JPH0864465A - Method for manufacturing monolithic ceramic component - Google Patents
Method for manufacturing monolithic ceramic componentInfo
- Publication number
- JPH0864465A JPH0864465A JP6225784A JP22578494A JPH0864465A JP H0864465 A JPH0864465 A JP H0864465A JP 6225784 A JP6225784 A JP 6225784A JP 22578494 A JP22578494 A JP 22578494A JP H0864465 A JPH0864465 A JP H0864465A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- ceramic
- ceramic component
- manufacturing
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】
【目的】 生産性のよい安価な積層セラミック部品の製
造方法を提供すること。
【構成】 切断刃9が設けられた金型6に積層されたセ
ラミックグリーンシートは、ヒーター8により加熱され
る。前記切断刃9が設けられた上パンチ5から所定の圧
力をかけると、前記切断刃9によって、積層されたセラ
ミックグリーンシートは個々に切断され、焼成前の積層
セラミック部品7の積層体チップを得る。
(57) [Abstract] [Purpose] To provide a method for manufacturing an inexpensive monolithic ceramic component with good productivity. [Structure] A ceramic green sheet laminated on a mold 6 provided with a cutting blade 9 is heated by a heater 8. When a predetermined pressure is applied from the upper punch 5 provided with the cutting blade 9, the laminated ceramic green sheets are individually cut by the cutting blade 9 to obtain a laminated body chip of the laminated ceramic component 7 before firing. .
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子部品として用いら
れる積層セラミック部品の製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated ceramic component used as an electronic component.
【0002】[0002]
【従来の技術】積層セラミック部品として、例えば、内
部に金属導体層とセラミック絶縁層とが交互に積層され
た構造を有する積層セラミックコンデンサや積層チップ
インダクタ等がある。2. Description of the Related Art As a multilayer ceramic component, there is, for example, a multilayer ceramic capacitor or a multilayer chip inductor having a structure in which metal conductor layers and ceramic insulating layers are alternately laminated inside.
【0003】積層セラミックコンデンサ等の積層セラミ
ック部品は、優れた特性から、広い分野で利用され、そ
の製造方法は、次の通りとなっている。まず、セラミッ
ク粉末を有機バインダーと有機溶剤を用いてスラリーと
した後、ドクターブレード法等で一定の厚さのグリーン
シートを形成する。そのグリーンシート上に、金(A
u)、パラジウム(Pd)、銀(Ag)、銅(Cu)、
ニッケル(Ni)等の低抵抗金属を有機ビヒクルに分散
させた金属粉入りペーストを、ある一定の形状で、交互
に外部電極と接続する取り出し口を得られるようにスク
リーン印刷法により印刷して内部電極を形成する。次
に、印刷が施されていない保護膜のグリーンシート、及
び内部電極層が印刷されている印刷膜のグリーンシート
とを、所定の構成に従って、複数枚重ね合わせ積層し、
熱圧着した後、切断して、積層セラミックコンデンサの
焼成前の積層体を得る。その後、脱バインダーを行い、
焼成を行い、内部電極に接続する外部電極を塗布し、焼
付けをして、素子を得る。その素子にリード線を取り付
け、素子部分を絶縁樹脂でモールドすることにより、積
層セラミック部品が得られる。Due to their excellent characteristics, monolithic ceramic parts such as monolithic ceramic capacitors are used in a wide variety of fields, and their manufacturing methods are as follows. First, a ceramic powder is made into a slurry using an organic binder and an organic solvent, and then a green sheet having a constant thickness is formed by a doctor blade method or the like. Gold (A
u), palladium (Pd), silver (Ag), copper (Cu),
Internally printed with a paste containing metal powder in which a low resistance metal such as nickel (Ni) is dispersed in an organic vehicle by a screen printing method so as to obtain outlets for alternately connecting with external electrodes in a certain shape. Form electrodes. Next, a green sheet of a protective film not printed, and a green sheet of a printed film on which the internal electrode layers are printed, according to a predetermined configuration, a plurality of sheets are stacked and laminated,
After thermocompression bonding, cutting is performed to obtain a laminated body of the laminated ceramic capacitor before firing. After that, debinding
The device is obtained by baking, applying an external electrode connected to the internal electrode, and baking. By attaching a lead wire to the element and molding the element portion with an insulating resin, a laminated ceramic component is obtained.
【0004】一般に、前述の積層セラミックコンデンサ
の外部電極は、外部電極取り出し面にホウケイ酸鉛と銀
を混合したペーストを塗布、焼き付けし、その上から、
更に銀と白金を混合したペーストを塗布、焼き付けする
という2層構造で製造されている。又、それぞれの外部
電極は、直方体の形をした部品の5面を覆う形で形成さ
れている。In general, the external electrodes of the above-mentioned monolithic ceramic capacitor are coated with a paste of lead borosilicate and silver and baked on the external electrode extraction surface, and then, from above,
Furthermore, it is manufactured with a two-layer structure in which a paste in which silver and platinum are mixed is applied and baked. Further, each external electrode is formed so as to cover the five faces of the rectangular parallelepiped-shaped component.
【0005】前述のように、印刷が施されていない保護
膜のグリーンシート、及び内部電極層が印刷されている
印刷膜のグリーンシートを、所定の構成に従って複数枚
重ね合わせて積層した後、熱圧着する従来の熱プレス工
程について、以下、図3を参照して説明する。従来、積
層セラミックコンデンサの熱プレス工程は、図3に示す
ような熱プレス装置の金型2内に前記印刷膜と保護膜を
複数数重ね合わせて積層し、積層されたセラミックシー
ト3の金型内でのずれを抑制するため、仕切板10を1
枚設置し、さらに、その上に、熱プレス機からの圧力を
伝える上パンチ1を乗せ、金型2と上パンチ1をヒータ
ー4によって温度を加えながら、所定の圧力で熱プレス
を行うという工程であり、これにより、図2のような前
記印刷膜と前記保護膜が所定枚数積層された積層体が得
られる。この積層体を外周刃切断機(ダイシングマシ
ン)により、所定の個数、寸法で切断し、個々の焼成前
の積層セラミックコンデンサを得ている。As described above, a plurality of green sheets of a protective film not printed and a green sheet of a printed film printed with an internal electrode layer are laminated and laminated in accordance with a predetermined structure, and then heat-treated. The conventional hot pressing process of pressure bonding will be described below with reference to FIG. Conventionally, the hot pressing process of a monolithic ceramic capacitor is performed by stacking a plurality of the printing films and protective films in a mold 2 of a hot pressing apparatus as shown in FIG. The partition plate 10 is set to 1 in order to suppress internal displacement.
A process in which the upper punch 1 for transmitting the pressure from the hot press machine is placed thereon, and the die 2 and the upper punch 1 are heated by the heater 4 while being heated at a predetermined pressure. As a result, a laminate in which a predetermined number of the print film and the protective film are stacked as shown in FIG. 2 is obtained. This laminated body is cut by a peripheral blade cutting machine (dicing machine) into a predetermined number and dimensions to obtain individual monolithic ceramic capacitors before firing.
【0006】[0006]
【発明が解決しようとする課題】以上のように、従来の
積層セラミック部品の製造方法においては、熱プレス工
程を行い、焼成前、積層体を得てから、外周刃切断機に
より切断を行うため、工数が増えるという欠点があっ
た。As described above, in the conventional method for manufacturing a monolithic ceramic component, the hot pressing step is performed, and before firing, the laminated body is obtained, and then the outer peripheral blade cutting machine is used for cutting. However, there was a drawback that the man-hour increased.
【0007】本発明は、熱プレス工程と切断工程を同時
に行うことにより、以上の欠点を改善し、製造が容易な
生産性のよい安価な積層セラミック部品の製造方法を提
供するものである。The present invention provides a method for manufacturing an inexpensive monolithic ceramic component which is easy to manufacture and has good productivity, by performing the hot pressing step and the cutting step at the same time.
【0008】[0008]
【課題を解決するための手段】本発明によれば、内部電
極を印刷したセラミックグリーンシートの印刷膜、及び
セラミックグリーンシートの保護膜からなる積層セラミ
ック部品の製造方法において、前記印刷膜と前記保護膜
を積層し、積層されたセラミックグリーンシートを熱圧
着させる熱プレス工程と、個々の積層セラミック部品に
切断する切断工程とを同時に行うことを特徴とした積層
セラミック部品の製造方法である。According to the present invention, there is provided a method of manufacturing a laminated ceramic component comprising a printed film of a ceramic green sheet on which internal electrodes are printed, and a protective film of the ceramic green sheet. A method of manufacturing a laminated ceramic component, characterized in that a hot pressing process of laminating films and thermocompressing the laminated ceramic green sheets and a cutting process of cutting into individual laminated ceramic components are performed at the same time.
【0009】本発明によれば、上記記載の積層セラミッ
ク部品の製造方法において、上パンチと金型とに切断刃
を設けて、熱圧着時のプレス圧を用いて、積層されたグ
リーンシートを個々の積層セラミック部品に押し切りす
ることを特徴とした積層セラミック部品の製造方法であ
る。According to the present invention, in the method for producing a laminated ceramic component described above, cutting blades are provided on the upper punch and the die, and the laminated green sheets are individually separated by using the press pressure during thermocompression bonding. The method for producing a monolithic ceramic component is characterized in that the monolithic ceramic component is punched out.
【0010】[0010]
【作用】複数個の内部電極が印刷された印刷膜のグリー
ンシートと保護膜のグリーンシートを所定の枚数積層
し、この積層されたセラミックグリーンシートを熱圧着
しながら、個々の積層セラミックコンデンサに、切断刃
が加工された金型、仕切板によって押し切することによ
って、切断する。このように熱圧着しながら、金型、仕
切板に加工された切断刃により押し切ることによって、
熱プレスによる圧着と切断を一度に行うことで、一工数
削減となり、より安価な積層セラミック部品が提供でき
る。即ち、本発明によれば、一工数で従来の熱プレス、
切断が行えるので、一工数削減と、大幅な合理化が計れ
ることになる。A predetermined number of green sheets of a printed film and a green sheet of a protective film on which a plurality of internal electrodes are printed are laminated, and the laminated ceramic green sheets are thermocompression bonded to each laminated ceramic capacitor. Cutting is performed by pressing with a mold having a cutting blade and a partition plate. By pressing with a cutting blade processed into a mold and a partition plate while thermocompressing in this way,
By performing pressure bonding and cutting at the same time with a hot press, the number of steps can be reduced, and a cheaper monolithic ceramic component can be provided. That is, according to the present invention, the conventional hot press in one man-hour,
Since it can be cut, the number of steps can be reduced and the rationalization can be greatly achieved.
【0011】[0011]
【実施例】以下に、本発明の実施例について、積層セラ
ミック部品として代表的な積層セラミックコンデンサに
ついて図面を参照しながら説明する。Embodiments of the present invention will be described below with reference to the drawings on a typical monolithic ceramic capacitor as a monolithic ceramic component.
【0012】本発明の積層セラミックコンデンサをコン
デンサの母材として、強誘電体セラミックに鉛(Pd)
系ペロブスカイト構造を持つ、粒径が1μm以下の粉末
を使用し、内部電極には、銀(Ag)とパラジウム(P
d)が80:20の割合の合金ペーストを用いて作製し
た。また、ドクターブレード法により、誘電体セラミッ
クス粉末と有機バインダーと有機溶剤からなる、厚みが
18μmのグリーンシートを作製し、そのグリーンシー
ト上に内部電極の金属ペーストを短冊状のパターンにス
クリーン印刷法により印刷することで、内部電極を作製
した。保護膜として、18μmのグリーンシートを打ち
抜き、金型内に300μm積層した後、先の内部電極を
印刷したグリーンシートを、後の工程で行う外部電極の
取り付け時に交互に取り出しできるように、又、容量が
47μFの設計になるまで積層し、更に、保護膜とし
て、300μm積層した後、熱プレスで熱圧着すると同
時に、切断することで、複数個の積層体チップの繰り返
しパターンを含む積層体を得る。その後、脱バインダー
処理の後、900℃で焼成を行い、遠心バレル機で角取
り作業を行い、焼成上がりのチップを得た。Using the monolithic ceramic capacitor of the present invention as the base material of the capacitor, lead (Pd) is added to the ferroelectric ceramic.
A powder having a particle size of 1 μm or less having a system-based perovskite structure is used, and silver (Ag) and palladium (P
It was prepared using an alloy paste having a ratio of d: 80: 20. Also, a doctor blade method was used to prepare a green sheet having a thickness of 18 μm, which was composed of a dielectric ceramic powder, an organic binder, and an organic solvent, and the metal paste of the internal electrodes was formed on the green sheet by a screen printing method in a strip pattern. An internal electrode was produced by printing. As a protective film, a 18 μm green sheet was punched out, laminated to a mold of 300 μm, and then the green sheet printed with the internal electrodes can be taken out alternately when mounting external electrodes in a later step. By stacking until the design has a capacity of 47 μF, and further stacking 300 μm as a protective film, thermocompression bonding by a hot press and cutting at the same time, a laminated body including a repeating pattern of a plurality of laminated body chips is obtained. . Then, after the binder removal treatment, firing was performed at 900 ° C., and the chamfering operation was performed using a centrifugal barrel machine to obtain chips after firing.
【0013】前述したように、内部電極を印刷したセラ
ミックグリーンシートの印刷膜、セラミックグリーンシ
ートの保護膜からなる、積層セラミックコンデンサのシ
ートを熱圧着させる熱プレス工程と、個々の積層セラミ
ックコンデンサのチップに切断する切断工程とを同時に
行う製造方法は、次のように行われる。As described above, a hot-pressing step of thermocompression-bonding a laminated ceramic capacitor sheet consisting of a printed film of a ceramic green sheet on which internal electrodes are printed and a protective film of the ceramic green sheet, and chips of individual laminated ceramic capacitors. The manufacturing method of simultaneously performing the cutting step of cutting into pieces is performed as follows.
【0014】即ち、図1に示すように、複数個の内部電
極が印刷された印刷膜のグリーンシートと、印刷を施さ
ない保護膜のグリーンシートを所定枚数金型6に積層す
る。積層されたセラミックグリーンシートの金型内での
ずれの防止と切断のため、仕切板11を積層されたセラ
ミックグリーンシート上に置く。さらに、仕切板11の
上に、プレス機からの圧力を伝えるための上パンチ5を
置き、ヒーター8によって加熱しながら、圧力を加えて
いく。このプレス機からの圧力を伝える際に、金型6、
仕切板11に加圧された切断刃9によって、金型内に積
層されたセラミックグリーンシートは、圧力を加えてい
く程、熱圧着され、さらに、徐々に、押し切りされてい
く。金型と仕切板に加工された切断刃9が接触した時点
で積層されたセラミックグリーンシートは、個々の焼成
前の積層セラミックコンデンサ7に分割され、チップ状
の積層体が得られる。That is, as shown in FIG. 1, a predetermined number of green sheets of a printed film on which a plurality of internal electrodes are printed and green sheets of a protective film on which no printing is applied are laminated on the mold 6. The partition plate 11 is placed on the laminated ceramic green sheets in order to prevent the laminated ceramic green sheets from being displaced in the mold and to cut them. Further, the upper punch 5 for transmitting the pressure from the pressing machine is placed on the partition plate 11, and the pressure is applied while being heated by the heater 8. When transmitting the pressure from this press, mold 6,
The ceramic green sheets stacked in the mold are thermocompression-bonded by the pressure of the cutting blade 9 pressed against the partition plate 11, and further gradually pushed out. The ceramic green sheets laminated at the time when the die and the cutting blade 9 processed into the partition plate come into contact with each other are divided into individual monolithic ceramic capacitors 7 before firing to obtain a chip-shaped laminated body.
【0015】これらを脱バインダー処理した後、900
℃の温度で焼成することで、積層セラミックコンデンサ
の焼成体チップを得る。その後、焼成体チップにバレル
法等により面取り工程が施され、チップ辺およびコーナ
ー部の角部はRが取られる。さらに、外部電極ペースト
を塗布、焼付けし、その後、下地としてニッケルめっき
を施した後、半田めっきとして、Pd/SnあるいはS
n等の半田成分のめっきを行うことで、外部電極端子を
形成した。After removing the binder from these, 900
By firing at a temperature of ° C, a fired body chip of a laminated ceramic capacitor is obtained. Then, the fired chip is subjected to a chamfering process by a barrel method or the like, and the corners of the chip sides and corners are rounded. Further, an external electrode paste is applied and baked, then nickel plating is applied as a base, and then Pd / Sn or S is applied as solder plating.
External electrode terminals were formed by plating a solder component such as n.
【0016】表1に、本発明による工法と従来の工法と
の作業時間(分)を示した。Table 1 shows the working time (minutes) between the method according to the present invention and the conventional method.
【0017】[0017]
【表1】 [Table 1]
【0018】表1からわかるように、本発明の工法によ
れば、従来の工法と比較して作業時間が半減する。更
に、刃の部分からも熱が伝わるため、均一に加熱して熱
圧着することができる。As can be seen from Table 1, according to the construction method of the present invention, the working time is halved as compared with the conventional construction method. Further, since heat is also transferred from the blade portion, it is possible to uniformly heat and perform thermocompression bonding.
【0019】以上、述べたように、本発明により、熱圧
着及び切断工程を一つの工程とする積層セラミック部品
の製造方法を提供することができた。As described above, according to the present invention, it is possible to provide a method for manufacturing a monolithic ceramic component having a thermocompression bonding and cutting step as one step.
【0020】[0020]
【発明の効果】本発明により、製造が容易で、生産性の
よい安価な積層セラミック部品の製造方法を提供でき
た。According to the present invention, it is possible to provide a method for manufacturing a monolithic ceramic component which is easy to manufacture and has good productivity and which is inexpensive.
【図1】本発明の熱プレス工程と切断工程を一工程にし
た熱プレス押し切りの状態を説明する断面図。FIG. 1 is a cross-sectional view for explaining a state of hot-pressing and pressing in which the hot-pressing step and the cutting step of the present invention are combined into one step.
【図2】本発明及び従来の積層セラミックコンデンサの
積層体の外観斜視図。FIG. 2 is an external perspective view of a laminated body of the present invention and a conventional laminated ceramic capacitor.
【図3】従来の積層セラミックコンデンサの熱プレス状
態を説明する断面図。FIG. 3 is a cross-sectional view illustrating a hot press state of a conventional monolithic ceramic capacitor.
1,5 上パンチ 2,6 金型 3 セラミックシート 4,8 ヒーター 7 積層セラミックコンデンサ(積層セラミック部
品) 9 切断刃 10,11 仕切板1,5 Upper punch 2,6 Mold 3 Ceramic sheet 4,8 Heater 7 Multilayer ceramic capacitor (multilayer ceramic component) 9 Cutting blade 10,11 Partition plate
Claims (2)
シートの印刷膜、及びセラミックグリーンシートの保護
膜からなる積層セラミック部品の製造方法において、前
記印刷膜と前記保護膜を積層し、積層されたセラミック
グリーンシートを熱圧着させる熱プレス工程と、個々の
積層セラミック部品に切断する切断工程とを同時に行う
ことを特徴とした積層セラミック部品の製造方法。1. A method of manufacturing a laminated ceramic component comprising a printed film of a ceramic green sheet on which internal electrodes are printed and a protective film of the ceramic green sheet, wherein the printed film and the protective film are laminated, and ceramic green is laminated. A method for manufacturing a laminated ceramic component, which comprises simultaneously performing a hot pressing step of thermocompressing a sheet and a cutting step of cutting into individual laminated ceramic components.
造方法において、上パンチと金型とに切断刃を設けて、
熱圧着時のプレス圧を用いて、積層されたグリーンシー
トを個々の積層セラミック部品に押し切りすることを特
徴とした積層セラミック部品の製造方法。2. The method for manufacturing a laminated ceramic component according to claim 1, wherein a cutting blade is provided on the upper punch and the die,
A method for manufacturing a monolithic ceramic component, which comprises pressing the laminated green sheets into individual monolithic ceramic components by using a pressing pressure during thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6225784A JPH0864465A (en) | 1994-08-25 | 1994-08-25 | Method for manufacturing monolithic ceramic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6225784A JPH0864465A (en) | 1994-08-25 | 1994-08-25 | Method for manufacturing monolithic ceramic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0864465A true JPH0864465A (en) | 1996-03-08 |
Family
ID=16834732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6225784A Pending JPH0864465A (en) | 1994-08-25 | 1994-08-25 | Method for manufacturing monolithic ceramic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0864465A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7182899B2 (en) * | 2001-09-19 | 2007-02-27 | Matsushita Electric Industrial Co., Ltd. | Manufacturing method of ceramic electronic components and its manufacturing equipment |
| JP2023535903A (en) * | 2020-07-20 | 2023-08-22 | タレス・アレーニア・スペース・イタリア・エッセ・ピ・ア・コン・ウニコ・ソシオ | Capacitive feedthrough for hybrid sealed modules for space applications |
-
1994
- 1994-08-25 JP JP6225784A patent/JPH0864465A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7182899B2 (en) * | 2001-09-19 | 2007-02-27 | Matsushita Electric Industrial Co., Ltd. | Manufacturing method of ceramic electronic components and its manufacturing equipment |
| JP2023535903A (en) * | 2020-07-20 | 2023-08-22 | タレス・アレーニア・スペース・イタリア・エッセ・ピ・ア・コン・ウニコ・ソシオ | Capacitive feedthrough for hybrid sealed modules for space applications |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002015939A (en) | Laminated electronic component and method of manufacturing the same | |
| JP2001044066A (en) | Laminated electronic component and method of manufacturing the same | |
| JP3306814B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JP2000340448A (en) | Multilayer ceramic capacitors | |
| JP2857552B2 (en) | Multilayer electronic component and method of manufacturing the same | |
| JP3592882B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JP2000243650A (en) | Multilayer ceramic capacitor and method of manufacturing the same | |
| JPH0677074A (en) | Manufacture of monolithic ceramic electronic part | |
| JP2970238B2 (en) | Manufacturing method of multilayer ceramic capacitor | |
| JP2003031948A (en) | Manufacturing method of ceramic multilayer substrate | |
| JPH09129486A (en) | Manufacture of laminated ceramic electronic part | |
| JP3912129B2 (en) | Manufacturing method of multilayer ceramic substrate | |
| JPH05175072A (en) | Method for manufacturing monolithic ceramic capacitor | |
| JPS6152969B2 (en) | ||
| JP3324461B2 (en) | Manufacturing method of multilayer ceramic capacitor array | |
| JP4321200B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JPH1126279A (en) | Manufacturing method of multilayer ceramic electronic component | |
| JPH0845768A (en) | Method for manufacturing monolithic ceramic capacitor | |
| JP3956191B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JP3625401B2 (en) | Manufacturing method of multilayer inductor element | |
| JP2003037010A (en) | Chip laminated electronic component and method of manufacturing the same | |
| JPH08130153A (en) | Method for manufacturing monolithic ceramic component | |
| JPH10149942A (en) | Manufacturing method of multilayer ceramic capacitor and multilayer chip inductor | |
| JPH08186047A (en) | Method for manufacturing laminated inductor component | |
| JPH1050552A (en) | Manufacturing method of multilayer ceramic capacitor |