JPH087233B2 - Printed circuit board measuring device - Google Patents
Printed circuit board measuring deviceInfo
- Publication number
- JPH087233B2 JPH087233B2 JP4033756A JP3375692A JPH087233B2 JP H087233 B2 JPH087233 B2 JP H087233B2 JP 4033756 A JP4033756 A JP 4033756A JP 3375692 A JP3375692 A JP 3375692A JP H087233 B2 JPH087233 B2 JP H087233B2
- Authority
- JP
- Japan
- Prior art keywords
- measuring
- printed circuit
- circuit board
- terminal
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005259 measurement Methods 0.000 claims description 25
- 239000000523 sample Substances 0.000 claims description 8
- 230000003028 elevating effect Effects 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000011295 pitch Substances 0.000 description 12
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明はプリント基板の測定装置
に関するものである。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board measuring device.
It is about.
【0002】[0002]
【従来の技術】LSI素子等の電子部品を測定する場
合、従来、図7に示すように、プリント基板6上に実装
されたLSI素子(電子部品3)のリード(端子部3
a)間、あるいはプリント基板6上の基準点とLSI素
子3のリード3aに測定子7を触れさせることにより行
われる。2. Description of the Related Art Conventionally, when measuring an electronic component such as an LSI element, as shown in FIG. 7, a lead (terminal portion 3) of an LSI element (electronic component 3) mounted on a printed circuit board 6 is conventionally used.
During a) or by touching the measuring element 7 to the reference point on the printed circuit board 6 and the lead 3a of the LSI element 3.
【0003】[0003]
【発明が解決しようとする課題】しかし、近年、電子部
品3の高密度実装化が進み、電子部品3のリード間ピッ
チは益々狭くなってきており、従来の方法では、正確な
測定点に測定子7を触れさせることが困難で、さらに、
隣接するリードへの測定時の短絡等が発生しやすく、測
定信頼性も低下しているという問題が指摘されるに至っ
ている。However, in recent years, the density of the electronic components 3 has been increased, and the pitch between the leads of the electronic components 3 has become narrower. In the conventional method, the measurement is performed at an accurate measurement point. It is difficult to touch the child 7,
It has been pointed out that a short circuit or the like is likely to occur in an adjacent lead at the time of measurement, and the measurement reliability is lowered.
【0004】本発明によれば上記目的は、昇降手段によ
り昇降操作が可能なコンベアを含む複数のコンベアによ
り構成され、複数の被測定電子部品が実装されたプリン
ト基板を搬送する搬送手段と、 プリント基板上に装着さ
れ、前記被測定電子部品の端子部に圧接する接触端子を
一端に備え、かつ、他端にはプリント基板と平行な面方
向に適宜広さを有して絶縁材料よりなる本体上面に配置
すべく前記被測定電子部品の端子部間のピッチより大き
なピッチで展開される測定用端子を備えた複数の端子片
を有する測定治具と、 測定治具の測定用端子に圧接し、
テスタに接続される複数の測定子を下面に突出させたフ
ィクスチャとを有し、前記昇降手段によりプリント基板
を上方に移動させることにより測定子を測定治具の測定
用端子に圧接させて、プリント基板上の被測定電子部品
の端子部の電気的測定を可能にしたプリント基板の測定
装置を提供することにより達成される。According to the present invention, the above object is achieved by the lifting means.
With multiple conveyors including a conveyor that can
Printed circuit board with multiple electronic components under test
The transport means for transporting the printed circuit board and the mounting on the printed circuit board.
The contact terminal that press-contacts with the terminal part of the measured electronic component.
A surface parallel to the printed circuit board at one end and at the other end
Arranged appropriately on the upper surface of the main body made of insulating material
It should be larger than the pitch between the terminals of the measured electronic component.
Multiple terminal strips with measuring terminals that can be deployed at different pitches
With a measuring jig having, and pressure contact with the measuring terminal of the measuring jig,
A probe with multiple probes connected to the tester
And a printed circuit board by the elevating means.
By moving the probe upward to measure the probe
Electronic parts to be measured on the printed board
Printed circuit board measurement that enables electrical measurement of terminals
This is accomplished by providing a device .
【0005】本発明は以上の欠点を解消すべくなされた
ものであって、測定精度が高く、かつ、自動的プリント
基板の測定が可能なプリント基板の測定装置を提供する
ことを目的とする。 The present invention has been made to solve the above drawbacks , and has high measurement accuracy and automatic printing.
Provide a printed circuit board measuring device capable of measuring a board.
The purpose is to
【0006】[0006]
【作用】測定治具は、本体1に保持される端子片2を有
し、該端子片2には接触端子4と測定用端子5とが設け
られる。接触端子4は電子部品3の端子部3aに対応し
て設けられ、測定用端子5は電子部品3の端子部3a間
のピッチより大きなピッチで本体1の適宜部位、例えば
上面に展開される。The measuring jig has the terminal piece 2 held by the main body 1, and the terminal piece 2 is provided with the contact terminal 4 and the measuring terminal 5. The contact terminals 4 are provided so as to correspond to the terminal portions 3a of the electronic component 3, and the measuring terminals 5 are spread on an appropriate portion of the main body 1, for example, the upper surface at a pitch larger than the pitch between the terminal portions 3a of the electronic component 3.
【0007】この結果、電子部品3の端子部3a間のピ
ッチは測定端子5の配置部位において広げられるととも
に、測定端子5の面積が大きくなるためにフィクスチャ
Bのセット位置に誤差が生じても、測定子7は確実に測
定端子5に圧接するために、測定の信頼性を向上させる
ことができる。 As a result, the pin between the terminal portions 3a of the electronic component 3 is
The switch is opened at the location where the measurement terminal 5 is placed.
In addition, because the area of the measuring terminal 5 becomes large, the fixture
Even if an error occurs in the set position of B, the contact point 7 is measured accurately.
Pressure contact with the constant terminal 5 improves the reliability of measurement.
be able to.
【0008】[0008]
【実施例】以下、本発明の望ましい実施例を添付図面に
基づいて詳細に説明する。図1に表面実装LSI用に構
成された測定治具Aを示し、図中3はQFPパッケージ
LSI素子(電子部品)、3aはこのLSI素子のリー
ド(端子部)、6は該LSI素子が実装されるプリント
基板である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows a measuring jig A configured for a surface-mount LSI, in which 3 is a QFP package LSI element (electronic component), 3a is a lead (terminal portion) of this LSI element, and 6 is the LSI element mounted. Printed circuit board.
【0009】測定治具Aは、絶縁材料により形成される
本体1と、良導電性材料により形成される端子片2とを
備える。端子片2は図2に示すように、平面視において
内側から外側に向かって放射状に広がるように配置さ
れ、本体1内に例えば一体成型等により埋設、保持され
る。The measuring jig A comprises a main body 1 made of an insulating material and a terminal piece 2 made of a highly conductive material. As shown in FIG. 2, the terminal pieces 2 are arranged so as to radially spread from the inner side to the outer side in a plan view, and are embedded and held in the main body 1 by, for example, integral molding.
【0010】また、上記端子片2は一端を本体1裏面に
突設させて接触端子4とされる。この接触端子4は、L
SI素子3のリードピッチに合致するピッチで整列さ
れ、端部はJ字状に屈曲されてLSI素子3のリード3
aを外方から圧接する。この結果、本体1は、接触端子
4により、LSI素子3の四側縁のリード3aを圧接
し、LSI素子3を抱持した状態で装着される。Further, one end of the terminal piece 2 is projected on the back surface of the main body 1 to form a contact terminal 4. This contact terminal 4 is L
The leads 3 of the LSI element 3 are aligned at a pitch that matches the lead pitch of the SI element 3 and the ends are bent in a J shape.
Pressure a from the outside. As a result, the main body 1 is mounted in a state in which the leads 3a on the four side edges of the LSI element 3 are pressed by the contact terminals 4 and the LSI element 3 is held.
【0011】さらに、上記端子片2は、接触端子4と反
対端に測定用端子5を有する。測定用端子5は、本体1
から外部に露出した状態で配置され、その上面には必要
ならば図1(a)に示すように、ローレット目を形成
し、測定子7の滑り止めがなされる。Further, the terminal piece 2 has a measuring terminal 5 at the end opposite to the contact terminal 4. The measuring terminal 5 is the main body 1
Is exposed to the outside, and if necessary, knurls are formed on the upper surface thereof to prevent the contact point 7 from slipping.
【0012】しかして、この実施例において、LSI素
子3のリードピッチは測定用端子5において広げられた
結果となり、隣接するリード3aへの誤接触、あるいは
短絡等が確実に防止される。この場合、本体1に隔壁9
を突出させて測定用端子5間を仕切ることも可能であ
る。In this embodiment, however, the lead pitch of the LSI element 3 is widened at the measuring terminals 5, and the erroneous contact with the adjacent lead 3a or the short circuit is surely prevented. In this case, the partition wall 9 is attached to the main body 1.
It is also possible to project and to partition between the measuring terminals 5.
【0013】次に、コネクタ用に変形された測定治具A
を図3、図4に示す。図3は表面実装コネクタへの適
用、図4はフラットケーブル用コネクタへの適用例であ
る。この実施例において、コネクタ(電子部品3)はプ
リント基板6上のパッド10に半田付けされて実装さ
れ、ハウジング11内にはコンタクト(端子部3a)が
並設される。Next, the measuring jig A deformed for the connector is used.
Is shown in FIGS. 3 is an application to a surface mount connector, and FIG. 4 is an application example to a flat cable connector. In this embodiment, the connector (electronic component 3) is soldered and mounted on the pad 10 on the printed circuit board 6, and contacts (terminal portions 3a) are arranged in parallel in the housing 11.
【0014】測定治具Aは、上記コネクタ3のハウジン
グ11に嵌合可能な凹部12を有し、該凹部12からコ
ネクタ3のコンタクト3aにプラグイン接続される接触
端子4が突設される。また、測定用端子5は、本体1の
上面部に並べて配置され、そのピッチはコネクタ3のコ
ンタクト3aのピッチに比して広くされる。なお、測定
用端子5を展開するための面積が本体1上面に確保でき
ない場合には、測定用端子5を2段に配置することも可
能である。The measuring jig A has a recess 12 which can be fitted into the housing 11 of the connector 3, and a contact terminal 4 plugged into the contact 3a of the connector 3 from the recess 12. The measuring terminals 5 are arranged side by side on the upper surface of the main body 1, and their pitch is made wider than the pitch of the contacts 3 a of the connector 3. In addition, when the area for developing the measuring terminals 5 cannot be secured on the upper surface of the main body 1, the measuring terminals 5 can be arranged in two stages.
【0015】図5に本発明の他の実施例を示す。この実
施例における測定治具Aは、プリント基板6上に実装さ
れる複数のLSI素子3、3・・の各リード3a、3
a、・・、およびコネクタ3のコンタクト3aに対応す
る複数の接触端子4、4・・を有し、これら接触端子4
を保持する本体1は、プリント基板6と略同一の面積に
形成される。一方、各接触端子4に対応する測定用端子
5は、本体1の上面に、例えばマトリクス状に配置され
ている。FIG. 5 shows another embodiment of the present invention. The measuring jig A in this embodiment is composed of the leads 3a, 3 of the plurality of LSI elements 3 mounted on the printed board 6.
., and a plurality of contact terminals 4, 4 ... Corresponding to the contacts 3a of the connector 3, and these contact terminals 4
The main body 1 for holding is formed to have substantially the same area as the printed circuit board 6. On the other hand, the measuring terminals 5 corresponding to the contact terminals 4 are arranged on the upper surface of the main body 1 in a matrix, for example.
【0016】したがってこの実施例において、先ず、プ
リント基板6に測定治具Aをセットした後、適宜箇所の
測定用端子5を測定子7を使用して個別にプローブする
ことが可能であり、例えば、本体1上面に回路図等を表
示しておき、順次必要な測定点をテスタ8により検針す
ることが可能となる。Therefore, in this embodiment, first, after setting the measuring jig A on the printed circuit board 6, it is possible to individually probe the measuring terminals 5 at appropriate places by using the measuring element 7. It is possible to display a circuit diagram or the like on the upper surface of the main body 1 and sequentially measure the necessary measurement points by the tester 8.
【0017】また、図5には、上記測定治具Aを使用し
た測定装置の構成が含まれている。測定装置は、複数の
コンベア13と、中央部のコンベア13を上昇させるた
めの昇降手段14と、昇降手段14の上方に配置される
フィクスチャBとを有し、プリント基板6は供給部15
から中央部にコンベア13により搬送された後、昇降手
段14によりコンベア13毎上方に押し上げられ、その
上方に配置された測定治具Aにセットされる。Further, FIG. 5 includes a structure of a measuring device using the above-mentioned measuring jig A. The measuring device has a plurality of conveyors 13, an elevating means 14 for elevating the central conveyor 13, and a fixture B arranged above the elevating means 14, and the printed circuit board 6 is provided with a supply part 15.
After being conveyed from the center to the center by the conveyer 13, the conveyer 13 is pushed upward by the elevating means 14 and set on the measuring jig A arranged above the conveyer 13.
【0018】フィクスチャBは、上記測定治具Aの各測
定用端子5に合致する位置に複数の測定子7、7・・を
設けて形成され、予め測定治具Aにセットされており、
プリント基板6の測定治具Aへのセット完了と同時にテ
スタ8の測定回路がonとなり、プリント基板6の測定
が行われ、測定が完了したプリント基板6は昇降手段1
4により原位置に降下した後、排出部16側のコンベア
13により装置外部に排出される。The fixture B is formed by providing a plurality of stylus elements 7, 7 ... at positions corresponding to the respective measuring terminals 5 of the measuring jig A, and is set in advance on the measuring jig A.
Simultaneously with the completion of setting the printed circuit board 6 on the measuring jig A, the measurement circuit of the tester 8 is turned on, the printed circuit board 6 is measured, and the printed circuit board 6 whose measurement has been completed is moved up and down by the lifting means 1
After being lowered to the original position by 4, the sheet is discharged to the outside of the apparatus by the conveyor 13 on the side of the discharging section 16.
【0019】なお、測定治具Aのプリント基板6への装
着は、コンベア13への供給前に行うことも可能であ
り、この場合には、昇降手段14によるプリント基板6
と測定治具Aの上昇動作により、測定治具Aとフィクス
チャBとの接続が行われる。The measurement jig A can be mounted on the printed circuit board 6 before it is supplied to the conveyor 13. In this case, the printed circuit board 6 is lifted by the elevating means 14.
By the ascending operation of the measurement jig A, the measurement jig A and the fixture B are connected.
【0020】図6は上記実施例の変形例を示す。この変
形例において、プリント基板6はコンベア13により搬
送され、所定位置において測定治具Aが被せられた後、
フィクスチャBが装着されてプリント基板6の測定が行
われる。なお、測定治具Aの接触端子4がプリント基板
6上の電子部品3の端子部3aに確実に接触するよう
に、プリント基板6と測定治具A、および測定治具Aと
フィクスチャBとの間には図示しないガイド機構が設け
られる。FIG. 6 shows a modification of the above embodiment. In this modification, the printed circuit board 6 is conveyed by the conveyor 13 and covered with the measurement jig A at a predetermined position.
The fixture B is mounted and the printed circuit board 6 is measured. The printed board 6 and the measurement jig A, and the measurement jig A and the fixture B are arranged so that the contact terminals 4 of the measurement jig A surely come into contact with the terminal portions 3a of the electronic components 3 on the printed board 6. A guide mechanism (not shown) is provided between them.
【0021】[0021]
【発明の効果】以上の説明から明らかなように、本発明
によれば、測定子による測定箇所となる測定用端子間の
ピッチを素子の端子部のピッチに比して大きくすること
ができるので、誤って隣接する端子部間を短絡させた
り、あるいは、異なった端子部に測定子を触れさせて、
誤った箇所を測定してしまうことが防止され、測定精度
が向上する。As is apparent from the above description, according to the present invention, the pitch between the measuring terminals, which are the measurement points by the probe, can be made larger than the pitch of the terminal portion of the element. , Accidentally short-circuiting between adjacent terminal parts, or touching different terminals with the probe,
It is possible to prevent the measurement of an erroneous portion and improve the measurement accuracy.
【図1】本発明の実施例を示す図で、(a)は断面図、
(b)は本体上面の斜視図である。FIG. 1 is a view showing an embodiment of the present invention, in which (a) is a sectional view,
(B) is a perspective view of the upper surface of the main body.
【図2】端子片の配置を示す平面図である。FIG. 2 is a plan view showing the arrangement of terminal pieces.
【図3】コネクタへの適用を示す断面図である。FIG. 3 is a cross-sectional view showing application to a connector.
【図4】図3の変形例を示す断面図である。FIG. 4 is a cross-sectional view showing a modified example of FIG.
【図5】測定装置を示す側面図である。FIG. 5 is a side view showing the measuring device.
【図6】図5の変形例を示す斜視図である。FIG. 6 is a perspective view showing a modified example of FIG.
【図7】従来例を示す斜視図である。FIG. 7 is a perspective view showing a conventional example.
A 測定治具 B フィクスチャ 1 本体 2 端子片 3 電子部品 3a 端子部 4 接触端子 5 測定用端子 6 プリント基板 7 測定子 8 テスタ A Measuring jig B Fixture 1 Main body 2 Terminal piece 3 Electronic component 3a Terminal part 4 Contact terminal 5 Measurement terminal 6 Printed circuit board 7 Measuring element 8 Tester
Claims (1)
を含む複数のコンベアにより構成され、複数の被測定電
子部品が実装されたプリント基板を搬送する搬送手段
と、 プリント基板上に装着され、前記被測定電子部品の端子
部に圧接する接触端子を一端に備え、かつ、他端にはプ
リント基板と平行な面方向に適宜広さを有して絶縁材料
よりなる本体上面に配置すべく前記被測定電子部品の端
子部間のピッチより大きなピッチで展開される測定用端
子を備えた複数の端子片を有する測定治具と、 測定治具の測定用端子に圧接し、テスタに接続される複
数の測定子を下面に突出させたフィクスチャとを有し、 前記昇降手段によりプリント基板を上方に移動させるこ
とにより測定子を測定治具の測定用端子に圧接させて、
プリント基板上の被測定電子部品の端子部の電気的測定
を可能にしたプリント基板の測定装置。 1. A conveyor that can be lifted and lowered by a lifting means.
It is composed of multiple conveyors including
Conveying means for conveying a printed circuit board on which child parts are mounted
And the terminals of the electronic device under test mounted on the printed circuit board.
One end is provided with a contact terminal that presses against the
Insulation material with appropriate width in the direction parallel to the lint substrate
Edge of the DUT to be placed on the upper surface of the body
Measuring end deployed at a pitch larger than the pitch between the child parts
A measuring jig having a plurality of terminal pieces with a child, and a compound jig that is pressed against the measuring terminals of the measuring jig and connected to the tester.
And a fixture having a number of measuring elements protruding on the lower surface, and the printed circuit board is moved upward by the elevating means.
And press the probe to the measuring terminal of the measuring jig,
Electrical measurement of terminals of electronic parts under test on printed circuit boards
A printed circuit board measurement device that enables
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4033756A JPH087233B2 (en) | 1992-02-20 | 1992-02-20 | Printed circuit board measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4033756A JPH087233B2 (en) | 1992-02-20 | 1992-02-20 | Printed circuit board measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05232140A JPH05232140A (en) | 1993-09-07 |
| JPH087233B2 true JPH087233B2 (en) | 1996-01-29 |
Family
ID=12395276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4033756A Expired - Lifetime JPH087233B2 (en) | 1992-02-20 | 1992-02-20 | Printed circuit board measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087233B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08146084A (en) * | 1994-11-18 | 1996-06-07 | Nec Corp | Waveform observing instrument for integrated circuit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5146920U (en) * | 1974-10-02 | 1976-04-07 | ||
| JPH0660983B2 (en) * | 1985-12-11 | 1994-08-10 | 日本電信電話株式会社 | Organic nonlinear optical material |
-
1992
- 1992-02-20 JP JP4033756A patent/JPH087233B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05232140A (en) | 1993-09-07 |
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