JPH0867742A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH0867742A JPH0867742A JP6205795A JP20579594A JPH0867742A JP H0867742 A JPH0867742 A JP H0867742A JP 6205795 A JP6205795 A JP 6205795A JP 20579594 A JP20579594 A JP 20579594A JP H0867742 A JPH0867742 A JP H0867742A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- injection molding
- melt viscosity
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 40
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 40
- 239000000203 mixture Substances 0.000 title claims abstract description 26
- 238000001746 injection moulding Methods 0.000 claims abstract description 25
- 239000000155 melt Substances 0.000 claims abstract description 17
- 239000005011 phenolic resin Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 7
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 5
- 239000011342 resin composition Substances 0.000 abstract description 16
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 14
- 238000001721 transfer moulding Methods 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- -1 amine compounds Chemical class 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- ONLPKGMCOFNAJA-UHFFFAOYSA-N 3-methoxysilylpropane-1-thiol Chemical compound CO[SiH2]CCCS ONLPKGMCOFNAJA-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、成形性、半田耐熱性及
び信頼性に優れ、特にインジェクション成形においてイ
ンジェクション成形機のシリンダー内での熱安定性に優
れた半導体封止用エポキシ樹脂組成物に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which is excellent in moldability, solder heat resistance and reliability, and particularly excellent in thermal stability in a cylinder of an injection molding machine in injection molding. It is a thing.
【０００２】[0002]
【従来の技術】従来より半導体封止用エポキシ樹脂組成
物は、ＩＣ、ＬＳＩ等の半導体素子の封止材料として使
用されている。この樹脂組成物を用いた封止法として
は、低コスト、大量生産に適したトランスファー成形が
採用され、更にトランスファー成形の中でも種々の方式
が開発され、封止材料の開発とあいまって現在に至って
いる。しかしながら、近年半導体用樹脂組成物のインジ
ェクション成形に関する開発が進められている。インジ
ェクション成形の長所は、樹脂組成物をタブレット化
し、１ショツト毎に予熱して成形するトランスファー成
形と異なり、樹脂組成物をそのまま供給することから生
産性の向上が図れる点とカル・ランナー等の産業廃棄物
がスプルー・ランナーレス技術を応用することで大幅に
削減できる点である。この樹脂組成物のトランスファー
成形では、プランジャーを備えたポット部に予備成形し
たタブレット又はパウダーを投入し溶融させ、半導体素
子を載置した成形金型に、プランジャーにて加圧する方
式をとっている。従って樹脂組成物は、成形金型温度１
５０〜２００℃程度で最適溶融粘度になるように設定さ
れている。このため従来の半導体封止用エポキシ樹脂組
成物を用いてインジェクション成形する場合には流動
性、熱安定性、硬化性を満足させることが極めて困難で
あり、現在迄量産化に至っていないのが現状である。2. Description of the Related Art Conventionally, epoxy resin compositions for semiconductor encapsulation have been used as encapsulating materials for semiconductor elements such as ICs and LSIs. As a sealing method using this resin composition, transfer molding suitable for low cost and mass production is adopted, and various methods among transfer molding have been developed. There is. However, in recent years, developments regarding injection molding of resin compositions for semiconductors have been advanced. The advantage of injection molding is that, unlike transfer molding, in which the resin composition is tableted and preheated for each shot, the resin composition is supplied as it is, improving productivity and the industry such as Cull Runner. The point is that waste can be greatly reduced by applying sprue-runnerless technology. In the transfer molding of this resin composition, a method is adopted in which a preformed tablet or powder is put into a pot portion provided with a plunger and melted, and a molding die on which a semiconductor element is placed is pressurized by the plunger. There is. Therefore, the resin composition has a molding die temperature of 1
The optimum melt viscosity is set at about 50 to 200 ° C. Therefore, when injection molding is performed using a conventional semiconductor encapsulating epoxy resin composition, it is extremely difficult to satisfy the fluidity, thermal stability, and curability, and it has not been mass-produced until now. Is.
【０００３】この問題を解決する方法として、樹脂組成
物の流動性を向上させる等の各種の方法が知られている
が、これらの場合可塑化溶融状態での熱安定性を向上さ
せると、金型内での温度１５０〜２００℃における硬化
反応が遅くなり、一方金型内での硬化性を向上させると
インジェクション成形機のシリンダー内の熱安定性が大
幅に劣るようになり、インジェクション成形可能な半導
体封止用エポキシ樹脂組成物を得ることは困難であっ
た。Various methods are known to solve this problem, such as improving the fluidity of the resin composition. In these cases, when the thermal stability in the plasticized and molten state is improved, gold The curing reaction at a temperature of 150 to 200 ° C. in the mold is slowed down, while improving the curability in the mold makes the thermal stability in the cylinder of the injection molding machine significantly inferior and enables injection molding. It was difficult to obtain an epoxy resin composition for semiconductor encapsulation.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、インジェク
ション成形におけるシリンダー内の可塑化溶融状態での
熱安定性、成形金型内での流動性及び硬化性に優れ、か
つ信頼性に優れ、トランスファー成形なみの低圧成形が
可能であり、更にスプルー・ランナーレスのインジェク
ション成形に適した半導体封止用エポキシ樹脂組成物を
提供するものである。DISCLOSURE OF THE INVENTION The present invention is excellent in thermal stability in a plasticized and molten state in a cylinder in injection molding, excellent fluidity and curability in a molding die, and excellent in reliability and transfer. The present invention provides an epoxy resin composition for semiconductor encapsulation, which enables low-pressure molding similar to molding, and is suitable for sprue-runnerless injection molding.
【０００５】[0005]
【課題を解決するための手段】本発明は、（ａ）少なく
とも２個以上のエポキシ基を有するエポキシ樹脂、
（ｂ）少なくとも２個以上の水酸基を有するフェノール
樹脂硬化剤、（ｃ）硬化促進剤、（ｄ）無機質充填材及
び（ｅ）シランカップリング剤を必須成分とするエポキ
シ樹脂組成物において、総エポキシ樹脂組成物の溶融粘
度が７０〜１１０℃で、７００〜３５００ポイズである
インジェクション成形用エポキシ樹脂組成物である。The present invention provides (a) an epoxy resin having at least two epoxy groups,
In the epoxy resin composition containing (b) a phenol resin curing agent having at least two or more hydroxyl groups, (c) a curing accelerator, (d) an inorganic filler, and (e) a silane coupling agent as essential components, total epoxy is included. The epoxy resin composition for injection molding has a melt viscosity of 70 to 110 ° C. and 700 to 3500 poise.
【０００６】以下に本発明を詳細に説明する。本発明に
用いられる少なくとも２個以上のエポキシ基を有するエ
ポキシ樹脂は、エポキシ基を有するモノマー、オリゴマ
ー、ポリマー全般を指し、例えばビスフェノールＡ型エ
ポキシ樹脂、ビフェノール型エポキシ樹脂、オルソクレ
ゾールノボラック型エポキシ樹脂、ナフタリン型エポキ
シ樹脂、トリフェノールメタン型エポキシ樹脂、ハイド
ロキノン型エポキシ樹脂等が挙げられるが、これらに限
定されるものではなく、またこれらのエポキシ樹脂は単
独もしくは併用しても差し支えない。本発明の樹脂組成
物は、多量の無機質充填材を含み、その配合量により樹
脂組成物の溶融粘度は左右されるが、用いるエポキシ樹
脂としては、１７５℃での溶融粘度が０．３〜１．５ポ
イズのものが好ましい。樹脂の溶融粘度は、東亜工業
(株)・製 ＣＶ−１Ｓ型粘度計で測定したものである。
本発明に用いる少なくとも２個以上の水酸基を有するフ
ェノール樹脂硬化剤は、上記エポキシ樹脂と硬化反応を
行い、架橋構造を形成することができるフェノール性水
酸基を有するモノマー、オリゴマー、ポリマー全般を指
し、例えばフェノールノボラック樹脂、パラキシリレン
変性フェノール樹脂、テルペン変性フェノール樹脂、ジ
シクロペンタジエン変性フェノール樹脂、ビスフェノー
ルＡ、トリフェノールメタン等が挙げられ、これらに限
定されるものではない。これらのフェノール樹脂硬化剤
は単独もしくは併用しても差し支えない。用いるフェノ
ール樹脂硬化剤としては、１７５℃での溶融粘度が０．
９〜６．２ポイズのものが好ましい。この樹脂の溶融粘
度は、エポキシ樹脂と同様に東亜工業(株)・製 ＣＶ−
１Ｓ型粘度計で測定したものである。エポキシ樹脂のエ
ポキシ基数とフェノール樹脂硬化剤の水酸基数とは、ほ
ぼ当量にするのが好ましい。The present invention will be described in detail below. The epoxy resin having at least two epoxy groups used in the present invention refers to all epoxy group-containing monomers, oligomers and polymers, for example, bisphenol A type epoxy resin, biphenol type epoxy resin, orthocresol novolac type epoxy resin, Examples thereof include naphthalene-type epoxy resin, triphenolmethane-type epoxy resin, and hydroquinone-type epoxy resin. However, the present invention is not limited to these, and these epoxy resins may be used alone or in combination. The resin composition of the present invention contains a large amount of inorganic filler, and the melt viscosity of the resin composition depends on the blending amount thereof, but the epoxy resin used has a melt viscosity of 0.3 to 1 at 175 ° C. The one having a poise of 0.5 is preferable. The melt viscosity of the resin is Toa Kogyo
It was measured by CV-1S viscometer manufactured by Co., Ltd.
The phenol resin curing agent having at least two hydroxyl groups used in the present invention refers to all monomers, oligomers and polymers having a phenolic hydroxyl group capable of forming a crosslinked structure by curing reaction with the above epoxy resin, and examples thereof include Examples thereof include, but are not limited to, phenol novolac resin, paraxylylene-modified phenol resin, terpene-modified phenol resin, dicyclopentadiene-modified phenol resin, bisphenol A, and triphenolmethane. These phenol resin curing agents may be used alone or in combination. The phenolic resin curing agent used has a melt viscosity at 175 ° C. of 0.
It is preferably 9 to 6.2 poise. The melt viscosity of this resin is the same as that of epoxy resin, CV- manufactured by Toa Kogyo Co., Ltd.
It is measured with a 1S type viscometer. It is preferable that the number of epoxy groups of the epoxy resin and the number of hydroxyl groups of the phenol resin curing agent are approximately equivalent.
【０００７】硬化促進剤は、エポキシ樹脂とフェノール
樹脂硬化剤との架橋反応を促進するものであり、例え
ば、ジアザビシクロウンデセン等のアミン系化合物、ト
リフェニルホスフィン等の有機ホスフィン化合物、２−
メチルイミダゾール等のイミダゾール化合物等が挙げら
れる。これらの硬化促進剤は単独もしくは併用しても差
し支えない。無機質充填材は、溶融シリカ粉末、結晶シ
リカ粉末、アルミナ、窒化珪素等が挙げられる。これら
無機質充填材の配合量は成形性と信頼性とのバランスか
ら総エポキシ樹脂組成物中に７０〜９０重量％含有する
ことが好ましい。特に無機質充填材量の多い配合では、
球状の溶融シリカを用いることが好ましい。シランカッ
プリング剤としては、例えばγ−グリシドキシプロピル
トリメトキシシラン、γ−アミノプロピルトリメトキシ
シラン、γ−メルカプトプロピルメトキシシラン、ビニ
ルトリエトキシシラン等が挙げられるが、これらに限定
されるものでなく、またこれらは単独もしくは併用して
も差し支えない。本発明のエポキシ樹脂組成物は、エポ
キシ樹脂、フェノール樹脂硬化剤、硬化促進剤、無機質
充填材及びシランカップリング剤を必須成分とするが、
これ以外にも必要に応じて臭素化エポキシ樹脂、三酸化
アンチモン等の難燃剤、カーボンブラックに代表される
着色剤、天然ワックス及び合成ワックス等の離型剤、シ
リコーンオイル、シリコーンゴム、合成ゴム等の低応力
添加剤を適宜配合しても差し支えない。成形材料化する
に際しては、加熱ニーダや熱ロールにより全組成物を加
熱混練し、続いて冷却、粉砕することにより目的とする
半導体封止用エポキシ樹脂組成物が得られる。The curing accelerator accelerates the crosslinking reaction between the epoxy resin and the phenol resin curing agent, and examples thereof include amine compounds such as diazabicycloundecene, organic phosphine compounds such as triphenylphosphine, and 2-
Examples include imidazole compounds such as methylimidazole. These curing accelerators may be used alone or in combination. Examples of the inorganic filler include fused silica powder, crystalline silica powder, alumina and silicon nitride. The blending amount of these inorganic fillers is preferably 70 to 90% by weight in the total epoxy resin composition from the viewpoint of balance between moldability and reliability. Especially when the amount of inorganic filler is large,
It is preferable to use spherical fused silica. Examples of the silane coupling agent include, but are not limited to, γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, γ-mercaptopropylmethoxysilane, and vinyltriethoxysilane. In addition, these may be used alone or in combination. The epoxy resin composition of the present invention contains an epoxy resin, a phenol resin curing agent, a curing accelerator, an inorganic filler and a silane coupling agent as essential components,
In addition to these, brominated epoxy resins, flame retardants such as antimony trioxide, colorants typified by carbon black, release agents such as natural wax and synthetic wax, silicone oil, silicone rubber, synthetic rubber, etc. The low-stress additive may be appropriately blended. When forming a molding material, the desired epoxy resin composition for semiconductor encapsulation is obtained by heating and kneading the entire composition with a heating kneader or a heating roll, followed by cooling and pulverizing.
【０００８】本発明の最も重要な点は、インジェクショ
ン成形機のシリンダー内の温度に相当する７０〜１１０
℃で、エポキシ樹脂組成物の溶融粘度が７００〜３５０
０ポイズ、好ましくは８０〜９０℃で１２００〜２００
０ポイズであることである。一般に、トランスファー成
形用の半導体封止用エポキシ樹脂組成物は成形金型温度
領域、即ち温度１５０〜２００℃では１００〜５００ポ
イズの低粘度を有し、２００℃以上ではゴム状領域とな
り、１５０℃以下では半ゲル化状態となっている。従っ
てこの温度領域内での成形圧力は、充填性、信頼性（特
に金線のワイヤースイープ）を考慮し、５０〜１２０ｋ
ｇ／ｃｍ2、好ましくは７０〜１００ｋｇ／ｃｍ2とされ
ている。The most important point of the present invention is 70 to 110 corresponding to the temperature in the cylinder of the injection molding machine.
The melt viscosity of the epoxy resin composition is 700 to 350 at ℃.
0 poise, preferably 1200-200 at 80-90 ° C
It is 0 poise. Generally, an epoxy resin composition for semiconductor encapsulation for transfer molding has a low viscosity of 100 to 500 poise at a molding die temperature range, that is, a temperature of 150 to 200 ° C., and becomes a rubber-like region at 200 ° C. or higher, and 150 ° C. Below, it is in a semi-gelled state. Therefore, the molding pressure within this temperature range is 50 to 120 k considering the filling property and reliability (especially wire sweep of gold wire).
It is set to g / cm 2 , preferably 70 to 100 kg / cm 2 .
【０００９】一方、樹脂組成物を供給、圧縮、溶融させ
るインライン式のインジェクション成形機においては、
シリンダー内の供給側ではパウダー及びペレット状態、
圧縮側ではトランスファー成形におけるタブレット状、
即ち打錠された状態、溶融側では半ゲル化した状態が理
想である。しかし、トランスファー成形と異なる点は、
インジェクション成形機のシリンダー内での滞留及びせ
ん断発熱による熱履歴を受けても硬化反応の進行が著し
く抑制される必要がある。本発明では、この溶融側を温
度７０〜１１０℃で７００〜３５００ポイズの溶融粘度
にすることにより、インジェクション成形を可能にし、
可塑化溶融状態での熱安定性を向上させ、かつ成形金型
内での流動性を良好としたものである。On the other hand, in an in-line type injection molding machine for supplying, compressing and melting the resin composition,
Powder and pellets on the supply side in the cylinder,
On the compression side, tablets in transfer molding,
That is, a tableted state and a semi-gelled state on the melting side are ideal. However, the difference from transfer molding is
It is necessary to significantly suppress the progress of the curing reaction even if it receives heat history due to residence in the cylinder of the injection molding machine and shear heat generation. In the present invention, the melt side has a melt viscosity of 700 to 3500 poise at a temperature of 70 to 110 ° C., thereby enabling injection molding,
The thermal stability in the plasticized and molten state is improved, and the fluidity in the molding die is improved.
【００１０】この状態での成形圧力はトランスファー成
形の場合と同等であり、即ち５０〜１２０ｋｇ／ｃ
ｍ2、好ましくは７０〜１００ｋｇ／ｃｍ2であり、得ら
れた半導体成形物は充填性、信頼性に優れている。シリ
ンダー内の温度が７０℃未満では溶融しないため高トル
クとなり成形機を破損することもある。又、温度１１０
℃を越えると硬化が進み、極端に熱安定性が悪化し連続
成形が不可能となる。好ましい温度は８０〜９０℃で、
その際の溶融粘度は１２００〜２０００ポイズである。
シリンダー内の温度に相当する７０〜１１０℃で、エポ
キシ樹脂組成物の溶融粘度が７００ポイズ未満だと熱安
定性が悪化し連続成形が不可となり、３５００ポイズを
越えると高トルクにより成形機破損等の問題が発生する
可能性がある。各温度域における溶融粘度は樹脂組成物
２．２ｇを断面直径１０ｍｍ、高さ１５ｍｍの大きさに
成形し、この試料を用いて島津製作所製の高化式フロー
テスター（ノズル０．５ｍｍφ×長さ１ｍｍ、荷重２０
ｋｇ／ｃｍ2）により所定温度で測定し評価した。熱安
定性については、インジェクション成形機のシリンダー
内での滞留時間にて評価した。一方信頼性についてはワ
イヤーボンディングした半導体素子組立品を用い、ＳＯ
ＦＴＥＸ軟Ｘ線装置にて透過し金線のワイヤースイープ
を評価した。The molding pressure in this state is the same as that in the transfer molding, that is, 50 to 120 kg / c.
m 2 is preferably 70 to 100 kg / cm 2 , and the obtained semiconductor molded product is excellent in filling property and reliability. If the temperature in the cylinder is less than 70 ° C., it does not melt, resulting in high torque, which may damage the molding machine. Also, the temperature is 110
If the temperature exceeds ℃, curing will proceed and the thermal stability will be extremely deteriorated, making continuous molding impossible. The preferred temperature is 80-90 ° C,
The melt viscosity at that time is 1200 to 2000 poise.
If the melt viscosity of the epoxy resin composition is less than 700 poise at 70 to 110 ° C, which is equivalent to the temperature in the cylinder, the thermal stability deteriorates and continuous molding becomes impossible, and if it exceeds 3500 poise, the molding machine is damaged due to high torque. Problems may occur. The melt viscosity in each temperature range was obtained by molding 2.2 g of the resin composition into a cross section with a diameter of 10 mm and a height of 15 mm, and using this sample, a high-performance flow tester manufactured by Shimadzu (nozzle 0.5 mmφ × length 1 mm, load 20
kg / cm 2 ) was measured at a predetermined temperature and evaluated. The thermal stability was evaluated by the residence time in the cylinder of the injection molding machine. On the other hand, regarding reliability, wire bonded semiconductor element assembly is used.
The wire sweep of the gold wire transmitted through the FTEX soft X-ray device was evaluated.
【００１１】以下本発明を実施例で具体的に説明する。
配合量の部は重量部を表す。 実施例１ オルソクレゾールノボラック型エポキシ樹脂（溶融粘度１．１ポイズ／１７５ ℃、エポキシ当量２００） １５０部 フェノールノボラック樹脂硬化剤（溶融粘度３．１ポイズ／１７５℃、水酸基 当量１０４） ７３部 溶融シリカ（平均粒径２３μｍ） ７２０部 テトラフェニルホスフォニウム・テトラフェニルボレート ２部 γ−グリシドキシプロピルトリメトキシシラン ５部 カルナバワックス ７部 着色剤、低応力等の添加剤 ４３部 上記各成分を加熱ニーダ、加熱ロールにて混練し半導体
封止用エポキシ樹脂組成物を得た。用いた樹脂の溶融粘
度は、前記した方法に準じて測定した。この材料を用い
て、実インジェクション成形を行い、シリンダー内での
熱安定性、成形金型内での硬化性の評価を行った。信頼
性については実インジェクション成形を行いワイヤース
イープの評価を行い、更に各温度域における溶融粘度を
評価した。これらの評価結果を表１に示す。The present invention will be specifically described below with reference to examples.
The parts of the compounding amounts represent parts by weight. Example 1 Orthocresol novolac type epoxy resin (melt viscosity 1.1 poise / 175 ° C., epoxy equivalent 200) 150 parts Phenol novolac resin curing agent (melt viscosity 3.1 poise / 175 ° C., hydroxyl equivalent 104) 73 parts fused silica (Average particle size 23 μm) 720 parts Tetraphenylphosphonium tetraphenylborate 2 parts γ-glycidoxypropyltrimethoxysilane 5 parts Carnauba wax 7 parts Coloring agents, additives such as low stress 43 parts Heating the above components The mixture was kneaded with a kneader and a heating roll to obtain an epoxy resin composition for semiconductor encapsulation. The melt viscosity of the resin used was measured according to the method described above. Using this material, actual injection molding was performed, and thermal stability in the cylinder and curability in the molding die were evaluated. Regarding the reliability, actual injection molding was performed to evaluate the wire sweep, and further the melt viscosity in each temperature range was evaluated. The results of these evaluations are shown in Table 1.
【００１２】測定方法及び評価方法 組成物の溶融粘度：樹脂組成物２．２ｇを断面直径１０
ｍｍ、高さ１５ｍｍの大きさに成形し、この試料を用い
て島津製作所製の高化式フローテスター（ノズル０．５
ｍｍφ×長さ１ｍｍ、荷重２０ｋｇ／ｃｍ2）で金型温
度を７０℃から１７５℃に保ち測定した。 熱安定性：樹脂組成物を３５ショット連続インジェクシ
ョン成形し、その後成形機を停止して樹脂組成物をシリ
ンダー内に滞留させる。滞留時間は計量後からインジェ
クション開始までの時間とし、シリンダー温度は８０℃
及び９０℃で５分から６０分まで順次長くしてインジェ
クション成形が可能か否かを判定した。 ○：成形可能、△：成形可能（但し一部未充填）、×：
成形不可 硬化性：シリンダー温度９０℃で、金型温度１６０℃、
１７５℃の金型に連続インジェクション成形し、金型が
開いてから１０秒後の成形品の表面硬度をバコール硬度
計Ｎｏ９３５にて測定した。 信頼性：ワイヤーボンディング（２５μｍ径、長さ３ｍ
ｍのセミハード金線）した半導体素子組立品を成形圧力
５０ｋｇ／ｃｍ2より１２０ｋｇ／ｃｍ2まで順次高くし
て成形した成形物をＳＯＦＴＥＸ軟Ｘ線装置（（株）ソ
フテックス製）にて透過し金線のワイヤースイープの発
生数を評価した。 実施例２、比較例１、２ 表１の配合に従い樹脂組成物を製造し、実施例１と同様
に評価した。評価結果を表１に示す。Measuring Method and Evaluation Method Melt viscosity of the composition: 2.2 g of the resin composition was used to measure the cross-sectional diameter of 10
mm, height 15 mm, and using this sample, a Shimadzu-made elevation flow tester (nozzle 0.5
The mold temperature was measured from 70 ° C. to 175 ° C. with mmφ × length 1 mm, load 20 kg / cm 2 ). Thermal stability: The resin composition is subjected to continuous 35-shot injection molding, and then the molding machine is stopped to allow the resin composition to stay in the cylinder. The residence time is the time from the measurement to the start of injection, and the cylinder temperature is 80 ° C.
Then, it was determined whether injection molding was possible by sequentially increasing the temperature from 90 ° C. for 5 minutes to 60 minutes. ○: Moldable, △: Moldable (but partially unfilled), ×:
Unmoldable Curability: Cylinder temperature 90 ℃, Mold temperature 160 ℃,
Continuous injection molding was performed in a mold at 175 ° C., and the surface hardness of the molded product 10 seconds after the mold was opened was measured with a Bacol hardness meter No. 935. Reliability: Wire bonding (25μm diameter, 3m length)
(m semi-hard gold wire), the semiconductor element assembly was sequentially increased from 50 kg / cm 2 to 120 kg / cm 2, and the molded product was transmitted through a SOFTEX soft X-ray device (manufactured by Softex Co., Ltd.). The number of wire sweeps of the gold wire was evaluated. Example 2, Comparative Examples 1 and 2 Resin compositions were produced according to the formulations shown in Table 1 and evaluated in the same manner as in Example 1. Table 1 shows the evaluation results.
【００１３】[0013]
【表１】 [Table 1]
【００１４】[0014]
【発明の効果】本発明によるとインジェクション成形機
のシリンダー内での可塑化溶融状態での熱安定性に優
れ、可塑化溶融樹脂の粘度上昇が抑制され、かつ金型内
では急速に硬化するため成形加工性に優れている。又、
スプルー・ランナーレス成形にも極めて適している。EFFECTS OF THE INVENTION According to the present invention, the thermal stability in the plasticized and molten state in the cylinder of the injection molding machine is excellent, the increase in viscosity of the plasticized molten resin is suppressed, and the resin is rapidly cured in the mold. Excellent moldability. or,
Very suitable for sprue and runnerless molding.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/31 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01L 23/31
Claims (2)
を有するエポキシ樹脂、（ｂ）少なくとも２個以上の水
酸基を有するフェノール樹脂硬化剤、（ｃ）硬化促進
剤、（ｄ）無機質充填材及び（ｅ）シランカップリング
剤を必須成分とするエポキシ樹脂組成物において、総エ
ポキシ樹脂組成物の溶融粘度が７０〜１１０℃で、７０
０〜３５００ポイズであることを特徴とするインジェク
ション成形用エポキシ樹脂組成物。1. An epoxy resin having (a) at least two epoxy groups, (b) a phenol resin curing agent having at least two hydroxyl groups, (c) a curing accelerator, (d) an inorganic filler, and (E) In an epoxy resin composition containing a silane coupling agent as an essential component, the total epoxy resin composition has a melt viscosity of 70 to 110 ° C.
An epoxy resin composition for injection molding, characterized in that it is 0 to 3500 poise.
〜９０℃で１２００〜２０００ポイズである請求項１記
載のインジェクション成形用エポキシ樹脂組成物。2. The total epoxy resin composition has a melt viscosity of 80.
The epoxy resin composition for injection molding according to claim 1, which has a viscosity of 1200 to 2000 poise at 90 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6205795A JPH0867742A (en) | 1994-08-30 | 1994-08-30 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6205795A JPH0867742A (en) | 1994-08-30 | 1994-08-30 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0867742A true JPH0867742A (en) | 1996-03-12 |
Family
ID=16512817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6205795A Pending JPH0867742A (en) | 1994-08-30 | 1994-08-30 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0867742A (en) |
-
1994
- 1994-08-30 JP JP6205795A patent/JPH0867742A/en active Pending
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