JPH0845740A - Laminated coil element - Google Patents
Laminated coil elementInfo
- Publication number
- JPH0845740A JPH0845740A JP17554294A JP17554294A JPH0845740A JP H0845740 A JPH0845740 A JP H0845740A JP 17554294 A JP17554294 A JP 17554294A JP 17554294 A JP17554294 A JP 17554294A JP H0845740 A JPH0845740 A JP H0845740A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- coil element
- metal thin
- laminated coil
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000010408 film Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
- 239000000696 magnetic material Substances 0.000 abstract description 4
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910000792 Monel Inorganic materials 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】磁性体基板にコイルが形成された
素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element in which a coil is formed on a magnetic substrate.
【０００２】[0002]
【従来の技術】近年電子部品の小型化が望まれてきてい
るが、コイル素子においても基板に電気伝導性材料によ
りコイル形状やミアンダライン形状の金属薄膜が形成さ
れた小型の積層コイル素子が実用化されている。このよ
うな積層コイル素子のインダクタンスを大きくするため
にはコイル形状の金属薄膜を有する素子においてはタ−
ン数を、ミアンダライン形状を有する素子においては往
復数を増やすことにより実現されている。しかしながら
前記の方法によれば、金属薄膜の微細化をさらに進める
必要があるが、直流抵抗が大きくなるという問題があ
る。そこで小型でインダクタンスの大きなコイル素子を
得るために、磁性体基板に金属薄膜を形成するという方
法が採用されている。さらには磁力線の漏れを抑えるた
めに金属薄膜を磁性体基板で挟んだ構造の素子も開発さ
れている。2. Description of the Related Art In recent years, there has been a demand for miniaturization of electronic parts, and in coil elements as well, a small laminated coil element in which a coil-shaped or meander line-shaped metal thin film is formed of an electrically conductive material on a substrate is practically used. Has been converted. In order to increase the inductance of such a laminated coil element, in an element having a coil-shaped metal thin film,
This is realized by increasing the number of round trips in a device having a meander line shape. However, according to the above method, although it is necessary to further miniaturize the metal thin film, there is a problem that the DC resistance increases. Therefore, in order to obtain a coil element having a small size and a large inductance, a method of forming a metal thin film on a magnetic substrate is adopted. Furthermore, an element having a structure in which a metal thin film is sandwiched between magnetic substrates has been developed in order to suppress leakage of magnetic force lines.
【０００３】従来の積層コイル素子２０の構造を図９、
図１０を用いて説明する。The structure of a conventional laminated coil element 20 is shown in FIG.
This will be described with reference to FIG.
【０００４】図９は積層コイル素子２０を構成する金属
薄膜の平面断面図を、図１０は積層コイル素子を図９の
Ａ−Ａで切断したときの側面断面図を示す。図９におい
て１は金属薄膜でたとえばＡｇなどの薄膜からなり磁性
体基板２ａにスパッタリングおよびフォトリソグラフィ
−により形成されている。金属薄膜１はコイル形状をし
ているため、互いに交差する部分が短絡しないようにた
とえばポリイミドなどによるクロスオ−バ−と呼ばれる
絶縁層３が設けられている。図１０の側面断面図に示す
ように金属薄膜１の上には磁性体基板２ｂがポリイミド
からなる接着層４により接着されている。さらに金属薄
膜１の両端には外部の素子と接続するためのたとえばＮ
ｉＣｒＡｇモネルなどをスパッタリングにより成膜した
端子電極５、５が設けられている。前記金属薄膜１の外
周は磁性体基板２ａ、２ｂ端面の近傍まで形成されてお
り、その断面は電気抵抗値を小さくするために例えば幅
が３０μｍ、厚みが４μｍに形成されている。FIG. 9 is a plan sectional view of a metal thin film constituting the laminated coil element 20, and FIG. 10 is a side sectional view of the laminated coil element taken along the line AA in FIG. In FIG. 9, reference numeral 1 denotes a metal thin film made of a thin film such as Ag and formed on the magnetic substrate 2a by sputtering and photolithography. Since the metal thin film 1 has a coil shape, an insulating layer 3 called a crossover made of, for example, polyimide is provided so as not to short-circuit portions that intersect each other. As shown in the side sectional view of FIG. 10, a magnetic substrate 2b is adhered onto the metal thin film 1 by an adhesive layer 4 made of polyimide. Further, both ends of the metal thin film 1 are provided with, for example, N for connecting to an external element.
Terminal electrodes 5 and 5 formed by sputtering iCrAg monel or the like are provided. The outer periphery of the metal thin film 1 is formed up to the vicinity of the end faces of the magnetic substrates 2a and 2b, and its cross section is formed to have a width of 30 μm and a thickness of 4 μm in order to reduce the electric resistance value.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら以上の構
造を有する積層コイル素子は次に述べるような問題点が
ある。すなわち金属薄膜が形成されている磁性体基板の
透磁率が変動すると積層コイル素子のインダクタンスが
ばらつく。また磁性体基板を接着したとき磁性体基板間
の間隔が変動すると積層コイル素子のインダクタンスが
ばらつく。具体的には磁性体基板を形成する磁性材料の
透磁率を±５％に制御すると同時に、磁性体基板の間隔
を１０μｍ±５μｍに制御するのは困難である。そのた
めに、積層コイル素子のインダクタンスの変化量は６０
％にもなる。本発明は前記問題点を解決するためになさ
れたものであり、インダクタンスのばらつきの小さな積
層コイル素子を提供するものである。However, the laminated coil element having the above structure has the following problems. That is, when the magnetic permeability of the magnetic substrate on which the metal thin film is formed changes, the inductance of the laminated coil element varies. Further, when the magnetic substance substrates are bonded together, if the distance between the magnetic substance substrates varies, the inductance of the laminated coil element varies. Specifically, it is difficult to control the magnetic permeability of the magnetic material forming the magnetic substrate to ± 5% and simultaneously control the gap between the magnetic substrates to 10 μm ± 5 μm. Therefore, the amount of change in the inductance of the laminated coil element is 60
It also becomes%. The present invention has been made to solve the above-mentioned problems, and provides a laminated coil element having a small variation in inductance.
【０００６】[0006]
【課題を解決するための手段】本発明の請求項１に係る
積層コイル素子は、コイル形状を有する金属薄膜が磁性
体基板に挟まれてなる積層コイル素子において、コイル
を形成する金属薄膜の全外縁が磁性体基板の外縁よりそ
れぞれ基板寸法の１０％以上内側に形成され、かつ金属
薄膜の幅が５０μｍ以上で厚みが１μｍ以下であること
を特徴とする。A laminated coil element according to claim 1 of the present invention is a laminated coil element in which a metal thin film having a coil shape is sandwiched between magnetic substrates, and all the metal thin films forming a coil are included. The outer edge is formed inside 10% or more of the substrate dimension from the outer edge of the magnetic substrate, and the width of the metal thin film is 50 μm or more and the thickness is 1 μm or less.
【０００７】[0007]
【作用】請求項１記載の積層コイル素子は、コイル形状
を有する金属薄膜が磁性体基板に挟まれてなる積層コイ
ル素子において、コイルを形成する金属薄膜の全外縁が
磁性体基板の外縁よりそれぞれ基板寸法の１０％以上内
側に形成され、かつ金属薄膜の幅が５０μｍ以上で厚み
が１μｍ以下にすることにより金属薄膜近傍に生じる磁
力線が磁性体基板から漏れる事を減らす事ができる。The laminated coil element according to claim 1 is a laminated coil element in which a metal thin film having a coil shape is sandwiched between magnetic substrates, and all the outer edges of the metal thin films forming the coil are respectively located from the outer edge of the magnetic substrate. By forming the metal thin film at 10% or more inside of the substrate and having a width of 50 μm or more and a thickness of 1 μm or less, it is possible to reduce leakage of magnetic force lines generated in the vicinity of the metal thin film from the magnetic substrate.
【０００８】[0008]
【実施例】以下に本発明の一実施例回路素子の構造を図
１、２を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a circuit element according to an embodiment of the present invention will be described below with reference to FIGS.
【０００９】なお従来例と同一の部分については同一の
符号を用いる。The same parts as those in the conventional example are designated by the same reference numerals.
【００１０】図１は積層コイル素子１０の平面断面図で
外形が４×５ｍｍの磁性体基板２ａにＡｇ薄膜によりコ
イル形状を有する金属薄膜１が形成されている。図１に
示すように金属薄膜１はその交差する部分が短絡しない
ようにポリイミド樹脂によりクロスオ−バ−とよばれる
絶縁層３が設けられている。図１のＡ−Ａで切断したと
きの側面断面図を図２に示す。図２に示すように金属薄
膜１を覆うようにポリイミドからなる接着層４により磁
性体基板２ｂが接着されている。そして金属薄膜１の両
端に接続するように積層コイル素子１０の端面に接続電
極５、５が設けられている。なお破線でコイル形状を有
する金属薄膜１の外縁７を示す。FIG. 1 is a plan sectional view of the laminated coil element 10, in which a metal thin film 1 having a coil shape is formed of an Ag thin film on a magnetic substrate 2a having an outer shape of 4 × 5 mm. As shown in FIG. 1, the metal thin film 1 is provided with an insulating layer 3 called a crossover by a polyimide resin so that the intersecting portions are not short-circuited. FIG. 2 shows a side sectional view taken along the line AA of FIG. As shown in FIG. 2, the magnetic substrate 2b is adhered by the adhesive layer 4 made of polyimide so as to cover the metal thin film 1. The connection electrodes 5 and 5 are provided on the end faces of the laminated coil element 10 so as to be connected to both ends of the metal thin film 1. The broken line shows the outer edge 7 of the metal thin film 1 having a coil shape.
【００１１】前記金属薄膜１はその外縁７が、図１に示
すように縦と横の寸法がそれぞれｌ1 、ｌ2 となるよう
に形成されている。しかも金属薄膜１の縦方向が磁性体
基板２ａの外縁よりｌ3 、ｌ4 だけ内側に位置するよう
に形成されており、かつｌ3 、ｌ4 はそれぞれ磁性体基
板の外形縦寸法ｌ7 の１０％以上である。同様に金属薄
膜１の横方向は磁性体基板２ａの外縁よりｌ5 、ｌ6 だ
け内側に位置するように形成されており、かつｌ5 、ｌ
6 はそれぞれ磁性体基板の外形横寸法ｌ8 の１０％以上
である。さらには金属薄膜１の幅が５０μｍ以上で、厚
みが１μｍ以下となるような形状に形成されている。The metal thin film 1 is formed so that its outer edge 7 has vertical and horizontal dimensions of l 1 and l 2 , respectively, as shown in FIG. Moreover, the metal thin film 1 is formed so that the vertical direction thereof is located inside the outer edge of the magnetic substrate 2a by l 3 and l 4 , and l 3 and l 4 are respectively the external longitudinal dimension l 7 of the magnetic substrate. It is 10% or more. Similarly, the metal thin film 1 is formed so as to be located inward by l 5 , l 6 from the outer edge of the magnetic substrate 2a, and l 5 , l
6 is 10% or more of the outer lateral dimension l 8 of the magnetic substrate. Further, the metal thin film 1 is formed in a shape having a width of 50 μm or more and a thickness of 1 μm or less.
【００１２】上記積層コイル素子１０の製造方法を図３
〜図８を用いて説明する。A method of manufacturing the laminated coil element 10 will be described with reference to FIG.
This will be described with reference to FIG.
【００１３】まず粉末成形法により成形され、焼成され
た磁性体基板２ａを準備する。次に図３の断面図に示す
ように磁性体基板２ａにスパッタリングにより１μｍの
膜厚でＡｇ薄膜６を全面に形成する。そして図４の断面
図および図５の平面図に示すようにＡｇ薄膜６をフォト
リソグラフィ−により金属薄膜１の一部であるパタ−ン
１ａに形成する。次に図６の平面図に示すように金属薄
膜１が短絡しないように交差部分に絶縁層３としてはた
らくポリイミド膜を形成する。次に図７の平面図に示す
ようにパタ−ン１ａと同様に、スパッタリングとフォト
リソグラフィ−によりパタ−ン１ｂを形成する。前記パ
タ−ン１ａ、１ｂはそれぞれの一端が互いに接続しコイ
ル形状を有する金属薄膜１に形成される。次に図８の断
面図に示すようにポリイミドからなる接着層４により磁
性体基板２ｂを接着し、ダイシングソ−により個々の素
子に切断分離する。次に切断分離することにより端面に
露出した金属薄膜１に接続するようにＮｉＣｒＡｇモネ
ルからなる接続電極５、５をスパッタリングにより形成
して図２に示す断面構造を有する積層コイル素子１０が
得られる。なお以上の説明に用いた図では単独の金属薄
膜が磁性体基板に形成されている図を示したが、実際の
製造工程においては、多数個の金属薄膜を磁性体基板に
同時に形成し後工程で切断分離され、個々の回路素子に
形成される。なお本実施例において金属薄膜はＡｇで、
絶縁膜はポリイミドで、接続電極はＮｉＣｒＡｇモネル
でそれぞれ形成した例について述べたがこれらの材料だ
けに限定されないことはいうまでもない。First, a magnetic material substrate 2a which is molded by a powder molding method and fired is prepared. Next, as shown in the sectional view of FIG. 3, an Ag thin film 6 having a film thickness of 1 μm is formed on the entire surface of the magnetic substrate 2a by sputtering. Then, as shown in the sectional view of FIG. 4 and the plan view of FIG. 5, an Ag thin film 6 is formed on the pattern 1a which is a part of the metal thin film 1 by photolithography. Next, as shown in the plan view of FIG. 6, a polyimide film serving as an insulating layer 3 is formed at the intersection so that the metal thin film 1 is not short-circuited. Next, as shown in the plan view of FIG. 7, a pattern 1b is formed by sputtering and photolithography as in the case of the pattern 1a. The patterns 1a and 1b are connected to each other at one end thereof and are formed on a metal thin film 1 having a coil shape. Next, as shown in the sectional view of FIG. 8, the magnetic substrate 2b is adhered by the adhesive layer 4 made of polyimide, and cut into individual elements by a dicing saw. Next, by cutting and separating, the connection electrodes 5 and 5 made of NiCrAg monel are formed by sputtering so as to be connected to the metal thin film 1 exposed on the end face, and the laminated coil element 10 having the sectional structure shown in FIG. 2 is obtained. In the figures used in the above explanation, a single metal thin film is formed on the magnetic substrate, but in the actual manufacturing process, many metal thin films were formed on the magnetic substrate at the same time. Are cut and separated into individual circuit elements. In this embodiment, the metal thin film is Ag,
Although the insulating film is made of polyimide and the connecting electrode is made of NiCrAg monel, the materials are not limited to these materials.
【００１４】このような構造を有する積層コイル素子に
おいて、磁性体基板の透磁率を３０％小さくし磁性体基
板の間隔を１０μｍ〜２０μｍまで変化させてそのイン
ダクタンスのばらつきを調査したところ２０％の変動で
あった。In the laminated coil element having such a structure, the magnetic permeability of the magnetic substrate is reduced by 30%, the gap between the magnetic substrates is changed from 10 μm to 20 μm, and the variation of the inductance is investigated. Met.
【００１５】[0015]
【発明の効果】本発明に係る積層コイル素子の金属薄膜
をその外形寸法が磁性体基板の外形寸法の８０％以下
で、かつ金属薄膜の幅が５０μｍ以上で、厚みが１μｍ
以下となるように形成されることにより、積層コイル素
子のインダクタンス変化量を１／３に削減する事ができ
る。The metal thin film of the laminated coil element according to the present invention has an outer dimension of 80% or less of the outer dimension of the magnetic substrate, a metal thin film width of 50 μm or more and a thickness of 1 μm.
By forming as follows, the amount of change in the inductance of the laminated coil element can be reduced to 1/3.
【図１】本発明に係る一実施例積層コイル素子の平面断
面図である。FIG. 1 is a plan cross-sectional view of a laminated coil element according to an embodiment of the present invention.
【図２】本発明に係る一実施例積層コイル素子の側面断
面図である。FIG. 2 is a side sectional view of an example laminated coil element according to the present invention.
【図３】本発明に係る一実施例積層コイル素子の製造途
中における側面断面図である。FIG. 3 is a side sectional view of a laminated coil element according to an embodiment of the present invention during manufacturing.
【図４】本発明に係る一実施例積層コイル素子の製造途
中における側面断面図である。FIG. 4 is a side sectional view in the process of manufacturing a laminated coil element according to an embodiment of the present invention.
【図５】本発明に係る一実施例積層コイル素子の製造途
中における平面断面図である。FIG. 5 is a cross-sectional plan view in the process of manufacturing a laminated coil element according to an embodiment of the present invention.
【図６】本発明に係る一実施例積層コイル素子の製造途
中における平面断面図である。FIG. 6 is a cross-sectional plan view in the process of manufacturing a laminated coil element according to an embodiment of the present invention.
【図７】本発明に係る一実施例積層コイル素子の製造途
中における平面断面図である。FIG. 7 is a cross-sectional plan view in the process of manufacturing a laminated coil element according to an embodiment of the present invention.
【図８】本発明に係る一実施例積層コイル素子の製造途
中における側面断面図である。FIG. 8 is a side sectional view of the laminated coil element according to one embodiment of the present invention during manufacture.
【図９】従来の積層コイル素子の平面断面図である。FIG. 9 is a plan sectional view of a conventional laminated coil element.
【図１０】従来の積層コイル素子の側面断面図である。FIG. 10 is a side sectional view of a conventional laminated coil element.
１ 金属薄膜 １ａ、１ｂ パタ−ン ２ａ、２ｂ 磁性体基板 ３ 絶縁層 ４ 接着層 ５ 接続電極 ６ Ａｇ薄膜 ７ 外縁 1 Metal Thin Film 1a, 1b Pattern 2a, 2b Magnetic Substrate 3 Insulating Layer 4 Adhesive Layer 5 Connection Electrode 6 Ag Thin Film 7 Outer Edge
Claims (1)
に挟まれてなる積層コイル素子において、コイルを形成
する金属薄膜の全外縁が磁性体基板の外縁よりそれぞれ
基板寸法の１０％以上内側に形成され、かつ金属薄膜の
幅が５０μｍ以上で厚みが１μｍ以下であることを特徴
とする積層コイル素子。1. In a laminated coil element in which a metal thin film having a coil shape is sandwiched between magnetic substrates, the entire outer edges of the metal thin films forming the coil are located at 10% or more of the outer dimensions of the magnetic substrate inside the substrate. A laminated coil element, wherein the formed thin metal film has a width of 50 μm or more and a thickness of 1 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17554294A JPH0845740A (en) | 1994-07-27 | 1994-07-27 | Laminated coil element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17554294A JPH0845740A (en) | 1994-07-27 | 1994-07-27 | Laminated coil element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0845740A true JPH0845740A (en) | 1996-02-16 |
Family
ID=15997904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17554294A Pending JPH0845740A (en) | 1994-07-27 | 1994-07-27 | Laminated coil element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0845740A (en) |
-
1994
- 1994-07-27 JP JP17554294A patent/JPH0845740A/en active Pending
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