JPH0888306A - Lead-shape correction apparatus for electronic component - Google Patents

Abstract

PURPOSE: To obtain a lead-shape correction apparatus by which the shape of a J-bend-shaped lead can be corrected precisely and quickly. CONSTITUTION: In a lead-shape correction apparatus for an electronic component, the shape of a lead for an electronic component 100 having a J-bend-shaped lead is corrected. The lead-shape correction apparatus is provided with a primary correction means 3 which is moved in parallel with the bottom face of the electronic component 100, which comes into contact with the lead and which extends the lead by force to the side part of the electronic component and with a secondary correction means 5 which shapes the primarily corrected lead to a prescribed J-bend shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor integrated circuit (I
The present invention relates to a lead shape correction device for electronic parts such as C), and more particularly to a lead shape correction device for correcting an incorrect bending of a lead.

[0002]

2. Description of the Related Art Generally, PLCC and S among electronic parts are used.
For semiconductor packages such as OJ, 2 of the packages
It is known that a plurality of leads project from each of four or four side surfaces, the leads extend at right angles to the side surfaces of the package, and then bent into a J-bend shape.

A semiconductor package of this type is
This is a so-called surface mount type, and if any of the leads has an incorrect bend, the lead with the incorrect bend pops up when it is mounted on the board, and a connection failure occurs when soldering that part. There is a problem of causing.

For this reason, various lead flatness correction devices have been proposed for correcting illegal bending of the leads of the package.

[0005]

However, an apparatus for correcting the lead shape of an electronic component having a J-bend type lead has not been proposed.

Conventionally, it is the actual situation that J-bend type leads in which lead bending has occurred are corrected one by one using tweezers or the like visually and manually.
However, this makes it difficult to correct when the lead pitch becomes a fine pitch (one with a narrow lead interval),
There are various problems such that the lead is easily scratched, the correction takes too much time, the productivity is deteriorated, the individual difference of the correction greatly influences, and the quality is not stable.

Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art and to provide a lead shape correction device for an electronic component which can correct the J-bend type lead shape accurately and quickly. To provide.

[0008]

In order to achieve the above object, a first aspect of the present invention is an electronic component lead shape correcting device for correcting the lead shape of an electronic component having a J-bend type lead. Move parallel to the bottom of
A primary correction means that abuts on the tip of the lead and pushes the lead to the side of the electronic component and spreads it out, and
It is provided with a secondary correction means for adjusting to a bend shape.

According to a second aspect of the present invention, the primary correcting means comprises a slide cam that moves up and down in a vertical direction, and a side surface of the slide cam that comes into contact with the slide cam. And a slide punch that moves in parallel with respect to the leading end of the lead and spreads the lead to the side of the electronic component.

According to a third aspect of the present invention, the slide cam has a frustoconical shape, and the slant surface of the frustoconical shape is in contact with the slide punch, and the slide punch is pushed by the side surface of the slide cam when the slide cam is moved up and down. Moves in parallel to the bottom surface of the electronic component, contacts the tip of the lead, and spreads the lead laterally of the electronic component.

According to a fourth aspect of the present invention, the secondary correction means comprises an elevating member which vertically elevates and lowers, and when the elevating member is elevated and lowered, the base of the J-bend type lead is the bottom surface of the electronic component. And a cam punch that corrects the curved portion so as to have a predetermined J-bend shape at a substantially right angle with respect to.

According to a fifth aspect of the invention, the cam punch has a groove for receiving the J-bend type lead and correcting the shape of the lead when the cam punch is moved up and down. The base portion is bent substantially at right angles to the bottom surface of the electronic component, and the bent portion is bent into a predetermined J-bend shape.

[0013]

According to the first aspect of the invention, the primary correction means moves in parallel to the bottom surface of the electronic component, abuts against the tip of the lead, and pushes the lead laterally of the electronic component. The leads can be made to have the same primary shape, and in the next step, the leads that have been firstly modified to the same shape are trimmed into the predetermined J-bend shape, so the lead shape of the J-bend shape can be corrected accurately and quickly. Therefore, it is less likely to damage the leads and is suitable for repairing fine-pitch leads.

According to the second and third aspects of the invention, the slide punch is slid to the side by raising and lowering the slide cam. Then, the slide punch pushes and spreads the lead laterally of the electronic component. According to this, the primary correction means can be achieved with a simpler and more reliable configuration.

According to the fourth and fifth aspects, the elevating member moves up and down to operate the cam punch, and the operation of the cam punch secondarily corrects the shape of the J-bend type lead of the electronic component. According to this, the secondary correction means can be achieved with a simpler and more reliable configuration.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic component lead shape correcting device according to the present invention will be described below with reference to the accompanying drawings.

In FIGS. 1 and 2, reference numeral 1 indicates a base. Provided on the base 1 are a primary correction means 3 and a secondary correction means 5 for correcting the lead shape of the semiconductor package 100 having J-bend type leads in two steps of primary and secondary. ing.

Primary Correction Means 3 The primary correction means 3 comprises a die 11 on which the semiconductor package 100 is placed, and a primary correction jig 21 for primary correction of the leads.

Referring to FIG. 3, the die 11 is fixed to the die block 13, the die block 13 is inserted between the rails 15, and each rail 15 is fixed to the base 1. 16 is a stopper. In addition, the primary correction jig 21
Is suspended by four shafts 22 (only one is shown), and the upper end 22a of the shaft 22 is a block 23.
It is hung on and is urged downward by a spring 24.

A block 29 is connected to the block 23, a hook member 30 is connected to the block 29, and a free shank 31 is hooked on the hook member 30. The free shank 31 is connected to an air cylinder 32, and the air cylinder 32 is fixed to a fixed flash 33.

According to this, when the rod of the air cylinder 32 extends, the guide post 34 attached to the die block 13 through the free shank 31 (FIG. 1).
The hooking member 30, the block 29, the block 23, and the primary correction jig 21 are integrated and descend while being guided.

Further, as will be described later, the primary correction jig 21 moves in parallel to the bottom surface of the semiconductor package 100, abuts on the tip of the lead, and pushes and spreads the lead laterally of the semiconductor package. The punch 35 is provided.

The slide punch 35 is composed of a member that is movable in four directions with reference to FIG. Each slide punch 35 includes a block 21a and a rail member 36.
Sliding between the slide punches 35
Is urged by the spring 37 toward the side of the inclined surface 35a of the slide punch 35.

A frusto-conical slide cam 39 as shown in FIG. 3 can be fitted between the inclined surfaces 35a, and the slide cam 39 is fixed to the block 23. A hole is formed in the center of the slide cam 39, and a package pressing pin 290 is provided in this hole.
The package pressing pin 290 is biased downward by the spring 291.

According to this, when the slide cam 39 is fitted between the inclined surfaces 35a of the slide punch 35, the slide punch 35 contacting the inclined surface 39a of the slide cam 39 resists the spring force of the spring 37. , Is pushed by the inclined surface 39a of the slide cam 39 to move laterally.

The slide punch 35 is provided with a recess 40 for receiving the lead of the semiconductor package 100, as will be described later.

Secondary Correction Means 5 The secondary correction means 5 comprises a die 41 on which the semiconductor package 100 is placed, and a secondary correction jig 51 for secondarily correcting the leads.

As shown in FIG. 3, the die 41 is fixed to the taper block 42 and the die block 43. The die block 43 is inserted between the rails 15 described above, and each rail 15 is fixed to the base 1. There is. 46 is a stopper.

Further, the secondary correction jig 51 has four lifting members 53 (two lifting members 53 are shown in the figure for convenience) which move vertically, and pins 54 are mounted on the lifting members 53.
And a cam punch 55 connected by. 63 is a stopper. The elevating member 53 is fixed to the block 56 via the punch holder 90, and the block 56 is fixed to the block 57. A hook member 91 is fixed to the block 57, and a free shank 58 is hooked on the hook member 91. The free shank 58 is connected to an air cylinder 59, and the air cylinder 59 is fixed to the fixed flash 33 in the same manner as described above.

According to this, when the rod of the air cylinder 59 extends, the guide post 61 attached to the die block 43 via the free shank 58 (FIG. 1).
The hooking member 91, the block 57, the block 56, and the elevating / lowering member 53 are integrated and descend while being guided.

A hole is opened in the center of the punch holder 90, and a package pressing pin 300 is provided in this hole.
It is urged downward by 1.

The cam punch 55 has one end 55a urged by a spring 64. According to this
The other end 55b of the cam punch 55 is normally open to the outside. The other end 55b of the cam punch 55 is provided with a groove 65 for receiving all the J-bend type leads of the semiconductor package 100 when the cam punch 55 is lowered together with the elevating member 53.

As will be described later in detail, the groove 65 has a shape for bending the base portion of the J-bend type lead at a right angle to the bottom surface of the semiconductor package 100 and for bending the curved portion into a predetermined J-bend shape. I have it.

Next, the operation of this embodiment will be described.

With reference to FIG. 1, the J-bend type leads of the semiconductor package 100 are laterally splayed by the primary correcting means 3 and then trimmed into a predetermined J-bending shape by the secondary correcting means 5. It is assumed that the semiconductor package 100 is transferred from the primary correction means 3 to the secondary correction means 5 by a suction means such as a robot or a transfer means. FIG.
In the figure, reference numeral 500 denotes an idle stage, which is secondarily modified when the robot is transferred to the semiconductor package 100.
It is for temporarily stocking.

Primary Modification of J-Bend Type Lead Referring to FIG. 3, when the rod of the air cylinder 32 extends, the block 29, the block 23, and the primary correction jig 21 are integrated via the free shank 31. And descend. At this time, due to the action of the free shank 31, the primary correction jig 21 descends while maintaining a substantially horizontal state. When the lower surface of the primary correction jig 21 comes into contact with the stopper 16, the lowering of the primary correction jig 21 is stopped, and thereafter, the blocks 29 and 23 are integrally lowered against the spring force of the spring 24. .

Since the slide cam 39 is fixed to this block 23, the slide cam 39 also descends integrally, and as shown in FIG. 6, this slide cam 39 is inclined by the slide punch 35 of the primary correction jig 21. Fit between the surfaces 35a.

Then, the inclined surface 39a of the slide cam 39
The slide punch 35 that abuts against is pushed by the inclined surface 39a of the slide cam 39 against the spring force of the spring 37 and moves laterally (in the direction of the arrow).

At this time, the J-bend type lead 101 of the semiconductor package 100 is located in the recess 40 of the slide punch 35, so that the lead 101 is expanded to the side of the semiconductor package 100 as shown in FIG. According to this, the plurality of leads 101 extending to the four sides of the semiconductor package 100 are corrected at once by the slide punch 35. This is the primary modification of the J-bend type lead.

When the rod of the air cylinder 32 contracts, the slide cam 39 rises, the spring force of the spring 37 causes the slide punch 35 to return to the position shown in FIG. 6, and the rod of the air cylinder 32 contracts further. As shown in FIG. 3, the primary correction jig 21 moves up.
In this state, the semiconductor package 100 that has been subjected to the primary correction is transferred to the secondary correction means 5.

Secondary correction of J-bend type lead This secondary correction is a correction by pushing back. When the rod of the air cylinder 59 extends, the block 57, the block 56, and the pair of lifting members 53 are integrally lowered via the free shank 58.

At this time, due to the action of the free shank 58, the pair of elevating members 53 descend while maintaining a substantially horizontal state.

In the descending process, first, as shown in FIG. 8, the other end 55b of the cam punch 55 is opened to the outside.

When the descent further proceeds from this state, the J-bend type lead 101 of the semiconductor package 100 comes into contact with the first portion 65a of the groove 65 of the cam punch 55. When it comes into contact with the first portion 65a, the base portion 10 of the lead 101 is
1a begins to bend at a substantially right angle to the bottom surface 100a of the semiconductor package 100.

While being in contact with the first portion 65a, the base portion 101a of the lead 101 is continuously bent until it becomes a substantially right angle. That is, the first portion 65a has a function of bending the base portion 101a of the lead 101 substantially at right angles to the bottom surface 100a of the semiconductor package 100.

As the descent continues, the other end 55b of the cam punch 55 contacts the inclined surface 42a of the taper block 42, as shown in FIG.

Then, the other end 55b of the cam punch 55 is
It begins to close inward against the spring force of the spring 64.
In the process of closing the other end 55b of the cam punch 55, the curved portion 101b of the J-bend type lead 101 is received in the second portion 65b of the groove 65 of the cam punch 55, and thus the curved portion 101b is formed in the second portion 65b. It is bent into a predetermined J-bend shape along the shape. Also in this case, the plurality of leads 101 extending on the four sides of the semiconductor package 100 are corrected at once.

As described above, in the secondary correction stage, the base portion 101a of the J-bend type lead 101 is first slowly bent at a right angle to the bottom surface of the electronic component, and then the bending portion 1 is formed.
Since 01b is bent into a predetermined J-bend shape, the J-bend type lead 101 can be accurately corrected.

The pushing back amount of the lead 101 can be adjusted by adjusting the height of the taper block 42. Therefore, the corrected shape of the lead 101 can be easily fitted within the standard size of the product only by adjusting the height.

In summary, according to this embodiment, (1) J
The shape of the bend-shaped lead 101 can be corrected automatically, accurately and quickly. (2) Therefore, the flatness of the leads 101 can be maintained with high accuracy, the leads 101 can be prevented from rising when mounted on a substrate, and soldering defects and the like can be reduced.
(3) Since the lead 101 is not rubbed much at the stage of the primary correction and the secondary correction, the lead 101 is less likely to be scratched and is suitable for the correction of the fine pitch lead 101. (4) Since both the primary correction means 3 and the secondary correction means 5 have an integral structure as shown in the drawing, when the respective means 3, 5 are exchanged when the production type is changed, the exchange is quick. You can get various effects such as being able to change.

Although the lead correction of the semiconductor package 100 having a plurality of leads on four sides has been described above, it is needless to say that this embodiment is also applicable to the semiconductor package 100 having a plurality of leads on two sides. Yes. In any case, since a plurality of leads are corrected at the same time, the semiconductor package 100 can be corrected at the time of correction.
Since there is no need to reset the lead, there is an effect that the lead shape can be corrected extremely accurately.

When manufacturing the above lead shape correcting device, the assembling accuracy of the secondary correcting jig 51 is an important point.

At the stage of the secondary correction, the secondary correction jig 5
When 1 is lowered, the stopper 63 comes into contact with the stopper 46 and the bottom dead center is determined. Cam punch 55 at this bottom dead center
Is activated, and a predetermined J-bend shape along the shape of the second portion 65b is obtained, as described above.

In order to accurately obtain this predetermined J-bend shape, it is a condition that the cam punch 55 is lowered to a predetermined position at the bottom dead center, in other words, a predetermined pushing amount is secured. become. After assembling the lead shape correction device and trying to correct the lead in an actual machine, and if the corrected shape is incorrect, use the device shown in FIG.
The pushing amount of the cam punch 55 is adjusted.

FIG. 10 shows a device for adjusting the pushing amount of the cam punch 55.

When the corrected shape is incorrect, the secondary correction jig 51 is removed from the main body of the apparatus, and the hooking member 91 is further attached.
(FIG. 1) is removed, and the micrometer 73 is attached to the block 57 using the micrometer mounting bracket 71.

The tip 73a of the micrometer 73 is
The suspension bolt 302 fixed to the punch holder 90 contacts the suspension bolt 302, and the suspension bolt 302 is biased upward by the spring 303. The punch holder 90 has bolts 30
It is fixed to the block 56 via 5 and the bolt 3
When 05 is loosened, the punch holder 90, the elevating member 53, and the suspension bolt 302 are integrated and descend by their own weight, and they are supported by the spring 303.

Next, the members 90, 53, 55 below the suspension bolt 302 are integrally pushed downward using the micrometer 73. After pushing in a predetermined amount, the bolt 305 is tightened and the punch holder 90 and the elevating member 53 are blocked.
Fix at 6. Then, this is replaced with an actual machine, an attempt is made to correct the lead again, and if there is further fraud, the above-mentioned work is repeated until the fraud disappears.

According to this, since the work is performed using the micrometer 73, the pushing amount of the cam punch 55 can be reliably adjusted.

[0060]

As is apparent from the above description, according to the first aspect of the invention, the lead moves laterally of the electronic component and abuts against the tip of the lead so that the lead is laterally attached to the electronic component. Since it is equipped with a primary correction means for expanding the lead to a predetermined position and a secondary correction means for adjusting the primary-corrected lead into a predetermined J-bend type, the lead shape of the J-bend type can be corrected accurately and quickly. It is also suitable for fine pitch lead correction without scratching the.

According to the second and third inventions, the primary correction means can be achieved with a simpler and more reliable structure.

According to the fourth and fifth inventions, the secondary correction means can be achieved with a simpler and more reliable structure.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a lead shape correcting device according to the present invention.

FIG. 2 is a side view of the same.

FIG. 3 is a front view showing a main part of FIG.

4 is a cross-sectional view of the primary correction jig of FIG.

5 is a cross-sectional view taken along the line AA of FIG.

FIG. 6 is a sectional view showing a stage of primary correction.

FIG. 7 is a sectional view showing a stage of primary correction in the same manner.

FIG. 8 is a cross-sectional view showing a stage of secondary correction.

FIG. 9 is a sectional view showing the stage of secondary correction in the same manner.

FIG. 10 is a front view showing a device for adjusting a pushing amount of a cam punch.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base 3 Primary correction means 5 Secondary correction means 21 Primary correction jig 35 Slide punch 35a Inclined surface 39 Slide cam 39a Inclined surface 42 Tapered block 51 Secondary correction jig 53 Elevating member 55 Cam punch 65 Groove 100 Semiconductor package 101 Lead 101a base portion 101b curved portion

Claims (5)

[Claims] 1. A lead shape correction device for an electronic component, which corrects the shape of a lead of an electronic component having a J-bend type lead, wherein the device moves parallel to the bottom surface of the electronic component and abuts on the tip of the lead. A lead shape correcting device for an electronic component, comprising: a primary correcting device that pushes and spreads the lead laterally of the electronic component; and a secondary correcting device that arranges the primary corrected lead into a predetermined J-bend shape. 2. The primary correcting means includes a slide cam that moves up and down in a vertical direction, and a side surface of the slide cam that is in contact with the slide cam. 2. The lead shape correcting device for an electronic component according to claim 1, further comprising a slide punch that moves in parallel and contacts the tip of the lead and pushes and spreads the lead laterally of the electronic component. 3. The slide cam has a frustoconical shape, and the slide punch abuts on an inclined surface of the frustoconical shape,
When the slide cam is moved up and down, the slide punch is pushed by the side surface of the slide cam and moves parallel to the bottom surface of the electronic component, abuts on the tip of the lead, and pushes the lead laterally of the electronic component. The lead shape correction device for an electronic component according to claim 2. 4. The secondary correction means includes an elevating member that vertically elevates and lowers, and a base of the J-bend type lead with respect to the bottom surface of the electronic component when the elevating member is elevated and lowered. 2. A lead shape correction device for an electronic component according to claim 1, further comprising a cam punch that corrects the bent portion substantially at a right angle so as to have a predetermined J-bend shape. 5. The cam punch has a groove for receiving a J-bend type lead and correcting the shape of the lead when the cam punch is moved up and down, and the groove has an electronic part at the base of the J-bend type lead. 5. The lead shape correcting device for an electronic component according to claim 4, wherein the lead shape correcting device for an electronic component is provided with a shape for bending the bottom surface of the component substantially at a right angle and for bending the curved portion into a predetermined J-bend shape.