JPH08406B2 - Coating method of coating liquid such as surface modifier - Google Patents
Coating method of coating liquid such as surface modifierInfo
- Publication number
- JPH08406B2 JPH08406B2 JP5292527A JP29252793A JPH08406B2 JP H08406 B2 JPH08406 B2 JP H08406B2 JP 5292527 A JP5292527 A JP 5292527A JP 29252793 A JP29252793 A JP 29252793A JP H08406 B2 JPH08406 B2 JP H08406B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molded product
- coating liquid
- molding
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000576 coating method Methods 0.000 title claims description 72
- 239000011248 coating agent Substances 0.000 title claims description 68
- 239000007788 liquid Substances 0.000 title claims description 35
- 239000003607 modifier Substances 0.000 title claims description 10
- 238000000465 moulding Methods 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 25
- 239000002216 antistatic agent Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 5
- 239000010408 film Substances 0.000 description 28
- 230000003068 static effect Effects 0.000 description 23
- 230000005611 electricity Effects 0.000 description 22
- 239000000243 solution Substances 0.000 description 17
- 239000000443 aerosol Substances 0.000 description 16
- 229920003002 synthetic resin Polymers 0.000 description 8
- 239000000057 synthetic resin Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002778 food additive Substances 0.000 description 1
- 235000013373 food additive Nutrition 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【0001】[0001]
【産業上の利用分野】この発明は主に合成樹脂等の成型
品の外周面に、帯電防止剤、防曇剤等の表面改質剤、着
色剤、接着剤等を塗布したり、さらには食品添加剤の塗
布等に使用する塗布液の塗布法に関するものである。BACKGROUND OF THE INVENTION The present invention mainly applies a surface modifier such as an antistatic agent or an antifogging agent, a coloring agent, an adhesive agent or the like to the outer peripheral surface of a molded product such as a synthetic resin, and further The present invention relates to a coating method of a coating liquid used for coating food additives and the like.
【0002】[0002]
【従来の技術】合成樹脂の成型品は静電気が生じやす
く、成型後の塗装や印刷処理の際この静電気の影響を受
けて印刷等が不完全となる恐れが有る。そこで雄型と雌
型との間に合成樹脂の原料を送りこみ、これを雄型で雌
型に押圧して合成樹脂等の成型品を成形した後、当該成
型品の外周面に帯電防止剤等を塗布している。これは成
型直後の成型品を適宜の治具で吊るし、その状態で帯電
防止剤等の塗布液を噴霧している。2. Description of the Related Art A molded product made of a synthetic resin is liable to generate static electricity, and there is a possibility that printing or the like will be incomplete under the influence of the static electricity during painting or printing after molding. Therefore, a synthetic resin material is fed between the male mold and the female mold, and the male mold is pressed against the female mold to mold a molded product such as a synthetic resin, and then an antistatic agent is applied to the outer peripheral surface of the molded product. Etc. are applied. In this, a molded product immediately after molding is suspended by an appropriate jig, and in that state, a coating liquid such as an antistatic agent is sprayed.
【0003】[0003]
【発明が解決しようとする課題】しかしながらこの従来
の塗布方法では、雄型や雌型から成型品を剥がす離型時
に、剥離帯電が生じ、これらの型に放電しつつ50〜1
00KVの静電気が発生している場合が多い。従って成
型直後の成型品に帯電防止剤等の塗布液を噴霧すると、
これらの静電気による電気力線の影響を受け、放電模様
ができ塗布むらが生じ易い。従って均一な塗膜が得られ
ない欠点がある。これは塗布する粒子が小さければ小さ
い程電気力線の影響を受けやすく、従って微粒子を噴霧
して薄膜を作る際特に支障を来すおそれがある。However, in this conventional coating method, peeling electrification occurs at the time of releasing the molded product from the male mold or the female mold, and 50 to 1 while discharging to these molds.
In many cases, static electricity of 00 KV is generated. Therefore, when spraying a coating liquid such as an antistatic agent on a molded product immediately after molding,
Due to the influence of the lines of electric force due to these static electricity, a discharge pattern is formed and uneven coating is likely to occur. Therefore, there is a drawback that a uniform coating film cannot be obtained. This is because the smaller the applied particles are, the more easily they are affected by the lines of electric force, and therefore, there is a possibility that the particles are particularly troubled when the particles are sprayed to form a thin film.
【0004】そこで特公昭63−36627号公報に示
すごとく、表面改質剤を含んだ溶液を多数の粒子から成
るエアロゾルにし、合成樹脂成型の際の雄型、雌型の一
方又は双方の離型時に生じるこれらの型の間の減圧雰囲
気にエアロゾルを噴霧して離型された成型品の表面に上
記エアロゾルを付着せしめ、当該成型品を冷却させると
同時に成型品表面に表面改質剤から成る極薄膜を形成さ
せる方法が開発された。Therefore, as shown in JP-B-63-36627, a solution containing a surface modifier is made into an aerosol consisting of a large number of particles, and one or both of a male mold and a female mold at the time of molding a synthetic resin is released. An aerosol is sprayed in a decompressed atmosphere between these molds, which sometimes occurs, to adhere the above-mentioned aerosol to the surface of the molded product released from the mold, and at the same time to cool the molded product, a pole composed of a surface modifier on the surface of the molded product Methods have been developed for forming thin films.
【0005】しかしながらこの方法は型の間で減圧雰囲
気を設けるための完全密閉室を設けなければならず、そ
の点で大掛かりとなる。また吸引付着されるエアロゾル
の量に制限があり、任意の量を塗布するには不向きであ
る。また静電気を取り除くことはできても、帯電防止効
果を有する膜をつくるのには吸引力が弱いものであっ
た。However, this method requires a completely closed chamber for providing a reduced pressure atmosphere between the molds, which is a large scale in that respect. Further, there is a limit to the amount of aerosol that can be sucked and attached, and it is not suitable for applying an arbitrary amount. Further, although the static electricity can be removed, the suction force is weak to form a film having an antistatic effect.
【0006】そこでこの発明はこれらの合成樹脂製品の
型による成型直後の塗布において、静電気の影響を受け
ずに、均一な塗布ができる塗布液の塗布法を提供するこ
とを目的としたものである。Therefore, the object of the present invention is to provide a method for applying a coating solution which enables uniform application of these synthetic resin products immediately after molding with a mold without being affected by static electricity. .
【0007】[0007]
【課題を解決するための手段】請求項1項記載の発明
は、一方の型と他方の型との間に原料を注入して成型品
を成形する方法において、少なくとも一方の型は金型等
の静電容量の大きい導体又は半導体から成り、成型後に
他方の型を離した際、成型品を一方の型に接触又は近接
させた状態で適宜の塗布液を噴霧させ、成型品の露出し
た外周面に塗布液から成る塗膜を形成させ、その後当該
成型品を一方の型からイジェクタピン等で離した状態で
当該成型品の残りの外周面に塗布液を噴霧し、塗膜を形
成させる、表面改質剤等の塗布液の塗布法とした。According to a first aspect of the present invention, there is provided a method for forming a molded product by injecting a raw material between one mold and the other mold, wherein at least one mold is a mold or the like. Of a conductor or semiconductor with a large electrostatic capacity, and when the other mold is released after molding, spray the appropriate coating liquid with the molded product in contact with or close to one mold to expose the outer periphery of the molded product. Form a coating film made of the coating liquid on the surface, then spray the coating liquid on the remaining outer peripheral surface of the molded product in a state where the molded product is separated from one mold by an ejector pin or the like to form a coating film, The coating method was a coating solution such as a surface modifier.
【0008】請求項2項記載の発明は、一方の型と他方
の型との間に原料を注入して成型品を成形する方法にお
いて、双方の型は金型等の静電容量の大きい導体又は半
導体から成り、成型後に他方の型を離した際、成型品を
一方の型に接触又は近接させた状態で適宜の塗布液を噴
霧させ、成型品の露出した外周面に塗布液から成る塗膜
を形成させ、その後当該成型品を一方の型からイジェク
タピン等で離し、上記他方の型を一方の型より成型品か
らより近接した状態で当該成型品の残りの外周面に塗布
液を噴霧し、塗膜を形成させる、表面改質剤等の塗布液
の塗布法とした。According to a second aspect of the present invention, in a method for molding a molded product by injecting a raw material between one mold and the other mold, both molds are conductors having a large electrostatic capacitance such as a mold. Alternatively, when the mold is made of a semiconductor and the other mold is released after molding, an appropriate coating liquid is sprayed in a state where the molded product is in contact with or close to one mold, and the coating liquid is applied to the exposed outer peripheral surface of the molded product. A film is formed, and then the molded product is separated from one mold with an ejector pin, etc., and the coating liquid is sprayed on the remaining outer peripheral surface of the molded product while the other mold is closer to the molded product than the one mold. Then, a coating solution such as a surface modifier was applied to form a coating film.
【0009】また請求項3項記載の発明は、一方の型と
他方の型との間に原料を注入して成型品を成形する方法
において、少なくとも一方の型は金型等の静電容量の大
きい導体又は半導体から成り、成型後に他方の型を離し
た際、成型品を一方の型に接触又は近接させた状態で帯
電防止剤の溶液を噴霧させ、成型品の露出した外周面に
帯電防止剤から成る塗膜を形成させ、その後当該成型品
を一方の型からイジェクタピン等で離した状態で当該成
型品の残りの外周面に帯電防止剤の溶液を噴霧し、帯電
防止剤から成る塗膜を形成させる、表面改質剤等の塗布
液の塗布法とした。According to a third aspect of the present invention, in a method for forming a molded product by injecting a raw material between one mold and the other mold, at least one mold has a capacitance of a mold or the like. It consists of a large conductor or semiconductor, and when the other mold is released after molding, the solution of the antistatic agent is sprayed while the molded product is in contact with or close to one mold to prevent static charge on the exposed outer peripheral surface of the molded product. A coating film made of an antistatic agent is formed by spraying a solution of the antistatic agent onto the remaining outer peripheral surface of the molded article while forming a coating film made of the agent and then separating the molded article from one mold with an ejector pin or the like. A coating solution such as a surface modifier was used to form a film.
【0010】[0010]
【作用】請求項1項の発明では、少なくとも一方の型は
金型等の静電容量の大きい導体又は半導体から構成され
ているため、成型後に他方の型を離した際、成型品の離
型面に剥離帯電による静電気が発生し、この静電気で電
気力線が他方の型の方向に発生しようとするが、この状
態で成型品を接触させている一方の型の静電容量が大き
いため、当該電気力線をこの一方の型の方に引き込み、
離型面から電気力線が発生しない。従ってこの状態で適
宜の塗布液を成型品の離型面に噴霧する。この際成型品
を一方の型に接触させず、近接させた状態でも同様の作
用が生じる。これはパッシェン則によれば放電電位は1
0mmで30KVであり、従って1mmでは3KVとな
り、一般に3KVでは放電模様ができない。それ故成型
品を一方の型から1mm位い離した、近接状態でも良
い。According to the invention of claim 1, since at least one of the molds is made of a conductor or semiconductor having a large electrostatic capacity such as a mold, when the other mold is released after molding, the molded product is released from the mold. Static electricity due to peeling electrification occurs on the surface, and lines of electric force try to generate in the direction of the other mold due to this static electricity, but because the capacitance of one mold that is in contact with the molded product in this state is large, Pull the electric lines of force to this one mold,
No lines of electric force are generated from the release surface. Therefore, in this state, an appropriate coating liquid is sprayed on the release surface of the molded product. At this time, the same action occurs even when the molded product is brought into close proximity without being brought into contact with one mold. According to Paschen's law, the discharge potential is 1
It is 30 KV at 0 mm, and therefore becomes 3 KV at 1 mm, and generally a discharge pattern cannot be obtained at 3 KV. Therefore, the molded product may be in a close state in which it is separated from the one mold by about 1 mm.
【0011】請求項2項の発明では、双方の型は金型等
の静電容量の大きい導体又は半導体から構成されている
ため、成型後に他方の型を離した際、成型品の離型面に
剥離帯電による静電気が発生し、この静電気で電気力線
が他方の型の方向に発生しようとするが、この状態で成
型品を接触又は近接させている一方の型の静電容量が大
きいため、当該電気力線をこの一方の型の方に引き込
み、離型面から電気力線が発生しない。従ってこの状態
で適宜の塗布液を成型品の離型面に噴霧する。またこの
後成型品を一方の型からイジェクタピン等で離した状態
で、しかも他方の型を一方の型より当該成型品により近
接させているため、離型時の剥離帯電による電気力線が
生じるが、より近接した他方の型の方向に当該電気力線
が向くので、その分成型品の離型面は電気力線の影響は
少ない。この状態で当該成型品の離型外周面に帯電防止
剤の溶液を噴霧することとなる。In the invention of claim 2, since both molds are composed of a conductor or semiconductor having a large electrostatic capacity such as a mold, when the other mold is released after molding, the mold release surface of the molded product. Static electricity is generated due to peeling and charging, and lines of electric force try to generate in the direction of the other mold due to this static electricity, but in this state the molded product is in contact with or in close proximity. , The electric force line is drawn toward the one of the molds, and the electric force line is not generated from the release surface. Therefore, in this state, an appropriate coating liquid is sprayed on the release surface of the molded product. Further, after this, the molded product is separated from one mold by an ejector pin or the like, and since the other mold is brought closer to the molded product than the one mold, an electric force line is generated due to peeling charging at the time of mold release. However, since the electric force lines are directed in the direction of the other mold that is closer, the influence of the electric force lines on the release surface of the molded product is small. In this state, the antistatic agent solution is sprayed onto the outer peripheral surface of the mold release of the molded product.
【0012】請求項3項の発明では、少なくとも一方の
型は金型等の静電容量の大きい導体又は半導体から構成
されているため、成型後に他方の型を離した際、成型品
の離型面に剥離帯電による静電気が発生し、この静電気
で電気力線が他方の型の方向に発生しようとするが、こ
の状態で成型品を接触又は近接させている一方の型の静
電容量が大きいため、当該電気力線をこの一方の型の方
に引き込み、離型面から電気力線が発生しない。従って
この状態で適宜の塗布液を噴霧する。またこの後成型品
を一方の型からイジェクタピン等で離した状態では、前
述の様に成型品の一側面には帯電防止層が形成されてい
るため、離型時の剥離帯電による電気力線はこの帯電防
止層に向けられ、成型品の離型面に発生しない。この状
態で当該成型品の離型外周面に帯電防止剤の溶液を噴霧
することとなる。In the invention of claim 3, since at least one of the molds is composed of a conductor or semiconductor having a large electrostatic capacity such as a mold, when the other mold is released after molding, the molded product is released from the mold. Electrostatic force is generated on the surface due to peeling charging, and lines of electric force try to generate in the direction of the other mold due to this static electricity, but the molded product is in contact with or in close proximity in this state, and the capacitance of one mold is large. Therefore, the line of electric force is drawn toward the one of the molds, and no line of electric force is generated from the release surface. Therefore, an appropriate coating liquid is sprayed in this state. Also, after this, when the molded product is separated from one mold by an ejector pin, etc., the antistatic layer is formed on one side surface of the molded product as described above. Is directed to this antistatic layer and does not occur on the release surface of the molded product. In this state, the antistatic agent solution is sprayed onto the outer peripheral surface of the mold release of the molded product.
【0013】[0013]
【実施例】以下この発明の実施例を図について説明す
る。まずこの発明に使用する合成樹脂成型の成型装置及
び成型型の概略構成図を図1に基づいて説明する。成型
機1の先端に、静電容量の大きい導体から成る雌型の固
定型2を設け、この固定型2に対向して、この固定型2
に当接自在に静電容量の大きい導体から成る雄型の可動
型3を設けている。この成型機1のホッパーから入った
原料はスクリューにより練られて、噴出口4に達し、固
定型2と可動型3とで形成された中空状の型5内の空隙
に入り込むようになっている。また可動型3は伸縮自在
な伸縮腕6によって支持され、この伸縮腕6によって固
定型2に対して当接したり、離れたりする。Embodiments of the present invention will be described below with reference to the drawings. First, a schematic configuration diagram of a molding apparatus and a molding die for molding synthetic resin used in the present invention will be described with reference to FIG. A female fixed mold 2 made of a conductor having a large electrostatic capacity is provided at the tip of the molding machine 1, and the fixed mold 2 is provided so as to face the fixed mold 2.
A male movable mold 3 made of a conductor having a large electrostatic capacity is provided so as to be freely contactable with. The raw material entered from the hopper of the molding machine 1 is kneaded by the screw, reaches the ejection port 4, and enters the void in the hollow mold 5 formed by the fixed mold 2 and the movable mold 3. . The movable die 3 is supported by an extendable and retractable arm 6, and is brought into contact with or separated from the fixed die 2 by the extendable and retractable arm 6.
【0014】またこれらの固定型2と可動型3との間の
両側に図2に示すごとく、可動型と平行に摺動自在なノ
ズル室7が夫々設けられ、これらの各ノズル室7にはエ
アロゾル発生器8からフレキシブルパイプ9が導入され
ている。またこれらのノズル室7の間で、固定型2及び
可動型3の下方には、エアロゾル吸引体10が設けら
れ、このエアロゾル吸引体10からパイプ11及びブロ
アー12を通してエアロゾル発生器8に戻る帰還回路が
設けられている。As shown in FIG. 2, nozzle chambers 7 which are slidable in parallel with the movable mold are provided on both sides between the fixed mold 2 and the movable mold 3, and each of these nozzle chambers 7 is provided. A flexible pipe 9 is introduced from the aerosol generator 8. Further, between these nozzle chambers 7, an aerosol suction body 10 is provided below the fixed mold 2 and the movable mold 3, and a feedback circuit for returning from the aerosol suction body 10 to the aerosol generator 8 through the pipe 11 and the blower 12. Is provided.
【0015】つぎにこの発明の方法について説明する
と、予め伸縮腕6を作動させて上述の様に固定型2に可
動型3を当接させて、中空状の型5を形成し、この中空
状の型5の空隙に成型機1から原料を充填する。そして
当該型5により合成樹脂の成型品13を成型する。そし
て成型後に伸縮腕6を作動させて固定型2から可動型3
を引き離す。これによりこの雄型の可動型3の凸部3a
外周には成型品13が付着した状態で固定型2から離れ
る。そして図2及び図3に示すごとくこの成型品13を
一方の可動型3に接触させた状態で帯電防止剤の溶液を
噴霧させる。Explaining the method of the present invention, the telescopic arm 6 is actuated in advance to bring the movable mold 3 into contact with the fixed mold 2 as described above to form a hollow mold 5, and the hollow mold 5 is formed. The raw material is filled from the molding machine 1 into the space of the mold 5. Then, a molded product 13 of synthetic resin is molded by the mold 5. After molding, the telescopic arm 6 is operated to move the fixed mold 2 to the movable mold 3.
Pull apart. Thereby, the convex portion 3a of the male movable die 3 is formed.
The molded product 13 is attached to the outer periphery and is separated from the fixed mold 2. Then, as shown in FIGS. 2 and 3, the antistatic agent solution is sprayed in a state where the molded product 13 is in contact with one movable mold 3.
【0016】これにはエアロゾル発生器8で帯電防止剤
の溶液を多数の粒子から成るエアロゾルにし、各フレキ
シブルパイプ9を通して成型品13の両側に位置した各
ノズル室7からエアロゾルを成型品13に吹き付ける。
そして成型品13の下方に位置するエアロゾル吸引体を
作動させて成型品13に付着しなかったエアロゾルを吸
引し、パイプ11及びブロアー12を通してエアロゾル
発生器8に戻す。この様にして、図4に示すごとく成型
品13の露出した外周面に帯電防止剤から成る塗膜14
を形成させる(なお図では塗膜14を説明の便宜上厚く
表示しているが、実際は成型品13に比べて極めて薄
い)。To this end, a solution of the antistatic agent is made into an aerosol composed of a large number of particles by an aerosol generator 8, and the aerosol is sprayed onto the molded product 13 from each nozzle chamber 7 located on both sides of the molded product 13 through each flexible pipe 9. .
Then, the aerosol suction body located below the molded product 13 is actuated to suck the aerosol that has not adhered to the molded product 13, and returns it to the aerosol generator 8 through the pipe 11 and the blower 12. In this manner, as shown in FIG. 4, a coating film 14 made of an antistatic agent is formed on the exposed outer peripheral surface of the molded product 13.
Are formed (though the coating film 14 is shown thick in the figure for convenience of explanation, it is actually extremely thin compared to the molded product 13).
【0017】この様に成型品13の成型後に可動型3を
固定型2から離した際、成型品13の離型面に剥離帯電
による静電気が発生し、この静電気で電気力線が固定型
2の方向に発生しようとするが、この状態で成型品13
を接触させている可動型3の静電容量が大きいため、当
該電気力線をこの可動型3の方向に引き込み、離型面か
ら電気力線が発生しない。従ってこの状態で帯電防止剤
の溶液を成型品13の離型面に噴霧するため上記塗膜1
4にムラが生ぜず、均一となる。When the movable mold 3 is separated from the fixed mold 2 after the molded product 13 is molded in this manner, static electricity is generated on the mold release surface of the molded product 13 due to peeling charging, and the static electricity causes the lines of electric force to move to the fixed mold 2. , But in this state the molded product 13
Since the electrostatic capacity of the movable die 3 which is in contact with is large, the electric force line is pulled in the direction of the movable die 3 and the electric force line is not generated from the release surface. Therefore, in this state, the solution of the antistatic agent is sprayed onto the release surface of the molded product 13 so that the coating film 1
No unevenness occurs in 4 and becomes uniform.
【0018】その後適宜の手段でイジェクタピン15を
上記可動型3の凸部3a外周から突出させて図5に示す
ごとく当該イジェクタピン15で成型品13を支持し、
当該可動型3の凸部3a外周から離した状態で当該成型
品13の残りの外周面に帯電防止剤の溶液を上述と同様
にエアロゾルにして各ノズル室7から噴霧して図6に示
すごとく塗膜16を設ける。この可動型3から成型品1
3を離した際、剥離帯電による静電気が発生し、電気力
線が可動型3の方向に発生しようとするが、図5に示す
ごとく、成型品13の一側には帯電防止剤の塗膜14を
有するため、この塗膜14の帯電防止層に上記電気力線
が向き、可動型3との離型面には電気力線が発生しな
い。従ってこの状態で帯電防止剤の溶液を成型品13の
可動型3との離型面に噴霧するため上記塗膜16にムラ
が生ぜず、均一となる。この様にして図7に示すごと
く、成型品13の外周面全面に均一な帯電防止膜層17
を形成することができる。After that, the ejector pin 15 is projected from the outer periphery of the convex portion 3a of the movable mold 3 by an appropriate means to support the molded product 13 by the ejector pin 15 as shown in FIG.
As shown in FIG. 6, the antistatic agent solution is aerosolized on the remaining outer peripheral surface of the molded product 13 in the state of being separated from the outer periphery of the convex portion 3a of the movable mold 3 in the same manner as described above and sprayed from each nozzle chamber 7. A coating film 16 is provided. Molded product 1 from this movable mold 3
When 3 is released, static electricity due to peeling charge is generated and electric lines of force tend to be generated in the direction of the movable mold 3. However, as shown in FIG. 5, a coating film of an antistatic agent is formed on one side of the molded product 13. Since the coating film 14 is provided, the lines of electric force are directed to the antistatic layer of the coating film 14, and the lines of electric force are not generated on the release surface from the movable die 3. Therefore, in this state, the solution of the antistatic agent is sprayed on the release surface of the molded product 13 from the movable mold 3, so that the coating film 16 is uniform and uniform. In this way, as shown in FIG. 7, a uniform antistatic film layer 17 is formed on the entire outer peripheral surface of the molded product 13.
Can be formed.
【0019】また上記実施例では成型品13の外周面に
帯電防止膜層17を形成したが、これに限らず、適宜の
塗布液を成型品の外周面に噴霧する際も、この発明を適
用できる。しかしながら帯電防止剤の溶液以外の塗布液
を噴霧する場合は、上記実施例において、可動型3を固
定型2から離し、成型品13を固定型2から離型した際
は上記実施例と同様に静電気による電気力線の影響を受
けずに塗膜14を形成することができるが、可動型3か
ら成型品13を離型する際は、電気力線の影響を受ける
こととなる。従ってこの場合は、成型品13の外側外周
面にのみ均一な塗膜が形成される。Although the antistatic film layer 17 is formed on the outer peripheral surface of the molded product 13 in the above embodiment, the present invention is not limited to this, and the present invention is also applied when an appropriate coating liquid is sprayed on the outer peripheral surface of the molded product. it can. However, when spraying a coating liquid other than the antistatic agent solution, when the movable mold 3 is separated from the fixed mold 2 and the molded product 13 is separated from the fixed mold 2 in the above-described embodiment, the same as in the above-described embodiment. The coating film 14 can be formed without being affected by the lines of electric force due to static electricity, but when the molded product 13 is released from the movable die 3, it is affected by the lines of electric force. Therefore, in this case, a uniform coating film is formed only on the outer peripheral surface of the molded product 13.
【0020】さらに帯電防止剤の溶液以外の塗布液を噴
霧する場合に、図8に示すごとく、可動型3を固定型2
から離した際、固定型2を成型品13に近接した状態に
しておく。これにより可動型3からイジェクタピン15
で成型品13を離型した際、この離型面に静電気による
電気力線が発生しようとするが、この成型品13からよ
り近い固定型2の側に電気力線が向くので、可動型3と
の離型面には静電気が生ぜず、上記塗布液を均一に塗布
することができる。Further, when spraying a coating liquid other than the antistatic agent solution, as shown in FIG.
When separated from the fixed mold 2, the fixed mold 2 is kept close to the molded product 13. As a result, the movable die 3 to the ejector pin 15
When the molded product 13 is released from the mold, electric force lines due to static electricity tend to be generated on this release surface, but since the electric force lines are directed to the fixed mold 2 side closer to this molded product 13, the movable mold 3 No static electricity is generated on the release surface of and, and the coating liquid can be uniformly applied.
【0021】なお上記実施例では、一方の静電容量の大
きい導体から成る型に成型品を接触させた状態で当該成
型品の露出外周面に塗布液を噴霧したが、その場合上記
型に成型品を近接させた状態で噴霧しても同様の効果を
有するものである。また上記実施例では一方又は双方の
型を静電容量の大きい導体としたが、これに限らず、静
電容量の大きい導体又は半導体から成る金型としてもよ
い。また上記成型機にはコンプレッション成型、注入成
型、真空成型等適宜のものが包含され、この発明は離型
直後の成型品に適宜の塗布液を噴霧するものが、広く含
まれる。In the above embodiment, the coating liquid was sprayed on the exposed outer peripheral surface of the molded product while the molded product was in contact with one of the molds having a large electrostatic capacitance. The same effect can be obtained by spraying the products in close proximity. Further, in the above-mentioned embodiment, one or both of the molds is a conductor having a large electrostatic capacity, but the present invention is not limited to this, and a mold made of a conductor or a semiconductor having a large electrostatic capacity may be used. The above-mentioned molding machines include appropriate ones such as compression molding, injection molding, and vacuum molding, and the present invention broadly includes those that spray an appropriate coating liquid onto a molded product immediately after release from the mold.
【0022】[0022]
【発明の効果】請求項1項の発明は、成型品の外周面へ
の適宜の塗布液の塗布に当たって、一方の型を金型等の
静電容量の大きい導体又は半導体から構成しているた
め、成型後に他方の型を離した際、成型品の離型面に剥
離帯電による静電気が発生し、この静電気で電気力線が
他方の型の方向に発生しようとするが、この状態で成型
品を接触又は近接させている一方の型の静電容量が大き
いため、当該電気力線をこの一方の型の方向に引き込
み、離型面から電気力線が発生しない。従ってこの様に
静電気の影響を受けずに、適宜の塗布液を成型品の一方
の離型面に均一に塗布することができ、特に薄い塗膜を
設けようとする場合、塗布液の粒子を小さくするが、こ
の様な微粒子であっても静電気の影響を受けずに噴霧、
塗布することができ、均一な極薄膜が得られる。According to the invention of claim 1, one of the molds is composed of a conductor or a semiconductor having a large electrostatic capacitance such as a mold in applying an appropriate coating liquid to the outer peripheral surface of the molded product. , When the other mold is released after molding, static electricity is generated on the release surface of the molded product due to peeling charging, and this static electricity causes lines of electric force to be generated in the direction of the other mold. Since one of the molds that is in contact with or close to has a large electrostatic capacitance, the electric force line is drawn in the direction of the one mold, and the electric force line is not generated from the release surface. Therefore, it is possible to uniformly apply an appropriate coating liquid to one release surface of the molded product without being affected by static electricity in this way, and especially when a thin coating film is to be provided, particles of the coating liquid are Although it is small, even such fine particles are sprayed without being affected by static electricity,
It can be applied and a uniform ultrathin film can be obtained.
【0023】請求項2項の発明は、上記請求項1項の発
明の効果に加え、成型品の両方の離型面に適宜の塗布液
を均一に塗布することができる。According to the invention of claim 2, in addition to the effect of the invention of claim 1, an appropriate coating liquid can be uniformly applied to both release surfaces of the molded product.
【0024】さらに請求項3項の発明は、帯電防止層を
成型品の外周面に形成するのに適し、帯電防止剤の溶液
を多数の微粒子にして、成型品の外周面に極薄膜を形成
する際、静電気の影響を受けずに迅速にかつ均一に帯電
防止層を形成することができる。Furthermore, the invention of claim 3 is suitable for forming an antistatic layer on the outer peripheral surface of a molded product, and a solution of an antistatic agent is made into a large number of fine particles to form an extremely thin film on the outer peripheral surface of the molded product. In doing so, the antistatic layer can be formed quickly and uniformly without being affected by static electricity.
【図1】この発明の方法に使用する装置の概略構成図で
ある。FIG. 1 is a schematic configuration diagram of an apparatus used in the method of the present invention.
【図2】この発明の方法に使用するエアロゾル噴霧装置
の概略構成図である。FIG. 2 is a schematic configuration diagram of an aerosol spraying device used in the method of the present invention.
【図3】この発明の方法において一方の型に成型品を係
止した状態で、他方の型との離型面に塗布液を噴霧して
いる状態を示す概略図である。FIG. 3 is a schematic view showing a state in which a mold product is locked in one mold and a coating liquid is sprayed on a release surface from the other mold in the method of the present invention.
【図4】この発明の方法において一方の型に係止した成
型品の、他方の型との離型面に塗膜が形成された状態を
示す概略図である。FIG. 4 is a schematic view showing a state in which a coating film is formed on a release surface of a molded product locked in one mold in the method of the present invention from the other mold.
【図5】この発明の方法において一方の型から成型品を
離型した状態で、この成型品の一方の型との離型面に塗
布液を噴霧している状態を示す概略図である。FIG. 5 is a schematic view showing a state where a molded product is released from one mold in the method of the present invention, and a coating liquid is sprayed on a mold release surface of the molded product from the one mold.
【図6】この発明の方法において一方の型から成型品を
離型した状態で、この成型品の一方の型との離型面に塗
膜が形成された状態を示す概略図である。FIG. 6 is a schematic view showing a state in which a mold is released from one mold in the method of the present invention, and a coating film is formed on a mold release surface of the mold with one mold.
【図7】この発明の方法により塗布された成型品の概略
断面図である。FIG. 7 is a schematic cross-sectional view of a molded product applied by the method of the present invention.
【図8】この発明の方法の他の実施例において、一方の
型から成型品を離型した状態で、この成型品の一方の型
との離型面に塗布液を噴霧している状態を示す概略図で
ある。FIG. 8 shows another embodiment of the method of the present invention, in which the molded product is released from one mold and the coating liquid is sprayed on the mold release surface of the one mold. It is a schematic diagram showing.
1 成型機 2 固定型 3 可動型 5 中空状の型 6 伸縮腕 7 ノズル室 8 エアロゾル発生器 13 成型品 14 塗膜 15 イジェク
タピン 16 塗膜 17 帯電防止
膜層1 Molding machine 2 Fixed type 3 Movable type 5 Hollow type 6 Expandable arm 7 Nozzle chamber 8 Aerosol generator 13 Molded product 14 Coating film 15 Ejector pin 16 Coating film 17 Antistatic film layer
Claims (3)
て成型品を成形する方法において、少なくとも一方の型
は金型等の静電容量の大きい導体又は半導体から成り、
成型後に他方の型を離した際、成型品を一方の型に接触
又は近接させた状態で適宜の塗布液を噴霧させ、成型品
の露出した外周面に塗布液から成る塗膜を形成させ、そ
の後当該成型品を一方の型からイジェクタピン等で離し
た状態で当該成型品の残りの外周面に塗布液を噴霧し、
塗膜を形成させることを特徴とする、表面改質剤等の塗
布液の塗布法。1. A method of molding a molded article by injecting a raw material between one mold and the other mold, wherein at least one mold is made of a conductor or semiconductor having a large capacitance such as a mold,
When the other mold is released after molding, a suitable coating liquid is sprayed in a state where the molded product is in contact with or close to the one mold to form a coating film made of the coating liquid on the exposed outer peripheral surface of the molded product, Then spray the coating liquid on the remaining outer peripheral surface of the molded product in a state where the molded product is separated from one mold by an ejector pin or the like,
A method for applying a coating liquid such as a surface modifier, which comprises forming a coating film.
て成型品を成形する方法において、双方の型は金型等の
静電容量の大きい導体又は半導体から成り、成型後に他
方の型を離した際、成型品を一方の型に接触又は近接さ
せた状態で適宜の塗布液を噴霧させ、成型品の露出した
外周面に塗布液から成る塗膜を形成させ、その後当該成
型品を一方の型からイジェクタピン等で離し、上記他方
の型を一方の型より成型品からより近接した状態で当該
成型品の残りの外周面に塗布液を噴霧し、塗膜を形成さ
せることを特徴とする、表面改質剤等の塗布液の塗布
法。2. A method for molding a molded product by injecting a raw material between one mold and the other mold, wherein both molds are made of a conductor or semiconductor having a large electrostatic capacity such as a mold, and after molding. When the other mold is released, an appropriate coating liquid is sprayed with the molded product in contact with or close to one mold to form a coating film of the coating liquid on the exposed outer peripheral surface of the molded product, and then the Separate the molded product from one mold with an ejector pin or the like, and spray the coating liquid on the remaining outer peripheral surface of the molded product while the other mold is closer to the molded product than the one mold to form a coating film. A method of applying a coating liquid such as a surface modifier, which is characterized in that
て成型品を成形する方法において、少なくとも一方の型
は金型等の静電容量の大きい導体又は半導体から成り、
成型後に他方の型を離した際、成型品を一方の型に接触
又は近接させた状態で帯電防止剤の溶液を噴霧させ、成
型品の露出した外周面に帯電防止剤から成る塗膜を形成
させ、その後当該成型品を一方の型からイジェクタピン
等で離した状態で当該成型品の残りの外周面に帯電防止
剤の溶液を噴霧し、帯電防止剤から成る塗膜を形成させ
ることを特徴とする、表面改質剤等の塗布液の塗布法。3. A method for molding a molded product by injecting a raw material between one mold and the other mold, wherein at least one mold is made of a conductor or semiconductor having a large electrostatic capacitance such as a mold,
When the other mold is released after molding, the antistatic agent solution is sprayed while the molded product is in contact with or close to one mold to form a coating film consisting of the antistatic agent on the exposed outer peripheral surface of the molded product. After that, the molded product is sprayed with a solution of the antistatic agent on the remaining outer peripheral surface of the molded product in a state where the molded product is separated from one mold with an ejector pin or the like, and a coating film made of the antistatic agent is formed. And a method for applying a coating liquid such as a surface modifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5292527A JPH08406B2 (en) | 1993-10-29 | 1993-10-29 | Coating method of coating liquid such as surface modifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5292527A JPH08406B2 (en) | 1993-10-29 | 1993-10-29 | Coating method of coating liquid such as surface modifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07124955A JPH07124955A (en) | 1995-05-16 |
| JPH08406B2 true JPH08406B2 (en) | 1996-01-10 |
Family
ID=17782963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5292527A Expired - Lifetime JPH08406B2 (en) | 1993-10-29 | 1993-10-29 | Coating method of coating liquid such as surface modifier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08406B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6336627B2 (en) | 2014-03-05 | 2018-06-06 | インテル コーポレイション | Location discovery method and communication station |
-
1993
- 1993-10-29 JP JP5292527A patent/JPH08406B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6336627B2 (en) | 2014-03-05 | 2018-06-06 | インテル コーポレイション | Location discovery method and communication station |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07124955A (en) | 1995-05-16 |
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