JPH0890425A - Blade - Google Patents

Blade

Info

Publication number
JPH0890425A
JPH0890425A JP26603894A JP26603894A JPH0890425A JP H0890425 A JPH0890425 A JP H0890425A JP 26603894 A JP26603894 A JP 26603894A JP 26603894 A JP26603894 A JP 26603894A JP H0890425 A JPH0890425 A JP H0890425A
Authority
JP
Japan
Prior art keywords
tip
blade
substrate
foot attached
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26603894A
Other languages
Japanese (ja)
Other versions
JP3361631B2 (en
Inventor
Akihiro Koike
昭博 小池
Shinobu Satsuba
忍 札場
Yuichi Shimizu
裕一 清水
Shuichiro Koroku
修一郎 小六
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Diamond Industrial Co Ltd
Original Assignee
Osaka Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Diamond Industrial Co Ltd filed Critical Osaka Diamond Industrial Co Ltd
Priority to JP26603894A priority Critical patent/JP3361631B2/en
Publication of JPH0890425A publication Critical patent/JPH0890425A/en
Application granted granted Critical
Publication of JP3361631B2 publication Critical patent/JP3361631B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121Circular saw blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PURPOSE: To prolong the service life of a blade chip by forming a part of a super abrasive particle layer in a structure having a part partically extended towards the inner circumferential side. CONSTITUTION: A super abrasive particle layer (chip) 2, 2A, which is sintered by mixing a diamond or a CBN abrasive particle with a metal powder, is formed on a steel base plate 1. The tip 2A is formed as a foot attached tip. A part extended toward the inner circumferential side of the base plate 1 is formed for demonstrating such effect as under head abrasion prevention. Mounting of the tip 2 and the foot attached tip 2A is not necessary to be alternate as shown in the example herein but the arrangement can be freely changed depending upon the length of the blade radius, application terms or the like. It can also be formed by combining with those having their foot length of the foot attached tip 2A shortened. Side resistance caused at the foot attached tip 2A and the cutting plane at the time cutting operation can be reduced by forming a grinding groove on the foot attached tip 2A.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、石材、コンクリート、
その他の各種部材の切断加工に用いられるダイヤモン
ド、CBN等の超砥粒層を有するブレードに関するもの
である。
BACKGROUND OF THE INVENTION The present invention relates to stone, concrete,
The present invention relates to a blade having a super-abrasive grain layer such as diamond or CBN used for cutting various other members.

【0002】[0002]

【従来の技術】石材、コンクリート等の硬脆材料の切断
に使用されるブレードは一般的に図1に示すように、多
数の切溝3を設け、切溝間のセグメント外周縁に超砥粒
層チップ2を基板1に一体焼結又はろう付或いは溶接に
て接合したものである。
2. Description of the Related Art A blade used for cutting hard and brittle materials such as stones and concrete is generally provided with a large number of kerfs 3 as shown in FIG. The layer chip 2 is joined to the substrate 1 by integral sintering, brazing or welding.

【0003】[0003]

【発明が解決しようとする課題】この種のブレードでは
切断作業が進むうちに、切屑によって、特に図2に示す
如く、チップ接合下部の基板部分が削り取られ、いわゆ
る首下摩耗といわれる現象が起こる。
With this type of blade, as the cutting operation progresses, chips cause the substrate portion below the chip joint to be scraped off, as shown in FIG. 2, and a phenomenon called so-called under-neck wear occurs. .

【0004】このため、砥粒層はまだ充分使えるのに、
ブレードが使いものにならなくなったり、時には使用中
チップが外れたりする危険性があった。
For this reason, although the abrasive grain layer can be used sufficiently,
There was a risk that the blade would become unusable and the tip would sometimes come off during use.

【0005】[0005]

【課題を解決するための手段】従来の超砥粒層チップは
すべて弓形の同寸法、同形状で形成されているが、本発
明は超砥粒層の一部分を内周側へ部分的に延長した部分
をもった構造とする。
All of the conventional superabrasive grain layer chips are formed in the same shape and shape of an arc, but the present invention partially extends a part of the superabrasive grain layer toward the inner peripheral side. The structure will have the part that

【0006】延長した超砥粒層部分による耐摩性でもっ
て、基板の首下摩耗を防止できるばかりでなく、超砥粒
層と基板との接着面積が大きくなり、チップ外れが解消
される。
Not only can the abrasion resistance of the extended superabrasive grain layer portion prevent under-neck wear of the substrate, but also the adhesion area between the superabrasive grain layer and the substrate can be increased, and chip detachment can be eliminated.

【0007】切断作用時、被削材の切断面と基板とが接
触する板ヅリを起こさないよう刃部となる超砥粒層に対
し基板の板厚を薄くして両面にクリアランスを設けなけ
ればならない。
At the time of cutting action, the plate thickness of the substrate should be made thin to provide a clearance on both sides of the superabrasive grain layer serving as a blade portion so as not to cause plate scraping in which the cut surface of the work material comes into contact with the substrate. I have to.

【0008】このため、ブレードを薄くする上で制限が
あった。
Therefore, there is a limitation in thinning the blade.

【0009】本発明は基板内周側へ延長した超砥粒層に
よって耐摩性を持たせ、首下摩耗を防上すると同時に研
削効果が生じ、良好な切断面が得られる。
According to the present invention, a superabrasive grain layer extending to the inner peripheral side of the substrate is provided with abrasion resistance to prevent under-neck wear, and at the same time, a grinding effect is produced to obtain a good cut surface.

【0010】と同時に、クリアランスを必要としない程
度に迄、薄いブレードとすることができる。
At the same time, the blade can be thin to the extent that no clearance is required.

【0011】[0011]

【実施例】以下、実施例を図面に基づき説明する。図3
は本発明の一実施例におけるブレードの正面図、図4は
図3のA−A断面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments will be described below with reference to the drawings. Figure 3
FIG. 4 is a front view of a blade in one embodiment of the present invention, and FIG. 4 is a sectional view taken along line AA of FIG.

【0012】図3に於いて、1は鋼製基板、2,2Aは
ダイヤモンド又はCBN砥粒を金属粉末と混合し、焼結
した超砥粒層である。
In FIG. 3, 1 is a steel substrate, and 2 and 2A are superabrasive grain layers obtained by mixing diamond or CBN abrasive grains with metal powder and sintering.

【0013】2Aは首下摩耗防止その他の効果を発揮さ
せるために基板の内周側へ延長した超砥粒層をもつチッ
プ(脚付チップ)である。
Reference numeral 2A is a chip (a chip with legs) having a superabrasive grain layer extended to the inner peripheral side of the substrate in order to prevent wear under the neck and to exert other effects.

【0014】図3ではチップ2と脚付チップ2Aを交互
に取付けているが、特に限定するものでなく、ブレード
の径の大きさ、使用条件等によって配置は自由に変更で
きる。
In FIG. 3, the tip 2 and the legged tip 2A are alternately mounted, but the arrangement is not particularly limited, and the arrangement can be freely changed depending on the diameter of the blade, the use condition and the like.

【0015】又、他の実施例を図5に示す。本発明では
脚付チップの脚部の長さを2Bに対し2Cの如く短く
し、必要以上に超砥粒層部を設けることなく、組合せに
よってコスト低減が可能である。
Another embodiment is shown in FIG. In the present invention, the length of the leg portion of the legged tip is shortened from 2B to 2C, and the cost can be reduced by combining without providing the superabrasive layer portion more than necessary.

【0016】脚付チップと切断面で起こる切断時の側面
抵抗は、脚付チップに研削溝4を設けると低減効果があ
る。
The side resistance at the time of cutting that occurs between the legged tip and the cutting surface has a reducing effect when the grinding groove 4 is provided in the legged tip.

【0017】[0017]

【発明の効果】このように本発明は、脚付チップをブレ
ードに配置することで、首下摩耗を防止し、チップが使
い切れる迄寿命を延ばすことができる。
As described above, according to the present invention, by arranging the tip with leg on the blade, it is possible to prevent the wear under the neck and prolong the life until the tip is used up.

【0018】チップは基板に一体焼結又は溶接或いはろ
う付けされるが脚付チップは基板との接着面積も大きく
なりその分接合力が増し、チップ外れを起こさない。
The chip is integrally sintered, welded or brazed to the substrate, but the legged chip has a large bonding area with the substrate and the bonding force increases accordingly, so that the chip does not come off.

【0019】又、前述の如くクリアランスを切粉の排除
が阻害されない必要最小限に迄小さくしても何ら差しつ
かえがないので、従来にない薄いブレードが得られる。
Further, as described above, there is no problem even if the clearance is reduced to the necessary minimum at which the removal of chips is not obstructed, so that a thin blade which has never been obtained can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】従来のブレードの正面図。FIG. 1 is a front view of a conventional blade.

【図2】従来のブレードの首下摩耗状態を示す要部断面
図。
FIG. 2 is a cross-sectional view of a main part showing a conventional under-neck wear state of a blade.

【図3】本発明の一実施例の正面図。FIG. 3 is a front view of an embodiment of the present invention.

【図4】図3のA−A断面図。4 is a sectional view taken along line AA of FIG.

【図5】本発明の他の実施例の正面図。FIG. 5 is a front view of another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 基板 2 超砥粒層 3 切溝 4 研削溝 2A,2B,2C 脚付チップ 1 Substrate 2 Super Abrasive Grain Layer 3 Cutting Groove 4 Grinding Groove 2A, 2B, 2C Legged Tip

───────────────────────────────────────────────────── フロントページの続き (72)発明者 小六 修一郎 大阪府堺市鳳北町2丁80番地 大阪ダイヤ モンド工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shuichiro Koguro 2-80 Hotorikitacho, Sakai City, Osaka Prefecture Osaka Diamond Diamond Industry Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 基板の円周面に複数の切溝を設け、切溝
間の基板外周端面に超砥粒を固着してなるブレード於い
て、超砥粒層の一部分が基板内周側へ延長した部分を持
つチップが、少なくとも一個以上存在することを特徴と
するブレード。
1. A blade comprising a substrate having a plurality of kerfs formed on its circumferential surface and having superabrasive grains adhered to the outer peripheral end face of the substrate between the kerfs, wherein a portion of the superabrasive grain layer is directed toward the inner periphery of the substrate. A blade having at least one tip having an extended portion.
【請求項2】 基板内周側へ延長した超砥粒層部分が異
なる形状又は寸法よりなる請求項1記載のチップを有す
るブレード。
2. A blade having a tip according to claim 1, wherein the superabrasive grain layer portions extending toward the inner peripheral side of the substrate have different shapes or dimensions.
【請求項3】 基板内周側へ延長した超砥粒層のチップ
に研削溝を設けたことを特徴とする請求項1又は2記載
のブレード。
3. The blade according to claim 1, wherein a grinding groove is provided in the chip of the superabrasive grain layer extending toward the inner peripheral side of the substrate.
JP26603894A 1994-09-21 1994-09-21 blade Expired - Lifetime JP3361631B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26603894A JP3361631B2 (en) 1994-09-21 1994-09-21 blade

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26603894A JP3361631B2 (en) 1994-09-21 1994-09-21 blade

Publications (2)

Publication Number Publication Date
JPH0890425A true JPH0890425A (en) 1996-04-09
JP3361631B2 JP3361631B2 (en) 2003-01-07

Family

ID=17425532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26603894A Expired - Lifetime JP3361631B2 (en) 1994-09-21 1994-09-21 blade

Country Status (1)

Country Link
JP (1) JP3361631B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000030810A1 (en) * 1998-11-20 2000-06-02 Sankyo Diamond Industrial Co., Ltd. Diamond blade and method of producing same
WO2003084718A1 (en) * 2002-04-04 2003-10-16 A.L.M.T. Corp. Diamond blade
US7353819B2 (en) 2005-12-23 2008-04-08 Dong Young Diamond Industrial Co., Ltd. Processing tips and tools using the same
KR100910592B1 (en) * 2006-03-17 2009-08-03 동영다이아몬드공업(주) Machining tips and machining tools equipped with them

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000030810A1 (en) * 1998-11-20 2000-06-02 Sankyo Diamond Industrial Co., Ltd. Diamond blade and method of producing same
US6401705B1 (en) 1998-11-20 2002-06-11 Sankyo Diamond Industrial Co., Ltd. Diamond blade and method of manufacturing the same
JP4583603B2 (en) * 1998-11-20 2010-11-17 三京ダイヤモンド工業株式会社 Diamond blade
WO2003084718A1 (en) * 2002-04-04 2003-10-16 A.L.M.T. Corp. Diamond blade
US7100595B2 (en) 2002-04-04 2006-09-05 A.L.M.T. Corp. Diamond blade
US7353819B2 (en) 2005-12-23 2008-04-08 Dong Young Diamond Industrial Co., Ltd. Processing tips and tools using the same
KR100910592B1 (en) * 2006-03-17 2009-08-03 동영다이아몬드공업(주) Machining tips and machining tools equipped with them

Also Published As

Publication number Publication date
JP3361631B2 (en) 2003-01-07

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