JPH0851296A - Device for processing semiconductor substrate - Google Patents

Abstract

PURPOSE:To automatically cut the periphery of a ceramic base with any thickness and size simply and easily without necessitating manual operation or jigs by energizing a reversing means and rotating means by a control means in response to the output of a rear/front detecting means. CONSTITUTION:A chamfered part is formed at one corner of a ceramic base. When a position sensor at the chamfered part detects that the substrate is reversed, the substrate is corrected by a reversing device 3. The reversing device 3 is composed of a substrate receiving part 12 which sandwiches the leading edge of the semiconductor substrate 8, a rotating means 13, which rotates the substrate receiving part 12 at 180 deg. within the vertical plane with the semiconductor substrate 8, and a rotating means 14 which rotates 180 deg., in the vertical plane, for example, at a position that the substrate receiving part 12 is rotated 90 deg.C having the rotation radius as the axis, which is in this case, a vertical shaft. When time semiconductor substrate 8 is reversed, the leading edge of the semiconductor substrate 8 is sandwiched by the substrate receiving part 12, and the substrate receiving part 12 is rotated 130 deg. by the reversing means 13 within the vertical plane.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor substrate processing apparatus,
In particular, the present invention relates to a semiconductor substrate processing apparatus in which a metal plate is attached to the center of a ceramic substrate.

[0002]

2. Description of the Related Art In a conventional semiconductor substrate, a metal plate of a desired size, for example, a copper plate is applied to a ceramic base sufficiently larger than this, polished, and after patterning, the peripheral edge of the ceramic base is bent by a jig. , Have been removed.

[0003]

However, in the prior art, the removal of the peripheral portion of the ceramic substrate in the semiconductor substrate by bending and the like is performed manually, which is extremely inefficient and costly. .

The present invention is designed to eliminate the above drawbacks.

[0005]

A semiconductor substrate processing apparatus according to the present invention is a means for detecting the front and back of a conveyed semiconductor substrate, and holds the front end of the semiconductor substrate, and the front end serves as a base point in a vertical plane. A rotating means for rotating the semiconductor by 180 ° around it, a rotating means for rotating the semiconductor by 180 ° around the rotation radius of the semiconductor in the middle of its rotation, and a reversing means and a rotating means depending on the output of the front and back detecting means. It is characterized in that it has a semiconductor substrate reversing device comprising a control means for energizing.

The semiconductor substrate processing apparatus according to the present invention comprises a conveying means for movably supporting the semiconductor substrate in the front and rear directions, break cutters arranged in front of, behind, left and right of the conveying means, and the conveying means. It consists of right and left substrate shifting mechanisms arranged on the left and right of the means and fixing means for fixing the semiconductor substrate, and drives the break cutter with the semiconductor substrate positioned in front, rear, left and right. And a ceramic base peripheral edge cutting device for cutting the peripheral edge of the ceramic base in the semiconductor substrate.

A semiconductor substrate processing apparatus according to the present invention is a stock guide having a shooter extending obliquely downward, a support member horizontally arranged below the shooter, and an inclined stock surface protruding above the support member. And a semiconductor substrate stocking device comprising a stopper provided at the lower end of the shooter so as to project from the surface of the shooter, and a rotating means for making the shooter rotatable about the lower end thereof.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 show a semiconductor substrate processing apparatus of the present invention, in which 1 is an etching machine for patterning,
Reference numeral 2 is an escape mechanism portion, 3 is a reversing device, 4 is a peripheral edge cutting device for a ceramic substrate, and 5 is a semiconductor substrate stocking device.

FIG. 3 shows a metal plate, for example, a copper plate 6 and a ceramic substrate 7 which is sufficiently larger than the copper plate 6 to which the copper plate 6 is attached.
The semiconductor substrate 8 consisting of
Has a slit groove 9 for cutting in a frame portion larger than the outer circumference of the copper plate 6 by, for example, 5 mm, and after the etching treatment for patterning the copper plate 6, the peripheral edge portion 10 of the ceramic substrate 7 is located at the portion of the slit groove 9. Bent and removed.

Further, the semiconductor substrate 8 thus formed may be turned upside down during the etching process, which hinders subsequent processes.

Therefore, in the present invention, a chamfer 11 is formed at one corner of the ceramic substrate 7, and the position of the chamfer 11 is detected by a sensor (not shown) to determine that the substrate is face down. If it is, the reversing device 3 corrects it.

As shown in FIG. 1, the reversing device 3 of the present invention includes a substrate receiver 12 for holding the tip of the semiconductor substrate 8, and
This substrate holder 12 is placed together with the semiconductor substrate 8 in a vertical plane.
The reversing means 13 which rotates by 0 °, and the rotating means which rotates the substrate receiver 12 by, for example, 90 ° in a vertical plane, and which rotates by 180 ° around the axis that is vertical in this case with the radius of rotation as an axis. When the sensor determines that the semiconductor substrate 8 is oriented in the opposite direction, the front end of the semiconductor substrate 8 is held by the substrate receiver 12, and then the substrate receiver 12 is rotated by the inversion means. Rotate 180 ° in the vertical plane by 13. As a result, the orientation of the semiconductor substrate 8 becomes normal.

When it is determined that the semiconductor substrate 8 is in the normal orientation, the semiconductor substrate 8 is rotated by, for example, 90 ° in the vertical plane by the substrate receiver 12, and is vertically aligned. The substrate receiver 1 by the rotating means 14
2 together with the semiconductor substrate 8 about the radius of gyration as an axis and rotated by 180 ° around an axis which is vertical in this case, and then the substrate receiver 12 is further rotated by 90 ° in the vertical plane by the reversing means 13. And sends it to the peripheral edge cutting device 4 of the ceramic substrate. In this case, the orientation of the semiconductor substrate 8 remains normal.

Peripheral cutting device 4 for ceramic substrate of the present invention
Is a substrate loading conveyor 15 and a break conveyor 1 which are sequentially arranged in a horizontal direction as shown in FIGS.
6, a substrate discharge conveyor 17, a substrate stopper 18 and an upstream break cutter 19 inserted between the substrate loading conveyor 15 and the break conveyor 16, and a downstream side interposed between the break conveyor 16 and the substrate discharge conveyor 17. A break cutter 20, a left break cutter 21 and a right break cutter 22, which are respectively arranged on the left and right in the width direction of the break conveyor 16, and a right board moving mechanism 23 and a left board moving mechanism 24 which are movable in the width direction. It is composed of a substrate retainer 25 arranged above the break conveyor 16, and cylinders 26 to 31 for driving the substrate stopper 18, the break cutters 19 to 22 and the substrate retainer 25, respectively.

The break conveyer 16 is, for example, a roller conveyer having a shaft extending in a direction perpendicular to the carrying direction and comprising a plurality of rollers spaced from each other in the carrying direction. The right and left substrate shifting mechanisms 23, 24 are provided. Is, for example, a rod-shaped body that can move between the rollers in the left and right directions.

Peripheral cutting device 4 for ceramic substrate of the present invention
Has the above-mentioned configuration, the semiconductor substrate 8 sent to the substrate loading conveyor 15 via the reversing device 3 is transferred to the substrate stopper 18 by the stopper upper and lower cylinders 26.
Move down to stop and align in the feed direction.

Next, the substrate stopper 18 is opened, the semiconductor substrate 8 is moved by the substrate loading conveyor 15 and the break conveyor 16, and the downstream break cutter 2 is moved.
0, the tip of the ceramic substrate 7 of the semiconductor substrate 8 is positioned, and the right substrate moving mechanism 23 presses the right end of the ceramic substrate 7 against the right break cutter 22, thereby positioning the front end and the right end of the ceramic substrate 7, and pressing the substrate. The cylinder 31 is urged and the substrate retainer 25 is lowered to fix the substrate 8.

In this state, the cylinders 28 and 30 raise the break cutters 20 and 22 to raise the ceramic substrate 7.
The peripheral edge portions 10 at the front end and the right end are cut at the split groove 9.

Next, the substrate retainer 25 is moved upward, the semiconductor substrate 8 is moved backward by the break conveyor 16 toward the upstream break cutter 19, and the rear end of the ceramic substrate 7 is positioned. The left end of the ceramic base 7 is pressed against the left break cutter 21 to be positioned, and the remaining peripheral edge portion 10 is cut by the break cutters 19 and 21 in the same manner as described above.

After the cutting of the peripheral portion, the semiconductor substrate 8 is supplied to the semiconductor substrate stocking device 5 by the substrate discharge conveyor 17.

As shown in FIG. 6, the semiconductor substrate stocking device 5 of the present invention comprises a shooter 32 extending downward from the downstream end of the substrate discharge conveyor 17 and a floating belt horizontally arranged below the shooter 32. Conveyor 33
And a stock guide 35 projecting upstream of the upper running portion of the belt 34 of the belt conveyor 33 for obliquely holding the semiconductor substrate 8 and a lower end portion of the shooter 32 projecting freely from the surface thereof. The stopper 36 provided, a pivot shaft 37 for pivoting and retracting the stopper 36 from the surface, and the shooter 3
A substrate extruding block 38 which is in contact with the back surface of 2 and tilts the shooter with its lower end as a base point;
It is composed of a drive cylinder 39 of the substrate pushing block 38.

The semiconductor substrate stocking device 5 of the present invention
, The semiconductor substrate 8 lowered by being guided by the shooter 32 is stopped by the stopper 36, and then the stopper 36 is rotated about the rotation pivot shaft 37 to retract from the surface of the shooter 32. The lower end of the substrate 8 is lowered to and held by the belt 34.

Further, in this state, the drive cylinder 39 is urged to move the substrate pushing block 38 forward in the horizontal direction, and as a result, the shooter 32 pivots in the clockwise direction in FIG. To be done.

Since the semiconductor substrate stocking device 5 of the present invention has the above-mentioned structure, the semiconductor substrate 8 supplied from the substrate discharge conveyor 17 onto the shooter 32 is rotated by the shooter 32 so that the stock guide 35 has an inclined stock surface. Thus, the semiconductor substrates 8 are held obliquely, and the semiconductor substrates 8 are sequentially stacked on the belt 34 obliquely.

Reference numeral 40 is a roller for movably supporting the belt 34, 41 is a belt guide for supporting the upper running portion of the belt 34 so as not to bend, and 42 is the belt 3
4 is a tension applying means for applying a tension to 4.

[0027]

Since the semiconductor substrate processing apparatus of the present invention is constructed as described above, the semiconductor substrate can always be supplied to the ceramic substrate peripheral edge cutting apparatus 4 in the correct direction by the reversing apparatus 3, where the manual operation and the curing are performed. The peripheral edge of the ceramic substrate can be easily and easily cut automatically with any thickness and size without using a tool, and the processed semiconductor substrate 8 is obliquely placed on the belt 34 by the semiconductor substrate stocking device 5. Since each of the semiconductor substrates 8 is mounted so as to be inclined.
As a result, even if different thicknesses and sizes are mixed, it is easy to hold them, a cassette for stock is not required, and the semiconductor substrate is once stopped by the stopper 36 and then abutted on the belt 34. There is a great advantage that there is no possibility that the stocked semiconductor substrates will be scratched by the edges of the falling semiconductor substrates.

[Brief description of drawings]

FIG. 1 is a front view of a semiconductor processing apparatus of the present invention.

FIG. 2 is a plan view of a semiconductor processing apparatus of the present invention.

FIG. 3 is a plan view of a semiconductor substrate processed by the semiconductor processing apparatus of the present invention.

FIG. 4 is a front view of a ceramic base peripheral edge cutting device of the present invention.

FIG. 5 is a side view of the ceramic base peripheral edge cutting device of the present invention.

FIG. 6 is a front view of the semiconductor substrate stocking device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Etching machine 2 Escape mechanism part 3 Reversing device 4 Ceramic substrate peripheral edge cutting device 5 Semiconductor substrate stocking device 6 Copper plate 7 Ceramic substrate 8 Semiconductor substrate 9 Cutting slit 10 Peripheral edge 11 Chamfering 12 Substrate receiving 13 Reversing means 14 Rotating means 15 Substrate loading conveyor 16 Break conveyor 17 Substrate discharging conveyor 18 Substrate stopper 19 Upstream side break cutter 20 Downstream side break cutter 21 Left side break cutter 22 Right side break cutter 23 Right side board moving mechanism 24 Left side board moving mechanism 25 Board pressing 26 cylinder 27 cylinder 28 Cylinder 29 Cylinder 30 Cylinder 31 Cylinder 32 Shooter 33 Belt Conveyor 34 Belt 35 Stock Guide 36 Stopper 37 Rotating Pivot Shaft 38 Board Push Out block 39 drives the cylinder 40 roller 41 belt guide 42 tensioning means

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Toshikazu Tanaka 1-8-2 Marunouchi, Chiyoda-ku, Tokyo Dowa Mining Co., Ltd.

Claims (3)

[Claims] 1. A means for detecting the front and back of a conveyed semiconductor substrate, and a reversing means for holding the front end of the semiconductor substrate and rotating the front end by 180 ° in a vertical plane with the front end as a reference point.
A semiconductor substrate comprising rotating means for rotating the semiconductor about the radius of gyration by 180 ° around it in the course of rotation, and control means for urging the reversing means and the rotating means according to the output of the front and back detecting means. An apparatus for processing a semiconductor substrate, comprising: 2. A conveying means for supporting a semiconductor substrate so as to be movable forward and backward, a break cutter arranged in front of, behind, left and right of this conveying means, and arranged on the left and right of the conveying means. It consists of a right and left substrate shifting mechanism and a fixing means for fixing the semiconductor substrate.
An apparatus for processing a semiconductor substrate, comprising a ceramic base peripheral edge cutting device configured to drive the break cutter in a state of being positioned on the left and right to cut the peripheral edge of the ceramic base in the semiconductor substrate. 3. A shooter extending obliquely downward, a support member horizontally arranged below the shooter, a stock guide having an inclined stock surface protruding above the support member, and a lower end portion of the shooter. An apparatus for processing a semiconductor substrate, comprising: a semiconductor substrate stocking device comprising a stopper provided so as to project from the surface thereof and a rotating means for making the shooter rotatable about its lower end.