JPH085562Y2 - Surface mount components - Google Patents
Surface mount componentsInfo
- Publication number
- JPH085562Y2 JPH085562Y2 JP1989058262U JP5826289U JPH085562Y2 JP H085562 Y2 JPH085562 Y2 JP H085562Y2 JP 1989058262 U JP1989058262 U JP 1989058262U JP 5826289 U JP5826289 U JP 5826289U JP H085562 Y2 JPH085562 Y2 JP H085562Y2
- Authority
- JP
- Japan
- Prior art keywords
- horizontal
- horizontal portion
- mold resin
- lead body
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案は、ICやトランジスタ等の表面実装部品におけ
るリード体の突出構造に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The present invention relates to a projecting structure of a lead body in a surface mount component such as an IC or a transistor.
（従来の技術） 第４図は従来における表面実装部品の基板への実装構
造を示す断面図である。(Prior Art) FIG. 4 is a sectional view showing a conventional mounting structure of a surface mount component on a substrate.
図において、符号101はICやトランジスタ等の表面実
装部品であり、表面実装部品101はモールド樹脂部102内
に半導体チップ103が埋設されるとともに、その半導体
チップ103に一端側が接続される各リード体104の他端側
104aが、モールド樹脂部102から外方に突出する構成と
なっている。In the figure, reference numeral 101 is a surface-mounted component such as an IC or a transistor, and the surface-mounted component 101 includes a semiconductor chip 103 embedded in a mold resin portion 102, and each lead body whose one end side is connected to the semiconductor chip 103. The other end of 104
104a is configured to project outward from the mold resin portion 102.
そして、半導体チップ103は、上記リード体104の他端
側104aが、基板105上の所定位置に形成されるランド部1
06に半田付けにより固定されて基板105上に実装されて
いる。Then, in the semiconductor chip 103, the land portion 1 in which the other end side 104a of the lead body 104 is formed at a predetermined position on the substrate 105.
It is fixed to 06 by soldering and mounted on the substrate 105.
上記の半田付けは、例えばリフロー半田付けにより行
うもので、このリフロー半田付けは、まずランド部106
それぞれの面にペースト状態の半田を塗布し、表面実装
部品101のモールド樹脂部102の下面に接着剤を塗布して
その部分を基板105面に接着しながらリード体104の他端
側104aをランド部106上に載置する。このように表面実
装部品101を仮固定した状態の基板105を赤外線炉内を通
過させることにより加熱処理し、この加熱処理でペース
ト状態の半田が溶融して冷却後に固化することによりラ
ンド部106へのリード体104の接続固定が完了する。The above-mentioned soldering is performed by, for example, reflow soldering.
Solder in a paste state is applied to each surface, an adhesive is applied to the lower surface of the mold resin portion 102 of the surface mount component 101, and the other end side 104a of the lead body 104 is landed while adhering that portion to the surface of the substrate 105. It is placed on the unit 106. In this way, the substrate 105 in which the surface-mounted component 101 is temporarily fixed is heat-treated by passing through the infrared furnace, and the solder in the paste state is melted by this heat treatment and solidified after cooling to the land portion 106. The connection fixing of the lead body 104 is completed.
（考案が解決しようとする課題） しかしながら、従来においては、上記のリフロー半田
付けに際して半田付け不良がしばしば発生する問題点が
あった。(Problems to be Solved by the Invention) However, conventionally, there has been a problem that soldering failure often occurs during the reflow soldering.
上記のように半田付け不良が発生するのは、加熱処理
を行う際に溶け出した半田Ｈが、第５図に示すように、
リード体104の他端側104aに連続する湾曲部107の内面に
沿って表面張力現象により上昇し、固着されるべきラン
ド部106と他端側104a間に半田が十分に存在しなくなる
ことに起因すると考えられる。As described above, the soldering failure occurs because the solder H melted during the heat treatment is as shown in FIG.
Due to the fact that solder rises due to the surface tension phenomenon along the inner surface of the curved portion 107 continuous to the other end side 104a of the lead body 104, and there is no sufficient solder between the land portion 106 to be fixed and the other end side 104a. It is thought that.
本考案は上記の問題点に鑑みてなしたもので、リフロ
ー半田付けに際して、半田がリード体に沿って流れ出す
ことがなく、常に基板上に安定してリード体の半田付け
固定が行える表面実装部品を提供することを目的とす
る。The present invention has been made in view of the above-mentioned problems, and during reflow soldering, the solder does not flow along the lead body, and the surface mount component can always be stably soldered and fixed on the substrate. The purpose is to provide.
（課題を解決するための手段） 本考案は、このような目的を達成するために、表面実
装部品を、半導体チップと、前記半導体チップに接続さ
れる第１水平部と、基板への取り付け部となる第２水平
部と、前記両水平部間に介在し、それぞれの水平部を上
下位置に変位させるように連設する中間部とからなるリ
ード体と、前記半導体チップおよび前記リード体の第１
水平部と中間部とを一体にモールドするモールド樹脂部
とを備え、前記第２水平部が前記モールド樹脂部の底面
において突出状態に位置してなる構成とした。(Means for Solving the Problems) In order to achieve such an object, the present invention provides a surface mount component, a semiconductor chip, a first horizontal portion connected to the semiconductor chip, and a mounting portion to a substrate. A lead body including a second horizontal portion and a middle portion that is interposed between the two horizontal portions and that is arranged so as to displace the respective horizontal portions in the vertical position; 1
A molding resin portion for integrally molding the horizontal portion and the intermediate portion is provided, and the second horizontal portion is located in a protruding state on the bottom surface of the molding resin portion.
（作用） 本考案の構成によれば、リード体のモールド樹脂部か
ら外方に突出する部分は第２水平部のみであり、中間部
はモールド樹脂内に位置するので、第２水平部をリフロ
ー半田付けする際に溶け出した半田が中間部に沿って上
昇することが回避される。(Operation) According to the configuration of the present invention, the portion of the lead body protruding outward from the mold resin portion is only the second horizontal portion, and the middle portion is located in the mold resin. Therefore, the second horizontal portion is reflowed. It is possible to prevent the melted solder from rising along the intermediate portion during soldering.
上記のように半田が中間部に沿って上昇することは回
避されるが、第２水平部のモールド樹脂部の底面におい
て突出状態に位置することで形成される立ち上がり部と
取り付け面との間には半田が回り込み、これにより実装
強度が向上されるとともに、かつ、第２水平部の存在に
より基板とモールド樹脂部の底面との間に空間が形成さ
れその回り込みが確認できる。As described above, the solder is prevented from rising along the intermediate portion, but between the rising portion formed by being located in the protruding state on the bottom surface of the mold resin portion of the second horizontal portion and the mounting surface. The solder wraps around to improve the mounting strength, and the presence of the second horizontal portion forms a space between the substrate and the bottom surface of the mold resin portion, so that the wraparound can be confirmed.
（実施例） 以下、本考案を図面に示す実施例に基づいて詳細に説
明する。第１図は表面実装部品を示す斜視図、第２図は
実装状態を示す断面図である。(Embodiment) Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings. FIG. 1 is a perspective view showing a surface mount component, and FIG. 2 is a sectional view showing a mounted state.
これらの図において、符号１はモールド樹脂部であ
り、モールド樹脂部１内のほぼ中央位置には半導体チッ
プ２が埋設されている。３のそれぞれはリード体であ
り、各リード体３は上記半導体チップ２に接続される第
１水平部４と、基板７への取り付け部となる第２水平部
５と、両水平部4,5間に介在し、それぞれの水平部4,5を
上下位置に変位させるように連設する中間部としての湾
曲部６とから構成されている。In these drawings, reference numeral 1 is a mold resin portion, and a semiconductor chip 2 is embedded in the mold resin portion 1 at a substantially central position. Each of the lead bodies 3 is a lead body, and each lead body 3 has a first horizontal portion 4 connected to the semiconductor chip 2, a second horizontal portion 5 to be attached to the substrate 7, and both horizontal portions 4 and 5. It is composed of a curved portion 6 as an intermediate portion which is interposed between the horizontal portions 4 and 5 so as to displace the respective horizontal portions 4 and 5 in the vertical position.
そして、モールド樹脂部１により半導体チップ２およ
び各リード体３の第１水平部４と湾曲部６とが一体にモ
ールドされ、モールド樹脂部１の下部から第２水平部５
のみが側方に突出する構成となっている。Then, the first horizontal portion 4 and the curved portion 6 of the semiconductor chip 2 and the respective lead bodies 3 are integrally molded by the mold resin portion 1, and the lower portion of the mold resin portion 1 to the second horizontal portion 5 are molded.
Only the side is projected.
上記のように、基板７への取り付け部となる第２水平
部５のみがモールド樹脂部１から突出する構成とされて
いるので、リフロー半田付けにおいて加熱処理する際、
基板７のランド部８と第２水平部５との間から溶け出し
た半田は第２水平部５のモールド樹脂部１の底面におい
て突出する立ち上がり部とランド部８の取り付け面との
間には回り込むものの、湾曲部６の内面に沿って上昇す
ることが回避され、これにより、ランド部８と第２水平
部５との間が十分な量の半田により強固に固定され、さ
らに、上記半田の回り込みによっても強固な固定が可能
となる。As described above, since only the second horizontal portion 5 serving as the attachment portion to the substrate 7 is configured to project from the mold resin portion 1, when performing heat treatment during reflow soldering,
The solder melted out from between the land portion 8 of the substrate 7 and the second horizontal portion 5 is provided between the rising portion protruding on the bottom surface of the mold resin portion 1 of the second horizontal portion 5 and the mounting surface of the land portion 8. Although it wraps around, it is prevented from rising along the inner surface of the curved portion 6, whereby the land portion 8 and the second horizontal portion 5 are firmly fixed with a sufficient amount of solder, and further, the solder It can be firmly fixed even by wrapping around.
上記構成の表面実装部品の製造について簡略に説明す
る。The manufacture of the surface mount component having the above configuration will be briefly described.
まずリードフレームの所定位置に半導体チップ２を搭
載するとともに、半導体チップ２と各リード体３との接
続を行い、その状態においてプレス加工により各リード
体３の折り曲げを行なう。次に、各リード体３が所定の
位置、すなわち、湾曲部６と第２水平部５とのほぼ境界
位置まで覆われるようにモールド成形を行い、その後各
リード体３の第２水平部５を残すようにフレームを除去
する。このようにして得られる表面実装部品は、モール
ド樹脂部１の外形が従来品より大きくなるが、リード体
３を含む全体外形は従来品と変わらないものとなる。First, the semiconductor chip 2 is mounted at a predetermined position on the lead frame, the semiconductor chip 2 and each lead body 3 are connected, and in that state, each lead body 3 is bent by press working. Next, molding is performed so that each lead body 3 is covered up to a predetermined position, that is, almost the boundary position between the curved portion 6 and the second horizontal portion 5, and then the second horizontal portion 5 of each lead body 3 is covered. Remove the frame to leave. In the surface mount component thus obtained, the outer shape of the mold resin portion 1 is larger than that of the conventional product, but the entire outer shape including the lead body 3 is the same as that of the conventional product.
上記の実施例においては、中間部が湾曲部６となった
ものについて示したが、表面実装部品は、第３図に示す
ように、中間部が垂直部９となった構成とされてもよ
い。In the above embodiment, the curved portion 6 is provided at the intermediate portion, but the surface mount component may be configured such that the intermediate portion is the vertical portion 9 as shown in FIG. .
（考案の効果） 本考案は上記のように構成され、中間部がモールド樹
脂部内に位置して第２水平部をリフロー半田付けする際
に溶け出す半田が中間部に沿って上昇することが回避さ
れるので、これにより、第２水平部と基板の取り付け部
との間が常に十分な量の半田により強固に固定されるよ
うになる。(Advantages of the Invention) The present invention is configured as described above, and avoids that the melted-out solder rises along the intermediate portion when the second horizontal portion is reflow-soldered with the intermediate portion located in the mold resin portion. As a result, the second horizontal portion and the mounting portion of the board are always firmly fixed by a sufficient amount of solder.
さらに、半田が第２水平部のモールド樹脂部の底面に
おいて突出する立ち上がり部とランド部の取り付け面と
の間に回り込み、この半田の回り込みによっても強固な
固定が可能となる。また、第２水平部の存在により基板
とモールド樹脂部の底面との間に形成される空間におい
て、この半田の回り込みを確認できて便利である。Further, the solder wraps around between the rising portion projecting on the bottom surface of the mold resin portion of the second horizontal portion and the mounting surface of the land portion, and the wraparound of the solder enables firm fixing. In addition, it is convenient that the presence of the second horizontal portion makes it possible to confirm the wraparound of the solder in the space formed between the substrate and the bottom surface of the mold resin portion.
第１図ないし第３図は本考案の実施例に関し、第１図は
表面実装部品の斜視図、第２図は表面実装部品の実装構
造を示す断面図、第３図は表面実装部品の他の実施例の
断面図である。 第４図は従来例における表面実装部品の実装構造を示す
断面図、第５図は従来例における作用を説明するための
部分拡大断面図である。 １……モールド樹脂部、、２……半導体チップ、３……
リード体、４……第１水平部、５……第２水平部、６…
…湾曲部（中間部）。1 to 3 relate to an embodiment of the present invention. FIG. 1 is a perspective view of a surface mount component, FIG. 2 is a sectional view showing a mounting structure of the surface mount component, and FIG. 3 is a cross-sectional view of the embodiment of FIG. FIG. 4 is a sectional view showing a mounting structure of a surface mount component in a conventional example, and FIG. 5 is a partially enlarged sectional view for explaining an operation in the conventional example. 1 ... Mold resin part, 2 ... Semiconductor chip, 3 ...
Lead body, 4 ... First horizontal portion, 5 ... Second horizontal portion, 6 ...
... Bent part (middle part).
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/18 Ｈ 8718−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H05K 1/18 H 8718-4E
Claims (1)
の取り付け部となる第２水平部と、前記両水平部間に介
在し、それぞれの水平部を上下位置に変位させるように
連設する中間部とからなるリード体と、 前記半導体チップおよび前記リード体の前記第一水平部
と中間部とを一体にモールドするモールド樹脂部とを備
え、 前記第２水平部が前記モールド樹脂部の底面において突
出状態に位置している表面実装部品。1. A semiconductor chip, a first horizontal portion connected to the semiconductor chip, a second horizontal portion serving as a mounting portion to a substrate, and a horizontal portion interposed between the horizontal portions and each horizontal portion. A lead body including an intermediate portion that is continuously provided so as to be displaced in a vertical position; and a mold resin portion that integrally molds the semiconductor chip and the first horizontal portion and the intermediate portion of the lead body, 2 A surface mount component in which the horizontal portion is located in a protruding state on the bottom surface of the mold resin portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058262U JPH085562Y2 (en) | 1989-05-19 | 1989-05-19 | Surface mount components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058262U JPH085562Y2 (en) | 1989-05-19 | 1989-05-19 | Surface mount components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0349U JPH0349U (en) | 1991-01-07 |
| JPH085562Y2 true JPH085562Y2 (en) | 1996-02-14 |
Family
ID=31583712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989058262U Expired - Fee Related JPH085562Y2 (en) | 1989-05-19 | 1989-05-19 | Surface mount components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085562Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60145825U (en) * | 1984-03-06 | 1985-09-27 | 株式会社 六▲よう▼社 | bag hanging device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57176751A (en) * | 1981-04-22 | 1982-10-30 | Toshiba Corp | Semiconductor device |
| JPS59145554A (en) * | 1984-02-03 | 1984-08-21 | Hitachi Ltd | Electronic parts with plural pieces of terminal |
| JPS6371551U (en) * | 1986-10-29 | 1988-05-13 | ||
| JPS63151058A (en) * | 1986-12-16 | 1988-06-23 | Matsushita Electronics Corp | Resin packaged type semiconductor device |
-
1989
- 1989-05-19 JP JP1989058262U patent/JPH085562Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0349U (en) | 1991-01-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |