JPH084929B2 - Desoldering device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A device for removing residual solder after removal of electronic components welded on a land such as a printed circuit board, which aims to remove residual solder efficiently and cleanly. And a heater chip fixed to the reciprocating shaft by a buffer spring, and an arm fixed to the reciprocating shaft in the vicinity of the front and rear of the heater chip. A first guide roller and a second guide roller for separating and holding the trowel surface of the heater chip and the solder absorbing braid in parallel, and the solder absorbing braid impregnated with flux disposed in front of the first guide roller. From a feeding reel with a braking device that applies a winding tension, a lower roller that is arranged behind the second guide roller and is directly connected to a rotation driving unit with a braking device, and an upper roller that presses the lower roller. And a discharge clamp roller for driving and discharging the solder absorbing / braiding braid, the driving of the reciprocating shaft and the braking and driving of the discharging clamp roller are electrically connected, and the forward and backward movement of the reciprocating shaft is performed. On the land of the printed circuit board, the solder absorption braid wire is pressed down and pressed against the printed circuit board arranged facing the heater chip by the first and second guide rollers, and subsequently, the heater chip is pressed and electrically heated. The remaining solder is melted and absorbed, and is discharged by the discharge clamp roller.

[Industrial applications]

The present invention relates to a device for removing residual solder after removal of electronic components welded on a land such as a printed circuit board.

Replacing electronic components soldered to the printed circuit board is not possible unless the solder on the land is heated, the solder is melted to remove the electronic components, and then the remaining solder on the land is removed cleanly. May occur.

Therefore, an apparatus for efficiently and cleanly removing the remaining solder is desired.

[Conventional technology]

Conventionally, as shown in the perspective view of the main part of FIG. 3, the residual solder 22 after removing the soldered electronic components from the land 21 of the printed circuit board 20 is manually removed. That is, a tape-shaped copper braided wire 7 impregnated with flux (hereinafter referred to as solder absorption braided wire 7) is placed on the remaining solder 22, and is heated by a soldering iron 23 from above to melt the remaining solder 22. Absorb and remove.

[Problems to be solved by the invention]

However, according to the above method, there is a problem that it takes time to cleanly remove the solder trowel because it is a manual work with a soldering iron, and the efficiency is low.

In view of the above problems, it is an object of the present invention to provide a solder removing device that removes residual solder efficiently and cleanly.

[Means for solving problems]

The above-mentioned problems in the conventional structure include a heater chip fixed to the reciprocating shaft via a buffer spring, and a reciprocating direction via a buffer spring to an arm arranged near the front and rear of the heater chip and fixed to the reciprocating shaft. First and second guide rollers that are rotatably supported at their both ends and rotatably supported at their both ends to separate and hold the trowel surface of the heater chip and the solder absorption braid in parallel, and are arranged in front of the first guide roller. A feeding reel with a braking device that winds the solder absorbing braided wire impregnated with the flux to give tension, a lower roller that is arranged behind the second guide roller and is directly connected to a rotation driving unit with a braking device, and the lower roller. And a discharge clamp roller configured to drive and discharge the solder absorbing / braided braid consisting of an upper roller that pressurizes the reciprocating shaft and braking and driving of the discharge clamp roller electrically. The solder absorbing / braiding braided wire is pressed down and press-contacted to the printed circuit board which is connected and is arranged to face the heater chip by the first and second guide rollers by the forward movement of the reciprocating shaft, and then the heater chip is pressure-contacted. This is solved by electrically heating in a state, melting and absorbing the residual solder on the land of the printed circuit board, and discharging by the discharging clamp roller.

[Action]

The solder absorbing / braided wire wound around the feeding reel can be continuously supplied by the discharge clamp roller, and the solder absorbing / braided wire drawn out by the heater chip corresponding to the land surface is pressure-contacted,
It is possible to remove the remaining solder on the land row over a relatively long range by one operation.

〔Example〕

Hereinafter, the gist of the present invention will be described in detail based on the embodiments shown in the drawings.

As shown in the side view of the main part of FIG. 1, a reciprocating shaft 1, for example, a piston shaft 1 of an air cylinder 2 has a power supply electrode (not shown) supported via a buffer spring 3, and its surface is electrically connected. The electrically insulated heater chip 4 and the front and rear of the heater chip 4,
The arm 5 fixed to the piston shaft 1 which is arranged in the vicinity moves in the piston axial direction via a buffer spring 6 and rotatably supports both ends thereof. The solder absorption braided wire 7 is parallel to the trowel surface 4a of the heater chip 4. And the first and second guide rollers 8 and 9 for separating and holding the solder from the trowel surface 4a, and the solder absorption braid 7 impregnated with flux (not shown) arranged in front of the first guide roller 8 A braking device (not shown) that can be adjusted to an appropriate tension, such as a commercially available reel 10 with a powder electromagnetic brake, and a rotation drive device (not shown) with a braking device that is arranged behind the second guide roller 9, for example, a commercially available From the discharge clamp roller 11 that drives and discharges the solder absorption / braided wire, which is composed of a lower roller 11a directly connected to the DC motor with a built-in brake and a lower roller 11b that presses the lower roller 11a with a compression spring (not shown). Composed .

The discharge clamp roller 11 sandwiches the solder absorbing / braiding braid 7 between the upper and lower rollers, holds the solder absorbing / braid braid 7 during braking, and discharges the solder absorbing / braid braid 7 by rotational driving.

The first and second guide rollers 8 and 9 push down the solder absorbing / braiding braid 7 when the heater chip 4 moves (falls), and the solder absorbing / braided braid 7 does not rub against the edge of the heater chip 4. To prevent.

The air cylinder 2 is connected to a high pressure air system 15 via forward and double acting (up) electromagnetic stop valves 12 and 13.

These electromagnetic stop valves 12, 13 and the motor with a built-in brake of the discharge clamp roller 11 are operated by an operation switch (not shown).

The printed board 14 is arranged so as to face the heater chip 4, and is moved by a transfer device (not shown) in a direction perpendicular to the moving direction of the solder absorbing / braiding wire 7.

The shape of the heater chip 4 can be changed and replaced according to the range in which the remaining solder is removed. Instead of using the heater chip itself as a resistance heating element, a chip using a resistance wire such as a soldering iron as a heat source may be used. In this case no electrical insulation of the surface is necessary.

FIG. 2 is a side view of an essential part showing a solder chip removed state of the heater chip.

The operation of the solder removing device is such that the discharge clamp roller 11 is driven to constantly solder the solder absorbing / braiding braided wire 7 and the feeding reel 10 is braked.
After pulling out the required length with an appropriate tension from, stop the braking motor with built-in brake.

Then, the forward electromagnetic stop valve 12 connected to the air cylinder 2 is opened. The piston shaft 1 descends and the heater chip 4 descends. At this time, the discharge clamp roller 11
Since the brake is stopped, the heater chip 4 is lowered and pulled out from the delivery reel 10 while pushing down the solder absorption / braided braided wire 7 extending between the first and second guide rollers 8 and 9, and the remaining land of the printed board 14 is left. The buffer spring 3 is pressed onto the solder (not shown) with an appropriate pressure.

The heater chip 4 is electrically heated while the solder absorbing / braiding braided wire 7 is pressed. The heated solder absorbing / braided wire 7 melts and absorbs and removes the remaining solder.

After removing the remaining solder, open the double-acting electromagnetic stop valve 13
The piston shaft 1 is raised to raise the heater chip 4.
Then, the motor with a speed reducer with a built-in brake is restarted, and the solder clamp / braid wire 7 is discharged by the discharge clamp roller 11 by the used length.

According to this device, the solder absorption braid can be continuously supplied, and the heater chip can be replaced with various shapes.
A wider range of residual solder can be removed as compared with the conventional method. For example, the remaining solder over a relatively long range such as lands arranged in a row can be efficiently removed by one operation.

〔The invention's effect〕

As described above in detail, according to the present invention, the solder absorption braid can be continuously fed out by the required length, and the remaining solder at many places can be removed by one operation, which greatly improves the workability. It has an extremely useful effect such as improvement.

[Brief description of drawings]

 FIG. 1 is a side view of an essential part of an embodiment according to the present invention, FIG. 2 is a side view of an essential part showing a solder removal state of FIG. 1, and FIG. 3 is a perspective view of an essential part according to a conventional technique. In the figure, 1 is a reciprocating shaft (piston shaft), 2 is an air cylinder, 3 and 6 are buffer springs, 4 is a heater chip, 4a is a trowel surface, 5 is an arm, 7 is a solder absorption braided wire, 8, 9 Is a first and second guide roller, 10 is a delivery reel, 11 is a discharge clamp roller, 11a and 11b are upper and lower rollers, 12 is a forward electromagnetic stop valve, 13 is a backward electromagnetic stop valve, and 14 is a printed circuit board. Indicates.

Claims (1)

[Claims] 1. A heater chip (4) fixed to a reciprocating shaft (1) via a buffer spring (3), and a reciprocating shaft (1) disposed near the front and rear of the heater chip (4). It moves in a reciprocating direction via a buffer spring (6) to a fixed arm (5) and is rotatably supported at its both ends so that the trowel surface (4a) of the heater chip and the solder absorption braid (7) are parallel to each other. First and second guide rollers (8, 9) that are held separately
A feeding reel (10) with a braking device which is arranged in front of the first guide roller (8) and which applies tension by winding the solder absorbing and braiding wire impregnated with the flux, and the second guide roller (9) ), Which is disposed behind the roller and is directly connected to the rotary drive unit with the braking device, and the upper roller (11b) that pressurizes the lower roller (11a). A clamp roller (11), and the driving of the reciprocating shaft and the braking and driving of the discharge clamp roller are electrically connected to each other, and the first and second guide rollers are driven by the reciprocating shaft. At (8, 9), the solder absorbing braided wire (7) is pressed down and pressure-contacted to the printed circuit board arranged facing the heater chip (4), and then the heater chip (4) is electrically pressed and heated, Remaining solder on the land of the printed circuit board A solder removing device, which melts and removes, and discharges by the discharge clamp roller.