JPH085014B2 - Polishing cloth - Google Patents
Polishing clothInfo
- Publication number
- JPH085014B2 JPH085014B2 JP33978392A JP33978392A JPH085014B2 JP H085014 B2 JPH085014 B2 JP H085014B2 JP 33978392 A JP33978392 A JP 33978392A JP 33978392 A JP33978392 A JP 33978392A JP H085014 B2 JPH085014 B2 JP H085014B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- resin
- polishing cloth
- polysulfone resin
- porous structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims description 36
- 239000004744 fabric Substances 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 229920002492 poly(sulfone) Polymers 0.000 claims description 14
- 239000004745 nonwoven fabric Substances 0.000 claims description 13
- 239000011148 porous material Substances 0.000 claims description 5
- 229920002994 synthetic fiber Polymers 0.000 claims description 2
- 239000012209 synthetic fiber Substances 0.000 claims description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- 229920005749 polyurethane resin Polymers 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015271 coagulation Effects 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 238000009941 weaving Methods 0.000 description 2
- BCNBMSZKALBQEF-UHFFFAOYSA-N 1,3-dimethylpyrrolidin-2-one Chemical compound CC1CCN(C)C1=O BCNBMSZKALBQEF-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は金属，半導体，ガラス等
の研磨に使用される研磨布の品質改良に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improving the quality of a polishing cloth used for polishing metals, semiconductors, glass and the like.
【０００２】[0002]
【従来の技術】従来、金属，半導体，ガラス，セラミッ
クス等の表面を超精密に研磨するために、一次研磨及び
二次研磨に不織布にポリウレタン樹脂溶液を含浸し、非
溶媒である水中にて、湿式凝固させることにより、無数
の細孔を含んだ微多孔構造のポリウレタン樹脂で不織布
繊維を結合，固定せしめた研磨布が使用されているが、
これはポリウレタン多孔構造が研磨砥粒を含む研磨液を
保持すると同時に排出される性能があるためである。し
かし多孔構造のポリウレタン樹脂は研磨加工時に加わる
圧力と温度によって変形しやすく砥粒の目づまりによる
研磨性能の低下，研磨傷の発生等、品質，生産性に問題
があった。更に最近、高圧，高速研磨が要求されてきて
おり、この傾向はますます顕著になり、改良が必要とさ
れている。2. Description of the Related Art Conventionally, in order to polish surfaces of metals, semiconductors, glass, ceramics, etc. with high precision, a nonwoven fabric is impregnated with a polyurethane resin solution in primary polishing and secondary polishing, and then in a non-solvent water. An abrasive cloth is used in which non-woven fibers are bonded and fixed with a polyurethane resin having a microporous structure containing innumerable pores by wet coagulation.
This is because the polyurethane porous structure has a property of holding the polishing liquid containing the polishing abrasive grains and simultaneously discharging the same. However, the polyurethane resin having a porous structure is apt to be deformed by pressure and temperature applied during polishing, and there are problems in quality and productivity such as deterioration of polishing performance due to clogging of abrasive grains and occurrence of polishing scratches. Further, recently, high-pressure and high-speed polishing has been required, and this tendency becomes more and more remarkable, and improvement is required.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記のように
研磨工程で加わる圧力と熱によって多孔構造が変形する
ことなく、したがって研磨砥粒の目づまりがなく、研磨
傷などの欠点のない高品質の研磨性能と研磨性能の低下
が非常に少ない、生産性の高い研磨布を提供するもので
ある。As described above, the present invention does not deform the porous structure due to the pressure and heat applied in the polishing process, and therefore, the abrasive grains are not clogged and there is no defect such as polishing scratches. It provides a highly productive polishing cloth having a very low polishing performance and a small decrease in the polishing performance.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するため
に、ナイロン，ポリエステル等の合成繊維よりなる不織
布を、溶剤例えばジメチルホルムアミド，ジメチルピロ
リドンに溶解したポリサルホン樹脂溶液に含浸し、つい
で非溶媒である水に浸漬，凝固することにより形成され
る無数の微細気孔を内在する多孔質ポリサルホン樹脂に
て不織布を一体的に結合，固定化して構成している。本
発明に使用されるポリサルホン樹脂は芳香族系ポリサル
ホン樹脂である。In order to achieve the above object, a non-woven fabric made of synthetic fibers such as nylon and polyester is impregnated with a polysulfone resin solution dissolved in a solvent such as dimethylformamide and dimethylpyrrolidone, and then a nonsolvent is used. A non-woven fabric is integrally bonded and fixed by a porous polysulfone resin having innumerable fine pores formed by immersing and coagulating in certain water. The polysulfone resin used in the present invention is an aromatic polysulfone resin.
【０００５】[0005]
【作用】上記のように多孔構造のポリサルホン樹脂で不
織布を結合，固定化した研磨布であるため、ポリサルホ
ン樹脂の特性である非常に高い耐熱性，熱変形温度によ
り、研磨加工工程に於て研磨布に加わる熱と圧力による
樹脂の変形がなく多孔構造が損われることがないため、
砥粒の目づまりが発生せず、研磨性能の低下が全く認め
られなかった。更にポリサルホン樹脂はポリウレタン樹
脂に比べて自己ドレッシング性にすぐれ、殆どドレッシ
ングする必要がなく作業能率を上げることが出来た。さ
らに本発明の特徴であるポリサルホン樹脂は湿式凝固法
にて多孔構造を形成することが出来るため、孔径，空孔
率，孔の形状，強度等の性能を自由に調整することが出
来、研磨布としての性能をコントロールすることが容易
であった。[Function] Since it is a polishing cloth in which a nonwoven fabric is bonded and fixed with a polysulfone resin having a porous structure as described above, it is polished in the polishing process due to the extremely high heat resistance and heat deformation temperature of the characteristics of the polysulfone resin. Since the resin is not deformed by the heat and pressure applied to the cloth and the porous structure is not damaged,
No clogging of the abrasive grains occurred and no deterioration in polishing performance was observed. Furthermore, the polysulfone resin has excellent self-dressing property compared to the polyurethane resin, and it is possible to improve the work efficiency without requiring the dressing. Furthermore, since the polysulfone resin, which is a feature of the present invention, can form a porous structure by a wet coagulation method, performances such as pore diameter, porosity, pore shape, and strength can be freely adjusted, and a polishing cloth can be used. It was easy to control the performance as.
【０００６】[0006]
【実施例】以下実施例により本発明を説明する。 〔実施例１〕単繊維織度２．０デニールのポリエステル
短繊維よりなるニードリング不織布（目付２５０ｇ／ｍ
2 ，密度０．２ｇ／ｃｍ3 ，厚さ１．２ｍｍ）をポリエ
ーテルサルホン樹脂（I.C.I.製）をジメチルホルムアミ
ド（ＤＭＦ）に溶解した樹脂溶液（樹脂固型分２２重量
％）に含浸し、樹脂付着量を１２０重量％とした。この
含浸不織布を非溶媒である水中に浸漬し完全に凝固させ
た后、水洗乾燥して多孔質構造のポリサルホン樹脂で不
織布を結合，固定したシートをえた。このシートの表皮
層をスライサーで除去し、厚さ１．２ｍｍ，目付４５０
ｇ／ｍ2 ，密度０．３８ｇ／ｃｍ3 の研磨布を作成し
た。この研磨布を使用し平均粒子経０．０５ミクロンの
コロイダルシリカを含む研磨液を循環させながらシリコ
ンウエハーを研磨した結果、目づまり発生までの時間が
従来のウレタン樹脂によるものに比べ約３倍長い結果が
得られた。The present invention will be described with reference to the following examples. [Example 1] Needling non-woven fabric made of polyester short fibers having a monofilament weaving degree of 2.0 denier (weight per unit area: 250 g / m 2)
2 , density 0.2 g / cm 3 , thickness 1.2 mm) was impregnated with a resin solution (resin solid content of 22% by weight) in which a polyether sulfone resin (manufactured by ICI) was dissolved in dimethylformamide (DMF), The resin adhesion amount was 120% by weight. The impregnated non-woven fabric was immersed in non-solvent water to completely solidify it, then washed with water and dried to obtain a sheet in which the non-woven fabric was bonded and fixed with a polysulfone resin having a porous structure. The skin layer of this sheet was removed with a slicer to give a thickness of 1.2 mm and a basis weight of 450
A polishing cloth having a g / m 2 and a density of 0.38 g / cm 3 was prepared. As a result of polishing a silicon wafer using this polishing cloth while circulating a polishing liquid containing colloidal silica having an average particle size of 0.05 microns, the time until clogging is about 3 times longer than that of the conventional urethane resin. Results were obtained.
【０００７】〔実施例２〕単繊維織度３デニールのポリ
エステル短繊維よりなるニードリング不織布（目付４５
０ｇ／ｍ2 ，密度０．１８ｇ／ｃｍ3 ，厚さ２．５ｍ
ｍ）をポリサルホン樹脂（ユーデルサルホン樹脂）をジ
メチルホルムアミドに溶解した樹脂溶液（樹脂固型分２
４重量％）に含浸し、樹脂付着量１１０重量％とした。
この含浸不織布を水中に浸漬し、含浸した樹脂を完全に
凝固した后、水洗，乾燥して多孔構造のポリサルホン樹
脂で固定した不織布シートを得た。このシートをスライ
サーで２分割し、厚さ１．２ｍｍ，目付５００ｇ／
ｍ2 ，密度０．４１ｇ／ｃｍ3 の研磨布を作成した。こ
の研磨布を使用しコロイダルシリカと酸化セリウムを含
む研磨液を循環させながらシリコンウエハーを研磨した
結果、目づまりが従来のウレタン樹脂研磨布に比べ３倍
以上で且つ研磨量が多く、全く研磨傷のない研磨結果が
得られた。[Example 2] Needling non-woven fabric made of polyester short fibers having a monofilament weaving degree of 3 denier (Basis weight 45
0 g / m 2 , density 0.18 g / cm 3 , thickness 2.5 m
m) is a resin solution (resin solid content 2) obtained by dissolving polysulfone resin (Udelsulfone resin) in dimethylformamide.
4% by weight) to make a resin adhesion amount of 110% by weight.
The impregnated nonwoven fabric was dipped in water to completely solidify the impregnated resin, then washed with water and dried to obtain a nonwoven fabric sheet fixed with a polysulfone resin having a porous structure. This sheet is divided into two parts with a slicer, the thickness is 1.2 mm, and the basis weight is 500 g /
A polishing cloth having m 2 and a density of 0.41 g / cm 3 was prepared. As a result of polishing a silicon wafer using this polishing cloth while circulating a polishing liquid containing colloidal silica and cerium oxide, the clogging was 3 times or more compared with the conventional urethane resin polishing cloth, and the polishing amount was large, and there were no polishing scratches. No polishing results were obtained.
【０００８】[0008]
【発明の効果】本発明は多孔構造のポリサルホン樹脂で
不織布を結合，固定化した研磨布であるため、研磨工程
に於て加わる熱と圧力による樹脂の変形がおこらず、多
孔構造が損なわれることがないため、研磨砥粒の目づま
りが発生せず、研磨傷のない高品質と研磨性能の低下の
ない研磨布を提供できる。Since the present invention is a polishing cloth in which a nonwoven fabric is bonded and fixed with a polysulfone resin having a porous structure, the resin is not deformed by heat and pressure applied in the polishing process, and the porous structure is damaged. Therefore, it is possible to provide a polishing cloth that does not cause clogging of polishing abrasive grains, has no polishing scratches, and has no deterioration in polishing performance.
Claims (1)
樹脂溶液を含浸し、湿式凝固，乾燥して、不織布を微細
気孔を内在するポリサルホン樹脂多孔体で結合，固定化
することを特徴とする研磨布。1. A polishing cloth characterized in that a nonwoven fabric made of synthetic fibers is impregnated with a polysulfone resin solution, wet-coagulated and dried to bond and immobilize the nonwoven fabric with a polysulfone resin porous body having fine pores therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33978392A JPH085014B2 (en) | 1992-11-25 | 1992-11-25 | Polishing cloth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33978392A JPH085014B2 (en) | 1992-11-25 | 1992-11-25 | Polishing cloth |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07108464A JPH07108464A (en) | 1995-04-25 |
| JPH085014B2 true JPH085014B2 (en) | 1996-01-24 |
Family
ID=18330772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33978392A Expired - Lifetime JPH085014B2 (en) | 1992-11-25 | 1992-11-25 | Polishing cloth |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085014B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190194404A1 (en) * | 2013-03-11 | 2019-06-27 | Aonix Advanced Materials Corp. | Compositions and methods for making thermoplastic composite materials |
| JP6397592B1 (en) * | 2017-10-02 | 2018-09-26 | 住友化学株式会社 | Sputtering target manufacturing method and sputtering target |
| JP7550693B2 (en) * | 2021-03-25 | 2024-09-13 | ノリタケ株式会社 | Polishing Pad |
-
1992
- 1992-11-25 JP JP33978392A patent/JPH085014B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07108464A (en) | 1995-04-25 |
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