JPH0857767A - Method for manufacturing vitrified bond grindstone with excellent grinding ratio - Google Patents
Method for manufacturing vitrified bond grindstone with excellent grinding ratioInfo
- Publication number
- JPH0857767A JPH0857767A JP21948294A JP21948294A JPH0857767A JP H0857767 A JPH0857767 A JP H0857767A JP 21948294 A JP21948294 A JP 21948294A JP 21948294 A JP21948294 A JP 21948294A JP H0857767 A JPH0857767 A JP H0857767A
- Authority
- JP
- Japan
- Prior art keywords
- vitrified bond
- bond
- grinding
- grinding wheel
- vitrified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、立方晶窒化硼素(以
下、cBNと記す)砥粒、ダイヤモンド砥粒などの硬質
砥粒をビトリファイドボンドで結合して得られたビトリ
ファイドボンド砥石の性能を一層向上させる方法に関す
るものである。This invention relates to a vitrified bond grindstone obtained by combining hard abrasive grains such as cubic boron nitride (hereinafter referred to as cBN) abrasive grains and diamond abrasive grains with a vitrified bond. It is about how to improve.
【0002】[0002]
【従来の技術】一般に、ビトリファイドボンド砥石は、
cBNなどの砥粒間をガラスのボンドブリッジで結びつ
けているために、このボンドブリッジの強度が砥石の強
度に大きく影響を及ぼしていることは良く知られている
ところである。このボンドブリッジの強度を向上させて
優れたビトリファイドボンド砥石を得るために、(a)
cBN砥粒とジルコンの結晶粒を含むビトリファイド
ボンドと混合し、窒素雰囲気中、温度:950℃以下で
焼成する方法(特開昭54−39292号公報参照)、
(b) cBN砥粒と弗化リチウムを含むビトリファイ
ドボンドと混合し、窒素雰囲気中、温度:1200〜1
300℃で焼成する方法(特開昭57−54077号公
報参照)、などの製造方法が提案されている。2. Description of the Related Art Generally, vitrified bond wheels are
It is well known that the strength of the bond bridge has a great influence on the strength of the grindstone because the abrasive grains such as cBN are connected by a glass bond bridge. In order to improve the strength of this bond bridge and obtain an excellent vitrified bond grindstone, (a)
A method in which cBN abrasive grains and vitrified bonds containing zircon crystal grains are mixed and fired at a temperature of 950 ° C. or lower in a nitrogen atmosphere (see JP-A-54-39292).
(B) cBN abrasive grains and a vitrified bond containing lithium fluoride are mixed and the temperature is 1200 to 1 in a nitrogen atmosphere.
A manufacturing method such as a method of firing at 300 ° C. (see JP-A-57-54077) has been proposed.
【0003】[0003]
【発明が解決しようとする課題】しかし、近年、研削分
野においても高能率化が要求されているために一層苛酷
な条件での研削を強いられるようになってきており、従
来のビトリファイドボンド砥石では十分に対応すること
ができず、特に重研削に耐え得る研削比の優れた高強度
ビトリファイドボンド砥石は得られていない。However, in recent years, in the field of grinding as well, there is a demand for higher efficiency, so that it has become necessary to grind under severer conditions, and conventional vitrified bond grindstones are used. It has not been possible to obtain a high-strength vitrified bond grindstone which cannot sufficiently deal with the above problem and has an excellent grinding ratio capable of withstanding heavy grinding.
【0004】[0004]
【課題を解決するための手段】そこで、本発明者等は、
かかる苛酷な条件の重切削に耐え得る研削比の優れたビ
トリファイドボンド砥石を開発すべく研究を行った結
果、従来の方法で製造したビトリファイドボンド砥石
に、温度:500〜1000℃、圧力:1000〜20
00kg/cm2 の窒素雰囲気下に1〜5時間保持する処理
(以下、HIP処理という)を施すと、強度が向上し、
さらに研削比が大幅に向上するという知見を得たのであ
る。Therefore, the present inventors have
As a result of research to develop a vitrified bond grindstone having an excellent grinding ratio capable of withstanding heavy cutting under such severe conditions, the vitrified bond grindstone manufactured by the conventional method has a temperature of 500 to 1000 ° C. and a pressure of 1000 to 1000 ° C. 20
When a treatment (hereinafter referred to as HIP treatment) of holding for 1 to 5 hours in a nitrogen atmosphere of 00 kg / cm 2 is applied, the strength is improved,
Furthermore, they have found that the grinding ratio is significantly improved.
【0005】この発明は、かかる知見に基づいてなされ
たものであって、通常のビトリファイドボンド砥石に上
記HIP処理を施す研削比の優れたビトリファイドボン
ド砥石の製造方法に特徴を有するものである。The present invention has been made on the basis of the above findings, and is characterized by a method for producing a vitrified bond grindstone having an excellent grinding ratio by subjecting a normal vitrified bond grindstone to the above HIP treatment.
【0006】この発明の上記HIP処理の条件を上記の
如く限定した理由を説明する。The reason for limiting the conditions of the HIP processing of the present invention as described above will be described.
【0007】(a) 雰囲気、温度および圧力 砥粒とビトリファイドボンドを配合し混合したのち成形
し、得られた成形体を焼結して作製した通常のビトリフ
ァイドボンド砥石を温度:500〜1000℃、圧力:
1000〜2000kg/cm2 の窒素ガス雰囲気中に保持
すると、砥粒と砥粒を結合するボンドブリッジガラスの
抗折強度が向上し、砥石自身の抗折強度および研削比が
向上する。その理由として、上記高温高圧の窒素雰囲気
中にビトリファイドボンド砥石を置くと、ボンドブリッ
ジを構成する酸化物ガラスの表面が窒素を含有するオキ
シナイトガラスとなりかつボンドブリッジ中に存在する
微細な気孔が消失するために砥石の抗折強度および研削
比が向上するものと考えられる。(A) Atmosphere, temperature and pressure Abrasive grains and vitrified bonds are mixed and mixed, then shaped, and the resulting molded body is sintered to produce a normal vitrified bond grindstone at a temperature of 500 to 1000 ° C. pressure:
Holding in a nitrogen gas atmosphere of 1000 to 2000 kg / cm 2 improves the bending strength of the abrasive grains and the bond bridge glass connecting the abrasive grains, and improves the bending strength and the grinding ratio of the grindstone itself. The reason is that when a vitrified bond grindstone is placed in the nitrogen atmosphere of high temperature and high pressure, the surface of the oxide glass forming the bond bridge becomes an oxynite glass containing nitrogen and the fine pores existing in the bond bridge disappear. Therefore, it is considered that the bending strength and the grinding ratio of the grindstone are improved.
【0008】しかし、窒素ガス雰囲気中の圧力が100
0kg/cm2 未満、温度が500℃未満では所望の強度が
得られず、一方、圧力が2000kg/cm2 を越えると装
置が大型なものを必要とするのでコストがかかり、さら
に1000℃を越えた温度に保持するとボンドが再溶融
するのでやはり強度は向上しないので好ましくない。However, the pressure in the nitrogen gas atmosphere is 100
If the pressure is less than 0 kg / cm 2 and the temperature is less than 500 ° C, the desired strength cannot be obtained. On the other hand, if the pressure exceeds 2000 kg / cm 2 , a large device is required, which is costly. If the temperature is maintained at a certain temperature, the bond will be re-melted and the strength will not be improved, which is not preferable.
【0009】したがって、この発明のHIP処理条件
は、温度:500〜1000℃、圧力:1000〜20
00kg/cm2 の窒素雰囲気中に保持することが好まし
い。この発明のHIP処理の一層好ましい条件は、温
度:700〜900℃、圧力:1200〜1500kg/
cm2 の窒素雰囲気中に保持することである。Therefore, the HIP processing conditions of the present invention are as follows: temperature: 500 to 1000 ° C., pressure: 1000 to 20
It is preferable to keep it in a nitrogen atmosphere of 00 kg / cm 2 . More preferable conditions of the HIP treatment of the present invention are temperature: 700 to 900 ° C., pressure: 1200 to 1500 kg /
It is to keep in a nitrogen atmosphere of cm 2 .
【0010】(b) 保持時間 この発明のHIP処理時間は、HIP処理される砥石の
形状、厚さ、大きさなどによって異なるが、1時間未満
では所望の強度向上効果が得られず、また5時間を越え
る長時間保持してもそれ以上の強度向上は見られず、コ
ストがかかるので好ましくない。したがって1〜5時間
保持することが適当である。(B) Holding Time The HIP processing time of the present invention varies depending on the shape, thickness, size, etc. of the grindstone to be HIP processed, but if it is less than 1 hour, the desired strength improving effect cannot be obtained, and 5 Even if it is held for a long time exceeding the time, no further improvement in strength is observed, and it is costly, which is not preferable. Therefore, it is suitable to hold for 1 to 5 hours.
【0011】[0011]
【実施例】表1に示される成分組成のビトリファイド結
合剤a〜dを用意した。Example Vitrified binders a to d having the composition shown in Table 1 were prepared.
【0012】[0012]
【表1】 [Table 1]
【0013】さらに、いずれも平均粒径:100μmを
有するcBN砥粒、ダイヤモンド砥粒などの砥粒、並び
に成形用バインダーとしてポリビニルアルコール(以
下、PVAと記す)を用意した。Further, in each case, cBN abrasive grains having an average particle diameter of 100 μm, abrasive grains such as diamond abrasive grains, and polyvinyl alcohol (hereinafter referred to as PVA) as a forming binder were prepared.
【0014】表1のビトリファイド結合剤a〜dおよび
上記砥粒を表2に示される割合に配合し、成形用バイン
ダーとしてPVAを1重量%混合したのち、長さ:45
mm、幅:13mm、厚さ:5mmの寸法を有し100Rの曲
率を有する扇状の成形体を成形し、それぞれの成形体に
ついて表2に示す条件で脱脂処理し、引き続いて表2に
示す条件で焼成し、従来法1〜4による表2に示される
セグメント焼結体A〜Dを得た。The vitrified binders a to d shown in Table 1 and the above abrasive grains were mixed in the proportions shown in Table 2, and 1% by weight of PVA was mixed as a molding binder, and then the length was 45.
mm, width: 13 mm, thickness: 5 mm, and a fan-shaped molded body having a curvature of 100 R was molded, and each molded body was degreased under the conditions shown in Table 2 and subsequently the conditions shown in Table 2. By firing, to obtain segmented sintered bodies A to D shown in Table 2 by the conventional methods 1 to 4.
【0015】[0015]
【表2】 [Table 2]
【0016】従来法1〜4により得られた表2に示され
るセグメント焼結体A〜Dの抗折強度を測定したのち、
このセグメント焼結体A〜Dに窒素雰囲気の表3に示さ
れる条件のHIP処理を施す本発明法1〜12を実施し
たのち再び抗折強度を測定し、その結果を表3に示し
た。After measuring the bending strength of the segment sintered bodies A to D shown in Table 2 obtained by the conventional methods 1 to 4,
The segment sintered bodies A to D were subjected to the HIP treatment under the conditions shown in Table 3 under a nitrogen atmosphere, and then the bending strength was measured again. The results are shown in Table 3.
【0017】ついで、SKD−11製円筒状台金(外
径:190mm、内径:50.8mm、厚さ:13mm)を用
意し、この台金に上記HIP処理を施した本発明法1〜
12によるセグメント焼結体A〜DおよびHIP処理を
施さない従来法1〜4によるセグメント焼結体A〜Dを
接着剤を用いて接着し、ビトリファイドボンドホイール
を作製した。このビトリファイドボンドホイールを平面
研削盤に取り付け、 被研削材:SKD−11(硬さ:HRC50)製角材、 砥石周速:1500m/min.、 テーブル送り速度:5m/min.、 切込み:5μm、 研削液:JISW2種相当、 の条件で湿式平面プランジ研削を行ない、研削直後の研
削抵抗を研削盤の主軸電流値を測定することにより評価
し、さらに一般に砥石が寿命に近づくにつれて被研削面
の粗さが大きくなるところから、被研削面の表面粗さR
a(JIS規格で規定)が0.6μmに至るまでの被研
削加工量を測定し、その結果に基づいて研削比を算出
し、これらの結果も表3に示した。Next, a cylindrical base metal (outer diameter: 190 mm, inner diameter: 50.8 mm, thickness: 13 mm) made of SKD-11 was prepared, and this base metal was subjected to the above HIP treatment.
The segment sintered bodies A to D according to No. 12 and the segment sintered bodies A to D according to the conventional methods 1 to 4 not subjected to the HIP treatment were adhered with an adhesive to manufacture a vitrified bond wheel. This vitrified bond wheel is attached to a surface grinder, and the material to be ground: SKD-11 (hardness: HRC50) square material, grinding wheel peripheral speed: 1500 m / min., Table feed speed: 5 m / min., Depth of cut: 5 μm, grinding Liquid: Equivalent to JISW 2 types, wet surface plunge grinding is performed, and the grinding resistance immediately after grinding is evaluated by measuring the spindle current value of the grinder. Generally, as the grinding wheel approaches its life, the roughness of the surface to be ground becomes larger. The surface roughness R of the surface to be ground
The amount to be ground until a (specified by JIS standard) reaches 0.6 μm was measured, and the grinding ratio was calculated based on the result, and these results are also shown in Table 3.
【0018】[0018]
【表3】 [Table 3]
【0019】[0019]
【発明の効果】表3に示される結果から、本発明法1〜
3のHIP処理を施したセグメント焼結体AとHIP処
理を施さない従来法1によるセグメント焼結体Aとの比
較、本発明法4〜6のHIP処理を施したセグメント焼
結体BとHIP処理を施さない従来法2によるセグメン
ト焼結体Bとの比較、本発明法7〜9のHIP処理を施
したセグメント焼結体CとHIP処理を施さない従来法
3によるセグメント焼結体Cとの比較、本発明法10〜
12のHIP処理を施したセグメント焼結体DとHIP
処理を施さない従来法4によるセグメント焼結体Dとの
比較をそれぞれ行うと、本発明法のHIP処理を施すこ
とによりセグメント焼結体の抗折強度が向上し、研削直
後の研削抵抗が小さくなり、特に研削比が大幅に向上す
ることがわかる。From the results shown in Table 3, the present invention methods 1 to
Comparison of the segment sintered body A subjected to the HIP treatment of No. 3 and the segment sintered body A according to the conventional method 1 not subjected to the HIP treatment, and the segment sintered bodies B and HIP subjected to the HIP treatment of the present invention methods 4 to 6 Comparison with segment sintered body B according to conventional method 2 without treatment, segment sintered body C subjected to HIP treatment according to methods 7 to 9 of the present invention and segment sintered body C according to conventional method 3 not subjected to HIP treatment. Comparison of the present invention method 10
12 HIP-treated segment sintered bodies D and HIP
When compared with the segment sintered body D according to the conventional method 4 which is not treated, the bending strength of the segment sintered body is improved and the grinding resistance immediately after grinding is reduced by the HIP treatment of the method of the present invention. It can be seen that the grinding ratio is greatly improved.
【0020】したがって、HIP処理を施すこの発明の
方法によると、従来より一層すぐれたビトリファイドボ
ンド砥石を提供することができ、産業上すぐれた効果を
奏するものである。Therefore, according to the method of the present invention in which the HIP treatment is performed, it is possible to provide a vitrified bond grindstone which is more excellent than the conventional one, and to exert an industrially excellent effect.
【手続補正書】[Procedure amendment]
【提出日】平成7年1月23日[Submission date] January 23, 1995
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項1[Name of item to be corrected] Claim 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
Claims (1)
し、成形し、焼結して得られた通常のビトリファイドボ
ンド砥石に、 温度:500〜100℃、圧力:1000〜2000kg
/cm2 の窒素雰囲気下に1〜5時間保持する処理を施す
ことを特徴とする研削比の優れたビトリファイドボンド
砥石の製造方法。1. A normal vitrified bond grindstone obtained by mixing vitrified bond and hard abrasive grains, shaping and sintering, and temperature: 500 to 100 ° C., pressure: 1000 to 2000 kg.
A method for producing a vitrified bond grindstone having an excellent grinding ratio, which is characterized by performing a treatment of holding in a nitrogen atmosphere of / cm 2 for 1 to 5 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21948294A JPH0857767A (en) | 1994-08-22 | 1994-08-22 | Method for manufacturing vitrified bond grindstone with excellent grinding ratio |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21948294A JPH0857767A (en) | 1994-08-22 | 1994-08-22 | Method for manufacturing vitrified bond grindstone with excellent grinding ratio |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0857767A true JPH0857767A (en) | 1996-03-05 |
Family
ID=16736136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21948294A Pending JPH0857767A (en) | 1994-08-22 | 1994-08-22 | Method for manufacturing vitrified bond grindstone with excellent grinding ratio |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0857767A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326123A (en) * | 2001-04-27 | 2002-11-12 | Noritake Co Ltd | Gear honing stick |
| US8177871B2 (en) * | 2008-12-04 | 2012-05-15 | Jtekt Corporation | Vitrified bonded grindstone |
-
1994
- 1994-08-22 JP JP21948294A patent/JPH0857767A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326123A (en) * | 2001-04-27 | 2002-11-12 | Noritake Co Ltd | Gear honing stick |
| US8177871B2 (en) * | 2008-12-04 | 2012-05-15 | Jtekt Corporation | Vitrified bonded grindstone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20021119 |