JPH0878274A - Production of ceramic electronic parts - Google Patents
Production of ceramic electronic partsInfo
- Publication number
- JPH0878274A JPH0878274A JP6229050A JP22905094A JPH0878274A JP H0878274 A JPH0878274 A JP H0878274A JP 6229050 A JP6229050 A JP 6229050A JP 22905094 A JP22905094 A JP 22905094A JP H0878274 A JPH0878274 A JP H0878274A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- material layer
- layer
- conductor
- ceramic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 94
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 33
- 238000004544 sputter deposition Methods 0.000 claims abstract description 23
- 238000001962 electrophoresis Methods 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims description 72
- 239000000843 powder Substances 0.000 claims description 36
- 238000007740 vapor deposition Methods 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 19
- 238000004070 electrodeposition Methods 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 9
- 239000003989 dielectric material Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 138
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 26
- 239000000463 material Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 229910052697 platinum Inorganic materials 0.000 description 13
- 239000010408 film Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 241000772415 Neovison vison Species 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層セラミックコンデ
ンサ等のセラミック層と導電体層を有するセラミック電
子部品の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component having a ceramic layer such as a laminated ceramic capacitor and a conductor layer.
【０００２】[0002]
【従来の技術】積層セラミックコンデンサ等のセラミッ
ク電子部品をプリント基板に搭載して使用することが多
く行われている。この積層セラミックコンデンサは、セ
ラミック誘電体層と内部電極を交互に積層し、内部電極
をセラミック誘電体層を挟んで対向させ、かつその内部
電極の端部を交互に反対側に導出した構造を有するもの
であるが、その製造を行うにはセラミック誘電体粉末を
液中に分散させて得たスラリーをドクタブレード等を用
いて所定の厚みのグリーンシートを作成し、これに金属
材料ペーストを内部電極の所定のパターンにスクリーン
印刷し、ついで、この金属材料ペーストを印刷したグリ
ーンシートを数１０枚ないし数１００枚重ねて、圧着
し、積層体を得る。この積層体は多数の積層セラミック
コンデンサ単位を有するように作成されるので、各単位
毎に裁断される。裁断されたそれぞれの個別体は９００
℃以上で焼成される。そしてその焼成体の両端面に上記
した金属材料ペースト印刷膜の焼成体である内部電極と
接続する外部電極を形成し、積層セラミックコンデンサ
が得られる。近年、電子機器の小型化が進み、機器内に
電子部品を高密度に設けることが要求されており、これ
に応えるために、セラミック電子部品、特に積層セラミ
ックコンデンサはその小型化、大容量化が必要となって
きており、積層セラミックコンデンサの１層の厚さを５
μｍ以下にすることが当面の課題となっている。2. Description of the Related Art Ceramic electronic components such as monolithic ceramic capacitors are often mounted on a printed circuit board for use. This laminated ceramic capacitor has a structure in which ceramic dielectric layers and internal electrodes are alternately laminated, the internal electrodes are opposed to each other with the ceramic dielectric layer sandwiched therebetween, and the ends of the internal electrodes are alternately led out to the opposite side. In order to manufacture it, the slurry obtained by dispersing the ceramic dielectric powder in the liquid is used to make a green sheet of a predetermined thickness using a doctor blade, etc. Is screen-printed on a predetermined pattern, and then several tens to several hundreds of green sheets printed with this metal material paste are stacked and pressure-bonded to obtain a laminate. Since this laminated body is made to have a large number of laminated ceramic capacitor units, it is cut into individual units. Each individual body cut is 900
It is baked at ℃ or above. Then, external electrodes connected to the internal electrodes, which are the fired bodies of the metal material paste printed film, are formed on both end faces of the fired body, and a laminated ceramic capacitor is obtained. In recent years, electronic devices have been downsized, and it has been required to provide electronic components with high density in the devices. To meet this demand, ceramic electronic components, especially monolithic ceramic capacitors, are required to be downsized and have a large capacity. It is becoming necessary to reduce the thickness of one layer of a monolithic ceramic capacitor to 5
The issue for the time being is to make the thickness below μm.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うに積層セラミックコンデンサの１層当たりの厚さが薄
くなると、１層当たりのセラミック層にかかる電圧が大
きくなり、電流のリークの問題を生じ易くなるが、上記
した従来の積層セラミックコンデンサの製造方法では、
グリーンシートを作成するときにセラミック誘電体粉末
をシート状に保つために必要な有機バインダ（樹脂分、
溶剤等からなる）を上記したように積層体を裁断して得
た各個別体を焼成するときに分解揮発させて除去するの
で、その通過跡に空孔が残り、これが電流のリークの原
因となり、所定の容量を得ることができないという問題
を生じる。これは積層セラミックコンデンサを得る際の
障害となっており、緻密な組織の欠陥のないセラミック
ス層を有する積層セラミックコンデンサの出現が望まれ
ている。また、セラミック層の厚さが５μｍ以下になる
と、内部電極層の厚みも薄膜とするのでなければ得られ
る積層セラミックコンデンサの小型化ができなくなり、
通常の膜厚のまま小型化しようとすればセラミック層の
数が相対的に減ることになるから大容量化も実現できな
くなるが、従来の金属材料ペーストをスクリーン印刷す
る方法では、この薄膜を連続的に信頼性高く作成するそ
の薄膜化には限界があり、１μｍ以下の膜厚にすること
は難しく、さらにその塗布膜の厚みのバラツキもあると
いう問題があった。また、上記のようにグリーンシート
を用いる方法では、そのシートの形成工程、圧着工程が
必要であり、その設備が必要であるとともに、工程が多
く、その改善が望まれていた。電子部品の小型化という
課題は、他の積層セラミックインダクタ、積層セラミン
クトランス、積層ＬＣ部品、さらにはこれらに電子回路
を組み込んだ複合電子部品や、多層基板等においても同
じである。However, when the thickness of one layer of the monolithic ceramic capacitor is reduced as described above, the voltage applied to the ceramic layer per layer is increased, and the problem of current leakage is likely to occur. However, in the above-described conventional method for manufacturing a monolithic ceramic capacitor,
The organic binder (resin content, necessary to keep the ceramic dielectric powder in sheet form when creating the green sheet,
(Being composed of a solvent, etc.) is decomposed and volatilized and removed when firing each individual body obtained by cutting the laminated body as described above, so holes remain in the traces of passage, which causes current leakage. However, there arises a problem that a predetermined capacity cannot be obtained. This is an obstacle in obtaining a monolithic ceramic capacitor, and the advent of a monolithic ceramic capacitor having a ceramic layer having a dense structure and no defects is desired. Further, when the thickness of the ceramic layer is 5 μm or less, the obtained monolithic ceramic capacitor cannot be downsized unless the thickness of the internal electrode layer is thin.
If you try to reduce the size with the normal film thickness, the number of ceramic layers will decrease relatively, so you cannot achieve a large capacity.However, in the conventional method of screen-printing metal material paste, this thin film is There is a limit to how thin the film can be made with high reliability, and it is difficult to achieve a film thickness of 1 μm or less, and there is a problem that the thickness of the coating film also varies. Further, in the method using the green sheet as described above, the sheet forming step and the pressure-bonding step are required, the equipment is required, and there are many steps, and improvement thereof has been desired. The problem of miniaturization of electronic components is the same in other laminated ceramic inductors, laminated ceramic mink transformers, laminated LC components, composite electronic components in which an electronic circuit is incorporated therein, and multilayer substrates.
【０００４】本発明の第１の目的は、小型化できるセラ
ミック電子部品の製造方法を提供することにある。本発
明の第２の目的は、電流のリークのない耐電圧の高い
（またはセラミック素体層に空孔のない）セラミック電
子部品の製造方法を提供することにある。本発明の第３
の目的は、厚みのバラツキがなく、緻密で均一な内部電
極の薄膜化が可能なセラミック電子部品の製造方法を提
供することにある。本発明の第４の目的は、大容量化の
できるセラミックコンデンサの製造方法を提供すること
にある。本発明の第５の目的は、簡易な設備で生産工程
の単純なセラミック電子部品の製造方法を提供すること
にある。A first object of the present invention is to provide a method of manufacturing a ceramic electronic component which can be miniaturized. A second object of the present invention is to provide a method of manufacturing a ceramic electronic component having a high withstand voltage (or having no pores in the ceramic body layer) without current leakage. Third of the present invention
It is an object of the present invention to provide a method of manufacturing a ceramic electronic component, which is capable of forming a dense and uniform thin internal electrode without variation in thickness. A fourth object of the present invention is to provide a method of manufacturing a ceramic capacitor that can have a large capacity. A fifth object of the present invention is to provide a method for manufacturing a ceramic electronic component with a simple production process using simple equipment.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記課題を解
決するために、（１）、セラミックス層と導電体層を有
するセラミック電子部品において、該セラミックス層は
セラミックス粉末を電着液中の粒子に用いて電気泳動法
により形成したセラミック材料層の焼成体を有し、該導
電体層はスパッタリング法又は蒸着法により形成するセ
ラミック電子部品の製造方法を提供するものである。ま
た、本発明は、（２）、セラミックス粉末を電着液中の
粒子に用いて電気泳動法によりセラミックス材料層を形
成するセラミックス材料層形成工程と、スパッタリング
法若しくは蒸着法により導電体層を形成する導電体形成
工程と、該セラミックス材料層形成工程と該導電体形成
工程を有することにより得られる積層体を焼成する工程
を有するセラミック電子部品の製造方法、（３）、積層
体はセラミック材料層と、内部導体となる導電体層を順
次積層し、最後にセラミック材料層を積層した構造体で
あり、該セラミック材料層の第１のセラミック材料層は
セラミックス粉末を分散させた電着液中に設けた導電板
に通電する電気泳動法により該導電板上に形成されたセ
ラミックス材料層であり、該導電体層の第１の導電体層
はスパッタリング法若しくは蒸着法により該第１のセラ
ミック材料層に選択的に形成した導電体層であり、該セ
ラミック材料層の第２以後のセラミック材料層及び該導
電体層の第２以後の導電体層はそれぞれ先行の導電体層
及びセラミック材料層を形成した導電板をそれぞれセラ
ミックス粉末を分散させた電着液中に設けた電気泳動法
及びスパッタリング法若しくは蒸着法により順次形成し
た上記（２）のセラミック電子部品の製造方法、
（４）、セラミック材料層に選択的に形成する導電体層
は必要箇所が導電体粒子を通過可能でありそれ以外は通
過不能でありかつ取り外し可能のマスクを介して該セラ
ミック材料層に導電体粉末をスパッタリング若しくは蒸
着法により形成する上記（３）のセラミック電子部品の
製造方法、（５）、セラミック材料層はセラミック誘電
体材料層であり、導電体材料層は内部電極材料層であ
り、積層体の焼成体は積層セラミック素体であり、積層
セラミックコンデンサを製造する上記（３）又は（４）
のセラミック電子部品の製造方法を提供するものであ
る。In order to solve the above-mentioned problems, the present invention provides (1) a ceramic electronic component having a ceramic layer and a conductor layer, wherein the ceramic layer contains a ceramic powder in an electrodeposition solution. The present invention provides a method for manufacturing a ceramic electronic component, which has a fired body of a ceramic material layer formed by an electrophoretic method using particles, and the conductor layer is formed by a sputtering method or a vapor deposition method. Further, the present invention includes (2) a ceramic material layer forming step of forming a ceramic material layer by an electrophoretic method using ceramic powder as particles in an electrodeposition liquid, and forming a conductor layer by a sputtering method or a vapor deposition method. A step of forming a conductor, a step of forming the ceramic material layer, and a step of firing the laminate obtained by the step of forming the conductor, (3), the laminate is a ceramic material layer And a conductor layer serving as an internal conductor are sequentially laminated, and finally a ceramic material layer is laminated, and the first ceramic material layer of the ceramic material layer is formed in an electrodeposition liquid in which ceramic powder is dispersed. The first conductor layer of the conductor layer is a ceramic material layer formed on the conductor plate by an electrophoretic method in which the conductor plate is energized. Is a conductor layer selectively formed on the first ceramic material layer by a sputtering method or a vapor deposition method, and the second and subsequent ceramic material layers of the ceramic material layer and the second and subsequent conductor layers of the conductor layer are A ceramic plate according to the above (2), in which conductive plates on which the preceding conductor layers and ceramic material layers have been formed are respectively formed in an electrodeposition liquid in which ceramic powder is dispersed by an electrophoresis method and a sputtering method or an evaporation method. Parts manufacturing method,
(4) The conductor layer selectively formed on the ceramic material layer allows the conductor particles to pass through the necessary portions, and the other portions cannot pass through the conductor layer, and the conductor is formed on the ceramic material layer through a removable mask. (3) The method for manufacturing a ceramic electronic component according to the above (3), wherein the powder is formed by a sputtering or vapor deposition method, (5), the ceramic material layer is a ceramic dielectric material layer, the conductor material layer is an internal electrode material layer, and laminated. The fired body of the body is a monolithic ceramic body, which is used for manufacturing a monolithic ceramic capacitor (3) or (4) above.
The present invention provides a method for manufacturing a ceramic electronic component of the above.
【０００６】上記のほかに、（７）、セラミック材料層
はセラミック磁性体材料層であり、導電体層はインダク
タの導体の一部を形成する内部電極層であり、積層体の
焼成体は積層セラミックインダクタ素体であり、積層セ
ラミックインダクタを製造する上記（３）又は（４）の
セラミック電子部品の製造方法、（８）、積層体の焼成
体は上記（５）の積層セラミックコンデンサ素体と上記
（７）の積層セラミックインダクタ素体の複合体であ
り、積層セラミックＬＣ部品を製造する上記（３）又は
（４）のセラミック電子部品の製造方法を提供すること
ができ、また、（９）、積層体の焼成体が多層基板であ
る上記（２）のセラミック電子部品の製造方法も提供で
きる。In addition to the above, (7), the ceramic material layer is a ceramic magnetic material layer, the conductor layer is an internal electrode layer forming a part of the conductor of the inductor, and the fired body of the laminated body is a laminated body. A ceramic inductor body, which is a method for manufacturing a ceramic electronic component according to (3) or (4) above for manufacturing a laminated ceramic inductor, (8), wherein the fired body of the laminated body is the laminated ceramic capacitor body according to (5) above. A method for producing a ceramic electronic component according to the above (3) or (4), which is a composite of the laminated ceramic inductor element body according to (7) above, can be provided, and (9). It is also possible to provide the method for manufacturing a ceramic electronic component according to the above (2), in which the fired body of the laminated body is a multilayer substrate.
【０００７】本発明において、セラミックス粉末とは、
チタン酸系の誘電体材料粉末、フェライト系の磁性材料
粉末その他通常のセラミック電子部品に用いられるセラ
ミックス粉末を言う。チタン酸系の誘電体材料粉末とし
ては、ＢａＴｉＯ3 、Ｐｂ（Ｍｇ，Ｎｂ）Ｏ3 等が挙げ
られ、フェライト系の磁性材料粉末としては、Ｍｎ−Ｚ
ｎ系、Ｎｉ−Ｚｎ系、Ｎｉ−Ｚｎ−Ｃｕ系、Ｍｇ−Ｚｎ
系等のフェライトが挙げられ、これらはそれぞれの対応
する原料粉末を仮焼し、その仮焼物を粉砕して得られ
る。これらセラミックス粉末の形状、大きさ、粒径分布
としては均一で微細なものが好ましい。電着液の溶媒と
しては、乾燥等を考えれば、有機溶剤が好ましく、例え
ばアセトン、アルコール類、ケトン類、アルデヒド類、
エステル類等の電離効果の大きい極性溶媒その他の溶媒
が使用でき、これらは単独又は複数併用することができ
る。In the present invention, ceramic powder means
Titanic acid-based dielectric material powder, ferrite-based magnetic material powder, and other ceramic powders used for ordinary ceramic electronic parts. Examples of the titanic acid-based dielectric material powder include BaTiO 3 , Pb (Mg, Nb) O 3 and the like, and examples of the ferrite-based magnetic material powder include Mn-Z.
n-based, Ni-Zn-based, Ni-Zn-Cu-based, Mg-Zn
Examples include ferrites such as those of the series, which are obtained by calcining the corresponding raw material powders and crushing the calcined product. The shape, size, and particle size distribution of these ceramic powders are preferably uniform and fine. The solvent of the electrodeposition liquid is preferably an organic solvent in consideration of drying and the like, for example, acetone, alcohols, ketones, aldehydes,
A polar solvent having a large ionization effect such as esters and other solvents can be used, and these can be used alone or in combination.
【０００８】本発明においては、電気泳動法によりセラ
ミック材料層を形成し、このセラミック材料層にスパッ
タリング又は蒸着法により形成した導電体層を有する
が、その複数の導電体層の一部を電気泳動法により形成
した導電体材料層の焼成体で構成しても良い。電気泳動
法によりセラミック材料層、導電体材料層を形成するに
は、セラミックス粉末又は導電体粉末を分散させたスラ
リーに、１組以上の陽極と陰極となる導電体、例えば金
属板又はマスクを張り付けた金属板を浸漬させ、陽極と
陰極に電圧を印加し、セラミックス粉末又は導電体粉末
を電気泳動により付着させる（電着ともいう）ことによ
り形成できるが、さらに例えばセラミック材料層の上に
導電体材料層を形成しようとするときは、セラミック材
料層を形成した電極を用い、導電体材料粉末を含む電着
液を用いて電着を行なう。導電体材料層にセラミック材
料層を形成する場合もこれに準じて行う。この際、導電
体材料層が後の焼成により例えば積層セラミックコンデ
ンサや積層セラミックインダクタの内部電極となるもの
であるときは、セラミック材料層に選択的に形成されな
ければならず、そのために上記マスクを用いるが、この
マスクとしては、必要箇所が電着液中の荷電粒子を通過
可能でありそれ以外は通過不能でありかつ取り外し可能
又は着脱自在であることが好ましく、具体的には高分子
フィルム、金属板、セラミックス板等を容易に剥離可能
な接着剤で張りつけることが挙げられる。In the present invention, the ceramic material layer is formed by the electrophoretic method, and the ceramic material layer has the conductor layer formed by the sputtering or vapor deposition method. However, a part of the plurality of conductor layers is electrophoresed. It may be constituted by a fired body of a conductor material layer formed by a method. In order to form the ceramic material layer and the conductor material layer by the electrophoretic method, one or more sets of conductors serving as an anode and a cathode, for example, a metal plate or a mask is attached to a slurry in which ceramic powder or conductor powder is dispersed. It can be formed by dipping a metal plate, applying a voltage to the anode and cathode, and adhering ceramic powder or conductor powder by electrophoresis (also referred to as electrodeposition). For example, a conductor can be formed on the ceramic material layer. When the material layer is to be formed, the electrode on which the ceramic material layer is formed is used and electrodeposition is performed using the electrodeposition liquid containing the conductor material powder. The same applies to the case of forming the ceramic material layer on the conductor material layer. At this time, when the conductor material layer is to be an internal electrode of a monolithic ceramic capacitor or a monolithic ceramic inductor by subsequent firing, for example, it must be selectively formed in the ceramic material layer, and therefore the mask is As this mask, it is preferable that this mask is capable of passing the charged particles in the electrodeposition liquid, and is otherwise impermeable and removable or detachable, specifically, a polymer film, Examples of the method include attaching a metal plate, a ceramic plate, or the like with an easily peelable adhesive.
【０００９】これらのマスクを付した例えばセラミック
材料層を有する電極を用いて導電体粉末の電着を行え
ば、そのマスクを通過した導電体粉末の荷電粒子だけが
セラミック材料層に電着され、選択的にセラミック材料
層を形成することができる。このようにして、電気泳動
用電極として用いた金属板にセラミック材料層を形成
し、さらにその上に導電体材料層を選択的に形成できる
が、さらにセラミック材料層を形成するには、これらの
材料層を形成した金属板を電極に用いて最初にセラミッ
ク材料層を電着により形成した場合と同様に操作すれば
良く、以下同様に導電体材料層、セラミック材料層を形
成でき、全体で数十層ないし数百層の積層を行うことが
できる。電極間には直流電圧が印加されるが、その電圧
は例えば電極間距離１ｃｍ当たり５０〜１０００ボルト
が挙げられるがこれに限らず、通電時間も数１０分ない
し数時間が例示される。電圧が高いと、セラミック粉末
の被覆速度は大きくなり、通電時間が長ければその被覆
膜の厚さは大きくなる。電着を行うときの電極の形状
は、最初開口のない平板電極を使用してセラミック材料
層を形成し、それからその電極からセラミック材料層を
剥がし、ついで例えば積層セラミックコンデンサの内部
電極と同じ形状の電極をそのセラミック材料層に付着さ
せて導電体粒子の電着を行うことにより、セラミック材
料層に任意の形状の導電体材料層を形成できる。When the conductor powder is electrodeposited by using an electrode having such a masked ceramic material layer, for example, only the charged particles of the conductor powder that have passed through the mask are electrodeposited on the ceramic material layer, The ceramic material layer can be selectively formed. In this way, the ceramic material layer can be formed on the metal plate used as the electrode for electrophoresis, and the conductor material layer can be selectively formed thereon. The same operation as in the case where the ceramic material layer is first formed by electrodeposition by using the metal plate on which the material layer is formed as the electrode can be performed.Hereafter, the conductor material layer and the ceramic material layer can be formed in the same manner. It is possible to stack ten layers to several hundred layers. A DC voltage is applied between the electrodes, and the voltage is, for example, 50 to 1000 V per 1 cm between the electrodes, but is not limited to this, and the energization time is, for example, several tens of minutes to several hours. The higher the voltage, the higher the coating speed of the ceramic powder, and the longer the energization time, the thicker the coating film. The shape of the electrode when electrodeposition is performed is to first form a ceramic material layer using a flat plate electrode without openings, then peel the ceramic material layer from that electrode, and then, for example, use the same shape as the internal electrode of a monolithic ceramic capacitor. By attaching electrodes to the ceramic material layer and electrodepositing the conductive particles, a conductive material layer having an arbitrary shape can be formed on the ceramic material layer.
【００１０】上記は、導電体材料層を電気泳動法により
形成し、その焼成体を内部電極等の一部の導電体層とす
る場合であるが、導電体層としては少なくともスパッタ
リング法又は蒸着法により形成された導電体層を有する
ことが必須である。これらスパッタリング法又は蒸着法
は、上記のように形成された金属板上のセラミック材料
層に対して行われるが、その導電体層が後の焼成により
例えば積層セラミックコンデンサや積層セラミックイン
ダクタの内部電極となるものであるときは、セラミック
材料層に選択的に形成されなければならず、そのために
は上記と同様のマスクを用いるが、このマスクとして
は、必要箇所がスパッタリング又は蒸着の際に発生する
粒子を通過可能でありそれ以外は通過不能でありかつ取
り外し可能又は着脱自在であることが好ましく、具体的
には高分子フィルム、金属板、セラミックス板等を容易
に剥離可能な接着剤で張りつけることが挙げられる。ス
パッタリング法又は蒸着法による導電体層の導電体とし
ては、銀、銅、パラジウム、ニッケル等の金属のいずれ
か又はこれら各々の合金等の金属を挙げることができる
が、これに限らず、スパッタリング、蒸着を行えるもの
であれば良い。なお、スパッタリングとは、例えば金属
を陰極とし、相手電極との間に、真空中又はそれに近い
状態で高圧を印加することにより、金属を飛び散らせて
相手の電極に付着させ、薄膜を形成することをいい、蒸
着とは、真空又はそれに近い状態で物質を加熱して蒸発
させ、基材に付着させて薄膜を形成することをいう。な
お、電気泳動法による導電体層は、上記金属、その他カ
ーボン、さらにはこれら導電体を含有する樹脂を電気泳
動法により形成した導電体材料層を焼成して得ることが
できる。The above is the case where the conductor material layer is formed by the electrophoretic method and the fired body is used as a part of the conductor layer such as the internal electrode. At least the sputtering method or the vapor deposition method is used as the conductor layer. It is essential to have a conductor layer formed by. The sputtering method or the vapor deposition method is performed on the ceramic material layer on the metal plate formed as described above, and the conductor layer is formed by the subsequent firing, for example, as an internal electrode of a multilayer ceramic capacitor or a multilayer ceramic inductor. If it is, it must be selectively formed in the ceramic material layer, and for that purpose, the same mask as described above is used, but as this mask, necessary portions are particles generated during sputtering or vapor deposition. It is preferable that it is able to pass through and is otherwise immovable and that it is removable or removable. Specifically, a polymer film, metal plate, ceramics plate, etc. can be attached with an easily peelable adhesive. Can be mentioned. As the conductor of the conductor layer by the sputtering method or the vapor deposition method, silver, copper, palladium, any one of the metals such as nickel or a metal such as an alloy of each of these, but not limited to this, sputtering, Any material that can perform vapor deposition may be used. Note that sputtering is, for example, forming a thin film by applying a high voltage between a partner electrode and a partner electrode in a vacuum or in a state close to the metal to cause the metal to scatter and adhere to the partner electrode. The term “vapor deposition” means that a substance is heated and evaporated in a vacuum or in a state close to the vacuum to be attached to a substrate to form a thin film. Note that the conductor layer formed by electrophoresis can be obtained by firing a conductor material layer formed by electrophoresis of the above metal, other carbon, and a resin containing these conductors.
【００１１】電気泳動法により形成されたセラミック材
料層と、このセラミック材料層にスパッタリング法、蒸
着法や電気泳動法により形成された導電体層あるいは導
電体材料層は積層され、その積層体が得られるが、この
積層体は電極の金属板から剥がされ、特別な圧着を必要
とすることがなくても良く、焼成されるが、その焼成温
度は、導電体材料の融点、酸化性等を考慮して決められ
るが、銀の場合には８００℃以上、９５０℃以下が好ま
しいが、その他の高融点の金属の場合にはこれに限られ
ない。上記は積層セラミックコンデンサを中心に説明し
たが、積層セラミックインダクタ、積層セラミックトラ
ンス、積層ＬＣ部品、さらにはこれらに電子回路を組み
込んだ複合電子部品や、多層基板、単層のセラミックコ
ンデンサ等においても適用できる。A ceramic material layer formed by an electrophoretic method and a conductor layer or a conductor material layer formed by a sputtering method, a vapor deposition method or an electrophoretic method are laminated on the ceramic material layer to obtain a laminated body. However, this laminated body is peeled off from the metal plate of the electrode and does not require special pressure bonding, and is fired, but the firing temperature should be set in consideration of the melting point, oxidizability, etc. of the conductor material. The temperature is preferably 800 ° C. or higher and 950 ° C. or lower in the case of silver, but not limited to this in the case of other high melting point metals. Although the above description has focused on the monolithic ceramic capacitor, it is also applicable to monolithic ceramic inductors, monolithic ceramic transformers, monolithic LC components, composite electronic components incorporating electronic circuits therein, multi-layer substrates, single-layer ceramic capacitors, and the like. it can.
【００１２】[0012]
【作用】電気泳動法とは、コロイド溶液または懸濁液や
エマルジョン中に電極を入れてこれに直流電圧を加える
ことによりコロイド粒子または微細粒子がどちらか一方
の極に移動する現象をいうので、例えば金属板の電極を
用い、コロイド粒子または微細粒子にセラミック粉末を
用いると（通常、液体中の粉体は荷電粒子として扱え
る）、電極にこれらセラミック粉末の粒子は互いに反対
の電荷の静電引力により付着しその層を形成でき、さら
にこの層にスパッタリング法又は蒸着法等を用いて導電
体層を形成でき、以下同様にしてセラミック材料層と導
電体層の積層体を得ることができ、これを焼成すると積
層セラミックコンデンサ等のセラミック部品を製造する
ことができる。この電気泳動を利用して粒子の層を形成
する、いわゆる電着は、その電着速度が大きく、電着液
に用いる粒子の種類、大きさ、形状、表面電化数、溶媒
の種類、溶媒中の電解質の種類、イオン強度、あるいは
ｐＨ、温度、加えた電圧等などによりその速度を調整で
き、バインダーを含まないようにもでき、さらには粒子
同士は反発しあうためので、空孔のない緻密なセラミッ
ク層等を例えば５μｍ以下の薄層にすることができる。
また、スパッタリング法又は蒸着法により、０．１〜
０．５μｍの金属薄膜を連続的かつ信頼性高く作成する
ことができる。このようにセラミック粉末を電着するこ
とができ、導電体粒子をスパッタリング又は蒸着できる
のでその積層体は圧着を特に必要とすることもない。[Function] The electrophoretic method is a phenomenon in which colloidal particles or fine particles move to one of the poles by placing an electrode in a colloidal solution or suspension or emulsion and applying a DC voltage to it. For example, when an electrode of a metal plate is used and ceramic powder is used as colloidal particles or fine particles (powder in a liquid can be treated as a charged particle), the particles of the ceramic powder are electrostatically attracted to each other by the electrodes. Can be adhered by to form a layer, further to form a conductor layer by using a sputtering method or vapor deposition method, etc., to obtain a laminate of a ceramic material layer and a conductor layer in the same manner below. By firing, it is possible to manufacture a ceramic component such as a monolithic ceramic capacitor. The so-called electrodeposition, in which a layer of particles is formed by utilizing this electrophoresis, has a high electrodeposition rate, and the type, size, shape, surface electrification number, type of solvent, type of solvent used in the electrodeposition solution The speed can be adjusted by adjusting the type of electrolyte, ionic strength, pH, temperature, applied voltage, etc., and it is possible to exclude the binder. Furthermore, since the particles repel each other, there are no pores and they are dense. For example, a thin ceramic layer or the like can be formed into a thin layer having a thickness of 5 μm or less.
Moreover, by the sputtering method or the vapor deposition method,
A metal thin film of 0.5 μm can be continuously and reliably formed. In this way, the ceramic powder can be electrodeposited and the conductor particles can be sputtered or vapor deposited, so that the laminate does not particularly require pressure bonding.
【００１３】[0013]
【実施例】次に本発明の実施例を図面に基づいて説明す
る。 実施例１ １００ｍｌビーカーにアセトン５０ｍｌ、平均粒径が
０．３μｍのチタン酸バリウム（ＢａＴｉＯ3)５ｇを入
れて混合し、超音波分散させてセラミック誘電体粉末の
スラリーを得た。また、白金板を陰極、白金棒を陽極と
し、両電極間が５００Ｖ／ｃｍとなるよに電源、白金
板、白金棒を固定し、電極セットを準備した。この状態
で、まず、電極セットの白金板、白金棒を上記セラミッ
ク誘電体粉末のスラリーに浸漬し、ついで両電極間に５
００Ｖ／ｃｍの電圧を白金板の電着層が３．５μｍにな
るまで印加し続け、３．５μｍのセラミック材料層を形
成した。Embodiments of the present invention will now be described with reference to the drawings. Example 1 In a 100 ml beaker, 50 ml of acetone and 5 g of barium titanate (BaTiO 3 ) having an average particle size of 0.3 μm were put and mixed, and ultrasonically dispersed to obtain a slurry of ceramic dielectric powder. Further, a platinum plate was used as a cathode and a platinum rod was used as an anode, and the power source, the platinum plate and the platinum rod were fixed so that the distance between both electrodes was 500 V / cm, and an electrode set was prepared. In this state, first, the platinum plate and the platinum rod of the electrode set were dipped in the slurry of the above ceramic dielectric powder, and then 5 electrodes were placed between the electrodes.
A voltage of 00 V / cm was continuously applied until the electrodeposited layer of the platinum plate reached 3.5 μm to form a ceramic material layer of 3.5 μm.
【００１４】次に、白金板、白金棒の電極を引き上げて
乾燥させ、白金板の上記セラミック材料層に縞状にスリ
ットのパターンを形成したポリエステルフィルムからな
るマスクを当てがい、その周辺を剥離容易な接着剤によ
り仮止めした。その後、電極材料のニッケル（Ｎｉ）を
マグネトロンスパッタリング装置によりスパッタリング
を行い、０．５μｍのパターン化された内部電極層を形
成した。さらに、マスクを外した後、上記セラミック材
料層を形成したと同様にして上記のパターン化された内
部電極層を形成したセラミック材料層上にセラミック材
料層を形成し、以下同様にパターン化された内部電極
層、セラミック材料層を順次形成し、全部で内部電極
層、セラミック材料層それぞれを１００層形成した。最
後にセラミック材料層と内部電極層の積層体を白金板か
ら剥がし、所定の大きさの角型にカットした積層体を９
５０℃で２時間焼成し、セラミック素体チップを得た。
その厚さは２．７μｍであった。なお、このセラミック
素体チップは、セラミック材料層の焼成体であるセラミ
ック層と、内部電極層の焼成体である内部電極の積層体
からなり、内部電極は交互に積層体チップの両側端面に
導出されるように、上記マスクはそのスリットのパター
ンを形成したものを用いる。セラミック素体チップの両
側端に銀ペーストを塗布し、焼き付けて銀電極を形成し
た。このようにしてチップ型積層セラミックコンデンサ
１０個を得、これらを１５０℃、３００Ｖの条件で寿命
試験を行ったところ、全て１００００秒以上の寿命を持
ち、実用に耐えることが確認された。また、静電容量を
測定したところ２５μＦであった。Next, the electrodes of the platinum plate or platinum rod are pulled up and dried, and a mask made of a polyester film having a stripe pattern of slits is applied to the above-mentioned ceramic material layer of the platinum plate, and its periphery is easily peeled off. It was temporarily fixed with a different adhesive. Then, nickel (Ni) as an electrode material was sputtered by a magnetron sputtering device to form a patterned internal electrode layer having a thickness of 0.5 μm. Further, after removing the mask, a ceramic material layer was formed on the ceramic material layer on which the patterned internal electrode layer was formed in the same manner as the above-mentioned ceramic material layer was formed, and then the same patterning was performed. An internal electrode layer and a ceramic material layer were sequentially formed, and a total of 100 internal electrode layers and ceramic material layers were formed respectively. Finally, the laminated body of the ceramic material layer and the internal electrode layer was peeled off from the platinum plate, and the laminated body cut into a square with a predetermined size was used.
The ceramic body chip was obtained by firing at 50 ° C. for 2 hours.
Its thickness was 2.7 μm. This ceramic element chip is composed of a laminated body of a ceramic layer, which is a fired body of a ceramic material layer, and an internal electrode, which is a fired body of an internal electrode layer. The internal electrodes are alternately led to both end faces of the laminated body chip. As described above, the mask used is one in which the pattern of the slit is formed. Silver paste was applied to both ends of the ceramic body chip and baked to form silver electrodes. In this way, 10 chip type monolithic ceramic capacitors were obtained and subjected to a life test under the conditions of 150 ° C. and 300 V, and it was confirmed that all had a life of 10,000 seconds or more and could be practically used. In addition, the measured capacitance was 25 μF.
【００１５】実施例２ 実施例１と同様にしてセラミック誘電体粉末のスラリー
を調製し、電極セットを準備した。次に実施例１と同様
にして白金板に３．５μｍのセラミック材料層を形成し
た後、今度は所定のパターンのマスクを用い、蒸着法に
よりニッケルを蒸着し、０．１μｍの厚さのバターン化
された内部電極層を形成した。このパターン化した内部
電極層を形成したセラミック材料層に有する白金板を用
いて、最初にセラミック材料層を形成したと同様にセラ
ミック材料層を形成し、以下同様に内部電極層、セラミ
ック材料層を順次形成し、全体で内部電極層、セラミッ
ク材料層それぞれを１００層積層し、以下実施例１と同
様に、カット、９５０℃での２時間の焼成を行ってセラ
ミック素体チップを得、これに銀電極の形成を行ってチ
ップ型積層セラミックコンデンサ１０個を得、これらに
ついても実施例１と同様に試験したところ、全て１００
００秒以上の寿命を持ち、実用に耐えることが確認され
た。また、セラミック素体チップの厚さは２．７μｍで
あり、チップ型積層セラミックコンデンサの静電容量は
２７μＦであった。Example 2 A slurry of ceramic dielectric powder was prepared in the same manner as in Example 1 to prepare an electrode set. Next, after forming a ceramic material layer of 3.5 μm on the platinum plate in the same manner as in Example 1, this time, nickel is vapor-deposited by a vapor deposition method using a mask having a predetermined pattern to form a pattern of 0.1 μm in thickness. An internalized electrode layer was formed. Using the platinum plate having the ceramic material layer on which the patterned internal electrode layer is formed, a ceramic material layer is formed in the same manner as the first formation of the ceramic material layer, and then the internal electrode layer and the ceramic material layer are similarly formed. 100 layers of the internal electrode layers and the ceramic material layers were sequentially formed, and cut and fired at 950 ° C. for 2 hours in the same manner as in Example 1 to obtain a ceramic element chip. When silver electrodes were formed to obtain 10 chip type monolithic ceramic capacitors, which were also tested in the same manner as in Example 1, all were 100
It has been confirmed that it has a life of 00 seconds or more and can withstand practical use. The thickness of the ceramic body chip was 2.7 μm, and the electrostatic capacity of the chip type multilayer ceramic capacitor was 27 μF.
【００１６】比較例 チタン酸バリウムのスラリー（ＢａＴｉＯ3 ８８．６５
重量部、ポリビニルブチラール樹脂９．８５重量部、エ
タノール１００重量部、トルエン１００重量部）を調製
し、これをドクターブレード法にてポリエステルフィル
ム上に塗布・乾燥し、乾燥膜厚３．５μｍのグリーンシ
ートを作成した。このグリーンシートにＰｄペースト
（Ｐｄ粉末５０重量部、エチルセルロース５重量部、ブ
チルカルビトール４５重量部）を所定のパターンにスク
リーン印刷した。このようにＰｄペーストを印刷したグ
リーンシートを表裏合わせて１００枚重ねた後、圧着
し、所定の大きさにカットして積層体チップを得た。こ
れを９５０℃、２時間焼成し、セラミック素体チップを
得、これに実施例１と同様に銀電極を形成し、チップ型
積層セラミックコンデンサを得た。このようにして得た
チップ型積層セラミックコンデンサ１０個について実施
例１と同様に試験したところ、１００００秒以上の寿命
を持ったものは無かった。また、セラミック素体チップ
の厚さは２．７μｍであり、積層セラミックコンデンサ
の静電容量は２５μＦであった。Comparative Example Slurry of barium titanate (BaTiO 3 88.65)
Parts by weight, 9.85 parts by weight of polyvinyl butyral resin, 100 parts by weight of ethanol, 100 parts by weight of toluene), and coating and drying this on a polyester film by a doctor blade method to obtain a green film having a dry film thickness of 3.5 μm. Created a sheet. Pd paste (50 parts by weight of Pd powder, 5 parts by weight of ethyl cellulose, 45 parts by weight of butyl carbitol) was screen-printed on the green sheet in a predetermined pattern. After stacking 100 sheets of the green sheets on which the Pd paste was printed side by side, they were pressure-bonded and cut into a predetermined size to obtain a laminated chip. This was fired at 950 ° C. for 2 hours to obtain a ceramic element chip, and a silver electrode was formed thereon in the same manner as in Example 1 to obtain a chip type laminated ceramic capacitor. When 10 chip monolithic ceramic capacitors thus obtained were tested in the same manner as in Example 1, none of them had a life of 10,000 seconds or more. The thickness of the ceramic element chip was 2.7 μm, and the electrostatic capacity of the monolithic ceramic capacitor was 25 μF.
【００１７】[0017]
【発明の効果】本発明によれば、電気泳動法によりセラ
ミック材料層を形成し、これとスパッタリング法又は蒸
着法により形成した導電体層を積層し、焼成するように
したので、セラミック材料層の焼成体を例えば５μｍ以
下の薄層とすることができるとともに、導電体層を例え
は０．１〜０．５μｍとすることができ、セラミック電
子部品を小型化することができるのみならず、セラミッ
クグリーンシートや導電体材料ペーストを用いる従来の
方法に比べてバインダーを用いておらず、その分解揮発
の必要がないので、空隙のない緻密な組織とすることが
でき、電流のリークのない耐電圧性のセラミック電子部
品を提供することができる。さらに例えば積層セラミッ
クコンデンサを有する部品では薄層の緻密なセラミック
層及び内部電極層と、小型のままそのセラミック層及び
内部電極層の層数を多くすることができることによる相
乗効果によりその大容量化することができ、小型化かつ
大容量化することにより性能を一段と向上させることが
できる。このように積層セラミックコンデンサを小型
化、大容量化できると、同じ大ききさであれば、より大
容量化ができ、同じ容量であれば、より小型化ができ
る。また、電気泳動法による方法は簡易な設備で良く、
これとスパッタリング法又は蒸着法を併用した方法は、
従来のグリーンシートを用いるものに比べて圧着工程を
必要としない等生産工程が単純であるから、設備費、能
率の点からも生産性を向上させることができる。According to the present invention, the ceramic material layer is formed by the electrophoretic method, and the conductor layer formed by the sputtering method or the vapor deposition method is laminated and fired. The fired body can be a thin layer having a thickness of, for example, 5 μm or less, and the conductor layer can be, for example, 0.1 to 0.5 μm, so that not only can the ceramic electronic component be downsized, but also the ceramic Compared to the conventional method using a green sheet or a conductor material paste, a binder is not used and its decomposition and volatilization is not required, so a dense structure with no voids can be obtained, and a withstand voltage without current leakage. It is possible to provide a good ceramic electronic component. Further, for example, in a component having a monolithic ceramic capacitor, the capacity is increased by a synergistic effect by increasing the number of thin and dense ceramic layers and internal electrode layers and the number of ceramic layers and internal electrode layers while maintaining a small size. The performance can be further improved by reducing the size and increasing the capacity. If the monolithic ceramic capacitor can be made smaller and have a larger capacity in this way, it can be made larger with the same size and can be made smaller with the same capacity. In addition, the method by electrophoresis can be done with simple equipment,
The method that uses this together with the sputtering method or the vapor deposition method is
Since the production process is simple as compared with the conventional one using a green sheet, such as not requiring a pressure bonding process, the productivity can be improved in terms of equipment cost and efficiency.
Claims (5)
ミック電子部品において、該セラミックス層はセラミッ
クス粉末を電着液中の粒子に用いて電気泳動法により形
成したセラミック材料層の焼成体を有し、該導電体層は
スパッタリング法又は蒸着法により形成するセラミック
電子部品の製造方法。1. A ceramic electronic component having a ceramic layer and a conductor layer, wherein the ceramic layer has a fired body of a ceramic material layer formed by an electrophoretic method using ceramic powder as particles in an electrodeposition liquid, A method for manufacturing a ceramic electronic component, wherein the conductor layer is formed by a sputtering method or a vapor deposition method.
いて電気泳動法によりセラミックス材料層を形成するセ
ラミックス材料層形成工程と、スパッタリング法若しく
は蒸着法により導電体層を形成する導電体形成工程と、
該セラミックス材料層形成工程と該導電体形成工程を有
することにより得られる積層体を焼成する工程を有する
セラミック電子部品の製造方法2. A ceramic material layer forming step of forming a ceramic material layer by an electrophoretic method using ceramic powder as particles in an electrodeposition liquid, and a conductor forming step of forming a conductor layer by a sputtering method or a vapor deposition method. When,
Method for manufacturing a ceramic electronic component having a step of firing a laminate obtained by including the ceramic material layer forming step and the conductor forming step
となる導電体層を順次積層し、最後にセラミック材料層
を積層した構造体であり、該セラミック材料層の第１の
セラミック材料層はセラミックス粉末を分散させた電着
液中に設けた導電板に通電する電気泳動法により該導電
板上に形成されたセラミックス材料層であり、該導電体
層の第１の導電体層はスパッタリング法若しくは蒸着法
により該第１のセラミック材料層に選択的に形成した導
電体層であり、該セラミック材料層の第２以後のセラミ
ック材料層及び該導電体層の第２以後の導電体層はそれ
ぞれ先行の導電体層及びセラミック材料層を形成した導
電板をそれぞれセラミックス粉末を分散させた電着液中
に設けた電気泳動法及びスパッタリング法若しくは蒸着
法により順次形成した請求項２記載のセラミック電子部
品の製造方法。3. The laminated body is a structure in which a ceramic material layer, a conductor layer that becomes an internal conductor are sequentially laminated, and finally a ceramic material layer is laminated, and the first ceramic material layer of the ceramic material layer is A ceramic material layer is formed on the conductive plate by an electrophoretic method in which a conductive plate provided in an electrodeposition liquid in which ceramic powder is dispersed is energized, and the first conductive layer of the conductive layer is a sputtering method. Alternatively, the conductor layers are selectively formed on the first ceramic material layer by a vapor deposition method, and the second and subsequent ceramic material layers of the ceramic material layer and the second and subsequent conductor layers of the conductor layer are respectively formed. The conductive plate on which the preceding conductor layer and the ceramic material layer were formed was sequentially formed by the electrophoretic method and the sputtering method or the vapor deposition method provided in the electrodeposition liquid in which the ceramic powder was dispersed. The method for manufacturing a ceramic electronic component according to claim 2.
電体層は必要箇所が導電体粒子を通過可能でありそれ以
外は通過不能でありかつ取り外し可能のマスクを介して
該セラミック材料層に導電体粉末をスパッタリング若し
くは蒸着法により形成する請求項３記載のセラミック電
子部品の製造方法。4. The conductive material layer selectively formed on the ceramic material layer is electrically conductive to the ceramic material layer through a removable mask that allows the conductive material particles to pass therethrough at necessary places and does not pass through other portions. The method for manufacturing a ceramic electronic component according to claim 3, wherein the body powder is formed by sputtering or vapor deposition.
料層であり、導電体層は内部電極層であり、積層体の焼
成体は積層セラミック素体であり、積層セラミックコン
デンサを製造する請求項３又は４記載のセラミック電子
部品の製造方法。5. The laminated ceramic capacitor according to claim 3, wherein the ceramic material layer is a ceramic dielectric material layer, the conductor layer is an internal electrode layer, and the fired body of the laminated body is a laminated ceramic body. 4. The method for manufacturing a ceramic electronic component according to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6229050A JPH0878274A (en) | 1994-08-31 | 1994-08-31 | Production of ceramic electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6229050A JPH0878274A (en) | 1994-08-31 | 1994-08-31 | Production of ceramic electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0878274A true JPH0878274A (en) | 1996-03-22 |
Family
ID=16885965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6229050A Withdrawn JPH0878274A (en) | 1994-08-31 | 1994-08-31 | Production of ceramic electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0878274A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6942901B1 (en) | 1999-01-07 | 2005-09-13 | The Penn State Research Foundation | Fabrication of particulate tapes by electrophoretic deposition |
| JP2008103630A (en) * | 2006-10-20 | 2008-05-01 | Hitachi Chem Co Ltd | Method of manufacturing capacitor material for containing resin substrate |
| WO2024070428A1 (en) * | 2022-09-27 | 2024-04-04 | 太陽誘電株式会社 | Ceramic electronic component and metho for producing ceramic electronic component |
| WO2024070427A1 (en) * | 2022-09-26 | 2024-04-04 | 太陽誘電株式会社 | Ceramic electronic component, and method for producing ceramic electronic component |
-
1994
- 1994-08-31 JP JP6229050A patent/JPH0878274A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6942901B1 (en) | 1999-01-07 | 2005-09-13 | The Penn State Research Foundation | Fabrication of particulate tapes by electrophoretic deposition |
| JP2008103630A (en) * | 2006-10-20 | 2008-05-01 | Hitachi Chem Co Ltd | Method of manufacturing capacitor material for containing resin substrate |
| WO2024070427A1 (en) * | 2022-09-26 | 2024-04-04 | 太陽誘電株式会社 | Ceramic electronic component, and method for producing ceramic electronic component |
| WO2024070428A1 (en) * | 2022-09-27 | 2024-04-04 | 太陽誘電株式会社 | Ceramic electronic component and metho for producing ceramic electronic component |
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