JPH0855941A - Electronic part sealing resin package and epoxy resin composition used for it - Google Patents

Abstract

PURPOSE:To provide an electronic part sealing resin package excellent in electrical insulation to a high voltage, wherein the electronic part sealing resin package is composed of a silicone gel hardened layer which seals up an electronic part and an epoxy resin composition hardened layer deposited on it. CONSTITUTION:A silicone gel hardened layer A which seals up an electronic part is kept at high temperatures, and a liquid epoxy resin composition layer B' less than 40g/cm<2> in tensile bond strength to a silicone gel hardened layer is formed on the silicone gel hardened layer A kept at high temperatures. The liquid epoxy resin composition layer B' is hardened into an epoxy resin hardened layer B by heating, the epoxy resin hardened layer B is cooled down, and the silicone get hardened layer A and the epoxy resin hardened layer B are formed as substantially kept in a non-bonded state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed product for an electronic component, a method for producing the same, and a liquid epoxy resin composition used for producing the resin-sealed product for the electronic component.

[0002]

2. Description of the Related Art Conventionally, an electronic part such as a semiconductor element is housed in a case whose peripheral wall is formed of a plastic case, and the case is filled with a resin to seal the electronic part in the case. Is widely practiced. In such a resin-sealed product of an electronic component, two kinds of resins are used as raw material resins: a resin A which gives a cured product rich in flexibility and elasticity, and a resin B which gives a cured product rich in rigidity. There is. In this case, the resin A is used as a lower layer to seal the electronic component, and the resin B is used as an upper layer to prevent water permeation and to fix the external terminals. A silicone gel is generally used as the resin A, and a liquid epoxy resin composition is generally used as the resin B. by the way,
The resin-sealed product of the electronic component having the above-described structure has a poor electrical insulation property against a high voltage, and when a high voltage is applied, problems such as dielectric breakdown occur.

[0003]

DISCLOSURE OF THE INVENTION The present invention provides a resin-sealed product for an electronic component, which has a structure in which a cured product layer of an epoxy resin composition is laminated on a cured layer of a silicone gel for sealing an electronic component, The first object is to provide a material having a good electric insulation property against a high voltage. A second object of the present invention is to provide a method for producing a resin-sealed product of the electronic component. Furthermore, the third aspect of the present invention is to provide a liquid epoxy resin composition which is preferably applied to the production of a resin-sealed product of the electronic component.
And the subject.

[0004]

As a result of intensive studies to solve the above-mentioned problems, the inventor of the present invention has found that a conventional resin-sealed product for electronic parts has a silicone gel cured product layer constituting a lower layer and an upper layer. The epoxy resin composition cured product layer to be formed is firmly adhered, and the volume contraction rate of the silicone gel cured product layer upon cooling is larger than that of the epoxy resin composition cured product layer. At the time of manufacturing the sealed product, etc., when the resin sealed product of the electronic component is cooled,
A large tensile stress acts on the cured silicone gel layer, which causes cracks in the cured silicone gel layer with weak mechanical strength, resulting in a significant decrease in electrical insulation of the cured silicone gel layer. Found. In addition, the present inventor has found that the problem of deterioration in electrical insulation of the resin-sealed product of the electronic component is that the silicone gel cured product layer and the epoxy resin composition cured product layer are substantially in a non-adhesive state. It was found that holding it could solve the problem. The present invention has been completed based on the above findings.

That is, according to the present invention, the epoxy resin composition cured product layer B is formed on the upper surface of the silicone gel cured product layer A for encapsulating electronic parts.
There is provided a resin-encapsulated product for an electronic component, which is substantially in a non-adhesive state.

Further, according to the present invention, the hardly-adhesive substance layer C is formed on the upper surface of the silicone gel cured product layer A for encapsulating electronic parts.
A resin-encapsulated product for electronic parts, which has a structure in which a cured product layer B of an epoxy resin composition is formed through a layer, and the layer A and the layer C are substantially in a non-adhesive state. Will be provided.

Furthermore, according to the present invention, the silicone gel cured product layer A for encapsulating electronic parts is held at an elevated temperature, and the silicone gel cured product layer A at this elevated temperature is coated with silicone. A liquid epoxy resin composition layer B ′ having a tensile adhesion strength to the gel cured product of 40 g / cm ² or less is formed, and the liquid epoxy resin composition layer B ′ is heat-cured to form the cured epoxy resin composition layer B. After being formed, it is cooled to form a substantially non-adhesive state between the silicone gel cured product layer A and the epoxy resin composition cured product layer B. A method is provided.

Furthermore, according to the present invention, a layer C of a hard-to-adhesive substance having a tensile adhesive strength of 40 g / cm ² or less with respect to a silicone gel cured product is provided on the silicone gel cured product layer A for sealing electronic parts. And the silicone gel cured product layer A and the hardly-adhesive substance layer C are maintained at an elevated temperature, and the liquid epoxy resin composition layer is formed on the hardly-adhesive substance layer C at the elevated temperature. Forming B ',
This liquid epoxy resin composition layer B ′ is heated and cured to form an epoxy resin composition cured product layer B, and then cooled, and a space between the silicone gel cured product layer A and the hardly-adhesive substance layer C is substantially obtained. Provided is a method for producing a resin-sealed product for an electronic component, which is characterized in that the resin-sealed product is formed in a non-adhesive state.

Furthermore, according to the present invention, there is provided a liquid epoxy resin composition having a tensile adhesive strength to a silicone gel cured product of 40 g / cm ² or less.

Next, the present invention will be described with reference to the drawings.
FIG. 1 is a structural explanatory view of an example of a resin-sealed product of an electronic component used as a power module. In this figure, 1 is a heat sink, 2 is a plastic peripheral wall, 3
Is a silicone adhesive layer, 4 is a solder layer, 5 is a wiring board,
6 is an electronic component (semiconductor chip), 7 is a conductive wire,
8 to 12 are external terminals, A is a silicone gel cured product layer, B
Indicates each of the cured epoxy resin composition layers.

In the resin-sealed product of the electronic component of the present invention having the structure shown in FIG. 1, the silicone gel cured product layer A and the epoxy resin composition cured product layer B are held substantially in a non-adhesive state. There is. As a result, even if the layer A undergoes a large volume contraction due to cooling, the volume contraction of the layer A is not limited by the layer B at all, so that a large tensile stress does not act on the layer A and a crack is generated. There is no such thing. If the layer A and the layer B are firmly adhered and held like a resin-sealed product of a conventional electronic component, the volume shrinkage rate of the layer A upon cooling is significantly larger than the volume shrinkage rate of the layer B. Therefore, a large tensile stress acts on the layer A, and as a result, a crack (explosion) occurs in the layer A having low mechanical strength, and the electrical insulation of the layer A is greatly reduced.

There are various methods for maintaining a substantially non-adhesive state between the layer A and the layer B, one of which is to reduce the adhesive force in the epoxy resin composition. This is a method of adding an adhesion-reducing agent, and the other one is a method of allowing the hardly-adhesive substance layer C to exist between the layer A and the layer B. Hereinafter, these methods will be described in detail.

(Method of Adding Adhesion-Reducing Agent to Epoxy Resin Composition) A commonly used liquid epoxy resin composition exhibits good adhesiveness and strongly adheres to a silicone gel cured product, By adding a substance that reduces the adhesive strength (adhesion-reducing agent) to the epoxy resin composition, an epoxy resin composition having weak adhesion to the silicone gel cured product can be obtained.
According to the study by the present inventor, the tensile adhesive strength of the epoxy resin composition to the silicone gel cured product was 40 g / cm.
² or less, preferably by lowering below 35 g / cm ^2, between the silicone gel cured layer A and an epoxy resin composition layer B is held in a state of substantially non-adhesive, layer A
It was found that the volumetric shrinkage of layer A was not substantially limited by layer B and cracking of layer A was effectively prevented.

As the adhesiveness-reducing agent, the adhesive strength of the epoxy resin composition is reduced to 40 g / cm ² or less, preferably 35 g / cm ² or less, as described above, in terms of tensile adhesive strength to a cured silicone gel. Anything that can be used can be used. The adhesion-reducing agent is
It is a substance having a long-chain hydrophobic group and a polar group, and is appropriately selected from surfactants, fluidity improvers, leveling agents, and the like. A specific adhesion-reducing agent can be easily selected by a tensile adhesion strength test of a cured epoxy resin composition containing the adhesion-reducing agent to a silicone gel cured product.
A specific example of a preferable adhesion-reducing agent is, for example, a fluorine-based surfactant (Sumitomo 3M, Fluorad).
FC-430, FC-431, etc.), acrylic polymer (manufactured by BYK Chemie Japan, BYK 354), acrylic copolymer (manufactured by BYK Chemie Japan, BYK).
361), high molecular weight unsaturated polycarboxylic acid (manufactured by BYK-Chemie Japan, BYK-P104), mixture of high molecular weight unsaturated polycarboxylic acid and silicone resin (manufactured by BYK-Chemie Japan, BYK-P104S), amino resin modified Acrylic copolymer (Hoechst Japan, A
dditol XL480, XL490), polydimethylcycloxane side chain glycidyl polyoxyalkylene (manufactured by Nippon Unicar Co., Ltd., FZ-3736) and the like. These substances are contained in the conventional liquid epoxy resin composition in an amount of 0.15 to 10% by weight, preferably 0.2 to 10% by weight.
It is added in a percentage by weight.

(Method of Presenting Difficult-to-Adhesive Substance Layer) As the difficult-to-adhesive substance, the adhesive property between the silicone gel cured product layer A and the epoxy resin composition cured product layer B is impeded, and tensile adhesion between the two is carried out. Strength is 40 g / cm ² or less, preferably 35
40 g / cm tensile adhesion strength to a substance that lowers g / cm ² or less, or to a cured silicone gel
² below, can be preferably used even mentioned any substances is 35 g / cm ² or less. Examples of such a hard-to-adhere substance include an adhesion-reducing agent shown for the epoxy resin composition described above; a thermoplastic resin such as polyethylene, polypropylene, polyethylene terephthalate, polyamide, a fluorine-containing resin and polystyrene; an unsaturated polyester resin and the like. Curable resin etc. are mentioned. These poorly-adhesive substances may contain an inorganic or organic filler, if necessary. These substances are formed as the hardly-adhesive substance layer C on the upper surface of the silicone gel cured product layer A. In this case, the layer C may be formed by any suitable method depending on the kind of the hardly-adhesive substance. Adopted. For example, a brush coating method or a spray coating method is adopted if the hardly-adhesive substance is a coating substance, and if the hardly-adhesive substance is a heat-melting substance, the heat-melting substance is applied to the upper surface of the layer A. Cast it. When the hard-to-adhere substance is a liquid curable resin composition, the composition may be cast on the layer A and cured. The thickness of the hardly-adhesive substance layer C is not particularly limited, but is generally 1 μm to 2 mm, preferably 10 μm.
Is about 1000 μm. It is preferable that the hardly-adhesive substance layer C does not completely melt when the epoxy resin composition is cured.

In one method of manufacturing a resin-sealed product for an electronic component according to the present invention, first, in the electronic-device-sealed product having the structure shown in FIG. 1, a structure not filled with resin is prepared. That is, the electronic component (semiconductor chip) 6, the wire 7, and the external terminals 8 to 12 are provided on the surface of the heat dissipation plate 1 of the case whose bottom surface is composed of the heat dissipation plate 1 and whose peripheral wall is composed of the plastic peripheral wall 2 via the solder layer 4. A structure on which the wiring board is mounted is prepared. In this structure, a metal plate such as a copper plate or an aluminum plate is used as the heat dissipation plate 1, and a plastic such as polyphenylene sulfide or polybutylene terephthalate is used as the plastic peripheral wall 2. As the wire 7, a metal wire such as an aluminum wire or a copper wire is used. A metal strip such as copper or aluminum is used as the external terminal.

Next, the inside of the structure is first filled with silicone gel to form a silicone gel layer A ', which is then cured to form a silicone gel cured product layer A. The upper end surface of the silicone gel cured product layer A is positioned so that the height from the upper surface of the substrate 5 is in the range of 40 to 70% of the height of the peripheral wall 2 from the upper surface of the substrate 5.

Next, a liquid epoxy resin composition containing an adhesion-reducing agent is filled (added) on the silicone gel cured product layer A formed as described above, and the liquid epoxy resin composition layer B is added. After the formation of ', the epoxy resin composition cured product layer B is formed by curing it. In this case, for curing the liquid epoxy resin composition, normal temperature or heating is adopted depending on the type of the composition.

In the case of producing a resin-sealed product for electronic parts as described above, the liquid epoxy resin composition containing an adhesion-reducing agent has a curing temperature of 100 to 180 ° C, preferably 120 to 160 ° C. It is preferable to use a material, preheat it to a temperature lower than its curing temperature, fill it on the heated silicone gel cured material layer A, and cure it under the temperature conditions of the curing temperature range of the epoxy resin composition. The heating temperature of the layer A is usually 110 to 190 ° C., preferably 13
It is 0 to 170 ° C. Further, the heating temperature of the layer A is 5 to 20 from the temperature adopted for curing the epoxy resin composition.
It is preferable that the temperature is as high as 0 ° C, preferably about 10 to 15 ° C. In the case of producing a resin-sealed product of an electronic component in this way, when the thermally expanded layers A and B are cooled to room temperature, the layer A shrinks more than the layer B in volume. , A tensile stress is generated between the layer A and the layer B,
The layer B is peeled off by this tensile stress, and a void is formed between the layer A and the layer B. When such voids are formed, the volume shrinkage of the layer A is not limited by the layer B, so that a large tensile stress does not occur in the layer A and the generation of cracks in the layer A is prevented.

In another method for producing an electronic component encapsulant of the present invention, after forming the hardly-adhesive substance layer C on the silicone gel cured product layer A formed as described above, After the liquid epoxy resin composition is filled on the above to form a liquid epoxy resin composition layer B ′, it is cured. When a resin-sealed product for electronic parts is produced as described above, a liquid epoxy resin composition having a curing temperature of 100 to 180 ° C., preferably 120 to 160 ° C., is used. Preheat to a lower temperature,
It is preferable to fill the heated silicone gel cured product layer A and cure under the temperature condition of the curing temperature range of the epoxy resin composition. The heating temperature of the layers A and C is 11
The temperature is 0 to 190 ° C, preferably 130 to 170 ° C. The heating temperature of the layers A and C is preferably 5 to 20 ° C., preferably about 10 to 15 ° C. higher than the temperature used for curing the epoxy resin composition. In this way, when manufacturing a resin-sealed product for electronic parts,
When the thermally expanded layers A, B and C are cooled to room temperature, a tensile stress is generated between the layers A and C because the layer A shrinks more than the layers B and C by volume. The layers A and C are separated by this tensile stress, and a void is formed between the layers A and C. When such voids are formed, the volume shrinkage of the layer A is not limited by the layers B and C, so that a large tensile stress does not occur in the layer A and cracks in the layer A are not generated. To be prevented.

The silicone gel used in the present invention is
Any conventionally known one used for manufacturing a resin-sealed product of an electronic component may be arbitrarily used. The silicone gel is a partially crosslinked product of a curable organopolysiloxane (for example, dimethylpolysiloxane), and generally exhibits a low-viscosity oil state before curing and a jelly state after curing.
Silicone gel is available in one-pack type and two-pack type.
Any of these can be applied to the present invention. The one-pack type is usually cured at a temperature of 100 ° C. or higher, and the two-pack type is cured after mixing at room temperature or by heating up to about 70 ° C. In the present invention, it is preferable to use a one-pack type. The types of silicone gel curing include (1) condensation-type curing that cures by a condensation reaction,
There are (2) addition reaction type curing which is cured by an addition reaction and (3) ultraviolet curing which is cured by irradiation of ultraviolet rays. In the present invention, any curing type can be used. It is preferable to use a reaction curing type. Further, to this silicone gel, an inorganic filler such as silica, alumina, calcium silicate, mica or the like, or an organic filler such as nylon beads or cured resin powder can be added.

As the liquid epoxy resin composition used in the present invention, any conventionally known one used in the production of resin-sealed products for electronic parts can be arbitrarily used. The liquid epoxy resin composition is classified into a one-pack type and a two-pack type, and any of them can be applied to the present invention. The one-pack type is usually cured at a temperature of 100 ° C. or higher, and the two-pack type is cured after mixing at room temperature or by heating up to about 100 ° C. In the present invention, it is preferable to use a one-pack type. The silicone gel preferably used in the present invention is TSE 3051 (Toshiba Silicone Co.).
And KE-1255 (Shin-Etsu Chemical Co., Ltd.) and the like.

The liquid epoxy resin composition used in the present invention contains a liquid epoxy resin and a curing agent. Various conventionally known epoxy resins are used as the epoxy resin. Examples thereof include diglycidyl ether type epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin; novolac type epoxy resins such as phenol novolac type epoxy resin and cresol novolac type epoxy resin; alicyclic. Epoxy resin; Glycidyl ester type epoxy resin; Glycidyl amine type epoxy resin; Linear aliphatic type epoxy resin;
Heterocyclic epoxy resins; halogenated epoxy resins and the like. In the present invention, in particular, 20 to 40% by weight of the bisphenol A type epoxy resin and the alicyclic epoxy resin 60 to
Preference is given to using a mixture with 80% by weight. Further, as the curing agent, conventionally known ones such as carboxylic acid or anhydride thereof, polyamine, novolac type phenol resin and the like are used. The epoxy resin composition, if necessary,
Further, a curing accelerator, a filler, a colorant, a flame retardant, a release agent, a moisture resistance agent, etc. can be added. As the curing accelerator, a conventional one, for example, an imidazole compound, diazabicycloundecene and a phenol salt thereof, triphenylphosphine, a tertiary amine, an amine adduct latent curing accelerator, dicyandiamide or the like is used. Examples of the filler include alumina, silica, magnesia, antimony trioxide, magnesium carbonate, calcium carbonate, mica and clay. In the present invention, as described above, the liquid epoxy resin composition may be added with an adhesiveness-reducing agent in order to reduce the adhesiveness to the silicone gel cured product. It is also possible to reduce the amount to a desired range by appropriately selecting the types and blending amounts of the components such as the epoxy resin, the curing agent and the filler constituting the product.

[0024]

Next, the present invention will be described in more detail with reference to examples.

Example 1 As a simulation experiment for obtaining a resin-sealed product of an electronic component having the structure shown in FIG. 1, a silicone gel G was placed in a glass petri dish having an outer diameter of 195 mm, an inner diameter of 193 mm and a height of 20 mm.
An experiment of filling and curing liquid epoxy resin composition E with the adhesiveness-reducing agent shown in Table 1 in an amount of 0.25% by weight was carried out as follows. Silicone gel G was preheated at 60 ° C. for 1 hour in an oven and then degassed for 30 minutes in a vacuum chamber at 5 torr or less. The defoamed silicone gel was heated at a temperature of 60 ° C. to a thickness of 12 in a glass petri dish.
It was filled so as to have a size of 10 mm and heated in an oven at 150 ° C. for 1 hour to be cured. Next, the petri dish having the silicone gel cured product layer thus obtained formed therein is left in an oven at 150 ° C. for 1 hour to expand the silicone gel cured product, and at the same time, on the silicone gel cured product layer. Preheat to 60 ° C, 30 in vacuum layer below 5 Torr
The liquid epoxy resin composition E degassed for a minute was filled so as to have a thickness of about 6 mm, heat-cured in an oven at 140 ° C. for 1 hour, and then the petri dish was taken out from the oven.
It was left at room temperature for 30 minutes or longer and cooled to room temperature. A crack is formed in the silicone gel cured product layer A from the back surface of the petri dish having the resin layer composed of the silicone gel cured product layer A and the epoxy resin composition cured product layer B formed on the upper surface inside the thus obtained interior. It was visually judged whether or not the occurrence of the above phenomenon occurred. The results are shown in Table 1. Further, it was visually determined whether or not a void was formed in the interface between the silicone gel cured product layer A and the epoxy resin composition cured product layer B from the back surface of the petri dish. The results are shown in Table 1. When the voids are present, the layer B can be seen only slightly opaque through the layer A, whereas when the voids are not present and the layers A and B are in close contact with each other, the layer B is Is visible through layer A with good transparency.

[0026]

[Table 1]

Silicone gel G used in the above experiment
And epoxy resin composition E and adhesion-reducing agents Y-1 to Y-
The specific contents of No. 8 are as follows. (Silicone gel G) Dimethyl polysiloxane-based addition reaction curing type (TSE3051, manufactured by Toshiba Silicone Co., Ltd.) (Epoxy resin composition E) [Component] [Composition (parts by weight)] Bisphenol A type epoxy resin 10 (Araldite GY-260) , Manufactured by Japan Ciba-Geigy) Alicyclic epoxy resin 20 (Aral site CY-179, manufactured by Nippon Ciba-Geigy) Curing agent 30 (Methylhexahydrophthalic anhydride) Curing accelerator 0.5 (Tris (dimethylaminomethyl) phenol) 0.5 Silane coupling agent 0.1 (β-epoxycyclohexylethyltrimethoxysilane) Flame retardant 16 (Hexabromobenzene) Flame retardant aid 4 (Antimony trioxide) Filler 120 (Silica powder)

(Adhesion-reducing agent) Y-1: Fluorine-based surfactant (Fluorad FC-)
430, manufactured by Sumitomo 3M Ltd.) Y-2: Fluorine-based surfactant (Fluorad FC-)
431, manufactured by Sumitomo 3M Ltd. Y-3: acrylic polymer (BYK 354, manufactured by Big Chemie Japan) Y-4: acrylic copolymer (BYK 361, manufactured by Big Chemie Japan) Y-5: high molecular weight unsaturated poly Carboxylic acid (BYK-P1
04, manufactured by Big Chemie Japan Co., Ltd. Y-6: A mixture of a high molecular weight unsaturated polycarboxylic acid and a silicone resin (BYK-P104S, manufactured by Big Chemie Japan Co., Ltd.) Y-7: Amino resin-modified acrylic copolymer (Addif)
ol XL490, manufactured by Hoechst Japan) Y-8: Polydimethylcyclohexane side chain glycidyl polyoxyalkylene (FZ-3736, manufactured by Nippon Unicar Co., Ltd.)

Example 2 A silicone gel cured product layer was formed in a glass petri dish in the same manner as in Example 1, and this silicone gel was heated at 170 ° C.
The mixture was heated to 150 ° C. and filled with molten polypropylene having a temperature of 165 ° C. so as to have a thickness of about 1.5 mm.
Fill to a thickness of mm and 140 ° C in an oven
After being cured by heating for 1 hour, the petri dish was taken out from the oven, left at room temperature for 30 minutes or more, and cooled to room temperature. The back surface of a petri dish having a resin layer composed of a silicone gel cured product layer A, a polypropylene layer C formed on the upper surface thereof, and an epoxy resin composition cured product layer B formed on the upper surface thereof in the inside thus obtained. From the above, it is visually judged whether or not the silicone gel cured product layer A is cracked, and the silicone gel cured product layer A and the polypropylene layer C are
It was visually determined whether or not there was a gap between the two. As a result, the silicone gel cured product layer A has no cracks,
In addition, a silicone gel cured product layer A and a polypropylene layer C
It was confirmed that there was a gap between and.

Example 3 Tensile Adhesive Strength of Epoxy Resin Composition to Silicone Gel Cured Product and Cracking of Silicone Gel Cured Product Layer When Curing Epoxy Resin Composition Cured Layer on Top of Silicone Gel Cured Product Layer The following experiment was conducted to investigate the relationship with the occurrence status of.

(Measurement of Tensile Adhesive Strength of Epoxy Resin Composition to Cured Silicone Gel) Silicone gel G shown in Example 1 was treated in the same manner as in Example 1 to obtain an inner diameter of 90 m.
m, filling in a petri dish with a height of 18 mm and curing,
A silicone gel cured product layer having a thickness of 10 mm was formed. Next, on the silicone gel cured product layer, 20
A 2 mm thick silicone resin sheet having a square through hole of mm × 20 mm was adhered and laminated. Next, diameter 1.5
Bend the lower end of the mm wire into a loop shape with a diameter (outer diameter) of 10 mm, bend this loop at a right angle to the wire, and bend the upper end of the wire downward into an inverted U-shape to make the total length approx. A pulling member of 5 cm is made, and this pulling member is vertically inserted through the central portion of the through hole formed above so that the back surface of the lower end loop does not come into contact with the surface of the cured silicone gel layer. A liquid epoxy resin composition was filled from the through holes and cured in the same manner as in Example 1 at a temperature of 140 ° C. for 1 hour. Then, the silicone resin sheet is removed, and an epoxy resin composition cured product layer B having a length of 20 mm, a width of 20 mm and a thickness of 2 mm is laminated and adhered on the upper surface of the silicone gel cured product layer A having a thickness of 10 mm formed in the petri dish. The resin laminated product thus obtained was obtained.

Next, in order to measure the tensile adhesive strength of the epoxy resin composition to the cured product of silicone gel, the epoxy resin composition cured product layer B is formed on the upper end of the wire of the tensile member in which the lower end loop is embedded. The measuring end of the spring weigher was connected to the bent portion of the inverted U shape, and the spring weigher was pulled up to separate the cured epoxy resin composition layer B. The maximum value of the spring weigh when the epoxy resin composition cured product layer B was peeled from the silicone gel cured product layer B was measured, and this value was taken as the tensile adhesive force based on the tensile adhesive force measured as described above. The tensile adhesive strength per unit area (tensile adhesive strength) was calculated, and the tensile adhesive strength (g / cm ² ) is shown in Table 2 in relation to the epoxy resin composition.

[0033]

[Table 2]

The concrete contents of the epoxy resin composition shown by the reference numeral in Table 2 are as follows. E: Epoxy resin composition E shown in Example 1 E-Y-7-0.1: 0.1% by weight of the adhesion-reducing agent Y-7 shown in Example 1 with respect to the epoxy resin composition E. EY-7-0.2: Epoxy resin composition E to which 0.2% by weight of the adhesiveness-reducing agent Y-7 shown in Example 1 was added EY-7-0 0.3: 0.3% by weight of the adhesion-reducing agent Y-7 shown in Example 1 was added to the epoxy resin composition E.

(Lamination Experiment of Silicone Gel Cured Product Layer and Epoxy Resin Composition Layer) An experiment was conducted in the same manner as in Example 1 except that the epoxy resin composition shown in Table 2 was used. Table 3 shows the results.

[0036]

[Table 3]

As can be seen from the results shown in Table 3, the silicone gel cured product layer A and the epoxy resin composition cured product layer B were formed by reducing the tensile adhesive strength of the epoxy resin composition to the silicone gel cured product. Voids can be created between the two layers to maintain a substantially non-adhesive state between the two layers, and as a result, generation of cracks in the cured silicone gel layer A can be prevented.

Example 4 A resin-sealed product (power module) of an electronic component having the structure shown in FIG. 1 was produced. In this case, the silicone gel G shown in Example 1 was used as the silicone gel, and the EY-7- shown in Example 3 was used as the liquid epoxy resin composition.
0.3 was used. Further, the filling of the silicone gel and the liquid epoxy resin composition into the structure was carried out according to Example 1
I went in the same way. The resin-sealed product of the electronic component produced in this manner did not cause cracks in the silicone gel cured product layer and showed excellent electrical insulation properties against high voltage (9 to 11 hv / mm). .

[0039]

INDUSTRIAL APPLICABILITY In the resin-sealed product of the electronic component of the present invention, the silicone gel cured product layer A and the epoxy resin composition cured product layer B are formed in a non-adhesive state, and the silicone gel cured product layer A is formed. It has excellent electrical insulation because it does not crack. The breakdown voltage of the conventional silicone gel cured product layer A is as low as 3 to 8 kg / mm in the product having cracks in the silicone gel cured product layer A, whereas the breakdown voltage of the silicone gel cured product layer A of the present invention product is low. Is increased to 9 to 11 kg / mm. According to the method for producing a resin-sealed product of an electronic component of the present invention, a high-quality product having high electric insulation can be stably produced.
The liquid epoxy resin composition having a tensile adhesive strength to the cured silicone gel product of the present invention reduced to 40 g / cm ² or less is suitable as a liquid epoxy resin composition for producing a resin encapsulant for electronic parts of the present invention. Is.

[Brief description of drawings]

FIG. 1 is a structural explanatory view of an example of a resin-sealed product of an electronic component according to the present invention.

[Explanation of symbols]

 1 Radiating Plate 2 Plastic Peripheral Wall 3 Silicone Adhesive Layer 4 Solder Layer 5 Wiring Board 6 Electronic Component 7 Conductive Wire 8-12 External Terminal A Silicone Gel Cured Product Layer B Epoxy Resin Composition Cured Product Layer

Claims (7)

[Claims] 1. A structure having a cured epoxy resin composition layer B formed on the upper surface of a cured silicone gel layer A for encapsulating electronic parts, wherein the space between the layer A and the layer B is substantially A resin-sealed product for electronic parts, which is in a non-bonded state. 2. The resin-sealed product for an electronic component according to claim 1, wherein a void portion is present between the layer A and the layer B. 3. An epoxy resin composition cured product layer B is formed on the upper surface of a silicone gel cured product layer A for encapsulating an electronic component via a hardly adhesive substance layer C. A resin encapsulant for an electronic component, which is in a substantially non-adhesive state with the layer C. 4. The resin-sealed product for an electronic component according to claim 3, wherein a void portion is present between the layer A and the layer C. 5. A silicone gel cured product layer A for encapsulating an electronic component is held at an elevated temperature, and the silicone gel cured product layer A at this elevated temperature has a tensile adhesive strength to the silicone gel cured product. Of 40 g / cm ² or less is formed, and the liquid epoxy resin composition layer B ′ is formed, and the liquid epoxy resin composition layer B ′ is cured by heating to form the cured epoxy resin composition layer B, and then cooled, A method for producing a resin-encapsulated product for electronic parts, characterized in that the silicone gel cured product layer A and the epoxy resin composition cured product layer B are formed in a substantially non-adhesive state. 6. A hard-to-adhere substance layer C having a tensile adhesive strength of 40 g / cm ² or less with respect to a silicone gel cured product is formed on the silicone gel cured product layer A for encapsulating electronic parts, and this silicone is also used. The gel cured product layer A and the hardly-adhesive substance layer C are kept at an elevated temperature, and a liquid epoxy resin composition layer B ′ is formed on the hardly-adhesive substance layer C at this elevated temperature. The liquid epoxy resin composition layer B ′ is heat-cured to form the epoxy resin composition cured product layer B and then cooled, and the silicone gel cured product layer A and the hardly-adhesive substance layer C are substantially non-adhesive. 1. A method for manufacturing a resin-sealed product for an electronic component, which is characterized in that 7. A liquid epoxy resin composition having a tensile adhesive strength to a silicone gel cured product of 40 g / cm ² or less.