JPH08758Y2 - Inner lead bonder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to an inner lead bonder used for inner lead bonding of a semiconductor device using a TAB (tape automated bonding) tape.

[Conventional technology]

In the inner lead bonding process of the semiconductor device using the TAB tape, as shown in FIG. 4, the window portion 3a of the TAB tape 2 is arranged on the semiconductor pellet 1 so as to overlap each other, and each inner lead 4 on the TAB tape 2 is arranged. After the bump electrode (not shown) on the semiconductor pellet 1 is aligned, the tip of each inner lead 4 is pressed from above by the heated bonding tool 5 to perform thermocompression bonding with the bump electrode. This TAB tape 2 is formed by laminating a copper foil on a long insulating film 3 in which a window portion 3a is formed in advance and etching and removing the copper foil while leaving each pattern of the inner leads 4. However, in this etching step, as shown in FIG. 5, the tips of the inner leads 4 are connected in order to prevent bending or the like from occurring at the tips of the fine inner leads 4 protruding into the window 3a. In some cases, the copper suspender portion 6 made of a rectangular copper foil pattern is left. And, when using the TAB tape 2 which has such a copper suspender portion 6 left, conventionally,
Immediately before the inner lead bonding step shown in FIG. 4, the copper suspender portion 6 was cut and removed from the tip of each inner lead 4 by shirring.

[Problems to be solved by the device]

However, the inner lead 4 is a thin copper foil with a thickness of about 30 μm, and with the recent improvement in semiconductor integration technology, semiconductor devices with more than 400 leads have been manufactured. In this inner lead 4
Is becoming smaller and smaller. Therefore, the copper suspender section 6
If the shearing blade is slightly misaligned during cutting and removal, the tips of the inner leads 4 will be torn off, and burrs and bends will occur. Therefore, conventionally, there has been a problem that the tip of the inner lead 4 may be damaged in the shirring step immediately before the inner lead bonding step, which causes a reduction in manufacturing yield of the semiconductor device.

[Means for solving the problem]

In order to solve the above problems, the present invention is a TA in which a conductive film is etched to extend a large number of inner leads into the through holes and each inner lead inner end is connected to a suspender portion.
B Adhesive hole for adsorbing the suspender part is opened on the lower end surface of the bonding tool that crimps the inner lead of the tape and the overlapped part of the semiconductor pellet, and a cutting blade that cuts the adjacent part of the inner lead and the suspender part is protrudingly provided. Is characterized by.

[Action]

With the above configuration, when the bonding tool is lowered onto the TAB tape, the crimping surface thermocompresses the tip portion of each inner lead to the bump electrode of the semiconductor pellet, and the cutting formed inside the bump electrode pressing portion on this crimping surface. A blade cuts the tip of each inner lead. Then, when the bonding tool rises after the completion of thermocompression bonding, the separated suspender portion is adsorbed and removed.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

1 to 3 show an embodiment of the present invention. FIG. 1 is a perspective view of an inner lead bonder, FIG. 2 is a perspective view of a crimping surface of a bonding tool, and FIG. ) ~
(C) is a partial vertical cross-sectional view showing each step of thermocompression bonding with a bonding tool. Incidentally, the same numbers are added to the constituent members having the same functions as those of the conventional example shown in FIG. 4 and FIG.

In the inner lead bonder of this embodiment, as shown in FIG. 1, the semiconductor pellet 1 is placed in the window portion (through hole) 3a of the TAB tape 2.
Are placed inside, and each inner lead 4 on this TAB tape 2
And bump electrodes (not shown) on the semiconductor pellet 1 are polymerized, and the tip of each inner lead 4 is pressed by the pressure bonding surface 5a at the lower end of the heated bonding tool 5 to perform thermocompression bonding with the bump electrodes. Used here
The TAB tape 2 is formed by laminating a copper foil on a long insulating film 3 on which a window portion 3a is formed in advance and removing the copper foil while leaving each pattern of the inner leads 4 removed. However, in the window portion 3a, the copper suspender portion 6 made of a rectangular copper foil pattern connecting the tips of the inner leads 4 protruding here is also left.

As shown in FIG. 2, the crimping surface 5a of the bonding tool 5 is formed with a cutting edge 7 having four edges so as to surround an inner portion from the peripheral edge by a predetermined distance. The cutting blade 7 has a tip ridge line portion protruding from the crimping surface 5a in an acute angle. The bump height of the bump electrode 1a is 50 to 100 μm, and the thickness of the inner lead 4 is 30 μm.
In the case of, it is about 40 μm. The cutting blade 7 is formed by electrical discharge machining here because it is difficult to embed it in the bonding tool 5 or grind it. The pressure-bonding surface 5a formed outside the cutting blade 7 thus formed serves as a pressing portion for pressing the bump electrode of the semiconductor pellet 1 during thermocompression bonding. Further, a plurality of suction holes 8 are opened on the pressure-bonding surface 5a inside the cutting blade 7. The suction hole 8 is connected to an external vacuum pump 9 via a ventilation path 8a formed inside the bonding tool 5.

An inner lead bonding process using the inner lead bonder configured as described above will be described with reference to FIG. As shown in FIG. 3A, the tip of each inner lead 4 is located on each bump electrode 1a of the semiconductor pellet 1 while being connected to the copper suspender portion 6. Then, the bonding tool 5 heated in this state starts to descend. As the bonding tool 5 is lowered, as shown in FIG. 3B, when the pressure bonding surface 5a presses the tip portions of the inner leads 4 against the bump electrodes 1a, the tip portions of the inner leads 4 and their respective bump electrodes 1a. It will be thermocompression bonded with 1a. Further, at this time, the cutting blade 7 bends the tip end side of the thermocompression-bonded portion of the inner lead 4 with the bump electrode 1a downward by an acute-angled ridge line, so that the inner lead 4 is more firmly attached to the bump electrode 1a. While assisting thermocompression bonding, the tip of the inner lead 4 and the copper suspender portion 6 are cut off, or
Make it easy to cut. If the protruding height of the cutting blade 7 is set to about 40 μm as described above, a margin of about 40 to 90 μm can be obtained between the cutting blade 7 and the surface of the semiconductor pellet 1.
When the thermocompression bonding by the pressure bonding surface 5a is completed, as shown in FIG. 3 (C), the bonding tool 5 starts to move upward, and the vacuum pump 9 shown in FIG. Be seen. Then, the copper suspender portion 6 is attracted to the suction holes 8 and rises together with the bonding tool 5, so that the copper suspender portion 6 is already thermocompression-bonded to the bump electrode 1a, and the tip end side of the copper suspender portion 6 is bent by the cutting blade 7 from the tip of the inner lead 4. The gap between them is surely cut.

As a result, according to the inner lead bonder of this embodiment,
The tip of each inner lead 4 on the TAB tape 2 can be protected by the copper suspender portion 6 until the moment of being thermocompression bonded to the bump electrode 1a. Moreover, after thermocompression bonding, the copper suspender portion 6 can be reliably removed by suction of the suction holes 8.

Incidentally, the present invention is not limited to the above-mentioned embodiment, and for example, the TAB tape may be not only the insulating film on which the conductive film is laminated but also the conductive tape which is etched to form the inner leads. .

Further, the suction hole portion may be capable of projecting and retracting with respect to the cutting blade.

[Effect of device]

As is apparent from the above description, according to the inner lead bonder of the present invention, the tip end of each inner lead on the TAB tape can be protected by the suspender portion until the moment when the bump electrodes of the semiconductor pellet are thermocompressed. Therefore, it is possible to eliminate a defect in inner lead bonding due to bending of the tip portion of the inner lead, and moreover,
Since the suspender portion can be reliably removed after the thermocompression bonding, there is an effect that the work is not wasted and the productivity can be improved.

[Brief description of drawings]

1 to 3 show an embodiment of the present invention. FIG. 1 is a perspective view of an inner lead bonder, FIG. 2 is a perspective view of a crimping surface of a bonding tool, and FIG. ) ~
(C) is a partial vertical sectional view showing each step of thermocompression bonding by a bonding tool, FIGS. 4 and 5 show a conventional example, and FIG. 4 is a perspective view of an inner lead bonder, and FIG. The figure is a perspective view of the TAB tape. 1 ... Semiconductor pellet, 2 ... TAB tape, 3a ... Window part (through hole), 4 ... Inner lead, 5 ... Bonding tool, 5a ... Crimping surface, 6 ... Copper suspender part (suspender part) , 7 ... Cutting blade, 8 ... Suction hole.

Claims (1)

[Scope of utility model registration request] 1. A conductive film is etched to extend a large number of inner leads into the through holes, and the inner leads of a TAB tape in which the inner ends of each inner lead are connected to a suspender portion are pressure-bonded to the superposed portion of a semiconductor pellet. An inner lead bonder characterized in that a cutting blade that opens a suction hole for sucking a suspender portion and cuts an adjacent portion of the inner lead and the suspender portion is provided on a lower end surface of the bonding tool.