JPH087634Y2 - TAB semiconductor device - Google Patents

Description

TECHNICAL FIELD The present invention relates to a Tape Automted Bonding (TAB) type semiconductor device.

2. Description of the Related Art An example of a TAB type semiconductor device will be described with reference to FIG.

In the figure, reference numeral 1 is an insulating film having a through hole 1a. 2 is a conductive pattern laminated on the insulating film 1,
An inner lead 2a is formed by extending a part of it into the through hole 1a. 3 is a semiconductor pellet having bump electrodes 3a,
The bump electrode 3a is arranged in the through hole 1a, and the bump electrode 3a and the inner lead 2a are electrically connected by means such as thermocompression bonding.

This TAB type semiconductor device is continuously formed on a TAB tape 4 in which a conductive pattern 2 is laminated on an insulating film 1 and is separated into individual semiconductor devices by an outer lead outside the through hole 1a although not shown.

By the way, in this semiconductor device, the inner lead 2a is thin and thin, so that it is easily deformed, and there is a possibility that the TAB tape 4 may be deformed in the manufacturing process or the inner lead 2a may be deformed when an external force is applied to the semiconductor pellet 3.

On the other hand, the bump electrode 3a has a height of about several tens of μm, and when the inner lead 2a is deformed, the inner lead 2a may approach the edge portion of the semiconductor pellet 3 or may contact in the worst case, which may cause a decrease in withstand voltage or a short circuit accident. There is.

Therefore, as shown in FIG. 4, the inner lead 2a is pressed and deformed to secure a space between the inner lead 2a and the edge portion of the semiconductor pellet 3, and as shown in FIG. With pellet 3
The TAB tape 4 is covered with the resin 5 for protection.

However, in the semiconductor device shown in FIG.
When external force is applied to the inner lead 2a or the inner lead 2a, problems such as withstand voltage drop, short circuit, and wire breakage could not be completely solved.

Further, the semiconductor device in FIG. 5 is fixed as it is if the lead is deformed at the time of encapsulation, and when the resin 5 is cured, the lead may be broken, the lead may be detached, the tape may be distorted due to resin contraction, and the reliability may be lowered. there were.

Means for Solving the Problems The present invention has been proposed for the purpose of solving the above problems, in which a conductive pattern is laminated on an insulating film having a through hole so that a part of the conductive pattern extends into the through hole. TA that electrically connects the conductive pattern and the semiconductor pellet at the through hole position
A B-type semiconductor device is provided, in which an insulating cap having an emboss that presses a semiconductor pellet through a conductive pattern is attached to the through hole.

Effect According to the present invention, by embedding the conductive pattern along the embossing of the insulating cap, it is possible to form and fix the lead without twisting deformation of the lead, and the TAB does not have withstand voltage drop or short circuit.
Type semiconductor device can be realized.

Embodiment An embodiment of the present invention will be described below with reference to FIG. In the figure, the same reference numerals as those in FIG. In the figure, 6 is an insulating cap, and as shown in FIG. 2, the opening 6b is smaller than the through hole 1a and the bottom 6c is slightly smaller than the semiconductor pellet 3 by embossing in the central portion of the rectangular flat insulating film 6a. 6d is inclined. The embossed 6e is inserted into the through hole 1a and presses the semiconductor pellet 3 through the conductive pattern (inner lead) 2a, the inner lead 2a is molded along the side wall 6d, and the flat plate portion 6a is fixed to the TAB tape 4. There is. An adhesive may be used for fixing,
It may be directly welded.

As a result, the through hole 1a of the TAB tape 4 is not covered with the insulating cap 6.
The TAB tape 4 is less likely to be bent and deformed because it is occluded by the embossing 6e and is reinforced by the embossing 6e. Also, the positions of the inner leads 2a and the semiconductor pellets 3 that are mounted on the TAB tape 4 are fixed by the insulating cap 6, so that the leads are Bend,
It is possible to realize a reliable semiconductor device in which leads do not come off, a short circuit does not occur, and a withstand voltage is sufficiently maintained.

The present invention is not limited to the above embodiment, and the inner lead 2a and the semiconductor pellet 3 may be resin-sealed to the insulating cap 6, for example. In this case, holes may be drilled at appropriate positions on the insulating cap 6.

As described above, according to the present invention, by integrating the TAB tape and the insulating cap, the inner lead is molded and protected by the insulating cap, and lead bending and undesired deformation are prevented. .

Further, the resin shrinkage at the time of resin sealing is alleviated by the insulating cap, the lead cutting, the lead detachment, and the tape distortion are prevented, and the semiconductor device without the withstand voltage drop and the short circuit can be realized.

[Brief description of drawings]

1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a partial sectional perspective view of an insulating cap, and FIGS. 3 to 5 are side sectional views showing an example of a TAB semiconductor device. . 1 ... Insulating film, 1a ... Through hole, 2 ... Conductive pattern, 2a ... Inner lead, 3 ... Semiconductor pellet, 4 ...
… TAB tape, 6… Insulation cap, 6e… Emboss.

Claims (1)

[Scope of utility model registration request] 1. A TAB in which a conductive pattern is laminated on an insulating film having a through hole so that a part of the conductive pattern extends into the through hole, and the conductive pattern and the semiconductor pellet are electrically connected at the position of the through hole. A TAB type semiconductor device, wherein an insulating cap having an emboss for pressing the semiconductor pellet through the conductive pattern is attached to the through hole.