JPH0897251A - TAB tape - Google Patents

Abstract

(57) [Abstract] [Purpose] The mounted LSI chip has a large degree of freedom in movement, and when it is used in an electrical characteristic testing device with a contact cooling function in a TAB LSI state, a relatively small pressing force or suction force is applied. (EN) Provided is a TAB tape which can easily and surely bring a metal block for cooling into contact with force. [Structure] Hole portion 11 for mounting LSI chip 30
A film 10 having a frame shape that defines the
The pattern wiring portion 20a formed above and the LSI chip 3 exposed continuously in the hole portion 11 to the pattern wiring portion 20a.
The lead wire 20 is composed of an exposed portion 20b that is joined to zero. A notch 11a is formed in an edge region of the film 10 that faces the hole 11. The edge region has flexibility together with a portion of the pattern wiring portion 20b of the lead wire 20 corresponding to the edge region.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB (Tape Automated B) used for transporting a mounted semiconductor integrated circuit with itself in a manufacturing process of a semiconductor integrated circuit device.
onding) tape.

[0002]

2. Description of the Related Art Semiconductor integrated circuits (hereinafter, L
The power consumption during operation tends to increase with the high integration of (SI). For this reason, when conducting an electrical characteristic test of an LSI, a radiator is prepared in the assembled package and air-cooled or water-cooled to prevent damage to the LSI due to self-heating.

On the other hand, with the high integration of LSIs, a manufacturing method in which a lead wire is bonded to an LSI chip using a TAB tape and then the LSI chip is resin-sealed is widely used.

4A and 4B are views for explaining a conventional TAB tape. FIG. 4A is a top view and FIG. 4B is a cutting line AA.
It is a longitudinal cross-sectional view by '. In FIGS. 4A and 4B, the TAB tape has a frame-like film 10 defining a hole 13 for mounting the LSI chip 30.
And a lead wire 20 formed on the film 10 by photolithography or the like. The lead wire 20 is the film 10
It is composed of a pattern wiring portion 20a formed above, and an exposed portion 20b which is continuous with the pattern wiring portion 20a and which is exposed in the hole 13 and joined to the LSI chip 30. L
The SI chip 30 is connected to the tip of the exposed portion 20b of the lead wire 20 via a bump 31 (ILB: Inner Lead Bondi).
(It is called ng). Then, the TAB tape carries the mounted LSI chip 30 together with itself by being wound up like a movie film. The TAB tape with the LSI chip 30 mounted in this way is called a TAB LSI. The electrical characteristic test is performed in the TABLSI state.

In the electrical characteristic test of TAB LSI, LS
It is difficult to provide the I-chip 30 with a radiator. For this reason, the test apparatus for performing the electrical characteristic test of the TAB LSI adopts the cooling method as disclosed in, for example, Japanese Patent Laid-Open No. 1-286322. 5 and 6 are schematic views showing a test apparatus of this type.

First, referring to FIG. 5, the test apparatus includes a test section 51 for performing an electrical characteristic test of a TAB LSI 70 to be mounted.
A metal block 52 made of a material having a high thermal conductivity that contacts the TAB LSI 70 on the test section 51, a Peltier element 53 having a cooling side in contact with the metal block 52, and a bypass 521 formed in the metal block 52. Pipe 5 in communication
4, a vacuum pump 55 connected to the pipe 54, a refrigerant pipe 56 that is in contact with the heat radiation side of the Peltier element 53 and in which a refrigerant flows, a circulator 57 that circulates the refrigerant, and a refrigerant that circulates. And a cooler 58. Then, the TAB LSI 70 is brought into close contact with the metal block 52 by the vacuum pump 55, and heat conduction between the TAB LSI 70 and the metal block 52 and heat conduction between the metal block 52 and the Peltier element 53 are performed. Cool self-heating of 70. The heat radiation side of the Peltier element 53 is connected to the pipe 56.
And is cooled by the cooler 58 using the refrigerant circulating in the pipe 56.

FIG. 6 shows a configuration that is a simplification of the configuration of FIG. That is, in FIG. 6, the test apparatus includes a test unit 61 for performing an electrical characteristic test of the mounted TAB LSI 70.
A metal block 62 made of a material having a high thermal conductivity that contacts the TAB LSI 70 on the test section 61, a Peltier element 63 whose cooling side is in contact with the metal block 62, and a heat dissipation side of the Peltier element 63 which is in contact with the surface area. Has a wide radiator 64, and an air-cooling fan 65 that cools the radiator 64. Then, the Peltier element 63 is cooled by an air cooling system, and the TAB LSI
Instead of vacuuming 70, TAB the metal block 62
The configuration is such that it is pressed against the LSI 70.

Since both of the test devices shown in FIGS. 5 and 6 are of a system in which a metal block is brought into contact with the TAB LSI 70 to cool it by heat conduction, the TAB LSI 70
It is desired that the contact thermal resistance between the metal block 52 and the metal block 52 or 62 is low. Factors that affect the contact thermal resistance are TAB LSI 70 and metal block 52 or 62.
There are surface roughness and waviness of each contact surface, contact pressure of each other, each hardness, and each thermal conductivity.

[0009]

SUMMARY OF THE INVENTION Including the above-mentioned example,
In the conventional TAB tape, for example, as shown in FIG. 4B, the degree of freedom of movement of the LSI chip 30 is small due to the reaction force (indicated by an arrow in the figure) of the exposed portion 20a of the lead wire 20. , There are the following problems.

First, as shown in FIG. 6, when the TAB LSI 70 and the metal block 62 for cooling are brought into close contact with each other without vacuum suction, the facing angle between the TAB LSI 70 and the metal block 62 is set. Must be sufficiently parallel. this is,
If this angle is deviated even a little, the contact surface of the TAB LSI 70 and the contact surface of the metal block 62 do not evenly adhere to each other, and a region is not partially cooled. The TAB LSI 70 during electric measurement generates heat due to the electric power consumed by the TAB LSI 70, and accurate measurement of characteristics is impossible unless the generated heat is uniformly cooled. If bad, TAB due to fever
The LSI 70 itself may be damaged. In addition, in order to deal with the above problems, the TAB LSI 70 and the metal block 62
If they are brought into contact with each other with a large contact pressure, an excessive force is applied to the lead wire, which may damage the lead wire.

On the other hand, as shown in FIG. 5, the TAB LSI 70
When vacuuming is performed on the metal block 52, the cooling uniformity is substantially satisfied. However, TAB LS before suction
If the distance between the I 70 and the metal block 52 is too large, or the parallel surfaces to be in contact with each other are not maintained,
After the suction, excessive force is applied to the lead wire, and the lead wire is peeled off or damaged.

An object of the present invention is to provide a TAB tape in which a mounted LSI chip has a large degree of freedom of movement.

Another object of the present invention is to obtain accurate characteristic measurement as well as high cooling efficiency and thermal destruction when used in an electrical characteristic tester having a contact cooling function in a TAB LSI state. It is to provide a TAB tape that can be used.

Still another object of the present invention is to apply an excessive force locally to a lead wire when it is used in an electrical property tester having a contact cooling function in a TAB LSI state. It is to provide a TAB tape which is not damaged in the vicinity thereof.

[0015]

According to the present invention, a film having a frame shape that defines a hole for mounting a semiconductor integrated circuit, a pattern wiring portion formed on the film, and the pattern wiring portion are formed. And a lead wire consisting of an exposed portion which is continuously exposed in the hole and is joined to the semiconductor integrated circuit, and which is for transporting the mounted semiconductor integrated circuit together with itself. A notch is formed in an edge region of the film which faces the hole, and the edge region has flexibility together with a portion of the pattern wiring portion corresponding to the edge region. TAB tape is obtained.

According to the present invention, a film having a frame shape that defines a hole for mounting a semiconductor integrated circuit, a pattern wiring portion formed on the film, and the pattern wiring portion are continuously formed. In a TAB tape for transporting the mounted semiconductor integrated circuit together with the lead wire, the lead wire having an exposed portion exposed in the hole portion and joined to the semiconductor integrated circuit, The exposed portion has a substantially large area so as to have flexibility by exhibiting a substantially long length, and the exposed portion is made of the same material as the film in the hole, A TAB is provided, which is provided with an annular member that is joined to the exposed portion with a gap from an edge region facing the hole portion, and the annular member stabilizes the exposed portion.
The tape is obtained. In addition, a cut may be formed in the edge region so that the edge region has flexibility together with a portion of the pattern wiring portion corresponding to the edge region.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A TAB tape according to an embodiment of the present invention will be described below with reference to the drawings. In the drawings used in the following description, the same parts as or similar parts to those of the conventional example are shown in FIG.
The same reference numerals as those in (a) and (b) are attached.

[Embodiment 1] FIGS. 1A and 1B are views for explaining a TAB tape according to Embodiment 1 of the present invention. FIG. 1A is a top view and FIG. 1B is a vertical cross section taken along the section line AA '. It is a figure. 1A and 1B, the TAB tape according to Example 1 has a frame-like film 10 defining a hole 11 for mounting an LSI chip 30 and a film 10 on the film 10 as in the conventional example. And a lead wire 20 formed by photolithography or the like. The film 10 has strength,
It is made of polyimide such as Kapton or Upilex, which has excellent heat resistance and chemical resistance.
It is about 5 μm to 125 μm. The hole 11 is formed by punching using a die. The LSI chip 30 has a relatively large heat generation amount, for example,
When the size is about 15 mm square, the size of the hole 11 is 2
It is preferably 5 mm square to 30 mm square or more. However, if the hole 11 is too large with respect to the LSI chip 30, the exposed portion 20b of the lead wire 20 becomes too long and the support of the LSI chip 30 becomes unstable. The upper limit of the size is the LSI chip 3
The ratio of the length to the size of 0 should be set to about 250%.

The lead wire 20 is exposed in the pattern wiring portion 20a and the hole portion 11 formed on the film 10 and is exposed to the LS.
The exposed portion 20b is joined to the I-chip 30. Further, the LSI chip 30 is mounted by being connected to the tip of the exposed portion 20b of the lead wire 20 via the bump 31 to form a TAB LSI. The electrical characteristic test is performed in the TAB LSI state.

Further referring to FIG. 2 (a), in the TAB tape according to Example 1, its film 10
A cut 11a is formed continuously with the hole 11 in the edge area of the hole facing the hole 11, and the edge area has flexibility. The cut 11a is formed together with the hole 11 by punching. Also, the cut 11a
The dimension s is, for example, the LSI chip 30 and the hole 11
When each of the above dimensions is as described above, it is preferably about 2 mm to 3 mm. As a result, in the TAB LSI using the TAB tape according to the first embodiment, when pressure is applied to the back surface of the LSI chip 30 in the vertical direction, as shown in FIG. 1B, the edge region has the pattern wiring portion 20a. Since it flexes together with the portion corresponding to the edge region, the movable range of the LSI chip 30 joined to the exposed portion 20b is large.

Therefore, the tape according to Example 1 was used.
When the TAB LSI is applied to the apparatus shown in FIG. 6 as the TAB LSI 70 and an electric characteristic test is performed while cooling,
Even if the TABLSI 70 and the metal block 62 are not sufficiently prepared so that the facing angles thereof are parallel to each other, the edge region of the film is shown in FIG.
As shown in (b), the surface of the TAB LSI 70 to be brought into contact with the surface of the metal block 62 to be brought into close contact with each other is uniformly bent, and there is no occurrence of a partially uncooled region. Then, the heat generated by the TAB LSI 70 itself during the electrical measurement is uniformly cooled, and accurate characteristic measurement is possible. Of course, the TAB LSI 70 itself is not damaged by heat generation. Also, TAB
Since it is not necessary to bring the LSI 70 and the metal block 62 into contact with each other with a large contact pressure, an excessive force is applied to the lead wire,
The lead wire is not damaged.

Further, the TAB LSI according to the first embodiment is replaced with TAB LS
As I 70, when applying the apparatus shown in FIG. 5 to perform an electrical characteristic test while cooling, the TAB LSI 7 before suction is used.
Even when the distance between 0 and the metal block 52 is too large or the parallel surfaces to be in contact with each other are not kept parallel, the edge region of the film bends as shown in FIG. 1 (b). , Can be easily suctioned with a relatively weak suction force. For this reason,
Excessive force is not applied to the lead wire and damage such as peeling of the lead wire does not occur. Also, if the suction force is too strong, the edge area of the film bends and the TAB LS
The I 70 is attracted to the metal block 52, the tensile force applied to the exposed portion of the lead wire is dispersed, and damage is prevented.

2B and 2C show the T according to the first embodiment.
It is a figure which shows the other specific example of the notch 11a of AB tape. In FIG. 2B, the cut 11a ′ is the same as that of FIG.
It has a dimension s set similarly to the dimension s of the notch 11a shown in (a). In addition, in FIG.
The notch 11a ″ has a dimension s ″ that is also set similarly to the dimension s of the notch 11a. The incision of the TAB tape according to the present invention can have various shapes as described above, and any shape should be formed in a region of the lead wire 20 that does not interfere with the pattern wiring 20a.

[Second Embodiment] FIG. 3 is a top view for explaining a TAB tape according to a second embodiment of the present invention. In FIG. 3, the TAB tape according to the second embodiment is formed by a film 10 having a frame shape defining the hole 12 for mounting the LSI chip 30 and the film 10 on the film 10 by photolithography as in the first embodiment. And a lead wire 20. The film 10 is made of polyimide such as Kapton or Upilex and has a thickness of 75 μ, for example.
It is about m to 125 μm. The lead wire 20 is exposed in the pattern wiring portion 20a formed on the film 10 and the hole portion 12, and is exposed in the exposed portion 20b to be joined to the LSI chip 30.
And consists of.

The hole 12 is the exposed portion 20b of the lead wire 20.
Is secured in a substantially large area so as to be flexible by exhibiting a substantially long length. For example, when the LSI chip 30 is about 15 mm square, the size of the hole 12 is about 35 mm square to 50 mm square or larger. The exposed portion 20b of the lead wire 20 is made of the same material as the film 10 in the hole 12, and is spaced apart from the edge region of the film 10 facing the hole 12.
It has an annular member 40 to be joined to. Annular member 40
Is to stabilize the exposed portion 20b of the lead wire 20 having a long length so as not to vary. Considering that the exposed portion 20b of the lead wire 20 is stabilized by the annular member 40, the upper limit of the size of the hole 12 is about 400% in terms of the length with respect to the LSI chip 30.

The hole 12 is formed by punching using a mold as in the first embodiment, but the annular member 40 can also be formed during this punching. That is, first
The annular member 40 is held in the edge region of the film 10 via a runner (not shown) by punching.
And the hole portions 12-1 and 12-2 are formed, and then the lead wire 20 is formed on the film 10 and then the runner is removed to make the film 10 and the annular member 40 independent.

TAB according to the second embodiment having the above-described configuration
In the TAB LSI using the tape, since the center of deflection (fulcrum) of the lead wire 20 is far from the LSI chip 30, the lead wire 2
The reaction force due to the bending of 0 is small, and the degree of freedom with respect to the force applied to the back surface of the LSI chip 30 in the vertical direction is large. That is, the movable range of the LSI chip 30 joined to the exposed portion 20b is large.

Now, in the same manner as in the first embodiment, the LSI chip 30 is connected to the lead wire 2 of the TAB tape according to the second embodiment.
It is mounted by being connected to the tip of the exposed portion 20b of 0 through the bump 31 to form a TAB LSI. The electrical characteristic test is performed in the TAB LSI state. Similarly to the first embodiment, the TAB LSI using the TAB tape according to the second embodiment can be applied to the apparatus shown in FIG. 5 or 6 as the TAB LSI 70 to perform an electrical characteristic test while cooling. . Since the movable range of the LSI chip 30 joined to the exposed portion 20b is large based on the flexibility of the exposed portion of the lead wire having a long length, the same effect as that of the first embodiment can be obtained.

In the TAB tape according to the second embodiment, a cut (not shown) may be formed in the edge region of the film 10 as in the first embodiment. According to this structure, both the edge region and the exposed portion 20b of the lead wire 20 having a long length have flexibility, so that the movable range of the LSI chip 30 bonded to the exposed portion 20b. Can be made larger.

[0030]

In the TAB tape according to the present invention, a notch is formed in the edge region of the film facing the hole, and the edge region is formed together with the portion corresponding to the edge region of the pattern wiring portion of the lead wire. Since it has flexibility, it is mounted L
The flexibility of moving the SI chip is great. This allows TA
When used in an electrical characteristics tester with a contact cooling function in the BLSI state, the cooling metal block can be brought into contact with the cooling metal block easily and reliably with a relatively small pressing force or suction force, and cooling efficiency can be improved. The TAB LSI does not break due to heat, and accurate characteristics can be measured. Furthermore, excessive force is not locally applied to the lead wire and the lead wire and its vicinity are not damaged.

Also, the hole is secured in a substantially large area so that the exposed portion of the lead wire has a substantially long length and thus has flexibility, and the hole is made of the same material as the film. Even if the annular member is joined to the exposed portion of the lead wire with a gap from the edge region of the film, the degree of freedom of movement of the mounted LSI chip is large as in the above case. By providing an annular member,
The exposed part of the lead wire is stabilized. Further, in addition to securing a substantially large area of the hole, if a cut is formed in the edge region and the edge region has flexibility together with a portion of the pattern wiring portion corresponding to the edge region. , LSI to be mounted
Greater freedom of tip movement.

[Brief description of drawings]

1A and 1B are views showing a TAB tape according to a first embodiment of the present invention, in which FIG. 1A is a top view and FIG. 1B is a vertical sectional view.

FIG. 2 is a diagram showing a specific example of cuts in the TAB tape according to Example 1 of the present invention.

FIG. 3 is a top view showing a TAB tape according to Example 2 of the present invention.

FIG. 4 is a diagram showing a TAB tape according to a conventional example,
(A) is a top view and (b) is a longitudinal sectional view.

FIG. 5 is a schematic diagram showing an electrical characteristic test apparatus for TAB LSI.

FIG. 6 is a schematic view showing a TAB LSI electrical characteristic test apparatus.

[Explanation of symbols]

 10 film 11, 12, 13 hole part 11a, 11a ', 11a' 'notch 12-1, 12-2 hole part 20 lead wire 20a pattern wiring part 20b exposed part 30 LSI chip 31 bump 40 annular member 51, 61 test part 52, 62 Metal block 53, 63 Peltier element 55 Vacuum pump 56 Refrigerant pipe 57 Circulator 58 Cooler 64 Radiator 65 Air cooling fan 70 TAB LSI

Claims (3)

[Claims] 1. A film having a frame shape that defines a hole for mounting a semiconductor integrated circuit, a pattern wiring portion formed on the film, and exposed in the hole portion continuously to the pattern wiring portion. A lead wire composed of an exposed portion bonded to the semiconductor integrated circuit, and a TAB tape for carrying the mounted semiconductor integrated circuit with itself, an edge of the film facing the hole. The TAB tape is characterized in that a notch is formed in the end region, and the edge region has flexibility together with a portion of the pattern wiring portion corresponding to the edge region. 2. A film having a frame shape defining a hole for mounting a semiconductor integrated circuit, a pattern wiring portion formed on the film, and exposed in the hole portion continuously to the pattern wiring portion. In the TAB tape for carrying the mounted semiconductor integrated circuit together with the semiconductor integrated circuit, the hole is substantially covered by the exposed portion. Is secured to a substantially large area so as to have flexibility by exhibiting a long length, and an edge of the film made of the same material as the film and facing the hole of the film. A TAB tape, comprising: an annular member that is joined to the exposed portion with a gap from an area, the annular member stabilizing the exposed portion. 3. A cut is formed in the edge region, and the edge region is flexible together with a portion of the pattern wiring portion corresponding to the edge region. The TAB tape according to item 2.