JPH0897036A - Electronic circuit board - Google Patents

Abstract

PURPOSE: To obtain an electronic circuit board which is capable of being mounted with an inductive element on the same production line as other electronic parts, lessening the inductive element in area occupied by it, being decreased in size, and mass-produced. CONSTITUTION: An inductive device such as a coil or a transformer is formed direct on a printed board 5 by the use of a magnetic core 1, a conductor 2, a printed pattern, and through-holes 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board, and more particularly to a hybrid IC incorporating an inductance circuit.
The present invention relates to an improvement of an electronic circuit board that constitutes the

[0002]

2. Description of the Related Art Recently, with the miniaturization of information collecting equipment, communication equipment, measuring equipment, and control equipment, electromagnetic wave detection sensors, current detection sensors, oscillators, receiving circuits, filters, etc., which are used by incorporating these equipment, The miniaturization of used coils and transformers and the use of ICs have become problems.

A technique for mounting active elements such as transistors and diodes and passive elements such as resistors and capacitors on a substrate used for a hybrid IC has made great progress in recent years.
However, the method of mounting an inductance element such as a coil or a transformer used for a relatively low frequency purpose on an IC substrate is not so advanced as that for other elements. In particular, in order to form a transformer having a magnetic core on an IC substrate, these elements must be prepared separately before the IC.
The method of mounting on a board is still mainstream. Since these elements are relatively large and heavy and difficult to standardize, they are not only suitable for automatic mounting, but also easily affected by vibration even after mounting.

FIGS. 6 and 7 show an example of mounting a conventional hybrid IC substrate including this type of inductance element. FIG. 6 is a plan view and FIG. 7 is a side view. It is assumed that this hybrid IC constitutes an electromagnetic wave detection sensor.

In this example, an inductance element 6 and a circuit element 4 constituting a signal processing circuit for processing a signal output from the inductance element 6 are mounted on a printed board 5 such as a ceramic board or a glass epoxy board. . As the signal processing circuit, a signal amplification circuit, a filter circuit for removing unnecessary noise from the signal, an oscillator circuit or A
A GC circuit or the like can be considered. The circuit element 4 and the inductance element 6, which are separately manufactured, are fixed on or around the printed circuit board 5. Further, 7 and 8 in the figure are external connection terminals, which are connected to an external inductance element.

By the way, in such a conventional configuration, elements other than the inductance element, such as resistors, capacitors, transistors, operational amplifiers, etc., are small in size and standardized in shape so that they can be mounted by an automatic mounting machine. However, the shape of the inductance element changes depending on the frequency and purpose of use, it is difficult to standardize, and automatic mounting is difficult,
It was necessary to fix it using an adhesive or a clasp.
Further, in general, if it is large and heavy and is not sufficiently fixed to the substrate, there is a problem that after mounting, it may come off from the mounting due to vibration or the like, or the lead wire may be cut.

[0007]

As described above, the substrate used for the conventional hybrid IC or the like has a problem in mounting the inductance element. The present invention has been made to solve such a problem, in which the inductance element is configured in a small size, and when it is mounted on the board, it can be automatically mounted in the same process as other electronic components, and vibration and It is an object of the present invention to realize a substrate used for a hybrid IC or the like that includes an inductance element that does not come off due to shock or the like, or breaks in lead wires.

[0008]

To achieve the above object, the present invention provides an electronic circuit board having an electronic circuit including an inductance element, the inductance element being a magnetic core provided on the substrate, and the magnetic core. And a plurality of conductors arranged in parallel so as to cover the coil and a plurality of conductors connected in parallel to each other on the substrate so as to form a coil surrounding the magnetic core together with the conductors. It is characterized in that it is composed of a conductor pattern.

At this time, a through hole is used to attach the conductor, and the conductor pattern is provided on the back surface of the substrate.

Alternatively, a land is used to attach the conductor, and the conductor pattern is provided on the substrate surface.

Further, through holes and lands are used to attach the conductors, and the conductor patterns are provided on the front and back surfaces of the substrate.

[0012]

According to the present invention, the magnetic core and the conductor, which are the components of the inductance element, are directly constructed and mounted on the substrate, so that the mounting can be automated and the reliability after mounting is high, It can be miniaturized.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid IC or a printed circuit board according to the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 shows a hybrid I according to an embodiment of the present invention.
2 is a plan view of the C or printed circuit board, and FIG.
Is a cross-sectional view taken along line AA of FIG. 1-3, 1 is a magnetic core, 2 is a conducting wire, 3 is a through hole, 4 is a circuit element, 5 is a printed circuit board, and 9 is a conductor made of a printed pattern.

In the present invention, the magnetic core 1, the conductive wire 2, the through hole 3, and the conductor 9 are used to form an inductance element on the substrate.

First, as the magnetic core 1, a ferrite or permalloy core or an air core is selected in consideration of the frequency characteristics required for the inductance element, the inductance and the magnetomotive force. The magnetic core 1 thus selected is mounted between the rows of the through holes 3 shown in FIG. 1 by a method such as adhesion, welding, vapor deposition, or fixing with a stopper plate. Next, the through holes 3 on the side to which the magnetic core 1 is fixed are connected to the left and right by the conductors 2 to form the magnetic core 1.
Cover it. The connection can be performed by soldering or wire bonding. On the other hand, on the back surface of the substrate, the conductor 9 is previously formed in a printed pattern. As a result, an inductance element having a magnetic core 1 in a coil whose number of turns is the number of conducting wires 2 connecting left and right through holes 3 can be formed on the substrate.

Although the printed pattern conductor 9 is provided on the back surface of the printed circuit board 5 in the examples of FIGS. 1 to 3 described above, the inductance element can be formed by a printed pattern on only one surface. FIG. 4 is a plan view in that case. In order to configure an inductance element, after the printed pattern conductor 9 is formed as shown in the figure, the conductor is covered with an insulating film, the magnetic core 1 is mounted thereon, and then the left and right lands or through holes 3 are connected by the conductor 2. Then, the coil is configured to realize the inductance element on one surface of the printed circuit board 5.

FIG. 5 shows the inductance when the required number of turns cannot be obtained with only one row of lands or through holes 3 or when a plurality of rows of lands or through holes 3 are provided for the purpose of constructing a lap winding transformer. It is a pattern of an element part. By connecting two independent coils as shown in FIG. 5A, a transformer can be connected, and by connecting one coil as shown in FIG. 5B, the number of turns can be nearly doubled. .

[0019]

As described above, in the present invention, the magnetic core, the conductor, the printed pattern, the land or the through hole is used to directly form an inductance element such as a coil or a transformer on the printed circuit board. So
When an inductance element with the required characteristics is attached to another electronic component, it can be built at the same time as another electronic component is attached on the same production line, and the productivity of the circuit including the inductance element can be improved to improve reliability. You can Further, by adopting such a configuration, it is possible to reduce the area occupied by the inductance element on the printed board, and to mount the inductance element in a bridge with other components, which contributes to a space factor and miniaturization.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic circuit board according to an embodiment of the present invention.

FIG. 2 is a side view of the electronic circuit board of the embodiment of FIG.

FIG. 3 is a rear view of the electronic circuit board of the embodiment of FIG.

FIG. 4 is a plan view of an electronic circuit board according to another embodiment of the present invention.

FIG. 5 is a plan view of an electronic circuit board according to still another embodiment of the present invention.

FIG. 6 is a plan view of a conventional example of an electronic circuit board including an inductance element.

7 is a side view of the conventional example of FIG.

[Explanation of symbols]

 1 magnetic core 2 conducting wire 3 through hole 4 circuit element 5 printed circuit board 6 inductance element 7, 8 external connection terminal 9 conductor made of printed pattern

Claims (4)

[Claims] 1. An electronic circuit board having an electronic circuit including an inductance element, wherein the inductance element includes a magnetic core provided on the substrate, and a plurality of conductors arranged in parallel to cover the magnetic core. An electronic circuit board characterized in that the conductor patterns are provided in parallel on the substrate in a number corresponding to the number of the conductors so that the conductors are connected to each other to form a coil surrounding the magnetic core together with the conductors. . 2. The electronic circuit board according to claim 1, wherein a through hole is used for attaching the conductor, and the conductor pattern is provided on a back surface of the board. 3. The electronic circuit board according to claim 1, wherein a land is used to attach the conductor, and the conductor pattern is provided on a surface of the board. 4. The electronic circuit board according to claim 1, wherein through holes and lands are used for attaching the conductors, and the conductor patterns are provided on the front surface and the back surface of the board.