JPH088530A - Semiconductor chip mounting device - Google Patents

Abstract

PURPOSE:To provide a semiconductor chip mounting device which is capable of automatically mounting even a semiconductor chip such as a CCD device or the like susceptible to heat on a wiring board by quickly and.surely soldering it to the wiring board. CONSTITUTION:A pad 4 on which a semiconductor chip 1 and a wiring board 3 are placed is provided, and a heater chip 5 fitted with a fusing pressing section 6 which presses down the terminals 2 of the semiconductor chip 1 is provided movable in a vertical direction over the pad 4, wherein a heater is buried in the heater chip 5, and an electric power is supplied to the heater from a pulse- heat type power supply.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip mounting apparatus, and more particularly to a semiconductor chip mounting apparatus for connecting a desired semiconductor chip such as CCD, IC or LSI to a predetermined wiring board.

[0002]

2. Description of the Related Art In recent years, a technique for efficiently connecting a semiconductor chip such as a CCD, an IC or an LSI to a predetermined wiring board such as an FPC (flexible printed wiring board) is indispensable.

As a means for connecting such a semiconductor chip to a wiring board, conventionally, a semiconductor chip is placed at a predetermined terminal connection position on a predetermined wiring board, and reflow or hot air is applied to the terminal portion of the semiconductor chip. The semiconductor chip and the wiring board are electrically connected to each other by soldering by such means.

[0004]

However, in the above-mentioned conventional semiconductor chip mounting means, for example, when a semiconductor chip relatively vulnerable to heat, such as a CCD chip, is connected to the wiring board, the conventional method is used. However, if soldering is performed by constant heating such as reflow or hot air, there is a problem that the semiconductor chip will be damaged by heat and the semiconductor chip will not operate properly. Have the problem of not being able to do.

Therefore, when connecting such a semiconductor chip, which is susceptible to heat, to a wiring board, an operator performs soldering using a soldering iron to connect each terminal of the semiconductor chip to the wiring board. However, even in this case, if the soldering work takes a long time, the semiconductor chip will be damaged by heat,
There is a problem in that the defective rate of connection of semiconductor chips is about 20 to 30%, and moreover, since the worker performs soldering work with a soldering iron, the connection work time is extremely long. Therefore, there has been a demand for an apparatus capable of automatically performing a soldering operation and mounting a semiconductor chip even if the semiconductor chip is weak against heat.

The present invention has been made in view of the above-mentioned points, and it is quick and quick even for a semiconductor chip which is weak against heat.
An object of the present invention is to provide a semiconductor chip mounting apparatus capable of reliably soldering a wiring board and automatically mounting a semiconductor chip.

[0007]

In order to achieve the above object, a semiconductor chip mounting apparatus according to the present invention connects a predetermined semiconductor chip to a wiring board on which a predetermined wiring pattern is formed and connects the semiconductor chip to the semiconductor chip. In a semiconductor chip mounting apparatus for mounting on a wiring board, a mounting table on which the semiconductor chip and the wiring board are mounted is arranged, and a melting press for pressing a terminal portion of the semiconductor chip above the mounting table. It is characterized in that a heater chip having a section is arranged so as to be able to move up and down, and a heater is embedded inside the heater chip.

Preferably, the heater chip is heated to a predetermined temperature by energizing the heater using a pulse heating type power source. It is characterized in that it is formed of a ceramic heater and the heater chip is formed of titanium.

[0009]

According to the semiconductor chip mounting apparatus of the present invention, after mounting a predetermined wiring board on the upper surface of the mounting table and arranging the semiconductor chip at a predetermined mounting position on the upper surface of the wiring board, Solder is put on each terminal portion of the semiconductor chip, and in this state, the heater chip is heated to a predetermined temperature by energizing the heater chip with a pulse power supply, and the heater chip is lowered to melt and press the melt. By pressing the lower surface of the semiconductor chip to the terminal portion of the semiconductor chip, the solder is melted and each terminal is connected to the wiring board, and then the semiconductor chip is rapidly cooled, thereby The semiconductor chip can be automatically mounted on the wiring board without raising the temperature.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIG.

FIG. 1 shows an embodiment of a semiconductor chip mounting apparatus according to the present invention. A predetermined semiconductor chip 1 such as a CCD, IC or LSI and an FPC to which terminals 2 of this semiconductor chip 1 are connected. A flat plate-shaped mounting table 4 for mounting the wiring board 3 such as
Are formed so as to be swingable about an X axis and a Y axis in the drawing which are orthogonal to each other.

Above the mounting table 4, for example,
An elevating device (not shown) having a heater chip 5 made of a material having good wettability with respect to solder such as titanium or tungsten and having excellent wear resistance and having a planar shape substantially similar to the outer shape including the terminals 2 of the semiconductor chip The heater chip 5 has a heater (not shown) such as a ceramic heater embedded therein. By applying a pulse signal to this heater using a pulse heating type power source (not shown), the heater chip 5 can be heated to a predetermined melting temperature of the solder. Further, melt pressing portions 6 projecting downward are formed at both sides of the lower surface of the heater chip 5 and at positions corresponding to the terminals 2 of the semiconductor chip 1. Both sides of the melting pressing portion 6 are formed. The slit 7 on the surface and on the upper surface of the heater chip 5.
Are formed. In this embodiment, the lower surface of the melting and pressing portion 6 of the heater chip 5 is formed in a flat shape, but the lower surface of the melting and pressing portion 6 has the same shape as the space between the terminals 2 of the semiconductor chip 1. You may make it form the unevenness | corrugation which has the space | interval. Further, a thermocouple 8 for measuring the temperature of the heater chip 5 is connected to the heater chip 5.

Next, the operation of this embodiment will be described.

First, the wiring board 3 having a predetermined wiring pattern formed thereon is placed on the upper surface of the mounting table 4 by means such as etching a copper foil on a film substrate having a mask formed according to a desired pattern. The semiconductor chip 1 is arranged at a predetermined mounting position on the upper surface of the wiring board 3.

Then, solder is put on each terminal 2 portion of the semiconductor chip 1, and in this state, the heater chip 5 is energized with a pulse power source, so that the heater chip 5
Is raised to a predetermined temperature at which the solder melts at about 400 ° C., the heater chip 5 is lowered, and the lower surface of the melt pressing portion 6 is pressed against the terminal 2 portion of the semiconductor chip 1. Each terminal 2 is connected to the wiring board 3 by melting the solder. In this case, in the present embodiment, since the heater chip 5 is heated by the pulse heating method, the heater chip 5 can be instantaneously heated and the temperature control can be easily performed. It is possible. In addition, the above-mentioned table 4
Is formed so as to be swingable about the X axis and the Y axis. Therefore, when the heater chip 5 is lowered and the terminal 2 portion of the semiconductor chip 1 is pressed by the melt pressing portion 6, the heater chip 5 The adhesion between the melt pressing portion 6 and the terminal 2 of the semiconductor chip 1 can be remarkably enhanced.

Thereafter, the heater chip 5 is raised and the semiconductor chip 1 is moved by a cooling air device (not shown).
The semiconductor chip 1 is rapidly cooled by blowing a cooling air to the portion. This allows
The semiconductor chip 1 can be mounted on the wiring board 3 without increasing the temperature of the semiconductor chip 1.

Therefore, in this embodiment, the terminals 2 of the semiconductor chip 1 mounted on the upper surface of the mounting table 4 are soldered to the wiring board 3 by using the heater chip 5 which is rapidly heated. Therefore, even if the semiconductor chip 1 is weak against heat, such as a CCD element, the semiconductor chip 1 can be mounted on the wiring board 3 quickly and reliably without increasing the temperature of the semiconductor chip 1. As a result, it is possible to reliably prevent the semiconductor chip 1 from being damaged by heat, and the mounting work of the semiconductor chip 1 by soldering can be automatically performed.

In the above embodiment, the heater chip is heated only when the solder placed on the terminal portion of the semiconductor chip is melted. However, for example, the heater chip may be continuously heated. Good. Further, a ceramic material can be used as the material of the heater chip, and in this case, it is possible to shorten the soldering time, prevent the solder material from adhering to the heater chip, and prolong the life of the heater chip.

Further, the present invention is not limited to the above-mentioned embodiment, but various modifications can be made if necessary.

[0020]

As described above, in the semiconductor chip mounting apparatus according to the present invention, the terminals of the semiconductor chip mounted on the upper surface of the mounting table are mounted on the wiring board by using the heater chip which is rapidly heated. Since it is soldered, the semiconductor chip can be mounted on the wiring board quickly and reliably without increasing the temperature of the semiconductor chip, and as a result, the semiconductor chip is reliably prevented from being damaged by heat. Therefore, it is possible to automatically perform the mounting work of the semiconductor chip by soldering.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of a semiconductor chip mounting apparatus according to the present invention.

[Explanation of symbols]

 1 Semiconductor Chip 2 Terminal 3 Wiring Board 4 Mounting Table 5 Heater Chip 6 Melt Pressing Section 7 Slit

Claims (4)

[Claims] 1. A semiconductor chip mounting apparatus for mounting a predetermined semiconductor chip on a wiring board by connecting a predetermined semiconductor chip to a wiring board having a predetermined wiring pattern, the semiconductor chip and the wiring board. A mounting table for mounting is placed, and a heater chip having a melting and pressing portion for pressing the terminal portion of the semiconductor chip is disposed above the mounting table so as to be vertically movable, and inside the heater chip. A semiconductor chip mounting device having a heater embedded therein. 2. The semiconductor chip mounting apparatus according to claim 1, wherein the heater chip is heated to a predetermined temperature by energizing the heater using a pulse heating type power source. 3. The semiconductor chip mounting apparatus according to claim 1, wherein the heater is formed of a ceramic heater. 4. The semiconductor chip mounting apparatus according to claim 1, wherein the heater chip is made of titanium.