JPH08788Y2 - Fixed structure of metal plate - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal plate fixing structure.

[0002]

2. Description of the Related Art Conventionally, when a metal plate such as a heat sink is not provided with a fixing structure, the metal plate floats due to vibration or the like when it is mounted on the printed circuit board. In order to do this, I had to correct it by applying external pressure. However, in this case, there is a problem that stress is applied to the solder portion of the lead leg of a heat dissipation component such as a semiconductor element attached to a metal plate by applying an excessive force. Therefore, a structure for fixing the metal plate is necessary.

Conventionally, as a fixing structure of this metal plate,
5, there is shown in FIG. L That is, as shown in FIG. 5
In order to attach the metal plate 2 which is bent in a shape and constitutes the heat dissipation plate in which the semiconductor element 1 is attached to the outer surface of the piece 2A to the printed circuit board 3, the leg 5A is attached to the lower end of each piece 2A, 2B of the metal plate 2. , 5B leave projecting integrally, thereby inserting the lead leg 7 of the semiconductor element 1 to the hole 6 of the circuit pattern of the printed circuit board 3 as shown in FIG. 6, the leg 5 of the metal plate 2
After inserting A and 5B into the insertion holes 4A and 4B provided in the printed circuit board 3 and mounting them on the printed circuit board 3, the leg 5B is twisted to fix the leg 5B to the insertion hole 4B.

As another conventional fixing structure for a metal plate,
There is one found in Jitsukaihei 1-16568. That is, as shown in FIGS. 7 and 8 , a hook 9 is integrally formed on the lower end of one piece 2B of the metal plate 2 so as to project in an L shape, and the lower end of the other piece 2A is bent so as to have elasticity. Elastic piece 11
The projected integrally, in a state inserted to the hook 9 tip the hook 9 with respect to the insertion hole 4B of the printed circuit board 3 is engaged with the rear surface of the insertion hole 4B, the printed circuit board 3 to the elastic piece 11
There is one that is engaged with the insertion hole 4A.

[0005]

The present invention is to provide a way, FIG. 5,
The conventional example shown in FIG. 6 requires a twisting operation step, and the conventional examples shown in FIGS. 7 and 8 have a problem that the insertion hole 4B for the hook 9 becomes large and the mounting area becomes large. The present invention has been made in view of these problems, and the purpose thereof is to prevent a metal plate from rising without requiring a special work process and increasing a mounting area. To provide a fixed structure.

[0006]

In order to achieve the above-mentioned object, the present invention fixes a metal plate having side edges of a metal plate having at least two bent pieces fixed in contact with the substrate. In the structure, a leg is provided so as to protrude from the side edge of each piece, and an insertion hole corresponding to each leg is provided in the substrate,
The lead of the semiconductor device attached to the outer surface of either one
The legs are bent in the shape of an inverted L from the middle to form elastic legs.
Extend the horizontal piece from the bottom of the leg provided on the
With inserts each leg into the insertion hole of the vignetting non legs as an insertion fulcrum, the leg is locked in the insertion hole as an asymmetrical shape the legs that do not insert pivot relative to the insertion hole, the bullet
Seiashi a is obtained by inserting locking into a hole provided in the substrate.

[0007]

According to the present invention, the elastic leg has the hole formed in the substrate.
Insert and lock the legs, which are the insertion fulcrums , into the insertion holes and rotate the metal plate to insert each leg until the side edge hits the surface of the substrate, and lock the legs that are not the insertion fulcrum in the insertion holes. by, Oh <br/> Ru it is possible to fix the metal plate to the substrate. In addition, the lead legs of the semiconductor element are made into an inverted L shape from the middle.
Bend it to an elastic leg, and attach the elastic leg to the hole provided on the board.
By inserting and locking, the elastic return force of the lead leg
The lateral piece of the leg is locked in the insertion hole to connect the leg to the insertion hole.
More surely.

[0008]

EXAMPLES The present invention will be described below with reference to examples. (Embodiment 1) FIG. 1 shows an exploded perspective view of one embodiment. In this embodiment, both pieces 2A of a metal plate 2 which is a heat dissipation plate bent in an L shape,
Obtained by integrally projecting leg 5 A, 5 B to the lower end of 2B, the leg 5
A is formed in a rectangular shape and legs 5B are formed in an L shape.

[0009] protruding direction of the crosspiece of the legs 5 B a piece 2A direction for mounting the semiconductor element 1, and a slight ones than the projecting amount of the conventional hook. Further, the lead leg 7 of the semiconductor element 1 attached to the outer surface of the piece 2A of the metal plate 2
The lead leg 7 located at the center, for example, is bent into an inverted L shape from the middle to form an elastic leg. When mounting and fixing the metal plate 2 having the semiconductor element 1 attached to the piece 2A on the printed circuit board 3, the leg 5A is inserted into the insertion hole 4A so that the lead leg 7 of the semiconductor element 1 has the hole 6 in the printed circuit board 3. While inserting the lead leg 7 into the hole 6, the metal plate 2 is opposed to the elastic force of the lead leg 7 of the semiconductor element 1 so that the legs 5A and 5B face the insertion holes 4A and 4B. As shown in FIG. 2A, the legs 5A and 5B are slanted and inserted into the corresponding insertion holes 4A and 4B, and as shown in FIGS. 2B and 2C, the legs 5A are used as insertion fulcrums for the metal plate 2. Is rotated to insert the legs 5A and 5B below the printed circuit board 3 . And where full Niashi of 5 B tip protruding printed circuit board 3 downwardly, when releasing the force applied to the metal plate 2, the horizontal piece of the leg 5B by the elastic restoring force of the lead foot 7 of the semiconductor element 1 is 3
The metal plate 2 is prevented from being lifted by engaging with the insertion hole 4B as shown in FIG.

(Embodiment 2) In each of the above embodiments, an L-shaped bent metal plate 2 is used, but in the present embodiment, a metal plate 2 is bent in a U shape and a plurality of semiconductor elements 1 are attached to a central piece. The plate 2 is used. In this case, rectangular legs 5A and 5A are provided on both sides of the lower end of the piece 2A to which the semiconductor element 1 is attached, and the legs 5B of the first embodiment are formed at the lower ends of the other pieces 2B and 2B '. Similar shaped legs 5B, 5B '
Are projected respectively. Printed on the substrate 3 each leg 5A, 5 B, the insertion holes 4A corresponding to 5B ', 4B,
4B 'is provided.

The fixing is carried out in the same procedure as in the first embodiment, the legs 5A and 5A are used as insertion fulcrums, and the legs 5B and 5B 'are inserted into the insertion holes 4B and 4B' while rotating the metal plate 2.
Then, the metal plate 2 is fixed to the printed circuit board 3 by inserting the metal plate 2 into and locking the metal plate 2 .

[0012]

[Effect of the Invention] The present invention has at least two folded parts.
In a metal plate fixing structure for fixing a side edge of a metal plate having a piece in contact with a substrate, a leg is projected on the side edge of each piece and an insertion hole corresponding to each leg is formed on the substrate. Since each leg is inserted into the insertion hole with one of the legs as the insertion fulcrum and the leg that does not serve as the insertion fulcrum has an asymmetrical shape with respect to the insertion hole, the leg is locked in the insertion hole. Rotate the metal plate while inserting the legs to be inserted into the insertion hole and insert each leg until the side edge hits the surface of the substrate,
By locking the leg that does not become the insertion fulcrum in the insertion hole,
Since the metal plate can be fixed to the board, the conventional twisting work for fixing is unnecessary, assembly workability is improved, and pressure for fixing the rising of the metal plate is unnecessary. Therefore, there is an effect that the solder stress of the lead leg of the heat dissipation component attached to the metal plate can be reduced, the reliability of the device can be improved, and the insertion hole for inserting the asymmetric leg also needs to be particularly large. In addition, the mounting density of the substrate can be increased. Well
Of the semiconductor element attached to the outer surface of either one of them.
Bend the lead leg into an inverted L shape from the middle to make an elastic leg,
Extend the horizontal piece from the bottom of the leg on the other piece,
Use the legs that are not provided as insertion fulcrums to insert each leg into the insertion hole.
Insert the leg that does not serve as an insertion fulcrum into the insertion hole.
Then, lock the leg in the insertion hole as an asymmetrical shape, and
Insert the elastic legs into the holes provided on the board
Insert the legs with the semiconductor mounting surface as the insertion fulcrum.
It can be inflated to the fulcrum side and inserted while rotating,
The insertion hole of the board can be made smaller.
In addition, the elastic return force of the lead leg causes the lateral piece of the leg to enter the insertion hole.
Engagement ensures a more secure connection of the leg to the insertion hole
It is a thing.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a diagram illustrating the use of an embodiment of the present invention.

FIG. 3 is a sectional view showing an embodiment of the present invention.

FIG. 4 is a partially omitted exploded perspective view of another embodiment of the present invention.
It is.

FIG. 5 is a perspective view of a conventional metal plate.

FIG. 6 is a sectional view of a conventional example.

FIG. 7 is a perspective view of another conventional metal plate.

FIG. 8 is a sectional view of another conventional example.

[Explanation of symbols]

 1 Semiconductor Element 2 Metal Plate 2A Piece 2B Piece 3 Printed Circuit Board 4A Insertion Hole 4B Insertion Hole 5A Leg 5B Leg 6 Hole 7 Lead Leg

Claims (1)

[Scope of utility model registration request] 1. In a metal plate fixing structure for fixing a side edge of a metal plate having at least two bent pieces in a state of being in contact with a substrate, a leg is projectingly provided on a side edge of each piece,
Insertion holes corresponding to each of the legs is provided on the substrate, Izu
Lead legs of a semiconductor device attached to the outer surface of one or the other piece
From the middle into an inverted L shape to form an elastic leg, and the other piece
Extend the horizontal piece from the bottom of the leg provided on the
Is with inserts each leg into the insertion hole as the leg insertion fulcrum not, the legs and engaging the insertion hole as an asymmetrical shape the legs that do not insert pivot relative to the insertion hole, the elastic leg
A fixing structure for a metal plate, characterized in that the metal plate is inserted into and locked in a hole provided in the substrate .