JPH088328B2 - Heat sink assembly for electronic equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] In a heat sink assembly for an electronic device, positioning of an integrated circuit is completed during a manufacturing process of the heat sink assembly for an electronic device by using a time until a soft adhesive is cured. By doing so, the vibration resistance is improved and the structure is simplified.

TECHNICAL FIELD The present invention relates to a heat sink assembly for electronic equipment.

[Conventional technology]

As shown in FIG. 6, a conventional heat sink assembly for an electronic device has a piston 23 inserted into a recess 27 of a housing 21 and a spring between the upper surface of the piston 23 and the upper surface of the recess 27.
It has a structure in which the lower surface of the piston 23 is pressed against the heat conductive filler 24 of the integrated circuit element 25 mounted on the substrate 26 with 22 interposed.

By constructing such a structure, the heat generated in the integrated circuit element is transferred to the cooling water side.

[Problems to be solved by the invention]

In the prior art of FIG. 6, the spring 22 and the piston
The reason for providing 23 is to absorb variations in the position of the integrated circuit element 25.

However, in such a structure, since the spring 22 is interposed, the integrated circuit element 25 easily vibrates and receives an extra pressure.

In addition, the spring 22
There is a problem in that the structure is complicated because it is necessary to use a large amount of the piston 23 or other parts.

An object of the present invention is to improve vibration resistance and simplify the structure of a heat sink assembly for electronic equipment.

[Means for solving problems]

The means for achieving the above-mentioned object is to apply a heat conductive filler 3 to the integrated circuit element 2 mounted on the substrate 1 and bring a cooler 4 into close contact with the heat conductive filler 3, and to attach the cooler 4 and its attachment. It is characterized in that a soft adhesive 6 is interposed between the plates 5.

[Action]

In the present invention, the integrated circuit element 2 is fixed by curing the soft adhesive 6 interposed between the cooling element 4 and the mounting plate 5.

Therefore, the integrated circuit element 2 is positioned by using the time until the soft adhesive 6 is cured, and the positioning operation is completed before manufacturing the heat sink assembly.

For this reason, after completion of the assembly, the flexibility is lost and the integrated circuit element itself does not vibrate, and the vibration resistance is remarkably improved as compared with the conventional one.

Further, since the positioning is performed by utilizing the hardening action of the soft adhesive, no other parts for positioning are required, and the structure is further simplified as compared with the conventional structure.

〔Example〕

Hereinafter, the present invention will be described by way of examples with reference to the accompanying drawings.
explain.

 FIG. 1 is a diagram showing a first embodiment of the present invention.

In the drawing showing the assembly of FIG. 1 (A), an integrated circuit element 2 is mounted on a substrate 1, and a thermal conductive filler 3 is applied to the integrated circuit element 2.

The heat conductive filler 3 may be a thermal compound, grease, liquid metal or the like, on which the cooling element 4 is in close contact.

The cooling element 4 is configured such that the refrigerant 9 flows through the cooling element 4, and extends upward through the opening 51 of the mounting plate 5 so that the top 10 has a soft adhesive on the flange 7 containing the O-ring 8. It is fixed to the mounting plate 5 by hardening 6.

The adhesive 6 may be solder, for example, and the integrated circuit element 2 is positioned within a time period until the solder hardens.

Next, a manufacturing process of the assembly according to the present invention having the above-mentioned structure will be described with reference to FIG.

(1) First, the flange 7 is fixed to the periphery of the opening 51 of the mounting plate 5 through the O-ring 8 with a screw or the like (see FIG.
-1)).

(2) Next, the cooling element 4 is inserted into the opening 51 from below the mounting plate 5, and the outer surface of the upper end is temporarily fixed to the flange 7 with tape or the like (FIG. 1 (B-2)).

(3) Further, the integrated circuit element 2 mounted on the substrate 1 coated with the heat conductive filler 3 is opposed to the cooling element 4 (FIG. 1 (B-3)).

(4) Finally, attach the weight 11 from above the cooling element 4 to the inner surface 41 thereof.
By pressing it, the cooling element 4 and the heat conductive filler 3 are brought into close contact with each other, and the top 10 of the cooling element 4 is bonded to the flange 7 with the soft adhesive 6.

Since this soft adhesive 6 takes about 30 minutes to 1 hour to cure, variations in the positions of integrated circuit elements are absorbed during this time.

 FIG. 2 is a diagram showing a second embodiment of the present invention.

In the view showing the assembly of FIG. 2 (A), the soft adhesive 6 applied in the groove 42 of the cooling element 4 is hardened and adhered to the tip portion 71 of the flange 7 of the mounting plate 5, Compared to the first embodiment (FIG. 1 (A)), the number of parts and the size of the cooling element 4 are saved, and the structure is further simplified.

As the adhesive, a waterproof sealant, a two-component metal compound, or the like is used.

Next, a manufacturing process of the second embodiment of the present invention having the above structure will be described.

(1) First, the thermal conductive filler 3 is applied to the integrated circuit element 2 mounted on the substrate 1 (FIG. 2 (B-1)).

(2) Next, the cooling element 4 is pressed against the heat conductive filling material 3 by the pressing jig 12 of the heat transfer plate, and the adhesive 6 is applied into the groove 42 of the cooling element 4 (see FIG. 2)).

(3) While pressing the cooling element 4 against the heat-conducting filler 3, the substrate 1 is lifted up to bond the adhesive 6 in the groove 42 of the cooling element 4 to the tip portion 71 of the flange 7 of the mounting plate 5. (Second
(B-3)).

(4) The pressing jig 12 is removed, and the integrated circuit element 2 is positioned and fixed until the adhesive 6 is cured (FIG. 2 (B-4)).

 FIG. 3 is a diagram showing a third embodiment of the present invention.

A groove 72 is formed in the flange 7 around the opening 51 of the mounting plate 5, and the soft adhesive 6 is applied into the groove 72, and the cooling element 4 is adhered by the curing action of the soft adhesive 6. To position.

Since the top 10 of the cooling element 4 is embedded in the groove 72 of the flange 7 from above, the sealing action of the O-ring 8 in the flange 7 is further enhanced by the pressing force of the refrigerant 9.

 FIG. 4 is a diagram showing a fourth embodiment of the present invention.

As shown in FIG. 4 (A), the top portion 10 of the cooling element 4 is directly attached to the attachment plate 5 via the soft adhesive agent 6.

Since no flange is used, the structure is simpler.

In the manufacturing process, except that the soft adhesive 6 is applied in the groove 52 of the mounting plate (FIG. 4 (B-2)), (FIG. 2 (B-2)), the second embodiment (second embodiment) is used. (Fig. 2).

 FIG. 5 is a diagram showing a fifth embodiment of the present invention.

The groove 52 is provided on the side of the mounting plate 5 as in the fourth embodiment, but the cooler 4 has two members 4 (FIG. 5 (A)).
The difference is that it is manufactured by welding 4 and 45 (Fig. 5 (B)).

This is because it is difficult to form the recess 43 of the cooling element 4 by cutting only one member.

〔The invention's effect〕

In the present invention, since the cooling element is brought into close contact with the heat-conducting filler applied to the integrated circuit element, and the cooling element is attached to the mounting plate with the soft adhesive to harden it, the soft adhesive is applied. Positioning of integrated circuit elements will be completed in the time until the
After the flexibility was lost to improve the vibration resistance and the soft adhesive was hardened, no parts for positioning were required, the number of parts was reduced, and the structure was simplified.

[Brief description of drawings]

1 to 5 are views showing the first to fifth embodiments of the present invention, respectively, and FIG. 6 is an explanatory view of the prior art. In FIG. 1, 1 is a substrate, 2 is an integrated circuit element, 3 is a heat conductive filler, 4 is a cooling element, 5 is a mounting plate, and 6 is a soft adhesive.

Claims (1)

[Claims] 1. A thermal conductive filler (3) is applied to an integrated circuit element (2) mounted on a substrate (1), and a cooling element (4) is adhered to the thermal conductive filler (3) to cool the integrated circuit element (2). A heat sink assembly for electronic equipment, characterized in that a soft adhesive (6) is interposed between the child (4) and its mounting plate (5).