JPH0869985A - Table mechanism of dicing machine - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] To provide a table mechanism of a dicing device in which the position of the clamp portion can be easily changed without attaching and detaching the set screw. A table mechanism 1 for holding a wafer mounted on a frame via a tape at the time of dicing with a dicing device, the table mechanism including a chuck table 2 for sucking and holding a wafer, and an obstacle for dicing. The clamp mechanism 3 includes a clamp mechanism 3 that pushes down the frame so that it does not come into contact with the frame. The clamp mechanism 7 includes a clamp portion 7, a guide rail 6 that guides the radial movement of the clamp portion, and a lock portion that fixes the clamp portion to the guide rail. 8 and the lock portion 8 is selectively positioned at the release position and the non-release position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a table mechanism of a dicing device.

[0002]

2. Description of the Related Art In a conventional dicing apparatus, for example, as shown in FIG. 5, a wafer W (usually via a tape E as shown in FIG. 4) by a loading / unloading means B from inside a cassette C placed in a cassette placing area A is used. (Mounted on the frame F) is carried out to the standby area D, and the wafer W with the frame F is transferred to the table mechanism H by the transfer means G having a swing arm and suction-held on the chuck table T. Is moved to the alignment means I for alignment and then the wafer W is cut by the cutting means J having a rotating blade. As shown in FIG. 6, the table mechanism H is provided with clamp mechanisms K on both sides of the chuck table T.
Is a pair of guide bars K whose inner ends are fixed with screws Ka.
b, a clamp portion Kd that is attached to the guide bar Kb by a set screw Kc, an air motor Ke fixed to the clamp portion, and a clamp claw Kf that rotates as the air motor Ke rotates. Has been done. As shown in FIG. 7, when the wafer W with the frame F is transferred onto the chuck table T, the clamp mechanism K rotates the air motor Ke to rotate the clamp claws Kf inward (arrows P and Q). , The frame F is pushed down and fixed to the clamp part Kd. The reason why the frame F is pushed down and fixed below the upper surface of the wafer W in this manner is to prevent the rotary blade from being obstructed during the dicing by the cutting means J.

[0003]

According to the conventional clamp mechanism K, when the size of the wafer W is different, the size of the frame F is also changed accordingly, so that the position of the clamp portion Kd must be changed. Therefore, conventionally, as shown in FIG. 6, a plurality of screw holes Kg are formed in the pair of guide bars Kb.
And the mounting position of the clamp portion Kd can be changed by utilizing this screw hole Kg. However,
Each time the mounting position of the clamp part Kd is changed, the set screw K
Since c has to be attached and detached, it is troublesome and the work efficiency is reduced. Therefore, it is an object of the present invention to provide a table mechanism of a dicing device in which the position of the clamp portion can be easily changed without attaching and detaching the set screw.

[0004]

As a means for technically solving the above-mentioned problems, the present invention provides a table mechanism for holding a wafer mounted on a frame via a tape during dicing in a dicing device. The table mechanism is composed of a chuck table that holds the wafer by suction and a clamp mechanism that pushes down the frame so as not to interfere with dicing.The clamp mechanism prevents the clamp portion and the radial movement of the clamp portion. The gist of the table mechanism of the dicing device is constituted by a guide rail for guiding and a lock portion for fixing the clamp portion to the guide rail, and the lock portion is selectively positioned at the release position and the non-release position. .

[0005]

[Operation] The clamp part can be moved along the guide rail when the lock part is in the release position, and the clamp part can be fixed by moving the lock part to the non-release position after moving to the predetermined position. There is no need to attach and detach the setscrew when moving the clamp as in the past.

[0006]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a table mechanism 1 according to the present invention. The table mechanism 1 includes a chuck table 2 for sucking and holding a wafer W, and a clamp mechanism 3 for pushing down a frame F so as not to interfere with dicing. Has been done.

The clamp mechanism 3 is provided on both sides of the table holding base 4 and has a pair of guide rails 6 whose inner ends are fixed by screws 5, and a radial direction (X-axis direction) along the guide rails 6. A clamp portion 7 slidably fitted to the
It is composed of a lock portion 8 for fixing the clamp portion 7 to the guide rail 6.

An air motor 9 is fixed to the clamp portion 7, and a clamp pawl 10 which rotates with the rotation of the air motor 9 is attached to the clamp portion 7. As shown in FIG. It can be fixed to the part 7.

As shown in FIG. 2, the lock portion 8 is mounted in the clamp portion 7 via a spring 11, and a protrusion 8a provided at the tip of the lock portion 8 protrudes from the hole 7a of the clamp portion 7 to the outside, so that the guide rail The clamp portion 7 can be fixed by being fitted in a plurality of positioning grooves 6a provided on the side surface of the clamp 6. That is, the position shown by the solid line is the non-release position R of the lock portion 8.

When the knob 8b on the head of the lock portion 8 is pulled toward the front (Y-axis direction) against the spring 11, the projection 8a is formed.
Is disengaged from the groove 6a of the guide rail 6, and the clamp portion 7 can be moved along the guide rail 6. That is, the position shown by the phantom line in FIG. 2 is the release position S of the lock portion 8.

When the clamp part 7 is moved to a predetermined position, the restoring force of the spring 11 causes the projection 8a at the tip end to fit into the groove 6a of the guide rail 6, and the clamp part 7 can be fixed again. Since the protrusion 8a of the lock portion 8 is in contact with the side surface of the guide rail 6 during the movement of the clamp portion 7, the release position S is maintained as it is even if the knob 8b is not pulled all the time, and the protrusion 8a is recessed into the groove 6a. When the position is reached, the restoring force of the spring 11 automatically inserts it into the recessed groove 6a to reach the non-release position R. Therefore, the operation of moving the clamp portion 7 is extremely simple, and the positioning can be surely performed.

In this way, the lock portion 8 has the release position S.
And the non-releasing position R, so that the clamp portion 7 can be moved and fixed with respect to the guide rail 6. It should be noted that the table mechanism 1 is used by being incorporated in a dicing device as described above.

[0013]

As described above, according to the present invention,
In the table mechanism that sucks and holds the wafer of the dicing machine, the position of the clamp part that presses down the frame and fixes it can be easily changed, so it is not necessary to attach and detach the set screw of the clamp part each time unlike the conventional case. ,
It has excellent effects such as reducing the burden on the operator and improving the work efficiency.

[Brief description of drawings]

FIG. 1 is a perspective view of essential parts showing a table mechanism according to the present invention.

FIG. 2 is a sectional view showing a structure of a lock portion of the same.

FIG. 3 is a front view of relevant parts showing a state where a wafer with a frame is held.

FIG. 4 is a plan view of a wafer with a frame.

FIG. 5 is a perspective view showing an example of a dicing device.

FIG. 6 is a perspective view of a main part of a conventional table mechanism.

FIG. 7 is a front view of relevant parts showing a state in which the framed wafer is held.

[Explanation of symbols]

1 ... table mechanism 2 ... chuck table 3 ... clamping mechanism 4 ... table holding table 5 ... screw 6
… Guide rail 6a… Groove 7… Clamp
8 ... Lock part 8a ... Protrusion 8b ... Knob 9 ...
Air motor 10 ... Clamp claw 11 ... Spring

Claims (1)

[Claims] 1. When dicing with a dicing device,
A table mechanism for holding a wafer mounted on a frame via a tape, which comprises a chuck table for sucking and holding the wafer and a clamp mechanism for pushing down the frame so as not to interfere with dicing. , The clamp mechanism is composed of a clamp part, a guide rail for guiding the radial movement of the clamp part, and a lock part for fixing the clamp part to the guide rail. The lock part has a release position and a non-release position. A table mechanism of a dicing device selectively positioned to and.