JPH0853923A - Floor panel - Google Patents

Abstract

PURPOSE:To secure strength, and absorb unevenness by forming wiring passing groove parts between plural leg stands arranged on an upper surface of a board, arranging a large number of holes in the whole surface by holding a thickness of the board, and applying flexibility to the board. CONSTITUTION:Lower panels 10 are laid all over a backing floor, and mutual groove parts 4 of the respective lower panels 10 are formed in a communicating shape, and openings of the groove parts 4 are put together. Next, wiring is passed and laid in the groove parts 4, and a surface plate 5 is placed on the upper side of the lower panels 10. In this case, leg stands 3 are adhered to and formed on a board 1, and a large number of holes are formed in the whole surface of the board 1, and flexibility is applied to the board 1, and strength is secured, and unevenness of the backing floor is made absorbable. The backing floor is formed of concrete, and excess moisture in the concrete is evaporated and removed from the holes 2 arranged in the board 1, and the deterioration of concrete strength is prevented. The leg stands 3 are formed in a hollow shape, and weight of a floor panel is reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floor panel used for a double floor such as a free access floor.

[0002]

2. Description of the Related Art A double floor is formed by laying a plurality of floor panels on a base floor, and telephone lines and computer wiring are arranged below the floor panels. As a floor panel forming such a double floor, various structures have been proposed. For example, floor panel A described in Japanese Utility Model Laid-Open No. 62-131537.
As shown in FIG. 8A, a plurality of footrests 3 are provided on the upper surface of the substrate 1 to form groove portions 4 for passing wiring between the adjacent footrests 3, and the upper opening of the groove portion 4 is covered. It is designed to be closed at 16. However, in this floor panel A, the substrate 1
However, there is a problem that the substrate 1 cannot be bent because it is rigid, and it is impossible to absorb the unevenness of the ground floor.

Therefore, as shown in FIG.
According to Japanese Laid-Open Patent Publication No. 9143, a floor panel A formed by connecting legs 3 with a thin plate 20 and forming adjacent grooves 3 between the legs 3 as a groove portion 4 for passing a wiring, and providing a lid 16 for closing an upper opening of the groove portion 4.
Is proposed. In this way, the floor panel A has flexibility by connecting the legs 3 with the thin plate 20, and the unevenness of the base floor is absorbed by the bending of the substrate 1.

[0004]

However, the above-mentioned fairness-3
In the floor panel A described in Japanese Patent No. 9143, it is necessary to reduce the thickness of the thin plate 20 in order to absorb the unevenness, and if the thickness of the thin plate 20 is reduced in this way, the strength of the floor panel A decreases. there were. The present invention has been made in view of the above points, and an object of the present invention is to provide a floor panel that is capable of sufficiently absorbing unevenness without reducing strength.

[0005]

A floor panel A according to the present invention.
Is formed by forming a large number of holes 2 on the entire surface of the substrate 1, providing a plurality of pedestals 3 on the upper surface of the substrate 1, and forming a groove portion 4 for passing wiring between the pedestal 3 and the pedestal 3. The surface plate 5 for closing the upper surface opening of the substrate 3 is provided above the substrate 1.

In the present invention, the pedestal 3 can be formed hollow. Further, in the present invention, the side surface facing the groove portion 4 of the leg base 3 can be formed into the curved surface 22.

[0007]

Operation: A large number of holes 2 are formed on the entire surface of the substrate 1
A plurality of pedestals 3 are provided on the upper surface of the
Since the grooves 4 are formed between the wirings, it is possible to impart flexibility to the substrate 1 by forming the holes 2 in the substrate 1 without reducing the thickness of the substrate 1.

[0008]

EXAMPLES The present invention will be described in detail below with reference to examples. FIG.
As shown in FIG. 3, a flat plate made of plastic having a square shape can be used as the substrate 1, and a large number of holes 2 open to the front and back are formed over the entire surface of the substrate 1. This hole 2
Is punched by, for example, punching, or the substrate 1
It can be formed by molding into a mesh (mesh) when molding. In FIG. 3, only some of the holes 2 are shown, and the other holes 2 are shown in phantom lines. The pedestal 3 has a square upper surface, an open lower surface, and a hollow box shape inside. As shown in FIG. 1 (a), the surface plate 5 is formed as a flat plate having substantially the same size as the base 1 and with the corners cut off, but the material can be, for example, a black-painted steel plate. .

Then, as shown in FIG. 1 (b), the legs 3 are adhered and fixed to the corners of the upper surface of the substrate 1 to form the lower panel 10, and the surface plate 5 is arranged above the substrate 1. At the same time, the floor panel A is formed by mounting the corners of the back surface of the front plate 5 shown in FIG. Then, a groove portion 4 for passing wiring is formed between the adjacent pedestals 3, and an end portion of this groove portion 4 is opened to a side surface of the floor panel A, and each groove portion 4 is a cross shape at a substantially central portion of the floor panel A. It is crossed with and communicated.

When constructing the floor panel A, first, the lower panel 10 is laid on the base floor, and the openings of the groove portions 4 are aligned so that the groove portions 4 of each lower panel 10 communicate with each other. Next, the wiring is laid through the groove portion 4, and then the surface plate 5 is placed on the upper side of the lower panel 10. In the floor panel A of this embodiment, since the footrest 3 is formed by being bonded to the upper surface of the substrate 1, the strength is higher than that of connecting the footrest 3 with the thin plate 20 as in the conventional example shown in FIG. 8B. Can be large. Since a large number of holes 2 are formed on the entire surface of the substrate 1,
Since the substrate 1 has flexibility, the unevenness of the base floor can be absorbed by the substrate 1 bending. When the base floor is made of concrete, even if the floor panel A is laid in a state where the concrete is not completely dried, excess water in the concrete can be evaporated from the holes 2 provided in the substrate 1, Prevent scratches,
It is possible to prevent the strength of concrete from being lowered due to scratching. Further, since the floor panel A has the leg base 3 formed in a hollow shape, the floor panel A can be reduced in weight.

FIG. 4 shows another embodiment. At the upper edge of the pedestal 3 facing the groove 4 of the present embodiment, a concave step portion 11 opening to the upper surface and the side surface is formed along the groove 4, and at the inner corner of the pedestal 3. A recess 15 communicating with the recessed portion 11 is provided on the upper surface and the side surface. The surface plate 5 of this embodiment is formed with a lid 16 that closes only the upper surface opening of the groove portion 4, and the lid 16 is composed of a central lid 12 and a peripheral lid 13.

As shown in FIG. 5 (a), the central lid 12 is formed into a square shape in plan view and has a size enough to cover the upper surface opening of the intersecting portion of the groove portion 4. Further, as shown in FIG. 5B, the peripheral lid 13 is formed in a rectangular shape in plan view, and a cutout portion 14 for leading out a wiring is formed at a longitudinal end portion thereof. Then, the central lid 1 is attached to each of the recesses 15 provided on the leg stand 3.
Insert the two corners into the lower panel 10 and insert the center lid 1
The floor panel A can be formed by attaching the peripheral lid 13 to the lower panel 10 by attaching the peripheral lid 13 to the lower end 10 of the peripheral lid 13 by fitting the short edge portions of the peripheral lid 13 into the concave step portions 11 of the adjacent bases 3, respectively.

In this embodiment, only the upper surface opening of the groove portion 4 is closed by the central lid 12 and the peripheral lid 13, so that the surface plate 5 covering the upper surface of the leg base 3 is used more than the embodiment shown in FIG. The weight can be reduced and the material cost can be reduced. The lid 16 may have various shapes. For example, as shown in FIG. 5 (c), the central lid 12 may be provided with a notch 14 in the peripheral portion thereof. A plurality of groove portions 4 aligned in a line as shown in (d)
The long lid 17 may cover the upper surface opening of the.

FIG. 6 shows still another embodiment.
The inner side surface of the footrest 3 of this embodiment, that is, the side surface facing the groove 4 is a convex arc-shaped curved surface 2 centered on a corner of the substrate 1.
2 is formed so that the convex curved portion faces the intersecting portion of the groove portion 4. In this way, when the side surface of the foot stand 3 is formed into the convex arcuate curved surface 22, when the wiring is passed from the certain groove portion 4 to the groove portion 4 which is continuously provided in the right angle direction, it is assumed that the wiring is bent along the groove portion 4. Also, the bending angle of the wiring can be made gentle, and the wiring can be prevented from being damaged by bending. This is particularly effective when the wiring is formed of an optical fiber having a low bending strength.

[0015]

As described above, according to the present invention, a large number of holes are formed on the entire surface of the substrate, a plurality of legs are provided on the upper surface of the substrate, and a groove portion for passing wiring between the legs is provided. Since it is formed as, it is possible to impart flexibility to the substrate by providing a hole in the substrate without reducing the thickness of the substrate, and it is possible to sufficiently absorb unevenness without lowering the strength. is there. Even if the floor panel is laid in a state where the concrete is not completely dry, excess water in the concrete can be evaporated from the holes provided in the board, preventing scratching of the concrete and The strength can be prevented from decreasing.

Further, since the leg stand is formed hollow, the weight can be reduced. Furthermore, since the side surface facing the groove of the pedestal is formed into a curved surface, even if the wiring arranged in the groove is bent along the groove, the bending angle of the wiring can be made gentle, and the wiring can be It is something that can be prevented from being damaged.

[Brief description of drawings]

FIG. 1A is a perspective view of a surface plate and FIG. 1B is a perspective view of a lower panel, showing an embodiment of the present invention.

FIG. 2 (a) is a plan view showing the laid state of the same.
(B), (c) is sectional drawing.

FIG. 3 is a plan view of the above substrate.

FIG. 4A is a plan view showing another embodiment of the above.
(B) is sectional drawing, (c) is a perspective view of a lower panel.

FIG. 5 is a plan view of (a) to (d) of the lid used in another embodiment of the same.

FIG. 6 is a perspective view of a lower panel of another embodiment of the same.

FIG. 7 (a) is a plan view showing a laid state of the above.
(B), (c) is sectional drawing.

8A is a perspective view of a conventional example, and FIG. 8B is a perspective view of another conventional example.

[Explanation of symbols]

 1 substrate 2 hole 3 leg stand 4 groove 5 surface plate 22 curved surface A floor panel

Claims (3)

[Claims] 1. A large number of holes are formed on the entire surface of a substrate, a plurality of pedestals are provided on the upper surface of the substrate, and a groove is formed between the pedestal and the pedestal so as to pass a wire. A floor panel comprising a closing surface plate provided above a substrate. 2. The floor panel according to claim 1, wherein the footrest is formed to be hollow. 3. The floor panel according to claim 1, wherein the side surface of the footrest facing the groove is formed into a curved surface.