JPH0891427A - Embossed carrier tape and packaging machine using it - Google Patents

Abstract

PURPOSE: To obtain an embossed carrier tape ensuring an easy pick-up of an electronic part by a suction nozzle without such failures that an electronic part is laterally turned or reversed in a cavity part, an electronic part is ejected out of the cavity part, and an external lead is caught by a tongue piece and to obtain a packaging machine for packaging electronic parts using the embossed carrier tape. CONSTITUTION: On a side wall of a cavity part 3 of an embossed carrier tape 1, a V- or U-shaped overhang part 4 abutting against a wall surface of an electronic part 6 is provided. On the bottom surface of the cavity part 3, an ejecting hole 5 for ejecting the electronic part 6 is provided. On the other hand, in a packaging machine using this embossed carrier tape 1, a tape presser for holding embossed carrier tape 1 between the cavity parts 3 has a chevron- shaped cross section. The packaging machine is provided with an ejecting pin pressing up the electronic part 6 and the bottom surface of the cavity part 3 for releasing the electronic part 6 and a suction nozzle picking up the released electronic part 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed carrier tape and a mounting machine therefor, and more particularly to an embossed carrier tape suitable for storing and picking up electronic parts and a mounting machine therefor.

[0002]

2. Description of the Related Art Recent surface mounting technology for semiconductor devices (SM
In the case of (T), further high-density mounting is required for downsizing, price reduction, high speed, and high reliability. Along with this, surface mount type semiconductor devices are also becoming smaller, thinner, and lighter in weight, thinness, shortness, and size. Of these semiconductor devices, the size of the resin-sealed package of the three-terminal transistor (hereinafter referred to as TR) and the two-terminal diode (hereinafter referred to as Di) is
Depending on the size of the chip such as capacitors and resistors of passive circuit elements, 3.2 x 1.6 mm or 2 x 1.25 mm to 1.
The size is changing to 6 × 0.8 mm and 1.0 × 0.5 mm. The structure of the embossed carrier tape of Conventional Example 1 for supplying this electronic component to the mounting machine is shown in FIG.
As shown in (a), (b) and (c), an embossed carrier tape 1 having a concave cavity portion 3 for accommodating an electronic component 6 and a top tape 16 having a lid on the upper opening of the cavity portion 3 are formed. Composed. In the conventional example 1 configured in this way, after the top tape 16 is peeled off using the mounting machine, the electronic component 6 is picked up from the cavity portion 3 by the suction nozzle 7 as shown in FIG. .

On the other hand, the structure of the embossed carrier tape of Conventional Example 2 is shown in FIGS. 6 (a) and 6 (b) and FIGS. 7 (a) and 7 (b).
As shown in FIG. 3, the embossed carrier tape 1 having a tongue piece 14 that is inclined and protruded toward the bottom surface at the center of the side walls of two adjacent sides of the cavity 3 and the upper opening of the cavity 3 are covered. And a top tape 16 for This conventional example 2 has a structure in which the projecting tongue piece 14 presses the chip-type electronic component 13 against the wall surface opposite to the wall surface having the projecting tongue piece 14 (see, for example, Japanese Utility Model Laid-Open No. 63-23259). ). As in the case of the conventional example 1, the conventional example 2 having the above-described configuration has the same structure as shown in FIG.
After the top tape 16 is peeled off using a mounting machine, the chip electronic component 13 is picked up from the cavity 3 by the suction nozzle 7.

[0004]

When a two-terminal resin-sealed diode as the electronic component shown in FIG. 4 is housed in the embossed carrier of the conventional example 1, the two-terminal resin-sealed diode has a size of the resin portion. In proportion to the lead, the lead is extremely small, and since the lead flat part is below the bottom of the resin part, it is easy to tilt left and right around the lead and is in an unstable state. ing. Therefore, when the embossing carrier tape and the top tape are peeled off by the mounting machine and the tape is fed, if the feeding speed of the embossing carrier tape is high, the electronic components tilt backward due to inertia. Since the embossed carrier tape moves while the electronic component is tilted, there is a problem that it is easy to cause rollover, flipping inside the cavity, and popping out of the cavity.

On the other hand, the conventional example 2 is an embossed carrier tape for a capacitor chip or the like which is a leadless type electronic component, and the chip type electronic component is fixed on the wall surfaces of two adjacent sides in the cavity. The structure is done by the tongue. When a lead-equipped electronic component such as a two-terminal resin-sealed diode is stored in the embossed carrier tape of Conventional Example 2, the tongue is positioned above the external lead, and the lead is caught by the tongue when sucked by the suction nozzle. However, there is a problem in that it is liable to cause problems.

An object of the present invention is to provide an embossed carrier tape which can be easily adsorbed and picked up by an adsorbing nozzle without problems such as overturning, flipping over and flipping out of the electronic part in the cavity, and the like. is there.

[0007]

The embossed carrier tape according to the first aspect of the present invention comprises cavity portions which are provided at equal intervals and which accommodate electronic components, and tape feeding through holes which are provided at equal intervals and which feed the cavity portions. In an embossed carrier tape having a carrier tape for supplying the electronic component, an overhang portion that abuts a wall surface of the electronic component is provided on a side wall of the cavity portion, and a push-up hole that pushes up the electronic component is provided on a bottom surface of the cavity portion. Has been.

The embossed carrier tape of the second invention is
Cavity parts that are provided at equal intervals to store electronic components,
An embossed carrier tape for supplying the electronic component, comprising: a carrier tape that is provided at equal intervals and has a tape feeding through hole for feeding the cavity; and a top tape that seals an opening of the cavity of the carrier tape. An overhang portion that abuts a wall surface of the electronic component is provided on a side wall of the cavity portion, a push-up hole that pushes up the electronic component on the bottom surface of the cavity portion, and the narrow top tape.

The embossing carrier tape mounting machine according to the third aspect of the invention mounts the electronic parts by sucking and picking up the tape retainer for pressing between the cavities of the embossing carrier tape and the electronic parts housed in the cavities. In an embossing carrier tape mounting machine having a suction nozzle, the cross section of the tape retainer has a V-shaped structure, and a push-up pin that pushes up the bottom surface of the electronic component and the cavity is provided.

[0010]

By providing an overhang portion on the side wall of the cavity portion that comes into contact with the electronic component and a push-up hole on the bottom surface of the cavity portion to push up the electronic component, the electronic component is held down by the overhang portion and the electronic component rolls over, flips, and turns over. Problems such as popping out of the cavity can be prevented.

On the other hand, when picking up the electronic component from the cavity, the tape retainer of the embossing carrier tape mounting machine has a V-shaped cross-sectional structure, and a push-up pin for pushing up the electronic component and the bottom of the cavity is provided. Therefore, when the push-up pin is pushed up, the holding of the overhang portion holding the electronic component is released, and the electronic component can be easily picked up by the suction nozzle.

[0012]

Embodiments of the present invention will now be described with reference to the drawings.

1 (a), 1 (b) and 1 (c) are a plan view, a sectional view and a plan view of an embossed carrier tape for supplying electronic parts in a state in which electronic parts of a first embodiment of the present invention are housed. It is an AA 'line sectional view. In the first embodiment of the present invention, as shown in FIGS. 1 (a), 1 (b) and 1 (c), the electronic component 6 is housed in the tape feed through hole 2 side and the opposite side. In the embossed carrier tape 1 in which the outer leads are arranged and the resin side surface of the electronic component 6 is arranged in the feeding direction of the embossed carrier tape 1, first, a push-up hole having a diameter of about 1.0 mm is formed in the central portion of the bottom surface of the cavity portion 3. After forming the holes to be 5, the cavity 3 is formed in a desired shape and depth.

In the case of this embodiment, the shape of the opening is 3.0 m.
The rectangle was m × 1.6 mm and the depth was about 1.1 mm. Next, a V-shaped or U-shaped groove is formed in the central portion of two side surfaces of the cavity portion 3 abutting on the resin surface side of the electronic component 6 in the feeding direction of the embossed carrier tape 1 so as to face each other. An overhang portion 4 for pressing the electronic component 6 is formed in the opening. The size 1 of the overhang portion 4 is about 0.1 to 0.2 mm.

FIG. 2 is a sectional view showing a schematic construction of a mounting machine for explaining a method of taking out electronic components when the first embodiment of the present invention is used. As shown in FIG. 2, the tape presser opening of the mounting machine has a horizontal cross section, whereas the tape presser 8 has a V-shaped structure and is pushed up on the bottom of the cavity 3. The bottoms of the electronic component 6 and the cavity 3 are pushed up through the holes 5, and the openings of the cavities 3 of the embossed carrier tape 1 are deformed into a V shape along the openings of the C-shaped tape retainer 8 and fixed at the overhanging portions 4. The electronic component 6 that has been used is released and sucked by the suction nozzle 7.

Next, a second embodiment will be described.

FIGS. 3 (a), 3 (b) and 3 (c) are a plan view, a sectional view and a plan view of an embossed carrier tape for supplying electronic components in a state where the electronic components of the second embodiment of the present invention are housed. It is a BB 'sectional view. The structure and manufacturing method of the embossed carrier tape of the second embodiment are the same as those of the first embodiment shown in FIG. As shown in FIG. 3, after the electronic component 6 is housed in the embossed carrier tape 1 of this embodiment, the narrow top tape 11 is thermocompression bonded between the cavities 3 to form the thermocompression bonding part 12. The narrow top tape 11 has a width of 0.5 to 1.0 mm and a thickness of about 50 μm and is 1/3 or less of the long side of the cavity 3 of 3.0 mm. The product is taken out in the same manner as in the first embodiment after stripping the narrow top tape 11.

[0018]

As described above, according to the present invention, the overhanging portion is provided in the opening of the cavity portion to fix the electronic component, so that the electronic component can be overturned, turned upside down, popped out of the cavity portion, and It is possible to improve the problem of the external lead being caught by the tongue. Furthermore, by providing a push-up hole on the bottom of the cavity and by making the cross-sectional shape of the tape pressing opening of the mounting machine into a V shape,
This has the effect of facilitating the operation of pushing up and picking up an electronic component.

Further, when the top tape is provided, conventionally, the thermocompression bonding portions of the top tape are sequentially fixed by thermocompression bonding so that various problems occur when the tape is peeled off by the mounting machine. By using a narrow top tape such as the top tape of the present invention only for the cover of the electronic component and reducing the area of the thermocompression bonding portion, it is possible to avoid a problem due to variation in strength during peeling.

[Brief description of drawings]

1 (a), (b) and (c) are a plan view, a cross-sectional view and an A thereof of an embossed carrier tape for supplying electronic components in a state in which an electronic component according to a first embodiment of the present invention is housed. −
It is an A'line sectional view.

FIG. 2 is a cross-sectional view showing a schematic configuration of a mounting machine for explaining a method for taking out electronic components when the first embodiment of the present invention is used.

3 (a), (b) and (c) are a plan view of an embossed carrier tape for supplying electronic parts, a sectional view thereof and a part B thereof, in a state in which an electronic part of a second embodiment of the present invention is housed. −
It is a B'line sectional drawing.

4 (a), (b) and (c) are a plan view, a cross-sectional view and a cross-section taken along line CC 'of the embossed carrier tape for supplying electronic components in a state where the electronic components of Conventional Example 1 are housed. It is a figure.

FIG. 5 is a cross-sectional view showing a schematic configuration of a mounting machine for explaining a method of taking out an electronic component when the conventional example 1 is used.

6 (a) and 6 (b) are a plan view and a sectional view taken along line DD of an embossed carrier tape for supplying electronic components of Conventional Example 2.

7 (a) and 7 (b) are a plan view and a cross-sectional view taken along the line EE 'of the embossed carrier tape for supplying electronic components in a state where the chip-type electronic component of Conventional Example 2 is housed.

[Explanation of symbols]

 1 Embossed Carrier Tape 2 Tape Feed Through Hole 3 Cavity Part 4 Overhang Part 5 Push-up Hole 6 Electronic Parts 7 Adsorption Nozzle 8 C-shaped Tape Presser 9 Tape Presser 10 Push-up Pin 11 Narrow Top Tape 12 Thermo-compression Part 13 Chip Type Electronic parts 14 Tongue 16 Top tape

Claims (3)

[Claims] 1. An embossed carrier for supplying the electronic component, the cavity part being provided at equal intervals and having a carrier tape provided with through holes for tape feeding, which are arranged at equal intervals and which feed the cavity part. On the tape,
An embossed carrier tape, comprising: an overhang portion that contacts a wall surface of the electronic component on a side wall of the cavity portion; and a push-up hole that pushes up the electronic component on a bottom surface of the cavity portion. 2. Cavity portions that are provided at equal intervals to accommodate electronic components, carrier tapes that are provided at equal intervals and that have tape feed through holes for feeding the cavity parts, and openings of the cavity portions of the carrier tape. In an embossed carrier tape for supplying the electronic component having a top tape for sealing the electronic component, an overhang portion that abuts a wall surface of the electronic component on a side wall of the cavity portion, and a push-up that pushes up the electronic component on a bottom surface of the cavity portion. An embossed carrier tape comprising a hole and the narrow top tape. 3. A mounting machine for embossed carrier tape, comprising: a tape retainer for pressing between cavity portions of an embossed carrier tape; and an adsorption nozzle for adsorbing and picking up an electronic component housed in the cavity portion to mount the electronic component. 2. The embossed carrier tape mounting machine according to claim 2, wherein the tape retainer has a V-shaped cross-section and push-up pins for pushing up the bottom surfaces of the electronic component and the cavity are provided.