JPH0897535A - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JPH0897535A JPH0897535A JP6254778A JP25477894A JPH0897535A JP H0897535 A JPH0897535 A JP H0897535A JP 6254778 A JP6254778 A JP 6254778A JP 25477894 A JP25477894 A JP 25477894A JP H0897535 A JPH0897535 A JP H0897535A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- flow stop
- frame
- stop frame
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 封止樹脂流れ止めを確実に防止できる電子部
品搭載装置を提供する。
【構成】 長尺状プリント配線板用基材１１に設けられ
た電子部品収納・取付予定部１３及び該ボンディングホ
ール１４を取り囲むようにして配置された封止樹脂流れ
止め枠１２ａを具備し、この流れ止め枠１２ａの少なく
とも内側面の平面形状がジグザグ形状若しくは凹凸の連
続形状を示す。この流れ止め枠はパッド印刷法により接
着固定されて形成される。またこの流れ止め枠１２ａを
構成する樹脂は、ポリエステル樹脂とシリコーン系樹脂
とを含み、この両樹脂に対して該シリコーン系樹脂は２
〜５重量％配合される。更に、流れ止め枠１２ａが二重
以上に配置形成されてもよい。
(57) [Abstract] [Purpose] To provide an electronic component mounting device capable of reliably preventing a sealing resin flow stop. [Structure] An electronic component storage / mounting planned portion 13 provided on a long-sized printed wiring board substrate 11 and a sealing resin flow stop frame 12a arranged so as to surround the bonding hole 14 are provided. At least the inner surface of the flow stop frame 12a has a zigzag shape or a concavo-convex continuous shape. This flow stop frame is formed by being bonded and fixed by a pad printing method. The resin forming the flow stop frame 12a contains a polyester resin and a silicone resin, and the silicone resin is 2
~ 5% by weight. Further, the flow stop frame 12a may be formed in a double or more arrangement.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、封止樹脂流れ止めを確
実に防止できる電子部品搭載装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus capable of reliably preventing a sealing resin flow stop.
【０００２】[0002]
【従来の技術】従来は混成集積回路装置において、図８
に示すように、受動部品及び能動素子を搭載する絶縁基
板上に、バッファーコート用樹脂の流れを阻止する流れ
止め枠１２ｄをスクリーン印刷法により一体に設けたこ
とを特徴とした混成集積回路装置が知られている（特開
昭５９−１４１２８８号公報）。2. Description of the Related Art Conventionally, in a hybrid integrated circuit device, as shown in FIG.
As shown in FIG. 2, a mixed integrated circuit device characterized in that a flow stop frame 12d for blocking the flow of the resin for buffer coating is integrally provided by screen printing on an insulating substrate on which passive components and active elements are mounted. It is known (Japanese Patent Laid-Open No. 59-141288).
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記流れ止め
枠１２ｄは、図８及び図３（ｄ）に示すように、内周面
がジグザグでなく平坦な形状をしている。従って、樹脂
を用いて封止しようとした場合、この流れ止め枠１２ｄ
を乗り越えてしまう場合がある。また、この特開昭５９
−１４１２８８号公報には、シリコン樹脂からなる流れ
止め枠が開示されているが、シリコン樹脂のみからなる
ので、乾燥（硬化）時間が長く、そのため生産効率が低
下するし、また通常用いられるガラスエポキシ、ポリエ
ステル又はポリイミドからなる樹脂基板との接着強度が
十分でなく、更にこの流れ止め枠は柔らかいので傷が付
いたりし易い。更に、スクリーン印刷法により流れ止め
枠を形成する方法は、版のメッシュを通じて印刷するた
め最低線幅が０．３ｍｍ以上となり、しかも図９に示す
ように、線型が波状になる欠点があり、線幅が±０．０
５ｍｍで場所によりかなり変動する。従って、スクリー
ン印刷で作る流れ止め枠は、本来予定した封止領域より
外側に置かねばならず、そのためカードに取付け加工を
するときに必要な接着領域が狭くしかとれなかった。ま
た、この方法は版を使用するので、その版に寿命があ
り，そのため、製版代がかかりコスト高となる。However, as shown in FIGS. 8 and 3 (d), the flow stop frame 12d has an inner peripheral surface which is not zigzag but flat. Therefore, when the resin is used for sealing, the flow stop frame 12d
May get over. In addition, this Japanese Patent Application Laid-Open No. 59
Japanese Patent Laid-Open No. 141288/1992 discloses a flow stop frame made of a silicone resin, but since it is made of a silicone resin only, it takes a long time to dry (curing), resulting in a decrease in production efficiency and a commonly used glass epoxy. , The adhesive strength with the resin substrate made of polyester or polyimide is not sufficient, and the flow stop frame is soft, so that it is easily scratched. Furthermore, the method of forming the flow stop frame by the screen printing method has a drawback that the minimum line width becomes 0.3 mm or more because printing is performed through the mesh of the plate, and the linear shape becomes wavy as shown in FIG. Width ± 0.0
It varies considerably depending on the location at 5 mm. Therefore, the screen-printing flow-stop frame has to be placed outside the originally intended sealing area, so that the bonding area required when mounting the card is limited. In addition, since this method uses a plate, the plate has a long life, and therefore a plate-making fee is required, resulting in high cost.
【０００４】本発明は、上記欠点を克服するものであ
り、封止樹脂流れ止めを確実に防止できる電子部品搭載
装置を提供することを目的とする。The present invention overcomes the above-mentioned drawbacks, and an object of the present invention is to provide an electronic component mounting apparatus capable of reliably preventing a sealing resin flow stop.
【０００５】[0005]
【課題を解決するための手段】本発明は、プリント配線
板用基材と、該基材に設けられる電子部品収納・取付予
定部と、該電子部品収納・取付予定部の周辺に設けられ
た複数のボンディングホールと、該電子部品収納・取付
予定部及び該ボンディングホールを取り囲むようにして
配置された封止樹脂流れ止め枠（以下、単に「流れ止め
枠」又は「枠」ともいう。）と、上記基材の一面側に形
成された複数のコンタクト端子を備えた所望の配線回路
パターンとを具備したプリント配線板において、上記流
れ止め枠の少なくとも内側面の平面形状がジグザグ形状
若しくは凹凸の連続形状を示すことを特徴とする。According to the present invention, there is provided a base material for a printed wiring board, an electronic component storage / mounting planned portion provided on the base material, and a periphery of the electronic component storage / mounting planned portion. A plurality of bonding holes, a sealing resin flow stop frame (hereinafter, also simply referred to as “flow stop frame” or “frame”) arranged so as to surround the electronic component housing / mounting planned portion and the bonding hole. A printed wiring board having a desired wiring circuit pattern having a plurality of contact terminals formed on one surface side of the base material, wherein at least the inner surface of the flow stop frame has a zigzag shape or a continuous concavo-convex shape. It is characterized by showing a shape.
【０００６】上記プリント配線板用基材は、長尺状とす
ることができる。上記流れ止め枠において、上記電子部
品収納・取付予定部及び上記ボンディングホールを取り
囲むようにして配置された流れ止め枠の２枠以上が同心
円状に配置形成されるとともに、少なくともこのうちの
最内側に配置された１枠が上記ジグザグ形状若しくは凹
凸の連続形状を示すものとすることができる。上記流れ
止め枠は、スクリーン印刷法若しくはパッド印刷法又は
その他の印刷方法により形成されてもよいが、パッド印
刷法により接着固定されて形成されたのが好ましい。The printed wiring board substrate may be of a long shape. In the flow stop frame, two or more flow stop frames that are arranged so as to surround the electronic component storage / mounting planned portion and the bonding hole are concentrically arranged and formed, and at least the innermost one of them. The arranged one frame may have the above-mentioned zigzag shape or a continuous shape of irregularities. The flow stop frame may be formed by a screen printing method, a pad printing method, or another printing method, but it is preferably formed by being adhesively fixed by the pad printing method.
【０００７】上記流れ止め枠を構成する樹脂は、基材と
の適度の接着性及び封止樹脂との適度の濡れの悪さ、更
に適度の硬度及び強度を備える範囲において種々選択さ
れる。例えば、ポリエステル樹脂とシリコーン系樹脂と
を含み、この両樹脂を１００重量部とした場合、該シリ
コーン系樹脂は１〜２０重量部（好ましくは２〜５重量
部）配合されたものとすることができる。この配合量が
１重量部未満では、封止樹脂との濡れがよくなって十分
な流れ止め効果が得られにくくなり、２０重量部を越え
ると、この枠が軟らかくなりその硬度及び強度が十分で
なくなるとともに、基材との接着性も悪くなる。[0007] The resin constituting the flow stop frame is variously selected within a range that has a suitable adhesiveness with the base material, a suitable poor wetting with the sealing resin, and a suitable hardness and strength. For example, when a polyester resin and a silicone-based resin are included and the amount of both resins is 100 parts by weight, the silicone-based resin may be blended in an amount of 1 to 20 parts by weight (preferably 2 to 5 parts by weight). it can. If the blending amount is less than 1 part by weight, the wetting with the sealing resin will be good and it will be difficult to obtain a sufficient anti-flow effect. If the blending amount exceeds 20 parts by weight, the frame will be soft and its hardness and strength will be insufficient. At the same time, the adhesiveness to the base material also deteriorates.
【０００８】[0008]
【作用】本発明は、そのプリント配線板における流れ止
め枠が、その少なくとも内側面の平面形状がジグザグ形
状若しくは凹凸の連続形状を示す。従って、封止樹脂が
接触する流れ止め枠の内表面積が大きくなるので、この
枠を乗り越えようとする力が分散され、そのため封止樹
脂は側方に移動するようになり、この枠を乗り越えにく
くなる。このプリント配線板用基材が長尺状であれば、
樹脂封止工程を連続化し易い。According to the present invention, the flow stop frame of the printed wiring board has a zigzag shape or a concavo-convex continuous shape in at least the inner surface thereof in plan view. Therefore, the inner surface area of the flow stop frame with which the sealing resin comes into contact is increased, so the force that tries to get over this frame is dispersed, so that the sealing resin moves laterally and it is difficult to get over this frame. Become. If this printed wiring board substrate is long,
It is easy to continue the resin sealing process.
【０００９】また、流れ止め枠の２枠以上が同心円状に
配置形成されるとともに、少なくともこのうちの最内側
に配置された１枠が上記ジグザグ形状若しくは凹凸の連
続形状を示す構成とすれば、封止樹脂が最内側の枠を、
一旦乗り越えたとしても、その外側の枠により確実に流
れ止めができる。特に、この外側の枠もジグザグ形状等
を示すものの場合は、より一層確実に流れ止めができ
る。If two or more of the flow stop frames are concentrically arranged and formed, and at least one of the innermost frames is the zigzag shape or the concavo-convex continuous shape, The innermost frame of sealing resin
Even if you get over it, the outer frame can surely stop the flow. In particular, when the outer frame also has a zigzag shape or the like, the flow can be stopped more reliably.
【００１０】流れ止め枠はパッド印刷法により接着固定
されて形成できる。このパッド印刷法は、スクリーン印
刷法に比べて、版のメッシュを通して印刷しないので、
最低線幅が０．１〜０．３ｍｍに抑えられ、且つ線型は
直線状になるので、線幅±０．０５ｍｍに抑えることが
できる。また、このパッド印刷法は、例えば金属板プレ
ート（凹版）上のインクをシリコンゴムのパッドでさら
っていくので、版の消耗がなくコストの低減となる。更
に、インクの滲み出しも発生しにくいので、ボンディン
グの為の貫通孔にインクが流れ込み、孔中のメッキを汚
染することもない。また、リールツウリール方式により
製作した場合、スクリーン印刷法による量産では、版の
やぶれ、消耗による交換や版の掃除が困難であり、作業
性が悪いが、パッド印刷法ではこのような問題はない。The flow stop frame can be formed by being bonded and fixed by a pad printing method. Compared with the screen printing method, this pad printing method does not print through the mesh of the plate, so
Since the minimum line width is suppressed to 0.1 to 0.3 mm and the linear shape is linear, the line width can be suppressed to ± 0.05 mm. Further, in this pad printing method, for example, ink on a metal plate (intaglio) is exposed by a pad of silicon rubber, so that the plate is not consumed and the cost is reduced. Further, since ink does not easily seep out, the ink does not flow into the through hole for bonding and the plating in the hole is not contaminated. Further, when the reel-to-reel method is used, it is difficult to replace the plate due to blurring and wear of the plate and cleaning of the plate is difficult in mass production by the screen printing method. .
【００１１】また、流れ止め枠を構成する樹脂を、ポリ
エステル樹脂をベースとするとともに、封止樹脂との相
溶性の少ないシリコーン系樹脂を所定量含む構成とする
ことで、強度、硬度及び基材との接着性を維持しつつ、
封止樹脂との適度の濡れの悪さにより、封止樹脂の流れ
止めを十分に確保できる。Further, the resin constituting the flow stop frame is based on a polyester resin and contains a predetermined amount of a silicone-based resin having a low compatibility with the sealing resin, whereby the strength, hardness and base material are improved. While maintaining the adhesiveness with
Due to the reasonably poor wetting with the sealing resin, a sufficient flow stop of the sealing resin can be secured.
【００１２】[0012]
【実施例】以下、本発明を実施例により具体的に説明す
る。 （１）ＩＣカード用基板の構成及び電子部品の搭載 ＩＣカード用基板１は、図１及び図２に示すように、長
尺状ＩＣカード用基材１１と、該基材に設けられる電子
部品収容部（基材貫通孔）１３と、該電子部品収容部１
３の周辺に設けられた複数（例えば８個）のボンディン
グホール１４と該基材の一面（コンタクト面という。）
１１ｂ側に形成されたコンタクト端子１５とを備える。
この基材１１はガラスエポキシからなるが、他にポリエ
ステル、ポリイミドからなってもよい。尚、所定のパタ
ーン表面には、その保護のためにめっきが施されてい
る。更に、基材１１の他面（ボンディング面という。）
１１ａ側であって、且つ収容されるべき電子部品を保護
するための封止樹脂部を形成するに当たって樹脂封止を
行うに際して、樹脂封止領域を取り囲む表面に封止樹脂
用流れ止め防止枠１２ａが形成されている。この枠１２
ａは電子部品収納・取付部及びボンディングホールにで
きるだけ近い所に形成されている。EXAMPLES The present invention will be specifically described below with reference to examples. (1) Structure of IC Card Substrate and Mounting of Electronic Components As shown in FIGS. 1 and 2, the IC card substrate 1 includes a long-sized IC card base material 11 and electronic components provided on the base material. Housing (base material through hole) 13 and the electronic component housing 1
A plurality of (for example, eight) bonding holes 14 provided in the periphery of 3 and one surface of the base material (referred to as contact surface).
And a contact terminal 15 formed on the side of 11b.
The base material 11 is made of glass epoxy, but may be made of polyester or polyimide. The surface of the predetermined pattern is plated for protection. Further, the other surface of the base material 11 (referred to as a bonding surface).
When forming a sealing resin portion for protecting the electronic component to be housed, which is on the side of 11a, when resin sealing is performed, a sealing resin anti-flow prevention frame 12a for sealing resin is provided on the surface surrounding the resin sealing region. Are formed. This frame 12
The a is formed as close as possible to the electronic component storage / mounting portion and the bonding hole.
【００１３】この枠１２ａの内側面の平面形状は、図３
（ａ）に示す突部及び凹部が略四角状（やや台形状）の
ジグザグ状（Ｌ1 、Ｌ2 及びＬ3 ともに約１００μｍ、
尚、高さは約１０μｍである。）を示す。但し、この枠
の平面形状としては、同図（ｂ）の波型形状１２ｂ、又
は（ｃ）の線幅をもつ四角型形状１２ｃとすることもで
きる。そして、この枠１２ａは、シリコン系樹脂を含む
ポリエステル樹脂からなるインクをパッド印刷法により
形成した。このインクの組成は、ポリエチレンテレフタ
レート３０重量％、シリコーン樹脂３重量％、残部溶剤
（ケトン系溶剤）である。尚、この材料は使用する封止
樹脂に対して斥力が働くものであれば何でもよい。なる
べく転写しないもの又は後工程の加熱処理等により揮発
飛散しない永久マスク用樹脂を用いるのが好ましい。The plane shape of the inner surface of the frame 12a is shown in FIG.
The protrusions and recesses shown in (a) have a substantially square shape (slightly trapezoidal shape) in a zigzag shape (both L 1 , L 2 and L 3 are about 100 μm,
The height is about 10 μm. ). However, the planar shape of this frame may be a corrugated shape 12b in FIG. 7B or a square shape 12c having a line width in FIG. Then, the frame 12a was formed by pad printing with an ink made of a polyester resin containing a silicon resin. The composition of this ink is 30% by weight of polyethylene terephthalate, 3% by weight of silicone resin, and the balance solvent (ketone solvent). Any material may be used as long as it exerts a repulsive force on the sealing resin used. It is preferable to use a resin for a permanent mask that does not transfer as much as possible or that does not volatilize and scatter due to heat treatment in a subsequent step.
【００１４】そして、図５に示すように、この基板の電
子部品収容部１３内に所定の電子部品（半導体）１７を
搭載し、電子部品１７とコンタクト端子１５とを、ボン
ディングホール１４内に挿通されるリード線１８を用い
て電気的に接合する。これにより、樹脂封止前の電子部
品搭載基板１Ａを作製する。Then, as shown in FIG. 5, a predetermined electronic component (semiconductor) 17 is mounted in the electronic component housing portion 13 of this substrate, and the electronic component 17 and the contact terminal 15 are inserted into the bonding hole 14. It electrically connects using the lead wire 18 formed. In this way, the electronic component mounting substrate 1A before resin sealing is manufactured.
【００１５】（２）樹脂封止及び電子部品搭載装置の製
作 次いで、図５に示すように、樹脂封止を行って、基材１
１の封止面１１ａ側であって電子部品１７及びリード線
１８を保護するために封止樹脂部４１を形成する。即
ち、ディスペンサー等により、上記ＩＣカード用プリン
ト配線板の封止面側で流れ止め枠１２ａの内側に、封止
樹脂（商品名：「ＣＥＬ−４６００」日立化成株式会社
製）を滴下する。尚、この樹脂は約１８０℃に加熱され
硬化する。これにより、電子部品搭載装置が製作され
た。尚、図６は上記により製作された電子部品搭載装置
の１単位を示すものである。また、この電子部品搭載装
置は、図７に示すように、テレホンカード等の本体に装
着されて使用される。(2) Resin encapsulation and production of electronic component mounting apparatus Next, as shown in FIG.
The encapsulating resin portion 41 is formed on the encapsulating surface 11a side of No. 1 to protect the electronic component 17 and the lead wire 18. That is, a sealing resin (trade name: “CEL-4600” manufactured by Hitachi Chemical Co., Ltd.) is dropped inside the flow stop frame 12a on the sealing surface side of the IC card printed wiring board with a dispenser or the like. This resin is heated to about 180 ° C. and hardened. As a result, an electronic component mounting device was manufactured. FIG. 6 shows one unit of the electronic component mounting apparatus manufactured as described above. Further, as shown in FIG. 7, this electronic component mounting apparatus is used by being mounted on a main body such as a telephone card.
【００１６】（３）実施例の効果 この電子部品搭載装置において、流れ止め枠の内側面が
ジグザグ形状を示すので、封止樹脂がこの枠を乗り越え
ることもなかった。また、このプリント配線板用基材は
長尺状であり且つパターンが２列であるため、生産効率
が優れるとともに樹脂封止工程を連続化し易い。また、
流れ止め枠を構成する樹脂は、ポリエステル樹脂をベー
スとするとともに、これに対し適量のシリコーン系樹脂
を所定量含むので、基材との接着性に優れるとともに、
この枠の強度及び硬度も優れたものとなり、更に封止樹
脂の流れ止めを、この面からも確保できた。(3) Effect of the Embodiment In this electronic component mounting apparatus, since the inner surface of the flow stop frame has a zigzag shape, the sealing resin did not go over this frame. Further, since this printed wiring board substrate is long and has two patterns, the production efficiency is excellent and the resin sealing process is easily continuous. Also,
The resin constituting the flow stop frame is based on a polyester resin and contains a predetermined amount of an appropriate amount of silicone resin, so that it has excellent adhesiveness to the base material,
The strength and hardness of this frame were also excellent, and the flow stop of the sealing resin could be secured from this aspect as well.
【００１７】更に、パッド印刷法とスクリーン印刷法に
より形成される流れ止め枠の枠幅等を調べるために、表
１に示す比較試験を行い、その結果を同表に示した。Further, in order to investigate the frame width and the like of the flow stop frame formed by the pad printing method and the screen printing method, comparative tests shown in Table 1 were conducted, and the results are shown in the same table.
【００１８】[0018]
【表１】 [Table 1]
【００１９】この結果によれば、スクリーン印刷法によ
る枠幅が０．３１ｍｍに対して、パッド印刷法による枠
幅は０．１２ｍｍと極めて小さくできる。尚、スクリー
ン印刷法による可能最小枠幅が０．３０ｍｍに対して、
パッド印刷法による同枠幅は０．１０ｍｍと極めて小さ
くできる。また、スクリーン印刷法と異なり、パッド印
刷法ではインクの滲み出しが発生しにくいので、ボンデ
ィングホールのぎりぎりまで寄せることができ、更には
ボンディングの為の貫通孔にインクが流れ込み、孔中の
メッキを汚染することもない。従って、電子部品搭載装
置の樹脂封止部分の外側の接着領域が広くなり、十分な
接着領域を確保でき、特に流れ止め枠が二重になっても
従来の接着領域は確保できる。また、転写の際のパッド
がボンディングホールやダイパッドに当たらないよう
に、パッド中央に逃がし穴をあけておくことでボンディ
ングホールやダイパッドが汚染されないようにできる。According to this result, the frame width obtained by the screen printing method is 0.31 mm, whereas the frame width obtained by the pad printing method is as small as 0.12 mm. In addition, the minimum possible frame width by the screen printing method is 0.30 mm,
The same frame width by the pad printing method can be made extremely small at 0.10 mm. Also, unlike the screen printing method, the pad printing method is less likely to cause ink bleeding, so that it is possible to bring the bonding hole to the very limit, and further, the ink flows into the through hole for bonding and the plating in the hole is prevented. No pollution. Therefore, the bonding area outside the resin-sealed portion of the electronic component mounting device is widened, and a sufficient bonding area can be secured, and in particular, the conventional bonding area can be secured even if the flow stop frame is doubled. In addition, it is possible to prevent the bonding hole and the die pad from being contaminated by forming an escape hole in the center of the pad so that the pad at the time of transfer does not hit the bonding hole or the die pad.
【００２０】尚、本発明においては、前記具体的実施例
に示すものに限られず、目的、用途に応じて本発明の範
囲内で種々変更した実施例とすることができる。即ち、
流れ止め枠の形状は、その平面形状がジグザグ形状若し
くは凹凸の連続形状を示すものであればよく、図３及び
図４に示すように種々の形状を選択できる。例えば、そ
の内側が波状〔図３（ｂ）及び図４（ｂ）〕でもよい
し、三角形状〔図４（ｃ）〕でもよいし、四角形状〔図
３（ｃ）〕でもよいし、その他の形状でもよいし、異な
った形状が連続していてもよい。また、その外側もジグ
ザグ形状としてもよいし〔図３（ｃ）及び図４
（ｂ）〕、その突部部分の大きさ、そのピッチ等も特に
限定されない。The present invention is not limited to the specific examples described above, and various modifications may be made within the scope of the present invention depending on the purpose and application. That is,
The shape of the flow stop frame may be any shape as long as its planar shape shows a zigzag shape or a continuous shape of irregularities, and various shapes can be selected as shown in FIGS. 3 and 4. For example, the inside thereof may be wavy [FIGS. 3 (b) and 4 (b)], triangular [FIG. 4 (c)], quadrangular [FIG. 3 (c)], or the like. Shape may be used, or different shapes may be continuous. Further, the outer side thereof may be formed in a zigzag shape [Fig. 3 (c) and Fig. 4].
(B)], the size of the protruding portion, its pitch, etc. are not particularly limited.
【００２１】更に、この枠を図４に示すように二重に形
成配置してもよいし、場合によってはそれ以上形成して
もよい。この場合、同形状のものを２重に配置してもよ
いし〔同図（ａ）〜（ｃ）〕、異なったものを配置して
もよいし〔同図（ｄ）〕、同図（ｄ）に示すように外側
の枠はジグザグ形状でない従来形状のものを配置しても
よい。Further, this frame may be formed and arranged in double as shown in FIG. 4, or more frames may be formed in some cases. In this case, the same shape may be arranged in duplicate [(a) to (c) in the figure], or different ones may be arranged [(d) in the figure]. As shown in d), the outer frame may have a conventional shape other than the zigzag shape.
【００２２】また、上記電子部品収容部の形状及び大き
さ、ボンディングホールの配列方法、その数及び大き
さ、並びにコンタクト端子の形状、数及び大きさ等は特
に限定されない。この電子部品収容部の代わりに、収容
可能な孔部（凹部）となっていない、即ち、平坦な基材
表面上の所定位置に配置してもよい。また、パターンは
上記実施例においては２列であるが、これに限らず、４
列（例えばスプロケット孔を含めて２連で４列、即ち２
分割すると図１のものが２つできるようなものとしても
よい）や６列（３連等）又は他の配列数であってもよ
い。Further, the shape and size of the electronic part housing portion, the method of arranging the bonding holes, the number and size thereof, and the shape, number and size of the contact terminals are not particularly limited. Instead of this electronic component housing portion, it may be arranged at a predetermined position on the flat base material surface that is not a hole portion (recess) that can be housed. Further, although the pattern has two columns in the above-mentioned embodiment, the pattern is not limited to this and four patterns are provided.
Rows (eg 2 rows including sprocket holes, 4 rows, ie 2
It may be divided into two pieces as shown in FIG. 1), six rows (three rows, etc.), or another number of arrangements.
【００２３】[0023]
【発明の効果】本発明の電子部品搭載装置においては、
封止樹脂が流れ止め枠を乗り越えにくくなり、封止樹脂
流れ止めを確実に防止できる。According to the electronic component mounting apparatus of the present invention,
The sealing resin does not easily get over the flow stop frame, and the sealing resin flow stop can be reliably prevented.
【図１】実施例において用いたＩＣカード用基板の一部
平面図である。FIG. 1 is a partial plan view of an IC card substrate used in an example.
【図２】実施例において用いたＩＣカード用基板の一部
断面図である。FIG. 2 is a partial cross-sectional view of an IC card substrate used in an example.
【図３】実施例において用いたＩＣカード用基板に形成
された流れ止め枠の一部平面図であり、（ａ）は本発明
の、やや台形状のジグザグ状、（ｂ）は本発明の波型形
状、（ｃ）は本発明の、線幅をもつ四角型形状、及び
（ｄ）は従来の非ジグザグ形状の流れ止め枠の一部平面
図を示す。FIG. 3 is a partial plan view of a flow stop frame formed on a substrate for an IC card used in Examples, (a) of the present invention, a slightly trapezoidal zigzag shape, and (b) of the present invention. FIG. 3A is a partial plan view of a corrugated shape, FIG. 3C is a square shape having a line width, and FIG. 3D is a conventional non-zigzag flow stop frame of the present invention.
【図４】本発明のＩＣカード用基板において流れ止め枠
が二重に形成配置された状態を示す一部平面図であり、
（ａ）は線幅をもつ四角型形状、（ｂ）は線幅をもつ波
型形状、（ｃ）は三角形状の波形形状、及び（ｄ）は異
なった形状の流れ止め枠を備えたものの一部平面図を示
す。FIG. 4 is a partial plan view showing a state in which flow prevention frames are formed and arranged in double in the IC card substrate of the present invention;
(A) is a square shape with a line width, (b) is a corrugated shape with a line width, (c) is a triangular corrugated shape, and (d) is a different shape A partial plan view is shown.
【図５】図１に示すＩＣカード用基板に電子部品を搭載
した後、樹脂封止をした状態を示す電子部品搭載基板の
一部断面図である。5 is a partial cross-sectional view of the electronic component mounting substrate showing a state in which the electronic component is mounted on the IC card substrate shown in FIG. 1 and then resin sealing is performed.
【図６】図５に示す電子部品搭載装置の１単位を示す平
面図である。6 is a plan view showing one unit of the electronic component mounting apparatus shown in FIG.
【図７】テレホンカード等の本体に図５に示す電子部品
搭載装置を装着しようとしている一部斜視図である。FIG. 7 is a partial perspective view of the electronic component mounting device shown in FIG. 5 being mounted on a main body of a telephone card or the like.
【図８】従来の混成集積回路装置の縦断面図である。FIG. 8 is a vertical sectional view of a conventional hybrid integrated circuit device.
【図９】従来においてスクリーン印刷法により形成した
流れ止め防止枠とボンディングホールとを示す部分拡大
平面図である。FIG. 9 is a partial enlarged plan view showing a flow prevention frame and a bonding hole formed by a conventional screen printing method.
１；ＩＣカード用基板、１Ａ；樹脂封止後の電子部品搭
載基板、１１；ＩＣカード用基材、１１ａ；ボンディン
グ面、１１ｂ；コンタクト面、１２；封止樹脂流れ止め
封止枠、１２ａ；封止樹脂流れ止め封止枠、１２ｂ；封
止樹脂流れ止め封止枠、１３；電子部品収容部、１４；
ボンディングホール、１５；コンタクト端子、１６；ス
プロケットホール、１７；電子部品（半導体）、１８；
リード線、４１；封止樹脂部。1; IC card substrate, 1A; electronic component mounting substrate after resin sealing, 11; IC card base material, 11a; bonding surface, 11b; contact surface, 12; sealing resin flow stop sealing frame, 12a; Sealing resin flow stop sealing frame, 12b; Sealing resin flow stop sealing frame, 13; Electronic component housing portion, 14;
Bonding hole, 15; Contact terminal, 16; Sprocket hole, 17; Electronic component (semiconductor), 18;
Lead wire, 41; sealing resin part.
Claims (4)
られる電子部品収納・取付予定部と、該電子部品収納・
取付予定部の周辺に設けられた複数のボンディングホー
ルと、該電子部品収納・取付予定部及び該ボンディング
ホールを取り囲むようにして配置された封止樹脂流れ止
め枠と、上記基材の一面側に形成された複数のコンタク
ト端子を備えた所望の配線回路パターンとを具備した電
子部品搭載装置において、 上記封止樹脂流れ止め枠の少なくとも内側面の平面形状
がジグザグ形状若しくは凹凸の連続形状を示すことを特
徴とする電子部品搭載装置。1. A printed wiring board base material, an electronic component storage / mounting planned portion provided on the base material, and an electronic component storage / mounting portion.
A plurality of bonding holes provided around the attachment planned portion, a sealing resin flow stop frame arranged so as to surround the electronic component storage / attachment planned portion and the bonding hole, and on one surface side of the base material. In an electronic component mounting apparatus having a desired wiring circuit pattern having a plurality of formed contact terminals, at least the inner surface of the sealing resin flow stop frame has a zigzag shape or a continuous uneven shape. An electronic component mounting device characterized by.
ボンディングホールを取り囲むようにして配置された封
止樹脂流れ止め枠の２枠以上が同心円状に配置形成され
るとともに、少なくともこのうちの最内側に配置された
１枠が上記ジグザグ形状若しくは凹凸の連続形状を示す
請求項１記載の電子部品搭載装置。2. Two or more sealing resin flow stop frames, which are arranged so as to surround the electronic component storage / mounting planned portion and the bonding hole, are concentrically arranged and formed, and at least the most of them is formed. 2. The electronic component mounting apparatus according to claim 1, wherein one frame arranged inside shows the zigzag shape or the continuous shape of irregularities.
により接着固定されて形成される請求項１〜２記載の電
子部品搭載装置。3. The electronic component mounting apparatus according to claim 1, wherein the sealing resin flow stop frame is formed by being bonded and fixed by a pad printing method.
は、ポリエステル樹脂とシリコーン系樹脂とを含み、こ
の両樹脂を１００重量部とした場合、該シリコーン系樹
脂は２〜５重量部配合される請求項１〜３記載の電子部
品搭載装置。4. The resin constituting the sealing resin flow stop frame contains a polyester resin and a silicone-based resin, and when both the resins are 100 parts by weight, the silicone-based resin is blended in an amount of 2 to 5 parts by weight. The electronic component mounting device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25477894A JP3541300B2 (en) | 1994-09-21 | 1994-09-21 | Electronic component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25477894A JP3541300B2 (en) | 1994-09-21 | 1994-09-21 | Electronic component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0897535A true JPH0897535A (en) | 1996-04-12 |
| JP3541300B2 JP3541300B2 (en) | 2004-07-07 |
Family
ID=17269758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25477894A Expired - Fee Related JP3541300B2 (en) | 1994-09-21 | 1994-09-21 | Electronic component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3541300B2 (en) |
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| JP2008159911A (en) * | 2006-12-25 | 2008-07-10 | Shinko Electric Ind Co Ltd | Mounting board and electronic device |
| JP2008311411A (en) * | 2007-06-14 | 2008-12-25 | Panasonic Corp | Electrode bonding structure and electrode bonding method |
| US7880276B2 (en) | 2007-01-30 | 2011-02-01 | Fujitsu Semiconductor Limited | Wiring board and semiconductor device |
| JP2011259311A (en) * | 2010-06-10 | 2011-12-22 | Tyco Electronics Japan Kk | Loop antenna |
| JP2012134007A (en) * | 2010-12-21 | 2012-07-12 | Yazaki Corp | Connector with built-in electronic component |
| JP2014027069A (en) * | 2012-07-26 | 2014-02-06 | Kyocera Corp | Light emitting element array and light emitting element head |
| JP2014157976A (en) * | 2013-02-18 | 2014-08-28 | Stanley Electric Co Ltd | Semiconductor light-emitting device |
| JP2018014454A (en) * | 2016-07-22 | 2018-01-25 | 京セラ株式会社 | Wiring board, electronic device, and electronic module |
| WO2021145082A1 (en) * | 2020-01-14 | 2021-07-22 | ソニーセミコンダクタソリューションズ株式会社 | Solid-state imaging element and electronic device |
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1994
- 1994-09-21 JP JP25477894A patent/JP3541300B2/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101407564B1 (en) * | 2006-12-25 | 2014-06-13 | 신꼬오덴기 고교 가부시키가이샤 | Mounting substrate and electronic device |
| JP2008159911A (en) * | 2006-12-25 | 2008-07-10 | Shinko Electric Ind Co Ltd | Mounting board and electronic device |
| US7880276B2 (en) | 2007-01-30 | 2011-02-01 | Fujitsu Semiconductor Limited | Wiring board and semiconductor device |
| JP2008311411A (en) * | 2007-06-14 | 2008-12-25 | Panasonic Corp | Electrode bonding structure and electrode bonding method |
| JP2011259311A (en) * | 2010-06-10 | 2011-12-22 | Tyco Electronics Japan Kk | Loop antenna |
| CN102394373A (en) * | 2010-06-10 | 2012-03-28 | 泰科电子日本合同会社 | Loop antenna |
| JP2012134007A (en) * | 2010-12-21 | 2012-07-12 | Yazaki Corp | Connector with built-in electronic component |
| JP2014027069A (en) * | 2012-07-26 | 2014-02-06 | Kyocera Corp | Light emitting element array and light emitting element head |
| JP2014157976A (en) * | 2013-02-18 | 2014-08-28 | Stanley Electric Co Ltd | Semiconductor light-emitting device |
| JP2018014454A (en) * | 2016-07-22 | 2018-01-25 | 京セラ株式会社 | Wiring board, electronic device, and electronic module |
| WO2021145082A1 (en) * | 2020-01-14 | 2021-07-22 | ソニーセミコンダクタソリューションズ株式会社 | Solid-state imaging element and electronic device |
| JPWO2021145082A1 (en) * | 2020-01-14 | 2021-07-22 | ||
| US12382741B2 (en) | 2020-01-14 | 2025-08-05 | Sony Semiconductor Solutions Corporation | Solid-state imaging element and electronic device |
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|---|---|
| JP3541300B2 (en) | 2004-07-07 |
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