ... Horizontal groove, 16 ... Outer groove, 21 ... Fixing means, 30 ... Main body case,
32 …… Spacer, 34 …… Rib body, 35 …… Rib body element, 36
……bolt.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Creator Kazuhiro Hirao 10-101 at 666 Tsurumaki, Hadano City, Kanagawa Prefecture

Claims (1)

[Scope of utility model registration request] 1. A movable holding member whose upper and lower positions on both sides of the plating tank are vertically supported and guided and supported so as to be movable steplessly in the longitudinal direction of the plating tank, and a movable holding member after the movement holding member is moved. Fixing means for fixing the position, the anode is formed from an insoluble electrode, and the anode is inserted into both side grooves extending into the plating solution of the moving holding member and disposed in the plating tank. The plating apparatus is characterized in that the distance between the anode and the object to be plated can be finely adjusted by adjusting the position of.