JPH0851274A - Method for fixing electronic parts on printed circuit board - Google Patents
Method for fixing electronic parts on printed circuit boardInfo
- Publication number
- JPH0851274A JPH0851274A JP18435494A JP18435494A JPH0851274A JP H0851274 A JPH0851274 A JP H0851274A JP 18435494 A JP18435494 A JP 18435494A JP 18435494 A JP18435494 A JP 18435494A JP H0851274 A JPH0851274 A JP H0851274A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic component
- holes
- mounting position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電子部品をプリント
基板に搭載するに際し、処理時間を短くし、生産性を向
上することができるプリント基板における電子部品の固
定方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of fixing an electronic component on a printed circuit board, which can shorten processing time and improve productivity when mounting the electronic component on the printed circuit board.
【０００２】[0002]
【従来の技術】電子部品をプリント基板に搭載すると
き、はんだ処理に先き立ち、電子部品を所定の搭載位置
に接着して固定することがある。たとえば、フラットパ
ッケージ形の電子部品をプリント基板の回路パターン側
に搭載する場合、フローはんだに浸漬させてはんだ処理
するに際し、電子部品がプリント基板から脱落したり、
はんだの流れによって電子部品が位置ずれしたりするお
それがあるからである。2. Description of the Related Art When an electronic component is mounted on a printed circuit board, the electronic component may be bonded and fixed to a predetermined mounting position prior to soldering. For example, when mounting a flat package type electronic component on the circuit pattern side of a printed circuit board, the electronic component may fall off the printed circuit board when immersed in flow solder for soldering,
This is because there is a risk that the electronic components may be displaced due to the flow of solder.
【０００３】かかる場合の電子部品の固定方法として、
光硬化性の樹脂接着剤を使用することが提案されている
（特開平５−１９１０２９号公報）。このものは、プリ
ン基板に対し、電子部品の搭載位置に透孔を形成し、透
孔の近傍に樹脂接着剤を塗布し、電子部品を位置決めし
て接着した後、透孔を介して光を照射することにより、
接着剤を硬化させるものである。なお、光は、紫外線で
あってもよく、このときの接着剤の硬化時間は、約２０
秒程度で済むという。As a method of fixing electronic parts in such a case,
It has been proposed to use a photocurable resin adhesive (JP-A-5-191029). In this product, a through hole is formed on the printed circuit board at the mounting position of the electronic component, a resin adhesive is applied in the vicinity of the through hole, the electronic component is positioned and adhered, and then light is transmitted through the through hole. By irradiating,
It cures the adhesive. The light may be ultraviolet rays, and the curing time of the adhesive at this time is about 20.
It takes about a second.
【０００４】[0004]
【発明が解決しようとする課題】かかる従来技術による
ときは、接着剤の硬化時間は、約２０秒程度を必要とす
るから、極く少量のプリント基板を処理するときはよい
としても、大量のプリント基板を処理するには、処理時
間が過大であり、生産性が不十分であるという問題があ
った。また、接着剤を硬化させるに際し、プリント基板
の透孔を介して光を照射するから、このときの透孔は、
できるだけ大径にすることが好ましいが、大きな径の透
孔を電子部品の搭載位置に形成すると、搭載位置付近の
プリント基板の強度が小さくなり、搭載する電子部品が
機械的に破損するおそれがあるという問題もある。According to such a conventional technique, since the curing time of the adhesive agent is about 20 seconds, a large amount of a large amount of printed circuit board is required even if it is good to process a very small amount of printed circuit board. There is a problem that the processing time is too long to process the printed circuit board and the productivity is insufficient. Further, when the adhesive is cured, light is emitted through the through holes of the printed circuit board.
It is preferable to make the diameter as large as possible, but if a large-diameter through hole is formed at the mounting position of the electronic component, the strength of the printed circuit board near the mounting position will be reduced and the mounted electronic component may be mechanically damaged. There is also a problem.
【０００５】そこで、この発明の目的は、かかる従来技
術の問題に鑑み、接着剤として瞬間接着剤を使用するこ
とによって、処理時間を数秒間に短縮するとともに、搭
載位置に設ける透孔をプリント基板の板厚以下の極く小
径にすることができるプリント基板における電子部品の
固定方法を提供することにある。Therefore, in view of the problems of the prior art, an object of the present invention is to shorten the processing time to several seconds by using an instant adhesive as an adhesive and to form a through hole provided at a mounting position in a printed circuit board. It is an object of the present invention to provide a method for fixing electronic components on a printed circuit board, which can make the diameter extremely smaller than the plate thickness.
【０００６】[0006]
【課題を解決するための手段】かかる目的を達成するた
めのこの発明の構成は、プリント基板に電子部品を搭載
するに際し、プリント基板上の電子部品の搭載位置に透
孔を形成し、透孔の近傍に瞬間接着剤を滴下し、電子部
品を搭載位置に接着する各工程からなり、透孔は、プリ
ント基板の板厚より小径にすることをその要旨とする。According to the structure of the present invention for achieving the above object, when mounting an electronic component on a printed circuit board, a through hole is formed at a mounting position of the electronic component on the printed circuit board, and the through hole is formed. The step is to drop an instant adhesive in the vicinity of and to bond the electronic component to the mounting position. The gist of the through hole is to make it smaller than the thickness of the printed circuit board.
【０００７】なお、透孔は、電子部品の一方の対角線に
沿って一列に形成し、瞬間接着剤は、各透孔の中間に滴
下することができる。The through holes can be formed in a line along one diagonal of the electronic component, and the instant adhesive can be dropped in the middle of each through hole.
【０００８】また、電子部品は、搭載位置に接着するに
先き立ち、硬化促進剤を下面に塗布してもよい。Further, the electronic component may be coated with a curing accelerator on the lower surface before being bonded to the mounting position.
【０００９】[0009]
【作用】かかる発明の構成によるときは、瞬間接着剤
は、数秒間のうちに硬化し、電子部品を強力に接着する
ことができる。また、プリント基板に設ける透孔は、余
剰の瞬間接着剤が流れ込むことによって充填され、投錨
効果を発揮させることにより、接着強度を向上させるこ
とができる。According to the structure of the present invention, the instant adhesive can be hardened within a few seconds to strongly bond the electronic parts. Further, the through holes provided in the printed circuit board are filled by the excess instant adhesive flowing in, and the anchoring effect is exerted, whereby the adhesive strength can be improved.
【００１０】なお、瞬間接着剤としては、硬化時間が短
く、耐熱性の良好なものを選定すべきであり、たとえ
ば、東亜合成化学（株）製の瞬間強力接着剤アロンアル
ファの木工用Ｖグレードが好適である。As the instant adhesive, one having a short curing time and good heat resistance should be selected. For example, the instant strong adhesive Aron Alpha V grade for woodworking manufactured by Toa Gosei Kagaku Co., Ltd. It is suitable.
【００１１】電子部品の一方の対角線に沿って透孔を一
列に形成し、各透孔の中間に瞬間接着剤を滴下すれば、
瞬間接着剤は、電子部品とプリント基板との間におい
て、透孔の列の方向に長く流れて電子部品を接着するこ
とができ、同方向に流れるフローはんだに対し、一層強
力な接着力を実現することができる。If the through holes are formed in a row along one diagonal of the electronic component and the instant adhesive is dropped in the middle of each through hole,
The instant adhesive can flow between the electronic component and the printed circuit board in the direction of the row of through holes to bond the electronic component, and realize stronger adhesive force against the flow solder flowing in the same direction. can do.
【００１２】硬化促進剤を併用すれば、硬化促進剤は、
瞬間接着剤の硬化時間を短縮し、接着強度を一層向上さ
せることができる。ただし、硬化促進剤は、前述のアロ
ンアルファに対し、同社製のアロンアルファ専用硬化促
進剤ａａセッター２０を使用することができる。なお、
この硬化促進剤は、電子部品に塗布し、半乾燥状態に風
乾させた後、電子部品をプリント基板に接着する。When used in combination with a curing accelerator, the curing accelerator is
The curing time of the instant adhesive can be shortened and the adhesive strength can be further improved. However, as the curing accelerator, the Aron Alpha-specific curing accelerator aa setter 20 manufactured by the same company can be used in contrast to the aforementioned Aron Alpha. In addition,
This curing accelerator is applied to an electronic component, air-dried in a semi-dry state, and then the electronic component is adhered to a printed board.
【００１３】[0013]
【実施例】以下、図面を以って実施例を説明する。Embodiments Embodiments will be described below with reference to the drawings.
【００１４】プリント基板Ｐに対してフラットパッケー
ジ形の電子部品Ｂを搭載するときを想定する（図１）。Assume that a flat package type electronic component B is mounted on the printed circuit board P (FIG. 1).
【００１５】電子部品Ｂは、屈曲する多数のリードピン
Ｂ2 、Ｂ2 …をパッケージＢ1 の四周に所定間隔に突出
させて形成されている。一方、プリント基板Ｐは、電子
部品Ｂの搭載位置Ｐ1 を表面に設定し、搭載位置Ｐ1 の
周囲には、リードピンＢ2 、Ｂ2 …に対応するランドＬ
1 付きの回路パターンＬ、Ｌ…が整然と形成されてい
る。なお、搭載位置Ｐ1 の各角部には、大きな捨てラン
ドＬa 、Ｌa …が形成されており、各捨てランドＬa
は、図示しない接地ラインに接続されている。The electronic component B is formed by projecting a large number of bending lead pins B2, B2, ... At predetermined intervals along the four circumferences of the package B1. On the other hand, on the printed circuit board P, the mounting position P1 of the electronic component B is set on the surface, and the land L corresponding to the lead pins B2, B2 ... Is provided around the mounting position P1.
The circuit patterns L, L ... With 1 are formed orderly. Large discarding lands La, La ... Are formed at the corners of the mounting position P1.
Is connected to a ground line (not shown).
【００１６】プリント基板Ｐの搭載位置Ｐ1 内には、電
子部品Ｂの一方の対角線に沿って、複数の透孔１１、１
１…が一列に形成されている。透孔１１、１１…は、電
子部品Ｂの中心部に集中して位置するように、たとえ
ば、電子部品ＢのパッケージＢ1 の対角線の長さが約２
３mmのとき、パッケージＢ1 の中心を含み、間隔約５mm
に形成するのがよい。また、各透孔１１の径ｄは、プリ
ント基板Ｐの板厚ｔより小径にするものとし、たとえ
ば、ｔ＝１．６（mm）のとき、ｄ＝１．０（mm）とする
のがよい。In the mounting position P1 of the printed circuit board P, a plurality of through holes 11, 1 are provided along one diagonal line of the electronic component B.
1 ... are formed in a line. The through holes 11, 11 ... Are located so as to be concentrated in the central portion of the electronic component B, and the length of the diagonal line of the package B1 of the electronic component B is about 2 for example.
At 3 mm, including the center of the package B1 and spacing about 5 mm
It is better to form it. The diameter d of each through hole 11 is set to be smaller than the plate thickness t of the printed circuit board P. For example, when t = 1.6 (mm), d = 1.0 (mm). Good.
【００１７】プリント基板Ｐに電子部品Ｂを搭載すると
き、電子部品Ｂの下面に対し、硬化促進剤１２を塗布
し、半乾燥状態に風乾させる（図２）。つづいて、搭載
位置Ｐ1 の各透孔１１、１１の中間に瞬間接着剤１３、
１３を滴下し（図１、図２）、電子部品Ｂを搭載位置Ｐ
1 に正しく位置決めして接着する（図３）。このとき、
瞬間接着剤１３、１３は、電子部品Ｂとプリント基板Ｐ
との間に薄く押し拡げられ、殆ど瞬時に電子部品Ｂを接
着することができる。また、余剰の瞬間接着剤１３、１
３は、透孔１１、１１…に流れ込み（図４）、透孔１
１、１１…内に充填されることにより、良好な投錨効果
を発揮することができる。ただし、同図（Ａ）は、余剰
の瞬間接着剤１３が少なく、瞬間接着剤１３がプリント
基板Ｐの下面にまで到達しない場合を示し、同図（Ｂ）
は、透孔１１を介し、余剰の瞬間接着剤１３がプリント
基板Ｐの下面にまで盛り上がる場合を示している。When mounting the electronic component B on the printed circuit board P, the curing accelerator 12 is applied to the lower surface of the electronic component B and air-dried in a semi-dried state (FIG. 2). Next, an instant adhesive 13 is provided between the through holes 11 and 11 at the mounting position P1.
13 is dropped (FIGS. 1 and 2), and the electronic component B is mounted at the mounting position P.
Correctly position and bond to 1 (Fig. 3). At this time,
The instant adhesive 13, 13 is used for the electronic component B and the printed circuit board P.
It is spread thinly between and, and the electronic component B can be bonded almost instantly. In addition, excess instant adhesive 13, 1
3 flows into the through holes 11, 11 ... (FIG. 4), and the through hole 1
A good anchoring effect can be exhibited by filling the inside of 1, 1, ... However, the same figure (A) shows the case where the excess instant adhesive 13 is small and the instant adhesive 13 does not reach the lower surface of the printed circuit board P, and the same figure (B).
Shows a case where the surplus instant adhesive 13 swells up to the lower surface of the printed circuit board P through the through hole 11.
【００１８】このようにして電子部品Ｂを接着したプリ
ント基板Ｐは、他の部品を下面側から装着した後、電子
部品Ｂを下側にしてフローはんだに浸漬することによ
り、はんだ処理して完成させることができる。なお、こ
のときのフローはんだの流れの方向は、透孔１１、１１
…の方向に一致させるものとし（図１の矢印Ａ方向）、
電子部品Ｂがフローはんだに触れる時間は、必要最少限
にするものとする。The printed circuit board P to which the electronic component B is bonded in this way is completed by soldering by mounting other components from the lower surface side and immersing the electronic component B with the electronic component B on the lower side in flow solder. Can be made. At this time, the flow direction of the flow solder is determined by the through holes 11, 11
... (direction of arrow A in FIG. 1),
The time during which the electronic component B is in contact with the flow solder should be minimized.
【００１９】以上の説明において、透孔１１、１１…
は、搭載位置Ｐ1 の中心部に１個のみを形成してもよ
く、また、電子部品Ｂの一方の対角線に沿って、３個以
上を一列または複列に列設して形成してもよい。また、
各透孔１１は、その周囲に適当な形状の捨てランドを形
成してもよく、プリント基板Ｐ上には、搭載位置Ｐ1 の
内部を含め、はんだレジストを塗布してもよい。In the above description, the through holes 11, 11 ...
May be formed only at the center of the mounting position P1, or may be formed by arranging three or more in one or more rows along one diagonal of the electronic component B. . Also,
Each through hole 11 may have a waste land of an appropriate shape formed around it, and a solder resist may be applied to the printed circuit board P including the inside of the mounting position P1.
【００２０】なお、瞬間接着剤１３、１３としてアロン
アルファの木工用Ｖグレードを５mgずつ２点に滴下し、
硬化促進剤１２としてａａセッター２０を併用すると
き、電子部品Ｂの接着強度は、接着後１０秒経過時に２
kg、３０分経過時に定常強度６kgであった。一般に、瞬
間接着剤１３、１３は、接着時の膜厚が過大になると硬
化時間が長くなり、接着直後の接着強度がばらつく傾向
があるが、硬化促進剤１２は、硬化速度を速め、かかる
傾向を抑えるように作用する。As the instant adhesives 13, 13, Aron Alpha V grade for woodworking was dropped onto 2 points of 5 mg each,
When the aa setter 20 is also used as the curing accelerator 12, the adhesive strength of the electronic component B is 2 when 10 seconds have elapsed after the adhesion.
kg, steady strength was 6 kg after 30 minutes. In general, the instantaneous adhesives 13, 13 tend to have a longer curing time when the film thickness at the time of bonding becomes excessive and the adhesive strength immediately after bonding will vary. Acts to suppress.
【００２１】また、瞬間接着剤１３は、透孔１１、１１
…の中間に滴下するが、その滴下位置は、必ずしも厳密
に規定する必要はなく、各透孔１１から遠くない近傍で
あればよい。ただし、瞬間接着剤１３は、電子部品Ｂを
接着するとき、電子部品Ｂの周囲にはみ出すことがない
ように、必要最少量を使用するものとする。Further, the instant adhesive agent 13 has the through holes 11, 11
Although the droplet is dropped in the middle of ..., The dropping position does not necessarily have to be strictly defined, and may be in the vicinity not far from each through hole 11. However, when the electronic component B is bonded, the instantaneous adhesive 13 is used in a necessary minimum amount so that it does not overflow around the electronic component B.
【００２２】なお、この発明は、フラットパッケージ形
の電子部品Ｂをプリント基板Ｐの回路パターン側に搭載
するときのみならず、他の形式の半導体部品、チップ抵
抗部品等をプリント基板に搭載するときにも、広く一般
的に適用することができる。The present invention is applicable not only to mounting the flat package type electronic component B on the circuit pattern side of the printed circuit board P, but also to mounting other types of semiconductor components, chip resistance components and the like on the printed circuit board. Also, it can be widely and generally applied.
【００２３】[0023]
【発明の効果】以上説明したように、この発明によれ
ば、プリント基板上の電子部品の搭載位置に透孔を形成
し、瞬間接着剤を介して電子部品を接着するとともに、
透孔をプリント基板の板厚より小径にすることによっ
て、瞬間接着剤は、殆ど瞬時に硬化するから、処理時間
を数秒間に短縮して生産性を大幅に向上することができ
る上、小径の透孔は、プリント基板の強度を損うことが
なく、瞬間接着剤に対して良好な投錨効果を発揮させ、
全体として大きな接着強度を実現することができるとい
う優れた効果がある。As described above, according to the present invention, a through hole is formed at a mounting position of an electronic component on a printed circuit board, and the electronic component is bonded with an instant adhesive.
By making the through holes smaller than the thickness of the printed circuit board, the instant adhesive cures almost instantly, so the processing time can be shortened to a few seconds and productivity can be greatly improved. The through hole does not impair the strength of the printed circuit board and exerts a good anchoring effect on the instant adhesive,
There is an excellent effect that a large adhesive strength can be realized as a whole.
【図１】 工程説明図（１）FIG. 1 is a process explanatory diagram (1)
【図２】 工程説明図（２）[FIG. 2] Process explanatory drawing (2)
【図３】 工程説明図（３）FIG. 3 is a process explanatory diagram (3)
【図４】 完成品の要部拡大断面図FIG. 4 is an enlarged cross-sectional view of the main part of the finished product.
Ｂ…電子部品 Ｐ…プリント基板 Ｐ1 …搭載位置 １１…透孔 １２…硬化促進剤 １３…瞬間接着剤 B ... Electronic component P ... Printed circuit board P1 ... Mounting position 11 ... Through hole 12 ... Curing accelerator 13 ... Instant adhesive
Claims (3)
し、プリント基板上の電子部品の搭載位置に透孔を形成
し、該透孔の近傍に瞬間接着剤を滴下し、電子部品を搭
載位置に接着する各工程からなり、前記透孔は、プリン
ト基板の板厚より小径にすることを特徴とするプリント
基板における電子部品の固定方法。1. When mounting an electronic component on a printed circuit board, a through hole is formed at a mounting position of the electronic component on the printed circuit board, and an instant adhesive is dropped near the through hole to place the electronic component at the mounting position. A method of fixing an electronic component on a printed circuit board, comprising each step of bonding, wherein the through hole has a diameter smaller than a plate thickness of the printed circuit board.
沿って一列に形成し、瞬間接着剤は、前記各透孔の中間
に滴下することを特徴とする請求項１記載のプリント基
板における電子部品の固定方法。2. The printed circuit board according to claim 1, wherein the through holes are formed in a line along one diagonal of the electronic component, and the instant adhesive is dropped in the middle of each of the through holes. For fixing electronic components in.
立ち、硬化促進剤を下面に塗布することを特徴とする請
求項１または請求項２記載のプリント基板における電子
部品の固定方法。3. The method for fixing an electronic component on a printed circuit board according to claim 1, wherein the electronic component is coated with a curing accelerator on its lower surface before being bonded to the mounting position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6184354A JP2887644B2 (en) | 1994-08-05 | 1994-08-05 | How to fix electronic components on printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6184354A JP2887644B2 (en) | 1994-08-05 | 1994-08-05 | How to fix electronic components on printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0851274A true JPH0851274A (en) | 1996-02-20 |
| JP2887644B2 JP2887644B2 (en) | 1999-04-26 |
Family
ID=16151787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6184354A Expired - Lifetime JP2887644B2 (en) | 1994-08-05 | 1994-08-05 | How to fix electronic components on printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2887644B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011061054A (en) * | 2009-09-11 | 2011-03-24 | Toppan Forms Co Ltd | Electronic circuit board |
| CN114900958A (en) * | 2022-04-06 | 2022-08-12 | 深圳市武迪电子科技有限公司 | A shock-absorbing reinforcement structure and method for electronic components |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111629519B (en) | 2020-05-18 | 2021-04-09 | 微智医疗器械有限公司 | Chip and circuit board connecting method, circuit board assembly and electronic equipment |
-
1994
- 1994-08-05 JP JP6184354A patent/JP2887644B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011061054A (en) * | 2009-09-11 | 2011-03-24 | Toppan Forms Co Ltd | Electronic circuit board |
| CN114900958A (en) * | 2022-04-06 | 2022-08-12 | 深圳市武迪电子科技有限公司 | A shock-absorbing reinforcement structure and method for electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2887644B2 (en) | 1999-04-26 |
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