JPH086701A - Digitizer sensor plate - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a digitizer sensor plate that is excellent in manufacturing workability, is light, and is easy to handle. A sensor wire arranging pin 8 having a rectangular opening 7 and a positioning pin 9 for mounting and fixing a transparent insulating hard flat plate 2 having a rectangular shape are integrally formed and planted in a predetermined pattern. Insulated sensor wires 3 are laid in a predetermined pattern on the wiring frame 10 to form a sensor wire orthogonal wiring network 5, and transparent holes having a rectangular shape are provided with through holes 12 corresponding to the sensor wire wiring pins 8. A transparent adhesive 6 is applied to the peripheral portion of the hard flat plate 2 and the transparent insulating hard flat plate 2 positioned by the positioning pins 9 is attached to the wiring frame 1
0 is placed and fixed at a predetermined position, and the sensor wire folded portion 4 is sandwiched and fixed between the transparent insulating hard flat plate 2 and the wiring frame 10, and the sensor wire orthogonal wiring network 5 portion corresponding to the opening 7 is transparently bonded. The transparent insulating hard flat plate 2 is fixed by the agent 6A.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic induction type digitizer sensor plate used for an information input device such as CAD.

[0002]

2. Description of the Related Art As an electromagnetic induction type digitizer sensor plate which has been widely used in the past, there is, for example, a digitizer sensor plate 1 shown in FIG. In the figure, 3
Is an insulated sensor wire such as a magnet wire,
2 and 2 are rectangular transparent insulating hard plates for sandwiching and fixing the insulated sensor wire 3 via an adhesive, 4 is a folded portion of the sensor wire, and 6 and 6A are transparent adhesives.

The digitizer sensor plate 1 was manufactured as follows. First, sensor wire arranging pins (not shown) are arranged in a predetermined pattern on the outer periphery of one transparent insulating hard plate 2 having a rectangular shape. Next, the insulated sensor wire 3 made of a magnet wire or the like is hooked in sequence on the sensor wire arranging pin, folded back, and laid in a predetermined pattern while providing the sensor wire folded-back portion 4 on the outer periphery of the transparent insulating hard flat plate 2, A sensor wire orthogonal wiring network 5 is formed on the transparent insulating hard flat plate 2. Then, the transparent adhesive 6 is applied and cured on the sensor wire orthogonal wiring network 5 to fix the sensor wire orthogonal wiring network 5 on the transparent insulating hard flat plate 2.

Next, another transparent adhesive is applied from above the transparent adhesive 6, another transparent insulating hard flat plate 2 on the other side is placed and fixed, and after the transparent adhesive 6 is cured, the sensor wire folding portion 4 is removed from the sensor wire arranging pin and folded into the end faces of the two transparent insulating hard flat plates 2 and 2, and the folded folded sensor line portion 4 is attached to the predetermined end faces of the transparent insulating hard flat plates 2 and 2 by the transparent adhesive 6A. It was fixed and the digitizer sensor plate 1 was manufactured.

[0005]

By the way, in order to manufacture the above-mentioned digitizer sensor plate, it is necessary to remove the sensor wire folding portion from the sensor wire wiring pin or to remove the sensor wire folding portion from the sensor wire wiring pin. It was necessary to fold each of them into a predetermined end face of the two transparent insulating hard flat plates 2 and fix them with an adhesive. In addition to the great difficulty that these operations require time, there is a drawback that the insulated sensor wire is likely to be broken and the digitizer sensor plate becomes expensive. Further, the digitizer sensor plate becomes heavy, which makes it difficult to handle at the time of manufacturing, and automation of the sensor plate manufacturing process is hindered.

It is an object of the present invention to provide a digitizer sensor plate which enables automation of the digitizer sensor plate manufacturing process, is light, easy to handle and inexpensive.

[0007]

A sensor wire arranging pin having a rectangular opening and a positioning pin for mounting and fixing a transparent insulating hard flat plate having a rectangular shape are integrally formed and planted in a predetermined pattern. Insulating sensor wires are hooked in sequence on the sensor wire laying pins in the X-axis direction and the Y-axis direction on the sensor wire laying frame, and wired while folding back to form a sensor wire orthogonal wiring network of a predetermined pattern. A terminal lead wire of the insulated sensor wire is led out from the sensor wire laying frame, and a transparent adhesive is applied to the peripheral portion of a rectangular transparent insulating hard flat plate provided with through holes corresponding to the sensor wire laying pins. , Place the transparent insulating hard flat plate with the adhesive coated surface facing down and the positioning pin so that the sensor wire orthogonal wiring mesh is in close contact with the adhesive coated surface from above the sensor wire orthogonal wiring mesh onto the wiring frame. Fixed in place,
The folded portion of the sensor wire is sandwiched and fixed by the transparent insulating hard flat plate and the sensor wire wiring frame, and the sensor wire orthogonal wiring net portion corresponding to the opening is fixed to the transparent insulating hard flat plate by a transparent adhesive and is a digitizer. Configure the sensor plate. A visible light curable adhesive or an ultraviolet curable adhesive may be used as the transparent adhesive.

[0008]

The digitizer sensor plate has a sensor wire arranging frame which has a square opening and is formed by integrally molding and arranging the sensor wire arranging pins and the positioning pins in a predetermined pattern. Since it is configured to be sandwiched and fixed by a rectangular transparent insulating hard plate having a through hole corresponding to the wire pin,
This eliminates the need to remove the folded portion of the sensor wire from the wiring pin, eliminates the disconnection of the insulated sensor wire, and greatly improves the workability of manufacturing the digitizer sensor plate, resulting in an inexpensive digitizer sensor plate. Further, since the wiring frame is provided with the opening, the weight of the digitizer sensor plate is reduced, and the digitizer sensor plate can be easily handled during the manufacturing work. Furthermore, the structure is simplified, and the digitizer sensor plate manufacturing work can be automated.

[0009]

The present invention will be described below with reference to the drawings. 1A and 1B are explanatory views showing the configuration of a digitizer sensor plate according to the present invention. FIG. 1A is a plan view thereof and FIG. 1B is a view thereof.
2A is a cross-sectional view taken along the line AA, FIG. 4C is a partially enlarged view of a circled portion in FIG. 2B, and FIG. 2 is an explanatory view showing a manufacturing process of the digitizer sensor plate according to the present invention. 3 is a perspective view of a sensor wire wiring frame used in the present invention.

The digitizer sensor plate of the present invention is manufactured as follows. First, the sensor wire arranging pin 8 and the quadrangular insulating hard flat plate 2 having the quadrangular opening 7 are placed on a conventionally used sensor wire arranging jig (not shown). A quadrangular wiring frame 10 in which positioning pins 9 for fixing are integrally formed and planted in a predetermined pattern is arranged and fixed. Then, the insulated sensor wire 3 made of a magnet wire is sequentially hooked on the sensor wire arranging pins 8 provided in the X-axis direction and the Y-axis direction of the sensor wire arranging frame, and folded back to fold the sensor wire on the wire arranging frame 10. While forming the portion 4, the sensor wires are wired in a predetermined pattern to form the sensor wire orthogonal wiring network 5 on the sensor wire wiring frame 10, and each terminal lead wire 11 of the insulated sensor wire 3 is removed from the sensor wire wiring frame 10. Derive.

Next, the transparent adhesive 6 is applied to the peripheral portion of the rectangular transparent insulating hard plate 2 having the through holes 12 corresponding to the sensor wire arranging pins 8 in the peripheral portion, and the peripheral portion is transparent. From the top of the sensor wire laying frame 10 so that the transparent insulating hard flat plate 2 coated with the adhesive 6 has its adhesive coated surface facing downward and the sensor wire folded-back portion 4 is in close contact with the adhesive coated surface of the transparent insulating hard flat plate 2. Place and fix. At this time, the transparent insulating hard plate 2
Are positioned by the positioning pins 9, so that each wiring pin 8 has a through hole 12 provided corresponding to the wiring pin 8.
Will be located in. Therefore, the sensor wire turnback unit 4
It is no longer necessary to remove the sensor wire from the wire laying pin 8, and the sensor wire wrapping portion 4
Are clamped and fixed.

When the transparent adhesive 6 applied to the peripheral portion of the transparent insulating hard flat plate 2 is cured, the sensor wire laying frame 10 is fixed to the upper side and positioned in the rectangular opening 7 of the wire laying frame 10. The transparent adhesive 6A is applied on the sensor wire orthogonal wiring network 5 to form the sensor wire orthogonal wiring network 5 on the transparent insulating hard plate 2.
The digitizer sensor plate is fixedly attached to the plate.

[0013]

As described above, in the digitizer sensor plate of the present invention, the sensor wire arranging pin and the positioning pin for mounting and fixing the rectangular transparent insulating hard plate having the rectangular opening are predetermined. Since the sensor wire laying frame integrally formed by patterning and arranging and the rectangular transparent insulating hard flat plate provided with the through holes corresponding to the sensor wire laying pins, It can be manufactured without removing it from the wiring pin. As a result, disconnection of the insulated sensor wire is prevented, the weight of the digitizer sensor plate is reduced, and the digitizer sensor plate is easy to handle, the workability of manufacturing the digitizer sensor plate is significantly improved, and an inexpensive digitizer sensor plate is obtained. Further, the structure is simplified, and the digitizer sensor plate manufacturing work can be automated. The practical effects are great.

[Brief description of drawings]

1A and 1B are explanatory views showing a configuration of a digitizer sensor plate according to the present invention, in which FIG. 1A is a plan view thereof, and FIG. 1B is a sectional view taken along line AA of FIG. 1A. (C) is the same figure (b)
FIG. 7 is a partially enlarged view of a part marked with a circle.

FIG. 2 is an explanatory view showing a manufacturing process of the digitizer sensor plate according to the present invention.

FIG. 3 is a perspective view of a sensor wire wiring frame used in the present invention.

FIG. 4 is an explanatory diagram showing a configuration of a conventional digitizer sensor plate.

[Explanation of symbols]

 1 Digitizer sensor plate 2 Transparent insulating hard plate 3 Insulated sensor wire 4 Sensor wire folded portion 5 Sensor wire orthogonal wiring net 6,6A Transparent adhesive 7 Opening 8 Sensor wire wiring pin 9 Positioning pin 10 Wiring frame 11 Sensor wire Terminal lead wire 12 through hole

Claims (3)

[Claims] 1. A sensor wire having a square opening and a sensor wire laying pin and a positioning pin for mounting and fixing a transparent insulating hard flat plate having a square shape, which are integrally formed and planted in a predetermined pattern. Insulating sensor wires are hooked in sequence on the X-axis direction and Y-axis direction sensor wire laying pins on the wire laying frame, and are wired while being folded back to form a sensor wire orthogonal wire netting of a predetermined pattern to form the insulated sensor wire. The terminal lead wire of the above is drawn out from the sensor wire laying frame, and a transparent adhesive is applied to the peripheral portion of a rectangular transparent insulating hard flat plate provided with through holes corresponding to the sensor wire laying pins, and the adhesive is applied. Place the surface of the transparent insulating hard flat plate positioned on the wiring frame from the sensor wire orthogonal wiring net, and position and fix the transparent insulating hard flat plate positioned so that the sensor wire orthogonal wiring net is in close contact with the adhesive application surface with the positioning pin, Transparent insulation of the folded part of the sensor wire A digitizer sensor plate, characterized in that a rigid flat plate and a sensor wire laying frame are sandwiched and fixed, and a sensor wire orthogonal wiring net portion corresponding to the opening is fixed to the transparent insulating hard flat plate with a transparent adhesive. 2. The digitizer sensor plate according to claim 1, wherein the transparent adhesive is a visible light curable adhesive. 3. The digitizer sensor plate according to claim 1, wherein the transparent adhesive is an ultraviolet curable adhesive.