JPH088566A - Fixture for heat radiating body - Google Patents
Fixture for heat radiating bodyInfo
- Publication number
- JPH088566A JPH088566A JP16280594A JP16280594A JPH088566A JP H088566 A JPH088566 A JP H088566A JP 16280594 A JP16280594 A JP 16280594A JP 16280594 A JP16280594 A JP 16280594A JP H088566 A JPH088566 A JP H088566A
- Authority
- JP
- Japan
- Prior art keywords
- radiator
- heat
- main body
- heat radiating
- fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 239000013013 elastic material Substances 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 abstract description 5
- 229920001778 nylon Polymers 0.000 abstract description 5
- 239000007769 metal material Substances 0.000 abstract description 3
- 229920003002 synthetic resin Polymers 0.000 abstract description 3
- 239000000057 synthetic resin Substances 0.000 abstract description 3
- 229910000639 Spring steel Inorganic materials 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、高速駆動マイクロコン
ピュータなどの発熱密度の高いLSI、中容量のサイリス
タやパワートランジスタなどの半導体素子と、これらの
冷却を行うヒートシンク、及びヒートパイプで構成され
る放熱体との接続、固定を行う固定具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises an LSI having a high heat generation density such as a high speed drive microcomputer, a semiconductor element such as a medium capacity thyristor and a power transistor, a heat sink for cooling them, and a heat pipe. The present invention relates to a fixture for connecting and fixing a heat radiator.
【0002】[0002]
【従来の技術】近年の電気、電子部品では、素子の集積
化、製品の小型化等により、主に半導体素子において発
熱が起こり、製品の誤動作、また素子破壊等種々の問題
が発生するため、ヒートシンク等の放熱体を使用し、積
極的にこの熱を拡散、放出している。従来の発熱体と放
熱体との接着手段の例を図8に示す。図8は、発熱体93
となるPGA(Pin Grid Array)でセラ
ミックス・パッケージのマイクロコンピュータに、ヒー
トシンク若しくはヒートパイプ等の放熱体90を取り付け
た斜視図を示している。図8では、発熱体93となるPG
Aのマイクロコンピュータ上面に積層型のヒートシンク
90が搭載され、前記発熱体93とヒートシンク90とは、エ
ポキシ樹脂等の接着剤を使用し接着されている。2. Description of the Related Art In recent electric and electronic parts, heat is generated mainly in semiconductor elements due to integration of elements, miniaturization of products, etc., which causes various problems such as product malfunction and element destruction. A heat radiator such as a heat sink is used to positively diffuse and release this heat. FIG. 8 shows an example of conventional means for adhering a heating element and a radiator. FIG. 8 shows a heating element 93.
A perspective view in which a radiator 90 such as a heat sink or a heat pipe is attached to a microcomputer of a ceramic package by a PGA (Pin Grid Array) is shown. In FIG. 8, the PG that becomes the heating element 93
Stacked heat sink on top of A microcomputer
90 is mounted, and the heat generating element 93 and the heat sink 90 are bonded by using an adhesive such as an epoxy resin.
【0003】[0003]
【発明が解決しようとする課題】上記従来の技術におい
ては、発熱体93となるマイクロコンピュータ等の半導体
素子と放熱体90とは接着剤で密着固定され、前記発熱体
93と放熱体90との間に分離が必要な場合、例えば半導体
素子のみの故障による半導体素子の取り替え、逆に放熱
体が破損し放熱体のみを取り替えたい場合であっても、
前記半導体素子と放熱体とは1組の部品として形成され
ているので、この両者を共に交換する必要がある。In the prior art described above, the semiconductor element such as a microcomputer as the heat generating element 93 and the heat radiating element 90 are adhered and fixed to each other with an adhesive.
When it is necessary to separate between 93 and the heat radiator 90, for example, replacement of the semiconductor element due to a failure of only the semiconductor element, conversely even if you want to replace only the heat radiator due to damage
Since the semiconductor element and the radiator are formed as a set of parts, it is necessary to replace both of them.
【0004】接着剤を塗布し固定する手段では樹脂、接
着剤の管理、塗布等の作業、さらに樹脂、接着剤を使用
したときには、これらが硬化するまでに幾らかの時間が
必要であり、製造効率が悪く、作業に煩雑さが伴い、ま
た放熱効果においても、発熱体93と放熱体90との間に接
着剤等が介在するので、この両者間の熱伝導にも損失が
生じ、効果的な放熱が妨げられる。In the means for applying and fixing the adhesive, it is necessary to manage the resin and the adhesive, to perform operations such as application, and when the resin and the adhesive are used, some time is required until they are cured. The efficiency is low, the work is complicated, and the heat radiation effect is also effective because an adhesive agent or the like is interposed between the heat generating element 93 and the heat radiating element 90, which causes a loss in heat conduction between them. Heat dissipation is hindered.
【0005】また、プリント配線基板に半導体素子を取
り付ける場合においても、放熱体90の高さが取り付けが
妨げられることが多く、さらにプリント配線基板に半導
体素子を取り付けた後の各部品の検査に煩雑さが生じ
る。Also, when mounting a semiconductor element on a printed wiring board, the height of the radiator 90 often hinders the mounting, and it is complicated to inspect each part after mounting the semiconductor element on the printed wiring board. Occurs.
【0006】本発明は、上記課題を鑑みてなされたもの
で、発熱体93と放熱体90の何れかに故障が発生した場合
でも、この両者を共に取り替えることなく、故障した部
分の何れか一方のみが容易に取り替えられる構造とし、
発熱体93と放熱体90との固定作業を簡略化することを目
的とする。The present invention has been made in view of the above problems, and even if a failure occurs in either the heat generating element 93 or the heat radiating element 90, one of the failed parts is not replaced without replacing both of them. Only the structure can be easily replaced,
The purpose is to simplify the work of fixing the heating element 93 and the radiator 90.
【0007】[0007]
【課題を解決するための手段】上記課題を解決するため
に本発明では、放熱体と発熱体とを接着させる固定具に
おいて、弓状の本体部と糸からなり、前記本体部と糸の
各々は弾性体から構成されている放熱体固定具とする。
$In order to solve the above problems, according to the present invention, in a fixture for adhering a heat radiator to a heat generator, the fixture comprises an arcuate main body and a thread, each of the main body and the thread. Is a radiator fixing member composed of an elastic body.
$
【0008】前記本体部は、放熱体押さえ部と、この放
熱体押さえ部の両端の延長上に配置される側面とを有
し、前記両側面間には弾性を有する糸が配置され、前記
本体部と糸は弾性材から構成してもよい。また、前記糸
はピアノ線で構成され、絶縁性チューブによって囲んで
もよい。The main body has a heat radiating body pressing portion and side surfaces arranged on extensions of both ends of the heat radiating body pressing portion, and elastic threads are arranged between the both side surfaces. The parts and threads may be made of elastic material. Further, the thread is composed of a piano wire and may be surrounded by an insulating tube.
【0009】[0009]
【作用】上記構成により、発熱体93、若しくは放熱体90
の何れか一方が故障、破損を起こした場合には、側面に
内側方向に力を加えれば本体部の弾性により放熱体と発
熱体の離別が容易に行え、発熱体93若しくは放熱体90の
交換が行える。従って発熱体と放熱体との間には、従来
使用していた接着剤が不要、若しくは汎用性のない固定
具が不要になり、あらゆる形状の発熱体、放熱体に対応
してこの両者の接着が可能になる。また既存の電子部品
に新たに放熱体を付加することも可能になり、汎用性の
よい放熱体固定具が提供できる。[Function] With the above configuration, the heating element 93 or the radiator 90
If either one of them fails or is damaged, applying heat to the side surface inward will allow the heat dissipation element to easily separate from the heat dissipation element due to the elasticity of the main body. Can be done. Therefore, there is no need for an adhesive that has been used in the past between the heat generating element and the heat radiating element, or a fixture with no versatility is required. Will be possible. It is also possible to newly add a heat radiator to the existing electronic component, and a heat radiator fixing tool with good versatility can be provided.
【0010】[0010]
【実施例】本発明の放熱体固定具の正面図を図1に示
す。図1において、放熱体固定具10は、バネ鋼材等の金
属材料、または弾性のあるナイロン等の合成樹脂で形成
される本体部11と、この本体部11の両端部を結ぶナイロ
ン糸等の弾性糸12から構成されている。前記本体部11
は、上面に放熱体押さえ部14-14が設けられ、この延長
上に側面16-16が配置され、この側面16-16の両端部が、
前記弾性糸12によって結ばれ、全体として弓状に構成さ
れている。FIG. 1 is a front view of a radiator fixing tool of the present invention. In FIG. 1, a radiator fixing member 10 includes a main body 11 made of a metal material such as spring steel or an elastic synthetic resin such as nylon, and an elastic material such as nylon thread connecting both ends of the main body 11. Composed of 12 threads. The main body 11
Is provided with a radiator pressing portion 14-14 on the upper surface, and a side surface 16-16 is arranged on this extension, and both end portions of this side surface 16-16 are
The elastic threads 12 are tied together to form a bow shape as a whole.
【0011】この固定具を放熱体に取り付けた図を図2
に示す。図2においてプリント配線基板20上に発熱体93
が設けられ、この発熱体93上に放熱体90が設けられてい
る。前記放熱体90の上面には、放熱体固定具10の放熱体
押さえ部14-14が当接し、この延長の側面16-16が放熱体
90の側面方向に延び、この側面16-16のそれぞれの下端
部が弾性糸12によって結ばれており、この弾性糸12は、
プリント配線基板20と発熱体93との境界面の空間に配置
される如く設けられている。FIG. 2 is a view in which this fixing tool is attached to a radiator.
Shown in In FIG. 2, a heating element 93 is provided on the printed wiring board 20.
Is provided, and the radiator 90 is provided on the heating element 93. The heat radiating body holding portion 14-14 of the heat radiating body fixture 10 is in contact with the upper surface of the heat radiating body 90, and the side surface 16-16 of this extension is the heat radiating body.
90 extends in the lateral direction, and the lower ends of the respective side surfaces 16-16 are tied by elastic threads 12, which are
It is provided so as to be arranged in the space of the boundary surface between the printed wiring board 20 and the heating element 93.
【0012】前記において、側面16-16に内側方向に力
を加えると図3に示すような形状になり、前記の如く本
体部11は弾性があるために、内側方向の力がなくなる
と、図1に示す元の形状に戻る。In the above, when a force is applied inwardly to the side surfaces 16-16, the shape becomes as shown in FIG. 3, and since the main body portion 11 has elasticity as described above, when the inward force disappears, The original shape shown in 1 is restored.
【0013】上記実施例において、前記弾性糸12は、ナ
イロンやその他の絶縁繊維材料で構成されるものの他
に、ピアノ線等の金属材料で構成されている糸であって
もよい。また、前記弾性糸12は、溶接やカシメにより本
体部11の両端部に接続されているが、この両者の結合手
段は、例えば側面16-16の両端部付近に穴を開け、この
穴に弾性糸12を通して固定したり、直接側面16-16に結
びつけてもよい。In the above embodiment, the elastic yarn 12 may be a yarn made of a metal material such as a piano wire in addition to the yarn made of nylon or other insulating fiber material. Further, the elastic thread 12 is connected to both ends of the main body 11 by welding or caulking, and the connecting means for both is formed with a hole, for example, in the vicinity of both ends of the side surface 16-16, and is elastic in this hole. It may be fixed through the thread 12 or tied directly to the sides 16-16.
【0014】上記実施例において、半導体、制御素子等
の発熱体93をプリント配線基板20に取り付ける前に、予
め発熱体93と放熱体90、放熱体固定具10を一体化できる
場合であれば、放熱体固定具10は、図4に示す如く発熱
体90の中心部付近に配置できるのは勿論その他の任意の
位置に設けることができるが、プリント配線基板20上に
既に配置固定されている発熱体93、特に多数のピンを有
するLSIにおいて、本放熱体固定具10を使用して放熱体9
0を取り付ける場合では、図5に示す如く放熱体90の外
側方向に放熱体固定具10を配置すればよい。前記におい
ては、発熱体固定具10の数には特に制限がなく、1つ以
上設ければ発熱体93と放熱体90との接着が容易に行え
る。In the above embodiment, if the heating element 93, the radiator 90, and the radiator fixing tool 10 can be integrated in advance before the heating element 93 such as a semiconductor or a control element is attached to the printed wiring board 20, Although the radiator fixing tool 10 can be arranged near the center of the heating element 90 as shown in FIG. 4 and can be provided at any other position, the heat generating element already arranged and fixed on the printed wiring board 20. In the body 93, especially in an LSI having a large number of pins, the heat radiator
When attaching 0, the radiator fixing tool 10 may be arranged outside the radiator 90 as shown in FIG. In the above description, the number of the heating element fixtures 10 is not particularly limited, and if one or more heating element fixing tools 10 are provided, the heating element 93 and the radiator 90 can be easily bonded.
【0015】また、発熱体93の縁面の電気的な絶縁を考
慮して、弾性糸12の周囲には、図6に示すようなガラス
ファイバーやゴム、合成樹脂等の絶縁製チューブ18を設
けたり、図7に示すビーズを設てもよい。また、前記放
熱体固定具10では、放熱体押さえ部14-14が2つ設けて
あるが、この数は放熱体90の外形等に応じ1つ以上で適
宜変更できる。Further, in consideration of electrical insulation of the edge surface of the heating element 93, an insulating tube 18 made of glass fiber, rubber, synthetic resin or the like is provided around the elastic yarn 12 as shown in FIG. Alternatively, the beads shown in FIG. 7 may be provided. Further, in the radiator fixing tool 10, two radiator pressing portions 14-14 are provided, but the number can be appropriately changed to one or more according to the outer shape of the radiator 90 and the like.
【0016】[0016]
【発明の効果】上記構成により、従来発熱体93、若しく
は放熱体90の何れか一方が故障、破損した場合、この両
者を同時に交換しなくてはならなかったものが、故障、
破損をした何れか一方のみの交換で済み、発熱体93と放
熱体90の熱接触面が接着剤等を介さないために両者間の
熱伝導効率が良好になり、放熱体の機能が有効に働く。With the above structure, if either the conventional heat generating element 93 or the heat radiating element 90 fails or is damaged, the two must be replaced at the same time.
Only the damaged one needs to be replaced, and the heat contact surfaces of the heat generating element 93 and the heat radiating element 90 do not have an adhesive or the like between them, so the heat transfer efficiency between the two becomes good and the function of the heat radiating element becomes effective. work.
【0017】また、放熱性を考慮して表面に凹凸を備え
る放熱体90を使用した場合にあっては、前記放熱体押さ
え部14が、この凹凸部、特に凹部に埋設固定できるの
で、放熱体90と放熱体固定具10の両者は、機器使用中に
おいても位置ズレが生じず、これにより接着剤を用いな
くとも発熱体92と放熱体90との接着が確実に行える。Further, in the case of using the heat dissipating body 90 having unevenness on the surface in consideration of heat dissipating property, the heat dissipating body pressing portion 14 can be embedded and fixed in the concavo-convex portion, especially the recessed portion, Both 90 and the radiator fixing tool 10 are not displaced even during use of the device, so that the heating element 92 and the radiator 90 can be reliably bonded to each other without using an adhesive.
【図1】本発明の放熱体固定具の実施例であるFIG. 1 is an embodiment of a radiator fixing tool of the present invention.
【図2】本発明の放熱体固定具により放熱体と発熱体と
を接着した図であるFIG. 2 is a diagram in which a radiator and a heating element are bonded by a radiator fixing tool of the present invention.
【図3】本発明の放熱体固定具に弾性力を与えている図
であるFIG. 3 is a diagram in which an elastic force is applied to the radiator fixing tool of the present invention.
【図4】本発明の放熱体固定具の使用状態を上面から見
た図であるFIG. 4 is a diagram showing a usage state of the radiator fixing tool of the present invention as viewed from above.
【図5】本発明の放熱体固定具の使用状態を上面から見
た図であるFIG. 5 is a diagram showing a usage state of the radiator fixing tool of the present invention as viewed from above.
【図6】弾性糸を絶縁チューブで覆っている図であるFIG. 6 is a view showing an elastic thread covered with an insulating tube.
【図7】糸を絶縁ビーズで覆っている図であるFIG. 7 is a view showing a thread covered with insulating beads.
【図8】従来の放熱体と発熱体との接続を示す斜視図で
あるFIG. 8 is a perspective view showing a connection between a conventional radiator and a heating element.
図において同一符号は同一、または相当部分を示す。 10 放熱体固定具 11 本体部 12 弾性糸 14 放熱体押さえ部 16 側面 90 放熱体 93 発熱体 In the drawings, the same reference numerals indicate the same or corresponding parts. DESCRIPTION OF SYMBOLS 10 Radiator fixing tool 11 Main body part 12 Elastic thread 14 Radiator pressing part 16 Side surface 90 Radiator 93 Heat generator
Claims (3)
おいて、前記固定具が弓状の本体部と糸から構成され、
前記本体部と糸が弾性体から構成されている放熱体固定
具。1. A fixture for adhering a heat radiator to a heat generator, wherein the fixture comprises an arcuate main body and a thread,
A radiator fixing tool in which the main body and the thread are made of an elastic body.
おいて、放熱体押さえ部と、この放熱体押さえ部の両端
の延長上に配置される側面とを有する弓状の本体部があ
り、前記両側面間には糸が配置され、前記本体部と糸は
弾性材から構成されている放熱体固定具。2. A fixture for adhering a radiator to a heating element, which has an arcuate main body portion having a radiator pressing portion and side surfaces arranged on extensions of both ends of the radiator pressing portion, A radiator fixing tool in which a thread is disposed between the both side surfaces, and the main body and the thread are made of an elastic material.
ブによって囲まれている請求項1記載の放熱体固定具。3. The radiator fixing tool according to claim 1, wherein the thread is composed of a piano wire and is surrounded by an insulating tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16280594A JPH088566A (en) | 1994-06-20 | 1994-06-20 | Fixture for heat radiating body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16280594A JPH088566A (en) | 1994-06-20 | 1994-06-20 | Fixture for heat radiating body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH088566A true JPH088566A (en) | 1996-01-12 |
Family
ID=15761560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16280594A Pending JPH088566A (en) | 1994-06-20 | 1994-06-20 | Fixture for heat radiating body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH088566A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258437A (en) * | 2009-03-31 | 2010-11-11 | Dainippon Printing Co Ltd | Power feeder, contactless power transmission device, and joint auxiliary device |
-
1994
- 1994-06-20 JP JP16280594A patent/JPH088566A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258437A (en) * | 2009-03-31 | 2010-11-11 | Dainippon Printing Co Ltd | Power feeder, contactless power transmission device, and joint auxiliary device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4873799B2 (en) | Heat sink system and heat dissipation device | |
| KR100304085B1 (en) | Electronic package with compressible heatsink structure | |
| US6324072B1 (en) | Microelectronic component of sandwich construction | |
| CN100382289C (en) | circuit components | |
| JP5223212B2 (en) | Electronic component mounting structure with heat sink | |
| US5917700A (en) | Heat sink and attachment process for electronic components | |
| US6545871B1 (en) | Apparatus for providing heat dissipation for a circuit element | |
| JPH02305498A (en) | Cold plate assembly | |
| JPH08507656A (en) | Device and method for reducing thermal cycling in a semiconductor package | |
| US20010004135A1 (en) | Flip-chip bonded semiconductor device | |
| US20050174738A1 (en) | Method and structure for heat sink attachment in semiconductor device packaging | |
| JPH0447962Y2 (en) | ||
| JPH05259334A (en) | Semiconductor device | |
| US5083368A (en) | Method of forming modular power device assembly | |
| JPH088566A (en) | Fixture for heat radiating body | |
| JP3421137B2 (en) | Bare chip mounting structure and heat sink | |
| JP6941989B2 (en) | Semiconductor mounting structure and charger | |
| US4991002A (en) | Modular power device assembly | |
| JPH08204073A (en) | Heat radiating body fixing tool | |
| JP3092921B1 (en) | Board unit | |
| JP3150106B2 (en) | Connection structure of semiconductor device | |
| JP2000323875A (en) | Equipment and method for cooling electronic component | |
| WO1999022553A1 (en) | Transistor clamp | |
| JP2936845B2 (en) | Integrated circuit mounting structure | |
| JPH02192149A (en) | Cooling structure of lsi package |