JPH085553Y2 - Wafer delivery device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a wafer delivery device in a probing machine for inspecting each circuit element in a state where electronic circuits are formed on a wafer in a semiconductor manufacturing process. It is a thing.

<Prior Art> A wafer supplied to a probing machine has a large number of extremely fine circuits on its upper surface, and the arrangement position direction is regulated. Therefore, in order to set this on the table for loading, it is necessary to gently move it on the table without changing the direction, and the upper surface cannot be touched. In the probing machine, the loading table is moved for the purpose of its work, and the wafer receiving and sending positions are specified. Here, the wafer is held by the lower surface or the outer circumference, receives the wafer, and is sent to a position.
Here, a method is generally used in which the wafer is once passed to the intermediate holding mechanism and gently placed on the table. This raises three pins from the loading table, receives a wafer on it,
Next, the pins are lowered and placed on the table. And when sending out, the reverse operation is performed.

Since the intermediate holding mechanism for wafer handling is provided in the loading table, the weight of the loading table increases,
For precise table movement, increased inertia is undesirable.

<Problem solving means of the present invention> In the present invention, the drive source, which is a main part of the intermediate delivery mechanism, is fixedly provided at the receiving position and the unloading position, thereby making it possible to simplify and reduce the structure of the stage table. To do.

<Embodiment> In FIG. 1, a ring 3 is vertically movably fitted to the outside of a vertical cylindrical body 2 at the base portion on which the loading table is attached. The ring 3 has a spring 5 on a shelf 4 in the middle of the cylinder 2.
It is pressed by.

Then, three pins 6 which can freely move up and down through the upper surface of the table 1 are erected, and the lower ends thereof are brought into contact with the ring 3,
Support.

When the loading table having such a structure moves to a position for receiving the wafer, the support 11 that supports the wafer 10 on the lower surface moves to just above the table 1. A lever 13 having a fulcrum 12 is provided on the fixed portion at the receiving position, and the lever 13 is activated by the operation of the air cylinder 14.
Turns clockwise.

When the loading table moves to the receiving position,
The left end of the lever 13 in the figure is inserted under the ring 3. Then, the lever 13 is moved to the ring 3 by the operation of the air cylinder 14.
To lift the pins 6 all at once to support the wafer 10 from below and separate the wafer from the support 11. When the support 11 has passed, the air cylinder is returned and the pins 6 are lowered to lower the wafer 10. Gently transfer to table 1.

FIG. 2 shows another embodiment. Here, an upward air cylinder 15 is fixedly provided at the wafer receiving position, and the tip end of the vertical rod 16 thereof is positioned on the lower surface of the ring 3 built in the wafer table to which it moves. And air cylinder
The actuation of 15 raises the pin as before. In the case of unloading the wafer, the operations shown in FIGS. 1 and 2 are reversed.

<Effect> In the present invention, the structure is simple and the weight of the moving body can be reduced as compared with the method of providing the table driving source for the table that needs to be moved.

[Brief description of drawings]

FIG. 1 is an explanatory view of the configuration of the present invention, and FIG. 2 is an explanatory view showing another embodiment. 1 ... table, 2 ... cylindrical part, 3 ... ring 4 ... shelf, 6 ... pin, 10 ... wafer 11 ... support, 12 ... fulcrum, 13 ... lever 14,15 ... air Piston, 16 …… vertical rod

Claims (1)

[Scope of utility model registration request] 1. A device for transferring a wafer to a movable mount table, wherein a vertically movable ring built in the mount table and movement of the ring perpendicular to the mount table. A plurality of pins that are supported so as to be movable up and down in accordance with the above, and that are fixedly arranged at the wafer transfer position, with a plurality of pins that contact and hold the wafer when one end of the product is protruding onto the table for the aforementioned object. Delivery device comprising a drive mechanism for moving the pins up and down via the ring when the work table is positioned at the delivery position of the wafer.