JPH0864712A - Package for storing optical semiconductor elements - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide an optical semiconductor element accommodating package capable of easily performing a soldering operation of a lead wire to an external lead terminal. [Structure] A metal base 1 having a mounting portion 1a on which an optical semiconductor element 4 is mounted via a Peltier element 6, and a metal base 1 vertically penetrated around the mounting portion 1a of the metal base 1. In this way, the Peltier element external lead terminal 7b is fixed via the insulating member 8, and the electrode of the Peltier element 6 is electrically connected to the upper end portion of the Peltier element 6 via the lead wire 10.
A metal frame body 2 joined to the metal base 1 so as to surround the mounting portion 1a and the Peltier element external lead terminals 7b.
Attached to the upper surface of the metal frame 2 to form the optical semiconductor element 4
Is a package for storing an optical semiconductor element, which comprises a metal lid 3 for hermetically sealing the above, wherein a cutout portion C or a through hole into which the lead wire 10 can be inserted is provided at an upper end portion of the Peltier element external lead terminal 7b. H is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device housing package for housing an optical semiconductor device.

[0002]

2. Description of the Related Art Conventionally, an optical semiconductor device housing package for housing an optical semiconductor device is made of a metal such as an iron-nickel-cobalt alloy or a copper-tungsten alloy as shown in FIGS. A metal base 23 having a mounting portion 23a on which the optical semiconductor element 21 is mounted via a Peltier element 22 in the central portion, and the metal base 23 is vertically penetrated around the mounting portion 23a of the metal base 23. And a plurality of cylindrical external lead terminals 25 that are fixed via the insulating member 24 and are used to connect the optical semiconductor element 21 and the Peltier element 22 to an external electric circuit, respectively, and the mounting portion 23a.
Also, an optical fiber 26, which is joined to the metal base 23 via a brazing material such as silver brazing so as to surround the external lead terminal 25 and which transmits / receives an optical signal between the optical semiconductor element 21 and the outside, is fixed at a side portion thereof. Of the metal base 23, and a metal frame 28 on which the fixing member 27 is disposed, and a metal cover 29 that is joined to the upper surface of the metal frame 28 and hermetically seals the optical semiconductor element 21. The optical semiconductor element 21 is attached and fixed to the mounting portion 23a with the Peltier element 22 interposed therebetween, and the electrode of the optical semiconductor element 21 is bonded to the bonding wire 3
0 to electrically connect to a part of the external lead terminal 25, and then, a metal lid 29 is bonded to the upper surface of the metal frame 28 so that the metal base 23, the metal frame 28, and the metal lid 29 are joined together. The optical semiconductor element 21 is hermetically housed in the container, and finally the optical fiber 26 is adhesively fixed to the fixing member 27 of the metal frame body 28 to form an optical semiconductor device as a product.

Such an optical semiconductor device excites light in the optical semiconductor element 21 by a drive signal supplied from an external electric circuit, and transmits the excited light to the outside through an optical fiber 26 to realize high-speed optical communication or the like. It functions as an optical semiconductor device used.

Further, a part of the external lead terminal 25 of the package for accommodating the optical semiconductor element acts as an external lead terminal 25a for the Peltier element for connecting the Peltier element 22 to an external electric circuit, and the external lead for the Peltier element is provided. The lead wire 31 connected to the electrode of the Peltier element 22 is electrically connected to the terminal 25a by soldering, and the Peltier element external lead terminal 25a is electrically connected to the external electric circuit so that the Peltier element is connected to the external electric circuit. Element 2
2 to supply electric power to the Peltier device 22 and the optical semiconductor device 2
It operates as a heat pump that transfers heat from 1 to the metal base 23, and forcibly transfers the heat generated when the optical semiconductor element 21 operates to the metal base 22 via the Peltier element 22.
By dissipating and removing the heat from the metal substrate 23 into the atmosphere, the temperature of the optical semiconductor element 21 is always kept constant so that the optical semiconductor element 21 always operates stably.

The external lead terminal 2 for the Peltier device
In order to electrically connect the lead wire 31 to 5a by soldering, first, one end of the lead wire 31 is wound around the upper end portion of the Peltier element lead terminal 25a and temporarily fixed, and then the temporary connection is made. This is performed by soldering the lead wire 31 to the Peltier element external lead terminal 25.

[0006]

However, according to this conventional package for accommodating an optical semiconductor element, the external lead terminal is cylindrical, and the lead wire connected to the electrode of the Peltier element is connected to the external lead terminal for the Peltier element. In order to temporarily fix the lead wire, one end of the lead wire must be wound around the upper end portion of the Peltier element external lead terminal, which makes the temporary fixing work extremely complicated and the lead wire temporarily wound It loosens and slips off from the upper end of the Peltier device external lead terminal, and as a result, it is extremely difficult to solder the lead wire to the Peltier device external lead terminal.

[0007]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and an object thereof is to temporarily and securely temporarily fix a lead wire connected to an electrode of a Peltier element to an external lead terminal for a Peltier element. Another object of the present invention is to provide an optical semiconductor element accommodating package that can perform soldering work of a lead wire to an external lead terminal for a Peltier element.

[0008]

According to the present invention, there is provided a metal base having an upper surface on which an optical semiconductor element is mounted via a Peltier element, and the metal base around the mounting portion of the metal base. An external lead terminal for a Peltier element, which is fixed through an insulating member so as to penetrate vertically and whose upper end is electrically connected to an electrode of the Peltier element through a lead wire, and on the metal substrate. It is composed of a metal frame body that is joined so as to surround the mounting portion and the external lead terminal for the Peltier device, and a metal lid body that is attached to the upper surface of the metal frame body and hermetically seals the optical semiconductor device. A package for accommodating an optical semiconductor element, characterized in that a cutout portion or a through hole through which the lead wire can be inserted is formed at an upper end portion of the Peltier element external lead terminal.

[0009]

According to the optical semiconductor element accommodating package of the present invention, the Peltier element electrode is electrically connected through the lead wire to the upper end portion of the Peltier element external lead terminal. Since the notch or the through hole is formed, one end of the lead wire is inserted and locked in the notch or the through hole so that the lead wire is accurately and easily attached to the external lead terminal for the Peltier device. It can be temporarily fixed, and since one end of the lead wire is inserted and locked in the cutout portion or the through hole, the lead wire does not slide down from the upper end portion of the Peltier element external lead terminal, Therefore, the lead wire can be easily soldered to the Peltier element external lead terminal.

[0010]

The present invention will now be described in detail with reference to the accompanying drawings.

1 and 2 show an embodiment of a package for accommodating an optical semiconductor element according to the present invention, 1 is a metal base, 2 is a metal frame, 3 is a metal lid, and The metal frame body 2 and the metal lid body 3 constitute a container 5 for housing the optical semiconductor element 4.

The metal substrate 1 is a substantially rectangular flat plate made of a metal such as a copper-tungsten alloy or an iron-nickel-cobalt alloy, and a mount for mounting the optical semiconductor element 4 on the center of the upper surface thereof. A mounting portion 1a is formed, and an optical semiconductor element 4 is bonded and fixed to the mounting portion 1a with an adhesive material such as a brazing material with a Peltier element 6 interposed therebetween.

When the metal substrate 1 is made of, for example, a copper-tungsten alloy, tungsten powder (particle size: about 10 μm) is used.
m) is pressure-molded at a pressure of 1000 kgf / cm 2 and is fired at a temperature of about 2300 ° C. in a reducing atmosphere to obtain a porous tungsten sintered body, and then about 1100.
It is manufactured by impregnating the porous portion of the tungsten sintered body with copper heated and melted at a temperature of ℃ by utilizing the capillary phenomenon.

On the metal base 1, an optical semiconductor element external lead terminal 7a for connecting the optical semiconductor element 4 adhered and fixed to the metal base 1 to an external electric circuit and a Peltier element 6 are connected to the external electric circuit. A plurality of external lead terminals 7 including a Peltier device external lead terminal 7b for fixing the metal base 1 vertically around the mounting portion 1a via an insulating member 8 such as glass. There is.

The external lead terminal 7 is a rod-shaped body made of a metal such as an iron-cobalt-nickel alloy or an iron-nickel alloy. Of the external lead terminals 7, the optical semiconductor element 4 is connected to an external electric circuit. The external lead terminal 7a for an optical semiconductor element for performing the operation has a flat upper end surface, and the electrode of the optical semiconductor element 4 is bonded to the upper end surface of the external lead terminal 7a for an optical semiconductor element via the bonding wire 9. Electrically connected, external lead terminal 7a for optical semiconductor element
By connecting the other end to the wiring conductor of the external electric circuit board, the optical semiconductor element 4 is electrically connected to the external electric circuit through the bonding wire 9 and the optical semiconductor element external lead terminal 7a.

Of the external lead terminals 7, the Peltier element external lead terminal 7b for connecting the Peltier element 6 to an external electric circuit is connected to the electrode of the Peltier element 6 at its upper end as shown in FIG. A cutout portion C is formed so that the connected lead wire 10 can be inserted therethrough. One end of the lead wire 10 connected to the electrode of the Peltier element 6 is inserted into the cutout portion C, and the cutout portion C is inserted. One end is soldered to the upper end of the Peltier element external lead terminal 7b, and the other end of the external lead terminal 7b is connected to the wiring conductor of the external electric circuit board. It is electrically connected to the external electric circuit board via the lead terminal 7b.

The external lead terminal 7 for the Peltier device
In order to solder the lead wire 10 to the upper end of b, first, the lead wire 10 is inserted by inserting one end of the lead wire 10 into the notch C formed in the upper end of the Peltier element external lead terminal 7b. External lead terminal 7 for Peltier device
This is performed by temporarily fixing the lead wire 10 to the upper end of the lead wire b, and then soldering one end of the temporarily fixed lead wire 10 to the upper end of the external lead terminal 7b for the Peltier device.

External lead terminal 7b for the Peltier device
Since the cutout portion C through which the lead terminal 10 connected to the electrode of the Peltier element 6 can be inserted is formed in the upper end portion, only one end of the lead wire 10 is inserted into the cutout portion C. Thus, the lead wire 10 can be easily temporarily locked to the upper end portion of the Peltier element external lead terminal 7b, and one end of the lead wire 10 is inside the cutout portion C formed in the Peltier element external lead terminal 7b. The lead wire 1 is locked in the cutout portion C by being inserted into the lead wire 1.
0 does not easily slip from the upper end portion of the Peltier device external lead terminal 7b, and therefore the work of soldering the lead wire 10 to the Peltier device external lead terminal 7b becomes easy.

The external lead terminal 7 for the optical semiconductor element is used.
In order to fix the external lead terminals 7 including a and the Peltier element external lead terminals 7b to the metal base 1, a hole having a diameter slightly larger than that of the external lead terminals 7 is made in the metal base 1, and a ring-shaped glass is formed in this hole. The insulating member 8 made of glass and the external lead terminal 7 are inserted, and then the insulating member 8 made of glass is heated and melted.

Further, on the upper surface of the metal base 1, the mounting portion 1
The cylindrical metal frame body 2 is joined so as to surround a, thereby forming a space for accommodating the optical semiconductor element 4 therein. The metal frame 2 is made of, for example, iron-
It is made of a metal such as a nickel-cobalt alloy or an iron-nickel alloy, and is joined to the metal substrate 1 by brazing via a brazing material such as silver brazing.

Further, a fixing member 12 for fixing an optical fiber 11 for transmitting and receiving an optical signal to and from the optical semiconductor element 4 housed inside the metal frame body 2 penetrates the metal frame body 2. It is provided.

The fixing member 12 is, for example, iron-nickel-
A cylindrical member made of a metal such as a cobalt alloy or an iron-nickel alloy, which is inserted into a through hole 2a provided in the metal frame 2 and joined to the metal frame 2 through a brazing material such as silver brazing. The optical fiber is inserted and fixed in the inside of the optical fiber 11, so that optical signals can be transmitted and received between the optical semiconductor element 4 housed inside and the outside via the optical fiber 11.

Further, a substantially rectangular flat plate-like metal lid 3 made of a metal such as iron-nickel-cobalt alloy or iron-nickel alloy is joined to the upper surface of the metal frame body 2, whereby the metal substrate 1 is formed. The optical semiconductor element 4 is hermetically sealed inside the container 5 including the metal frame 2 and the metal lid 3.

The metal lid 3 is joined to the upper surface of the metal frame 2 by welding such as the seam weld method.

Thus, according to the optical semiconductor element accommodating package of the present invention, the optical semiconductor element 4 is adhesively fixed to the mounting portion 1a of the metal substrate 1 with the Peltier element 6 interposed therebetween, and then the optical semiconductor element 4 is attached. The electrode is electrically connected to the external lead terminal 7a for the optical semiconductor element via the bonding wire 9, and the electrode of the Peltier element 6 is electrically connected to the external lead terminal 7b for the Peltier element via the lead wire 10.
Then, the metal lid 3 is joined to the upper surface of the metal frame 2,
A container 5 including a metal base 1, a metal frame 2 and a metal lid 3.
The optical semiconductor element 4 is housed inside, and finally one end of the optical fiber 11 is inserted and bonded to the fixing member 12 of the metal frame body 2.
By fixing the optical fiber 11 to the metal frame body 2, it functions as an optical semiconductor device as a final product, and it becomes possible to exchange optical signals between the optical semiconductor element 4 housed inside and the outside via the optical fiber 11.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-mentioned embodiment, the Peltier element 6 is externally arranged. Although a notch C through which the lead wire 10 can be inserted is formed at the upper end portion of the Peltier element external lead terminal 7b for connecting to an electric circuit, the lead wire 10 is provided at the upper end portion of the external lead terminal 7b as shown in FIG. You may form the through-hole H which can be penetrated.

[0027]

According to the package for accommodating an optical semiconductor element of the present invention, the Peltier element external lead terminal to which the electrode of the Peltier element is connected via the lead wire has a notch or a notch through which the lead wire can be inserted. Since the through hole is formed, the lead wire can be accurately and easily temporarily fixed by inserting one end of the lead wire into the notch or the through hole, and the one end of the lead wire is used for the Peltier element. The lead wire does not slip off from the upper end of the external lead terminal for the Peltier element because it is inserted and locked in the notch or through hole formed in the external lead terminal, and therefore the lead wire can be easily attached to the external lead terminal. Can be soldered.

[Brief description of drawings]

FIG. 1 is a plan view of an upper surface of a metal base of a package for storing an optical semiconductor element of the present invention.

2 is an X of the package for storing an optical semiconductor element shown in FIG.
It is a sectional view taken along the line X-.

FIG. 3 is an enlarged view of a main part of the package for storing an optical semiconductor element shown in FIGS. 1 and 2.

FIG. 4 is an enlarged view of a main part for explaining another embodiment of the present invention.

FIG. 5 is a plan view of a top surface of a metal base of a conventional package for storing optical semiconductor elements.

6 is a sectional view taken along line XX of the package for storing optical semiconductor elements shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Metal substrate 2 ... Metal frame 3 ... Metal lid 4 ... Optical semiconductor element 6 ... Peltier element 7b ... External lead terminal for Peltier element 8 ... Insulating member 10 ... ..Lead wire C ... Notch H ... Through hole

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical display location H01L 33/00 MH01S 3/18

Claims (1)

[Claims] 1. A metal base having a mounting portion on which an optical semiconductor element is mounted via a Peltier element on an upper surface, and insulating around the mounting portion of the metal base by vertically penetrating the metal base. An external lead terminal for a Peltier element, which is fixed via a member and whose upper end is electrically connected to the electrode of the Peltier element via a lead wire; and a mounting portion and a Peltier element external on the metal base. A package for storing an optical semiconductor element, which comprises a metal frame body joined so as to surround a lead terminal and a metal lid body attached to an upper surface of the metal frame body to hermetically seal an optical semiconductor element. A package for storing an optical semiconductor element, wherein a cutout portion or a through hole through which the lead wire can be inserted is formed in an upper end portion of the Peltier element external lead terminal.