JPH045642U - - Google Patents
Info
- Publication number
- JPH045642U JPH045642U JP4628790U JP4628790U JPH045642U JP H045642 U JPH045642 U JP H045642U JP 4628790 U JP4628790 U JP 4628790U JP 4628790 U JP4628790 U JP 4628790U JP H045642 U JPH045642 U JP H045642U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- suspender
- bonding tool
- end surface
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図乃至第３図は本考案の一実施例を示すも
のであつて、第１図はインナリードボンダの斜視
図、第２図はボンデイングツールの圧着面の斜視
図、第３図イ〜ハはそれぞれボンデイングツール
による熱圧着の各工程を示す部分縦断面図、第４
図及び第５図は従来例を示すものであつて、第４
図はインナリードボンダの斜視図、第５図はＴＡ
Ｂテープの斜視図である。
１……半導体ペレツト、２……ＴＡＢテープ、
３ａ……窓部（透孔）、４……インナリード、５
……ボンデイングツール、５ａ……圧着面、６…
…銅サスペンダ部（サスペンダ部）、７……切断
刃、８……吸着孔。
1 to 3 show an embodiment of the present invention, in which FIG. 1 is a perspective view of the inner lead bonder, FIG. 2 is a perspective view of the crimping surface of the bonding tool, and FIGS. C is a partial vertical cross-sectional view showing each process of thermocompression bonding using a bonding tool, and
4 and 5 show conventional examples.
The figure is a perspective view of the inner lead bonder, and Figure 5 is a TA
It is a perspective view of B tape. 1... Semiconductor pellet, 2... TAB tape,
3a... Window (through hole), 4... Inner lead, 5
...Bonding tool, 5a...Crimping surface, 6...
...Copper suspender part (suspender part), 7... Cutting blade, 8... Suction hole.
Claims (1)
ナリードを延在させると共に各インナリード内端
をサスペンダ部に連結したＴＡＢテープのインナ
リードと半導体ペレツトの重合部を圧着するボン
デイングツールの下端面に、サスペンダ部を吸着
する吸着孔を開口しかつインナリードとサスペン
ダ部の隣接部分を切断する切断刃を突設したこと
を特徴とするインナリードボンダ。 The lower end surface of a bonding tool that etches the conductive film to extend a large number of inner leads into the through-hole, and connects the inner ends of each inner lead to the suspender part.The lower end surface of the bonding tool presses the overlapping part of the semiconductor pellet and the inner lead of the TAB tape. An inner lead bonder characterized in that the suction hole for suctioning the suspender portion is opened and a cutting blade for cutting the adjacent portion of the inner lead and the suspender portion is provided in a protruding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4628790U JPH08758Y2 (en) | 1990-04-26 | 1990-04-26 | Inner lead bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4628790U JPH08758Y2 (en) | 1990-04-26 | 1990-04-26 | Inner lead bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH045642U true JPH045642U (en) | 1992-01-20 |
| JPH08758Y2 JPH08758Y2 (en) | 1996-01-10 |
Family
ID=31561239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4628790U Expired - Lifetime JPH08758Y2 (en) | 1990-04-26 | 1990-04-26 | Inner lead bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08758Y2 (en) |
-
1990
- 1990-04-26 JP JP4628790U patent/JPH08758Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08758Y2 (en) | 1996-01-10 |