JPH0897522A - IC board for IC card - Google Patents
IC board for IC cardInfo
- Publication number
- JPH0897522A JPH0897522A JP6230119A JP23011994A JPH0897522A JP H0897522 A JPH0897522 A JP H0897522A JP 6230119 A JP6230119 A JP 6230119A JP 23011994 A JP23011994 A JP 23011994A JP H0897522 A JPH0897522 A JP H0897522A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- central electrode
- chip
- central
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/281—Auxiliary members
- H10W72/283—Reinforcing structures, e.g. bump collars
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
Landscapes
- Credit Cards Or The Like (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】
【目的】 ＩＣカード用ＩＣ基板10であって、グランド
用のパッドの位置がＩＳＯ規格に適合していないＩＣチ
ップを用いたＩＣカードを容易に製造することのできる
ＩＣカード用ＩＣ基板10を提供する。
【構成】 ＩＣチップの大きさに略一致する中央電極11
と、中央電極11から連続して中央電極11よりも幅の細い
延設電極13を中央電極11の上下に有し、中央電極11の左
右に各々独立した複数個の電極部21,22,〜,28を設け、
各電極部21,22,〜,28の一部を中央電極11に接近させる
ように配置したＩＣ基板10とする。
(57) [Abstract] [Purpose] An IC card which is an IC substrate 10 for an IC card and which can be easily manufactured using an IC chip in which the position of a pad for ground does not conform to the ISO standard. An IC substrate 10 for use is provided. [Structure] Central electrode 11 that substantially matches the size of the IC chip
A continuous electrode from the central electrode 11 having a narrower width than the central electrode 11 above and below the central electrode 11, and a plurality of independent electrode parts 21, 22, respectively on the left and right of the central electrode 11. , 28,
The IC substrate 10 is arranged such that a part of each of the electrode portions 21, 22, ..., 28 is brought close to the central electrode 11.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣカードに用いるＩ
Ｃチップを取り付けるＩＣ基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in IC cards.
The present invention relates to an IC substrate to which a C chip is attached.
【０００２】[0002]
【従来の技術】今日、ＩＣカードと称され、縦８５．５
±０．１２mm、横５３．９７±０．００６mm、厚さ０．
７６±０．００８mmの大きさに規格化され、内部にＩＣ
モジュールを内蔵する薄板状のものがある。このＩＣカ
ードのＩＣモジュールは、縦横約１５mm、厚さ約０．５
mm程度であって、通常はその裏面に６個又は８個の接点
端子としての電極を有し、図３に示すように、例えば８
個の電極を形成したＩＣ基板10上にＩＣチップ41を載置
し、ＩＣチップ41の上面に設けられている８個のボンデ
ィング用パッド43と基板10上に形成された８個の電極部
21,22,〜,28とをボンディングワイヤー45により接続
し、各電極部21,22,〜,28はスルーホールなどにより基
板10の裏面に形成した接点端子の電極と各々接続し、Ｉ
Ｃチップ41及びボンディングワイヤー45を合成樹脂によ
りモールドすることにより前記１５mm四方にして厚さを
０．５mm程度としたＩＣモジュールとして形成されてい
るものである。2. Description of the Related Art Today, it is called an IC card and has a length of 85.5.
± 0.12 mm, width 53.97 ± 0.006 mm, thickness 0.
Standardized to a size of 76 ± 0.008mm, IC inside
There is a thin plate type with a built-in module. The IC module of this IC card has a length and width of about 15 mm and a thickness of about 0.5.
It has a size of about mm, and usually has 6 or 8 electrodes as contact terminals on its back surface. For example, as shown in FIG.
The IC chip 41 is placed on the IC substrate 10 on which the electrodes are formed, and the eight bonding pads 43 provided on the upper surface of the IC chip 41 and the eight electrode portions formed on the substrate 10.
21, 22, ~, 28 are connected by a bonding wire 45, and each electrode portion 21, 22, ~, 28 is connected to an electrode of a contact terminal formed on the back surface of the substrate 10 by a through hole or the like, and I
The C chip 41 and the bonding wire 45 are molded with a synthetic resin so as to form an IC module having a 15 mm square and a thickness of about 0.5 mm.
【０００３】そして、このＩＣモジュールのＩＣ基板10
は、通常ＩＳＯ規格に従って形成され、図４に示すよう
に右上の電極部25をグランド用電極としてＩＣチップ41
を固定する中央電極11と接続するように形成され、中央
電極11の大きさをＩＣチップ41を載置し得る大きさと
し、この中央電極11の上にＩＣチップ41を接着固定して
ＩＣチップ41に形成されている８個のパッド43と各電極
部21,22,〜,28とを接続し、各パッド43と各電極部21,2
2,〜,28とを接続するボンディングワイヤー45の長さを
極力短くすることができるように各電極部21,22,〜,28
をＩＣチップ41の周囲間近まで接近させて形成している
ものである。The IC substrate 10 of this IC module
Is normally formed in accordance with the ISO standard, and as shown in FIG.
Is formed so as to be connected to the central electrode 11 for fixing the IC chip 41, and the size of the central electrode 11 is set to a size on which the IC chip 41 can be placed. The eight pads 43 formed in each of the electrodes are connected to the respective electrode portions 21, 22, ..., 28, and each pad 43 and the respective electrode portions 21, 2 are connected.
In order to minimize the length of the bonding wire 45 connecting 2, 2, 28, each electrode part 21, 22 ,, 28
Are formed close to the periphery of the IC chip 41.
【０００４】[0004]
【発明が解決しようとする課題】前述のように、ＩＳＯ
規格に基づいて規格化されたＩＣチップ及びＩＣカード
用ＩＣ基板では、右上の電極部をグランド用電極と定め
ているも、カスタムＩＣやその他のＩＣなどのチップで
は、必ずしも右上のパッドがグランド用電極とならない
ものもある。As described above, the ISO
In the IC chip and IC card IC board standardized based on the standard, the upper right electrode part is defined as the ground electrode, but in chips such as custom ICs and other ICs, the upper right pad is not always used for ground. Some may not be electrodes.
【０００５】このようなＩＳＯ規格の規格に適合しない
ＩＣチップを用いる場合、ボンディング用パッドと基板
の各電極部とを接続するボンディングワイヤーを交差さ
せるようにしてワイヤーボンディングを行うことになる
も、ボンディングワイヤーを交差させる場合、短絡を生
じさせる危険が高く、また、ＩＣモジュールとしてはそ
の厚みを薄く形成しなければならないため、数mmと短い
ボンディングワイヤーを接触させないように配線接続す
ることは極めて困難となる場合が多かった。When such an IC chip that does not conform to the ISO standard is used, wire bonding is performed so that the bonding wires connecting the bonding pad and each electrode portion of the substrate are crossed. When crossing the wires, there is a high risk of causing a short circuit, and since the IC module must be made thin, it is extremely difficult to make wiring connections so that bonding wires as short as a few mm do not come into contact with each other. It was often the case.
【０００６】[0006]
【課題を解決するための手段】本発明は、ＩＣチップの
大きさに略一致する中央電極と、中央電極から連続して
中央電極よりも幅の細い延設電極を中央電極の上下に有
し、中央電極の左右に各々独立させた複数個の電極部を
中央電極に接近させて配置したＩＣ基板とする。According to the present invention, a central electrode having a size substantially equal to that of an IC chip and extension electrodes continuous with the central electrode and having a width narrower than the central electrode are provided above and below the central electrode. , An IC substrate in which a plurality of independent electrode portions are provided on the left and right sides of the central electrode and are arranged close to the central electrode.
【０００７】[0007]
【作用】本発明は、中央電極をＩＣチップの大きさに略
一致させ、左右に各々独立した複数個の電極部を中央電
極に接近させて配置している故、中央電極の上にＩＣチ
ップを載置固定することができ、且つ、ＩＣチップ上の
各パッドと各電極部とを各々短いボンディングワイヤー
で容易に接続することができる。According to the present invention, since the central electrode is made to substantially correspond to the size of the IC chip, and a plurality of left and right independent electrode portions are arranged close to the central electrode, the IC chip is placed on the central electrode. Can be placed and fixed, and each pad on the IC chip and each electrode portion can be easily connected by a short bonding wire.
【０００８】さらに、中央電極から上下方向に延設電極
を連続させて設けている故、グランドとして定められた
パッドとボンディングワイヤーで接続した特定の電極部
を延設電極にボンディングワイヤーで接続することが容
易であり、延設電極と前記特定の電極部との間にワイヤ
ーボンディングを施すことにより、中央電極をグランド
端子とする特定の電極部へ容易に接続することができ
る。Further, since the extending electrode is continuously provided in the vertical direction from the central electrode, a specific electrode portion connected to the pad defined as the ground by the bonding wire is connected to the extending electrode by the bonding wire. By performing wire bonding between the extended electrode and the specific electrode portion, the central electrode can be easily connected to the specific electrode portion having the ground terminal.
【０００９】[0009]
【実施例】本発明に係るＩＣチップを取り付けるＩＣカ
ード用ＩＣ基板10の実施例は、図１に示すように、中央
に幅約２mm、長さ約３mmの中央電極11を形成し、この中
央電極11から上下方向には幅約１mmの延設電極13を設け
ると共に、中央電極11及び延設電極13の左右には各々独
立した４個の電極部21,22,〜,28を設けるものである。EXAMPLE An example of an IC card IC substrate 10 to which an IC chip according to the present invention is attached has a central electrode 11 having a width of about 2 mm and a length of about 3 mm formed at the center, as shown in FIG. An extended electrode 13 having a width of about 1 mm is provided from the electrode 11 in the vertical direction, and four independent electrode portions 21, 22, ..., 28 are provided on the left and right sides of the central electrode 11 and the extended electrode 13, respectively. is there.
【００１０】この左右の各４個の電極部21,22,〜,28
は、その一部を中央電極11に近接するようにし、左右の
各中央２個の電極部となる第２電極部22、第３電極部2
3、第６電極部26、及び、第７電極部27の中央辺31は直
線的に形成するも、この第２電極部22、第３電極部23、
第６電極部26、及び、第７電極部27の内側辺33は、中央
電極11の長さに合わせることにより内側周辺角部に切欠
部35を形成し、４隅の位置に相当する第１電極部21、第
４電極部24、第５電極部25、及び、第８電極部28の内隅
角部には前記第２電極部22、第３電極部23、第６電極部
26、及び、第７電極部27に形成した欠設部35に食い込む
ようにして中央電極11に近接する膨出部37を形成し、こ
の第１電極部21、第４電極部24、第５電極部25、及び、
第８電極部28の内隅から中央電極11の方向に向けて延設
した膨出部37により第１電極部21、第４電極部24、第５
電極部25、及び、第８電極部28の一部を中央電極11に近
接させ、残る第２電極部22、第３電極部23、第６電極部
26、及び、第７電極部27はその内側辺33を中央電極11に
近接させるようにして上下に対称とすると共に左右にも
対称に各電極部21,22,〜,28を中央電極11や延設電極13
に近接させて配置するものである。Each of the left and right four electrode parts 21, 22, ..., 28
Has a second electrode part 22 and a third electrode part 2 which are two electrode parts in each of the left and right centers so that a part thereof is close to the central electrode 11.
3, the sixth electrode portion 26 and the central side 31 of the seventh electrode portion 27 are formed linearly, but the second electrode portion 22, the third electrode portion 23,
The sixth electrode portion 26 and the inner side 33 of the seventh electrode portion 27 are formed with the notches 35 at the inner peripheral corners by being matched with the length of the central electrode 11 and correspond to the four corner positions. The second electrode portion 22, the third electrode portion 23, and the sixth electrode portion are provided at inner corner portions of the electrode portion 21, the fourth electrode portion 24, the fifth electrode portion 25, and the eighth electrode portion 28.
26 and a swelling portion 37 that is close to the central electrode 11 so as to bite into the recessed portion 35 formed in the seventh electrode portion 27, and the first electrode portion 21, the fourth electrode portion 24, and the fifth electrode portion Electrode part 25, and
The bulging portion 37 extending from the inner corner of the eighth electrode portion 28 toward the central electrode 11 causes the first electrode portion 21, the fourth electrode portion 24, and the fifth electrode portion
The electrode part 25 and a part of the eighth electrode part 28 are brought close to the central electrode 11 and the remaining second electrode part 22, third electrode part 23, and sixth electrode part
26, and the seventh electrode portion 27 is vertically symmetrical so that its inner side 33 is close to the central electrode 11, and the respective electrode portions 21, 22, ... Extended electrode 13
It is placed close to.
【００１１】従って、このＩＣ基板10にＩＣチップ41を
載置固定すれば、図２に示すように、ＩＣチップ41の各
ボンディング用パッド43を極めて細いボンディングワイ
ヤー45により各電極部21,22,〜,28と接続することがで
き、グランド端子に指定されているパッド43と接続した
電極部と延設電極13とを更にボンディングワイヤー46で
接続すれば、中央電極11とグランドとする電極部25とを
容易に接続することができ、ＩＳＯ規格に適合しないＩ
Ｃカード用のＩＣチップ41を基板10に取り付ける際、グ
ランドに指定されているパッドを間近の電極部と接続し
つつ、中央電極11とも接続することができるものであ
る。Therefore, when the IC chip 41 is mounted and fixed on the IC substrate 10, the bonding pads 43 of the IC chip 41 are connected to the electrode portions 21, 22, by the extremely thin bonding wires 45, as shown in FIG. , 28, and the electrode portion connected to the pad 43 designated as the ground terminal and the extended electrode 13 are further connected by the bonding wire 46, the central electrode 11 and the electrode portion 25 serving as the ground. Can be easily connected to and does not conform to the ISO standard.
When the IC chip 41 for the C card is attached to the substrate 10, the pad designated as the ground can be connected to the adjacent electrode portion as well as the central electrode 11.
【００１２】又、上記実施例は、電極部ひいては接点端
子が８個のＩＣ基板10であるも、電極部の数は８個に限
るものでなく、例えば第２電極部22と第３電極部23とを
一体とすると共に第６電極部26と第７電極部27とをも一
体とした６個の電極部ひいては接点端子を有するＩＣ基
板10とすることもあり、左右に各々３個の電極部を形成
する場合は、４隅の電極部に膨出部37を形成することな
く、左右の中央の電極部の幅を中央電極11の上下方向幅
と同一か又は上下方向幅よりも細くして６個の電極部の
一部を中央電極11に近接させることもでき、中央電極11
及び延設電極13の左右に各々独立した複数個の電極部を
形成すれば足りるものである。Further, in the above embodiment, the IC substrate 10 has eight electrode parts and thus contact terminals. However, the number of electrode parts is not limited to eight. For example, the second electrode part 22 and the third electrode part are provided. In some cases, the IC board 10 has six electrode portions which are integrated with 23 and the sixth electrode portion 26 and the seventh electrode portion 27, and thus have contact terminals. When forming the portions, the width of the left and right central electrode portions is made equal to or smaller than the vertical width of the central electrode 11 without forming the bulging portions 37 at the electrode portions at the four corners. It is also possible to bring some of the six electrode parts close to the central electrode 11.
It is only necessary to form a plurality of independent electrode portions on the left and right of the extended electrode 13.
【００１３】[0013]
【発明の効果】本発明は、ＩＣチップの大きさに略一致
した中央電極とこの中央電極から上下に連続して延びる
延設電極とを有すると共に、中央電極の左右に各々独立
した複数個の電極部を有する故、ＩＣチップのグランド
用パッドの配置に拘わらず、各パッドと各パッドに最も
近い電極部とをボンディングワイヤーにより接続し、延
設電極と所定の電極部とをさらにボンディングワイヤー
により接続することによって中央電極をグランド用の電
極部と接続することができ、グランドに指定されたパッ
ドがＩＳＯ規格に適合していないＩＣチップであっても
容易に載置することができるＩＣカード用ＩＣ基板であ
る。According to the present invention, a central electrode having a size substantially equal to the size of an IC chip and extended electrodes extending vertically from the central electrode are provided, and a plurality of independent electrodes are provided on the left and right sides of the central electrode. Since the electrodes are provided, regardless of the arrangement of the ground pads of the IC chip, each pad and the electrode portion closest to each pad are connected by a bonding wire, and the extended electrode and the predetermined electrode portion are further connected by a bonding wire. By connecting, the central electrode can be connected to the electrode part for the ground, and even if the pad specified as the ground is an IC chip that does not conform to the ISO standard, it can be easily mounted. It is an IC substrate.
【図１】本発明に係るＩＣカード用ＩＣ基板の平面図。FIG. 1 is a plan view of an IC substrate for an IC card according to the present invention.
【図２】本発明に係るＩＣカード用ＩＣ基板にＩＣチッ
プを取り付けた状態を示す図。FIG. 2 is a diagram showing a state in which an IC chip is attached to an IC substrate for an IC card according to the present invention.
【図３】従来のＩＣ基板にＩＣチップを取り付けた状態
を示す図。FIG. 3 is a diagram showing a state in which an IC chip is attached to a conventional IC substrate.
【図４】従来のＩＣカード用ＩＣ基板を示す平面図。FIG. 4 is a plan view showing a conventional IC card IC substrate.
１０ ＩＣ基板 １１ 中央電極 １３ 延設電極 ２１〜２８ 電極
部 ３１ 中央辺 ３３ 内側辺 ３５ 切欠部 ３７ 膨出部 ４１ ＩＣチップ ４３ パッド ４５，４６ ボンディングワイヤー10 IC Substrate 11 Central Electrode 13 Extended Electrodes 21 to 28 Electrode Part 31 Central Side 33 Inner Side 35 Cutout 37 Swelling 41 IC Chip 43 Pad 45, 46 Bonding Wire
Claims (1)
極と、この中央電極から連続して中央電極よりも幅の細
い延設電極をこの中央電極の上下に有し、前記中央電極
の左右に各々独立した複数個の電極部を前記中央電極に
接近させて配置したことを特徴とするＩＣカード用ＩＣ
基板1. A central electrode having a size substantially equal to that of an IC chip, and extension electrodes continuous with the central electrode and having a width smaller than that of the central electrode are provided above and below the central electrode. A plurality of independent electrode portions are arranged close to the central electrode in the IC for IC card
substrate
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6230119A JP2788196B2 (en) | 1994-09-27 | 1994-09-27 | IC board for IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6230119A JP2788196B2 (en) | 1994-09-27 | 1994-09-27 | IC board for IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0897522A true JPH0897522A (en) | 1996-04-12 |
| JP2788196B2 JP2788196B2 (en) | 1998-08-20 |
Family
ID=16902872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6230119A Expired - Fee Related JP2788196B2 (en) | 1994-09-27 | 1994-09-27 | IC board for IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2788196B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100723491B1 (en) * | 2005-07-14 | 2007-05-30 | 삼성전자주식회사 | Universal Printed Circuit Boards and Smart Cards Using the Same |
-
1994
- 1994-09-27 JP JP6230119A patent/JP2788196B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100723491B1 (en) * | 2005-07-14 | 2007-05-30 | 삼성전자주식회사 | Universal Printed Circuit Boards and Smart Cards Using the Same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2788196B2 (en) | 1998-08-20 |
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