JPH0846342A - Mounting of solder piece on printed board and device - Google Patents

Abstract

PURPOSE:To improve the accuracy of mounting of solder pieces by a method wherein in a process that a solder sheet drawn out from a solder roll is fed in a set direction, the solder pieces are cut out in the solder sheet and the solder pieces a corresponding to the patterns at solder piece mounting object positions on a printed board are formed on the solder sheet. CONSTITUTION:In a process that a long thin-walled foil-shaped solder sheet 1 of a set width is drawn out from a solder roll 1' wound into a roll form and is fed in a set direction, solder pieces 1a are cut out in the sheet 1 into the same patterns P.. as patterns P1 at solder piece mounting object positions 4 on a printed board 3. The solder pieces 1a are formed on the sheet 1 into the form of the patterns P2 to correspond to the patterns P2 and all the solder pieces 1a are simultaneously transferred on the board 3 in the state remaining as they hold the patterns P2 and are mounted on the board 3. Accordingly, even the solder pieces, which are vary small-sized and are in close proximity of each other, can be accurately mounted on the printed board 3.

Description

Detailed Description of the Invention

[0001]

[Industrial application] In the process of feeding a solder sheet drawn from a solder roll, which is a foil-shaped solder sheet wound in a roll, in the set direction, the pattern is the same as the pattern of the solder piece mounting target position on the printed circuit board. Provided is a solder piece mounting method and device on a printed circuit board, wherein the solder sheet is cut to form solder pieces in the same pattern, and all the solder pieces are simultaneously transferred onto a printed circuit board pattern and mounted. To do.

[0002]

2. Description of the Related Art At present, it is widely and generally practiced to mount and mount a chip register and other small electronic components (hereinafter simply referred to as a chip, reference numeral t) at a set position of a printed wiring pattern on a printed circuit board. Has been.

In particular, when a large number of chips, which have been extremely miniaturized recently, are mounted on a printed circuit board, a paste-like paste is provided at each chip mounting position on the printed circuit board (the connection between the chip terminal and the printed wiring). Solder is applied by printing or other means, on the solder paste,
The most common method is to mount the chip with the chip supply means, heat it, and mount the chip by soldering.

The means for using this solder paste is that the solder is literally in a paste form. Therefore, (1) it is possible to apply a precise shape and amount of paste to the set position, especially when the chip is a 0816 type chip (0. 8x
This is difficult when the size is extremely small (1.6 mm). (2) If even a small amount of contact is made during the process, the coating shape will be broken and it will not be possible to start over. (3) Since it is exposed to air for a long time during the process in a paste state, oxidation is unfavorable. (4) Naturally, since an additive for making a paste is used, the purity of the solder is low, which is not preferable for electrical connection. There was a problem such as.

[0005]

SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned conventional problems. Instead of using the above-mentioned paste-like solder, a so-called pure solder sheet (solder with a set width Long thin foil (eg, thickness 30-50
μ) is used to effectively solve the problem.

[0006]

[Means for solving the problem]

"Solder piece mounting method on a printed circuit board" That is, the present invention provides a solder roll in which a long thin foil-shaped solder sheet with a set width is wound in a roll shape, and the solder sheet pulled out from the solder roll is set in a setting direction. In the process of feeding to, the solder piece was cut into the above-mentioned solder sheet in the same pattern as the solder piece mounting target position pattern of the printed circuit board, and the solder sheet corresponded to the pattern of the solder piece mounting target position of the printed circuit board. Forming solder pieces,

As described above, all the solder pieces formed in a pattern on the solder sheet are simultaneously transferred to the printed circuit board while maintaining the pattern, and the solder piece mounting on the printed circuit board is intended. The problem is solved by a method of mounting a solder piece on a printed circuit board, which is characterized in that all the solder pieces are mounted at the same time.

[Solder Piece Mounting Device 1 on Printed Circuit Board] A solder sheet mounted on a printed circuit board is provided with a pattern at a desired position for mounting the solder piece on the way of a feeding path for feeding the solder sheet drawn out from the solder roll in a set direction. Solder piece mounting device for a printed circuit board, comprising means for cutting the solder pieces in the same pattern, and means for simultaneously transferring and mounting all the cut solder pieces and the cut solder pieces to the solder piece mounting target position of the printed circuit board. Is the solution to the problem.

[Solder Piece Mounting Device 2 for Printed Circuit Board] In the middle of the feeding path for feeding the solder sheet drawn out from the solder roll in the set direction, the solder sheet is formed into a pattern at the solder piece mounting target position on the printed circuit board. A means for cutting into the same pattern and all the solder pieces cut by the means are simultaneously held in a patterned state by adsorption or other means and transferred to the printed circuit board, and all the solder pieces held by the adsorption or other means are held. The problem is solved by a solder piece mounting device for a printed circuit board, which is provided with means for simultaneously transferring and mounting the solder pieces to a solder piece mounting target position on the printed circuit board.

[Solder Piece Mounting Device 3 for Printed Circuit Board] A solder sheet mounted on the printed circuit board is provided with a pattern at a target position for mounting the solder piece on the way of the feeding path for feeding the solder sheet pulled out from the solder roll in the set direction. A means for cutting into the same pattern, and all the pattern-shaped solder pieces cut by the means are transferred to and held on the peripheral surface of the conversion roller in the same pattern, and then, from the roller to the solder piece mounting target position of the printed circuit board. The problem is solved by a solder piece mounting device on a printed circuit board, which is equipped with a conversion roller for transfer mounting.

[0011]

EXAMPLE Next, an example of the method of the present invention will be described with reference to FIG. 1. A solder roll 1 ′, which is a roll of a thin foil foil solder sheet 1 having a set width, is provided. In the process of feeding the solder sheet 1 pulled out from the ', the solder pieces 1a are cut into the solder sheet 1 by the same pattern P _{2 as} the pattern P _{1 at} the solder piece mounting target position 4 of the printed circuit board 3. And then solder sheet 1
The solder pieces 1a is formed in the state of the pattern P ₂ corresponding to the pattern P ₁ of the solder piece mounting target position 4 of the printed circuit board 3, as described above, the pattern P ₂ in the solder sheet 1
All the solder pieces 1a formed in a pattern are transferred all at once onto the printed circuit board 3 with the pattern P ₂ being held, and the solder piece mounting target position 4 of the printed circuit board 3 is transferred.
A method of mounting solder pieces on a printed circuit board is characterized in that all the solder pieces 1a are simultaneously mounted.

Further, the embodiments of the devices 1, 2 and 3 of the present invention will be explained with reference to FIGS. 2, 3 and 4.

"Embodiment 1" (FIG. 2) A solder roll 1 ', in which a long thin foil-shaped solder sheet 1 having a set width is wound into a roll, is provided, and the solder sheet 1 pulled out from the solder roll 1'is provided. in the middle of the transport path 2 to deliver the set direction, and means a for cutting off the solder pieces 1a the solder sheet 1 with solder piece mounting target position 4 of the pattern P ₁ and the same pattern P ₂ of the printed circuit board 3, This is a device for mounting solder pieces on a printed circuit board, which is provided with means A and means B for simultaneously transferring and mounting all the cut solder pieces 1a to the solder piece mounting target position 4 on the printed circuit board 3.

[Embodiment 2] (FIG. 3) The solder sheet 1 is mounted on a printed circuit board 3 in the middle of a feeding path 2 for feeding the solder sheet 1 drawn from a solder roll 1'in a set direction. A means A for cutting the solder pieces 1a in the same pattern P _{2 as} the pattern P _{1 at the} target position 4 and all the solder pieces 1a cut by the means A are sucked and held all together in the state of the pattern P ₂ to hold the printed board 3 To the printed circuit board provided with means C for moving all the solder pieces 1a sucked and held upward to the pattern P ₁ (all solder piece mounting target position 4) of the printed circuit board 3 and mounting them all at once. This is a solder piece mounting device.

[Embodiment 3] (FIG. 4) The solder sheet 1 is mounted on the printed circuit board 3 in the middle of the feeding path 2 for feeding the solder sheet 1 drawn from the solder roll 1 ′ in the set direction. A means A for cutting the solder piece 1a with the same pattern P _{2 as} the pattern P _{1 at the} target position 4 and all the solder pieces 1a in the shape of the pattern P ₂ cut by the means A are converted into the pattern P ₂ without changing the conversion roller D. Is a device for mounting a solder piece on a printed circuit board, which is provided with a conversion roller D, which is transferred to and held on the peripheral surface of the printed circuit board 3 and then transferred and mounted from the roller D to the solder piece mounting target position 4 of the printed circuit board 3.

In the devices 1, 2, and 3 of the above-mentioned embodiment, if necessary, the solder roll 1'is fed in the pull-out setting direction, the solder piece 1a is cut in the middle of the feeding path 2, and the solder piece is cut. The used solder sheet 1 on which the transfer mounting of 1a to the printed circuit board 3 is completed is wound into a roll and is provided as a winding roll 1 ″ so as to be collected.

"Solder Sheet" Also, the solder sheet 1
In addition to the solder sheet in which the solder is formed in a long thin foil shape with a set width ((a) in FIG. 4), a release sheet, an adhesive sheet 5, a laminate film, etc. are integrally formed on one or both sides of the solder sheet. And the adhesive sheet, the adhesive sheet 6 and the like, which are releasably bonded ((b) in FIG. 4), and the entire surface or pattern position of one or both surfaces of the solder sheet. And the like (Fig. 4C), which are selectively used in combination with the purpose and means for cutting a solder sheet to form a solder piece and mounting it on a printed circuit board.

Further, if necessary, an adhesive agent may be preliminarily attached to each mounting target position (pattern) of the solder piece of the printed board.
An adhesive or the like is applied.

In the above description, the set width of the solder sheet is, for example, the width of the printed circuit board, and the set direction for feeding the solder sheet is, for example, the horizontal direction toward the winding roll.

[0020]

[Action] The solder sheet 1 drawn out from the solder roll 1 'in the middle of the transport path 2, first, in cutting off means A, After cutting off the respective solder pieces 1a to pattern P ₁ kinds of the printed circuit board 3 (pattern P ₂₎ , The transfer mount means B, C, or D is used to transfer mount the pattern P ₁ on the printed circuit board 3.

In the actual process, after all the solder pieces 1a are simultaneously mounted on all the solder piece mounting target positions 4 (on the pattern P ₁ ) of the printed board 3, (1) the chip t is mounted on the mounted solder pieces. Mount, heat-treat, and mount the chip. (See (a) in FIG. 6) (2) The printed circuit board on which the solder pieces are mounted is heat-treated to form a solder base at the pattern position on the printed circuit board, and the solder base is used for chip mounting and other solder in a later step. It is used for wearing. ((B) in FIG. 6
reference)

[0022]

[Effect] Unlike the case of using conventional paste solder, the solder sheet, which is a solid material, is cut into pieces and used. Therefore, it is cut by a press or transferred by a mechanical device regardless of printing means. The solder pieces can be mounted by a highly accurate mechanism such as a replacement mount, and the accuracy and efficiency of the solder mount on the printed circuit board can be significantly improved.

The solder sheet is formed into a roll and stored at the stage of manufacturing, and is pulled out and used for cutting when used for mounting. Therefore, unlike the conventional solder paste, it is exposed to air for a long time. Therefore, high-purity soldering can be performed.

Since the solder sheet is pulled out from the solder roll, the pattern is cut, and the solder pieces are transferred and mounted, the solder sheet is wound into a roll and collected.
Can be completely recovered as a solder material and no waste occurs.

Since the solder pieces are formed by cutting with a press or the like, even the extremely small solder pieces can be highly accurately cut especially in their peripheral portions. Therefore, as in the case of the solder paste, minute burrs are formed in the peripheral portions. Therefore, solder pieces that are extremely small and close to each other can be mounted accurately.

[Brief description of drawings]

FIG. 1 is an explanatory view of a method of the present invention, in which (a) is a plan view of a printed board, (b) is a view of a pattern P ₁ at a solder piece mounting target position of the printed board, and (c) is solder. A diagram in which the solder sheet pulled out from the roll is cut into the solder pieces by the means A by the pattern P ₂ having the same pattern as the pattern P _1, and (d) shows the solder pieces cut by the means A as the pattern P ₂ and the means B by the means B. The figure which shows mounting to a printed circuit board by C, D, etc.

FIG. 2 is a schematic diagram of a device 1 of the embodiment.

FIG. 3 is a schematic diagram of a device 2 of the embodiment.

FIG. 4 is a schematic diagram of Example device 3.

FIG. 5 is a cross-sectional view of a solder sheet, where (a) is provided with only solder, (b) is one having an adhesive sheet attached to one side of the solder sheet, and (c) is one side of the solder sheet. The figure which shows what adhere | attached the adhesive agent and pasted the release sheet on it.

FIG. 6A is a diagram showing a state in which a chip is mounted on a solder piece mounted on a printed circuit board, which is then subjected to heat treatment to complete chip mounting (mounting) on the printed circuit board. ) Is a diagram showing a state in which a solder piece is mounted on a printed circuit board, after which heat treatment is performed to form a solder base on the printed circuit board.

[Explanation of symbols]

A cutting means B transfer mounting means C suction transfer mounting means D conversion roller P ₁ pattern (solder piece mounting target position of the printed board) P ₂ pattern (solder piece arrangement pattern formed by cutting the solder sheet) t Chip 1 Solder Sheet 1'Solder Roll 1 "Take-up Roll 1a Solder Piece 2 Feeding Device 3 Printed Circuit Board 4 Solder Piece Mount Target Position (Pattern P ₁ ) 5 Adhesive Sheet 6 Adhesive 7 Release Sheet

Claims (7)

[Claims] 1. A solder roll formed by winding a long thin foil solder sheet having a set width into a roll shape, and the solder sheet drawn from the solder roll is fed in a set direction in the process of soldering a printed circuit board. In the same pattern as the pattern of one-sided mount position, cut the solder piece into the solder sheet to form a solder piece corresponding to the pattern of the solder-piece mount position of the printed board on the solder sheet, as described above. All the solder pieces formed in a pattern on the solder sheet are transferred all at once to the printed circuit board while maintaining the pattern, and all the solder pieces are collectively moved to the solder board mount target position on the printed circuit board. The feature is that it is mounted. Solder piece mounting method on printed circuit board. 2. A solder sheet is cut into a solder piece in the same pattern as a pattern of a solder piece mounting target position of a printed circuit board in the middle of a feeding path for feeding a solder sheet drawn from a solder roll in a set direction. An apparatus for mounting a solder piece on a printed circuit board, comprising: a means and a means for simultaneously mounting all the cut solder pieces and the cut solder pieces to a solder piece mounting target position on the printed circuit board. 3. A means for cutting the solder sheet into the same pattern as a pattern of a solder piece mounting target position of a printed circuit board in the middle of a feeding path for feeding a solder sheet drawn from a solder roll in a set direction, All the solder pieces cut by the means are held in a patterned state all at once by the other means such as adsorption and transferred to the printed circuit board, and all the solder pieces held by the other means are adsorbed on the printed board. Solder piece mounting device on a printed circuit board, equipped with a means for simultaneously mounting and mounting all mounting positions. 4. Means for arranging the solder sheet in the same pattern as the pattern of the solder piece mounting target position of the printed circuit board in the middle of the feeding path for feeding the solder sheet pulled out from the solder roll in the set direction. After transferring all the pattern-shaped solder pieces cut by the means to the peripheral surface of the conversion roller while maintaining the pattern,
An apparatus for mounting a solder piece on a printed circuit board, comprising a conversion roller for transferring and mounting the roller from the roller to a target position for mounting the solder piece on the printed circuit board. 5. A used solder sheet, which is fed from a solder roll in a pull-out setting direction, cuts a solder piece in the middle of a feeding path, and transfers the solder piece to a printed circuit board and completes mounting, is rolled. A device for mounting solder pieces on a printed circuit board, which is equipped with a device for winding onto and collecting as a solder winding roll. 6. The solder sheet includes a solder sheet in which solder is formed in a long thin foil shape with a set width, and a release sheet, an adhesive sheet, a laminate film, etc. are integrally and peeled on one or both sides of the solder sheet. It can be freely attached, or the one or both sides of the solder sheet or the pattern position can be coated or adhered with adhesive, pressure sensitive adhesive, etc., and the solder sheet can be cut to form solder pieces. A solder sheet for use in a method and apparatus for mounting a solder piece on a printed circuit board, which is selectively used in combination with the purpose and means for mounting it on the printed circuit board. 7. The method of mounting a solder piece on a printed circuit board according to claim 1, wherein an adhesive, a pressure sensitive adhesive or the like is applied beforehand to a target position (pattern) for mounting the solder piece on the printed circuit board.