JPH0899367A - Manufacture of compound optical element - Google Patents
Manufacture of compound optical elementInfo
- Publication number
- JPH0899367A JPH0899367A JP25914094A JP25914094A JPH0899367A JP H0899367 A JPH0899367 A JP H0899367A JP 25914094 A JP25914094 A JP 25914094A JP 25914094 A JP25914094 A JP 25914094A JP H0899367 A JPH0899367 A JP H0899367A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- mold
- resin layer
- resin
- central axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 150000001875 compounds Chemical class 0.000 title abstract 3
- 239000000463 material Substances 0.000 claims abstract description 129
- 239000011347 resin Substances 0.000 claims abstract description 123
- 229920005989 resin Polymers 0.000 claims abstract description 123
- 239000002131 composite material Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 abstract description 17
- 238000000465 moulding Methods 0.000 abstract description 13
- 230000008602 contraction Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、光学素子基材上に樹脂
層を載置した複合型光学素子の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a composite type optical element in which a resin layer is placed on an optical element base material.
【0002】[0002]
【従来の技術】従来この種の技術としては、特開平3−
184813号が知られている。これは、金型と基材の
中心軸を一致させるときに、基材の外周部を保持して位
置決めする方法である。これによると基材の曲率半径に
関係なく金型と基材の中心軸を精度よく一致させること
ができる。また同公報には、エネルギー照射中に金型が
樹脂を押圧する圧力を一定とすることにより、金型を樹
脂の硬化収縮に合わせて追従させる方法も開示されてい
る。2. Description of the Related Art Conventionally, as a technique of this kind, Japanese Patent Laid-Open No.
No. 184813 is known. This is a method of holding and positioning the outer peripheral portion of the base material when aligning the central axes of the mold and the base material. According to this, the central axes of the die and the base material can be accurately matched regardless of the radius of curvature of the base material. The publication also discloses a method of keeping the pressure of the mold pressed by the mold during irradiation of energy so that the mold follows the curing shrinkage of the resin.
【0003】[0003]
【発明が解決しようとする課題】ところが、上述の従来
技術では、次のような問題点があった。However, the above-mentioned conventional technique has the following problems.
【0004】複合型光学素子の樹脂層は中心軸からの距
離によって厚さが異なるので、樹脂の硬化収縮量も中心
軸からの距離により異なるのが一般的である。また、基
材の中心軸に近い部分に外力を加えるよりも、基材の中
心軸から遠い部分に外力を加えたほうが基材は変形しや
すい。また、両凹や両凸の場合よりもメニスカス形状の
レンズの方が変形しやすい。つまり、基材の変形量は中
心軸からの距離と樹脂の収縮量(物性値)と基材の変形
しやすさにより異なり、従来技術のように金型が樹脂を
押圧する圧力が一定の場合でも基材は部分的に変形して
しまう。非球面光学素子の場合は最外周部付近の樹脂層
の厚さが最大となることが多いので、基材の変形が最大
となる位置も、樹脂層の最外周部付近となることが多
い。Since the resin layer of the composite optical element has a different thickness depending on the distance from the central axis, it is general that the curing shrinkage amount of the resin also varies depending on the distance from the central axis. Further, the base material is more likely to be deformed when an external force is applied to a portion far from the central axis of the base material than an external force is applied to a portion close to the central axis of the base material. Further, the meniscus lens is more likely to be deformed than the biconcave or biconvex lens. In other words, the amount of deformation of the base material depends on the distance from the central axis, the amount of shrinkage of the resin (physical property value) and the easiness of deformation of the base material. However, the base material is partially deformed. In the case of an aspherical optical element, the thickness of the resin layer in the vicinity of the outermost periphery is often the maximum, so that the position where the deformation of the base material is maximized is also often in the vicinity of the outermost periphery of the resin layer.
【0005】そのため、特開平3−184813号記載
の方法では、基材側面を保持しているにも関わらず、基
材が金型の方向に引張られて基材と金型の中心軸がずれ
るという問題が発生する。それは、3個の基材保持部材
と基材の摩擦係数が全く同じ場合は基材が中心軸に平行
に金型の方向に引張られるので、基材の中心軸と金型の
中心軸がずれることはないが、現実に3箇所の摩擦係数
を一致させることは不可能なので結果的に中心軸がずれ
るためである。また、基材保持部材が変形することもあ
る。Therefore, in the method described in Japanese Patent Laid-Open No. 3-184813, the base material is pulled in the direction of the mold and the central axes of the base material and the mold are deviated even though the side surface of the base material is held. The problem occurs. If the three base material holding members and the base material have exactly the same friction coefficient, the base material is pulled in the direction of the mold parallel to the central axis, so that the central axis of the base material and the central axis of the mold deviate from each other. This is because it is impossible to match the friction coefficients at the three locations in reality, but as a result, the central axis shifts. Further, the base material holding member may be deformed.
【0006】この問題を解決するために保持力を強くす
るという方法も考えられるが、この場合は保持力そのも
のの力で基材が変形するという新たな問題が発生する。
この現象は基材の剛性が低い場合に顕著に現れる。To solve this problem, a method of strengthening the holding force can be considered, but in this case, a new problem arises that the base material is deformed by the force of the holding force itself.
This phenomenon remarkably appears when the rigidity of the base material is low.
【0007】本発明の目的は、基材を保持する力自体で
基材が変形することなく、且つ、樹脂層の硬化収縮によ
って金型と基材の中心軸がずれることのない複合型光学
素子の製造方法を提供することである。An object of the present invention is to prevent the base material from being deformed by the force itself for holding the base material and to prevent the center axes of the mold and the base material from deviating due to curing shrinkage of the resin layer. Is to provide a method for manufacturing the same.
【0008】[0008]
【課題を解決するための手段】上記目的を達成するため
に本発明の複合型光学素子の製造方法では、光学素子基
材表面にエネルギー硬化型の樹脂を供給し、所望の樹脂
層表面を形成するための光学面を有する金型と基材とを
相対的に接近させることにより樹脂を押圧して広げ金型
と基材との間に所望の樹脂層を形成した後、エネルギー
の照射により樹脂層を硬化させ、その後、硬化した樹脂
層と金型を剥離する複合型光学素子の製造方法におい
て、エネルギー照射中における樹脂の硬化収縮による基
材の変形量が最も大きい位置での基材の変形を打ち消す
ように金型と基材を光軸に平行な方向に相対的に接近さ
せることを特徴としている。In order to achieve the above object, in the method for producing a composite optical element of the present invention, an energy curable resin is supplied to the surface of an optical element substrate to form a desired resin layer surface. The resin having the optical surface for pressing is pressed against the resin by making the base material relatively close to each other to form a desired resin layer between the metal mold and the base material, and then the resin is irradiated with energy. In the method for manufacturing a composite optical element in which a layer is cured and then the cured resin layer and the mold are separated, the deformation of the substrate at the position where the amount of deformation of the substrate due to curing shrinkage of the resin during energy irradiation is the largest It is characterized in that the mold and the base material are brought relatively close to each other in a direction parallel to the optical axis so as to cancel out.
【0009】[0009]
【作用】上記構成を添付図面を参照して具体的に説明す
れば次の通りである。The above structure will be described in detail with reference to the accompanying drawings.
【0010】図16に示すような直径22mm、厚さ2
mmの円柱状の基材52上に中心軸上の厚さt(0)が
0.1mmで、中心軸からの距離がx(mm)の場合の
中心軸に平行な方向の厚さt(x)がt(x)=0.1
+0.03x(0≦x≦10)の樹脂層53が載置さ
れ、且つ、樹脂層表面53aが金型51の光学面(樹脂
層を押圧する面)51aと密着している場合を説明す
る。The diameter is 22 mm and the thickness is 2 as shown in FIG.
When the thickness t (0) on the central axis is 0.1 mm on the cylindrical base material 52 of mm and the distance from the central axis is x (mm), the thickness t (in the direction parallel to the central axis is x) is t (x) = 0.1
A case where the resin layer 53 of + 0.03x (0 ≦ x ≦ 10) is placed and the resin layer surface 53a is in close contact with the optical surface (the surface pressing the resin layer) 51a of the mold 51 will be described. .
【0011】基材の中心軸は芯出し部材54により予め
金型の中心軸と一致するように調整されており、図17
に示すように芯出し部材は基材の外周部において均等な
間隔で3箇所に設けられている。この状態で樹脂層にエ
ネルギーを照射すると樹脂層の硬化が始まり、同時に樹
脂層に収縮が発生する。すると、樹脂層内部には金型と
基材の距離を相対的に接近させる方向の力が発生する
が、通常は金型が容易に変形できないように固定するの
で、樹脂層の硬化収縮により基材が金型に接近する方向
に引張られることになる。The center axis of the base material is adjusted in advance by the centering member 54 so as to coincide with the center axis of the mold.
As shown in, the centering members are provided at three locations on the outer peripheral portion of the base material at equal intervals. When the resin layer is irradiated with energy in this state, the resin layer begins to harden, and at the same time the resin layer contracts. Then, a force is generated inside the resin layer in the direction of making the distance between the mold and the base material relatively close to each other, but since the mold is usually fixed so that it cannot be easily deformed, the resin shrinks due to curing shrinkage of the resin layer. The material will be pulled in the direction approaching the mold.
【0012】ここで、樹脂の収縮量が最も大きいのは基
材の最外周部付近外なので、中心軸からの距離と収縮量
の積が最も大きいのも樹脂層の最外周部付近となり、基
材に最も大きな応力がかかるのも基材の外周部付近とな
る。従って、基材が最も変形するのは樹脂層の最外周部
付近となる。このとき、従来技術に示されている方法を
用いて金型が樹脂を押圧する圧力が一定となるように金
型を基材に接近させると基材の外周部付近の変形も、あ
る程度、抑制することができる。しかし、基材の変形量
が最も多いのは基材の外周部付近なので、基材を保持し
ている位置で基材が金型の方向に引張られて金型と基材
の中心軸がずれるという問題が発生する。Here, since the amount of shrinkage of the resin is the largest outside the outermost peripheral portion of the base material, the largest product of the distance from the central axis and the amount of shrinkage is near the outermost peripheral portion of the resin layer. The greatest stress is applied to the material near the outer periphery of the base material. Therefore, the base material is most deformed near the outermost peripheral portion of the resin layer. At this time, when the mold is brought close to the base material so that the pressure with which the mold presses the resin becomes constant by using the method shown in the prior art, the deformation near the outer peripheral portion of the base material is suppressed to some extent. can do. However, the amount of deformation of the base material is the most near the outer periphery of the base material, so the base material is pulled in the direction of the mold at the position where the base material is held, and the central axes of the mold and the base material are misaligned. The problem occurs.
【0013】そこで、最大変形を常に打ち消すように、
金型を基材の方向に移動させる。すると、基材が金型の
方向に引張られることがなくなり、基材と金型の中心軸
がずれるという問題を解決することができる。このと
き、基材が最大変形している部分以外では、金型を基材
に接近させることにより樹脂層に圧縮応力がかかること
になるが、基材と樹脂層は弾性変形するので、エネルギ
ーの照射完了後に金型と樹脂層を剥離すると、基材と樹
脂層に加えられていた圧縮応力は解放されるので問題と
はならない。Therefore, in order to always cancel the maximum deformation,
Move the mold towards the substrate. Then, the base material is not pulled in the direction of the mold, and the problem that the central axes of the base material and the mold are displaced can be solved. At this time, except for the portion where the base material is deformed to the maximum, compressive stress is applied to the resin layer by bringing the mold close to the base material, but the base material and the resin layer are elastically deformed, and therefore the energy of If the mold and the resin layer are peeled off after the irradiation is completed, the compressive stress applied to the base material and the resin layer is released, so that there is no problem.
【0014】なお、樹脂層の任意の位置における収縮量
は、エネルギーを照射する前の樹脂層の厚さ(金型の光
学面と基材の成形面形状が既知なので計算により求め
る)とエネルギーの照射完了後に金型から剥離した複合
型光学素子の樹脂層の厚さ(樹脂層表面の形状を測定す
ることにより求められる)を比較すれば、容易に求める
ことができる。The amount of shrinkage of the resin layer at an arbitrary position is calculated by calculating the thickness of the resin layer before irradiation with energy (calculated because the optical surface of the mold and the molding surface of the substrate are known) and energy. The thickness can be easily calculated by comparing the thicknesses of the resin layers of the composite optical element separated from the mold after completion of irradiation (determined by measuring the shape of the resin layer surface).
【0015】[0015]
【実施例】以下、添付図面を参照して本発明に係る複合
型光学素子の製造方法の実施例を説明する。Embodiments of the method of manufacturing a composite optical element according to the present invention will be described below with reference to the accompanying drawings.
【0016】(実施例1)まず、図1に示すように両面
が凹面のガラス製の基材2の成形面(樹脂層を載置する
光学機能面)に紫外線硬化型樹脂5を必要量吐出する。
ここで、基材2は成形面の曲率半径が18mm、非成形
面(樹脂層を載置しない光学機能面)の曲率半径が10
0mm、外径が25mmであり、基材2の成形面の最外
周部には中心軸に対して垂直で半径方向の幅が1.5m
mの端面2aが基材の中心軸に対して軸対称形状になる
ように設けられている。また、基材は図16および図1
7に示す方法で保持されている。(Embodiment 1) First, as shown in FIG. 1, a required amount of ultraviolet curable resin 5 is discharged onto a molding surface (optical functional surface on which a resin layer is placed) of a glass substrate 2 having concave surfaces on both sides. To do.
Here, the base material 2 has a molding surface with a radius of curvature of 18 mm, and a non-molding surface (optical functional surface on which the resin layer is not mounted) has a curvature radius of 10 mm.
The outer diameter of the molding surface of the base material 2 is 0 mm, the outer diameter is 25 mm, and the width in the radial direction perpendicular to the central axis is 1.5 m.
The end face 2a of m is provided so as to have an axially symmetrical shape with respect to the central axis of the base material. Further, the base material is shown in FIG. 16 and FIG.
It is held by the method shown in FIG.
【0017】次に、図2に示すように所望の樹脂層表面
を形成するための光学面(樹脂を押圧する面)1aを有
し、光学面1aの直径が20mmで、且つ、中心軸が基
材2の中心軸と同一で上下動自在に保持された金型1を
下降させて基材2に近づけることにより樹脂5を広げ、
樹脂5が所望の厚さの樹脂層3を形成する位置で金型1
の下降を停止する。ここで、樹脂層3の中心軸上の厚さ
は0.1mm、有効直径Dは19mmであり、樹脂層3
の最外周部は有効直径Dより外側に到達しており、且
つ、基材2の端面2a上および金型1の光学面1aより
外側には到達していない。また、中心軸からの距離をx
とすると、中心軸に平行な方向の樹脂層の厚さt(x)
はおおむね0.1+0.03xである。Next, as shown in FIG. 2, it has an optical surface (surface for pressing resin) 1a for forming a desired resin layer surface, the diameter of the optical surface 1a is 20 mm, and the central axis is The resin 5 is spread by lowering the mold 1 that is held in the same vertical axis as the central axis of the base material 2 and is held close to the base material 2,
The mold 1 is placed at a position where the resin 5 forms the resin layer 3 having a desired thickness.
Stop descending. Here, the thickness of the resin layer 3 on the central axis is 0.1 mm and the effective diameter D is 19 mm.
The outermost peripheral part of the above reaches the outside of the effective diameter D, and does not reach the outside of the end surface 2a of the base material 2 and the optical surface 1a of the mold 1. Also, the distance from the center axis is x
Then, the thickness t (x) of the resin layer in the direction parallel to the central axis
Is approximately 0.1 + 0.03x.
【0018】次に、基材2の下方より不図示の手段によ
り紫外線を樹脂層全面に照射して樹脂層3の硬化を開始
する。ここで、紫外線の照射時間を60sec とすると、
樹脂の収縮量が最も大きいのは中心軸からの距離が9m
mの位置であり、その位置における中心軸に平行な方向
の樹脂の硬化収縮量(積算値)は図3に示すように10
sec で10μm,20sec で12μm,40sec で14
μm,60sec で15μmとなることが実験により求め
られた。Next, ultraviolet rays are applied to the entire surface of the resin layer from below the base material 2 by means not shown to start curing of the resin layer 3. Here, assuming that the irradiation time of ultraviolet rays is 60 seconds,
The largest amount of resin shrinkage is 9m from the central axis
At the position m, the curing shrinkage amount (integrated value) of the resin in the direction parallel to the central axis at that position is 10 as shown in FIG.
10 μm in sec, 12 μm in 20 sec, 14 in 40 sec
It was experimentally determined that the thickness becomes 15 μm in 60 μsec.
【0019】そこで、エネルギーの照射中は図3に示し
た樹脂の硬化収縮量を常に打ち消すように金型を基材の
方向に接近させる。すると、樹脂層外周部において基材
側面と芯出し部材に摩擦が発生することなく基材と金型
が相対的に接近するので、基材と金型の中心軸がずれる
ことはない。ただし、この時点では樹脂層の収縮量が少
ない部分において樹脂層を圧縮する力が発生しているこ
とになる。そして、エネルギーの照射が完了した時点で
は金型1、基材2および樹脂層3が一体となった密着体
が形成されている。Therefore, during the irradiation of energy, the mold is moved toward the substrate so as to always cancel out the curing shrinkage amount of the resin shown in FIG. Then, since the base material and the mold are relatively close to each other without causing friction between the side surface of the base material and the centering member in the outer peripheral portion of the resin layer, the center axes of the base material and the mold are not displaced. However, at this time point, the force for compressing the resin layer is generated in the portion where the shrinkage amount of the resin layer is small. Then, when the energy irradiation is completed, a contact body in which the mold 1, the base material 2 and the resin layer 3 are integrated is formed.
【0020】次に、図4に示すように密着体を上昇させ
ると、予め基材2の端面2aの一部の上方に設けられて
いた剥離用の部材4が基材2の端面2aと面接触する。
ここで、剥離用の部材4の下部は基材2の端面2aと平
行な平面4aが形成されている。そして、基材2の端面
2a上の剥離用の部材の平面4aが接触した部分にまず
荷重が集中し、その後、荷重が基材全体に分散する。Next, as shown in FIG. 4, when the contact member is raised, the peeling member 4 previously provided above a part of the end surface 2a of the base material 2 and the end surface 2a of the base material 2 are brought into contact with each other. Contact.
Here, the lower surface of the peeling member 4 is formed with a flat surface 4a parallel to the end surface 2a of the base material 2. Then, the load is first concentrated on a portion of the end face 2a of the base material 2 where the flat surface 4a of the peeling member is in contact, and thereafter, the load is dispersed over the entire base material.
【0021】ここで、密着体の上昇を続けると、図5に
示すように、容易、且つ、瞬時に金型1より基材2と樹
脂層3とが一体となった複合型光学素子6が剥離され
る。このとき、今まで樹脂層内部に蓄積されていた圧縮
応力は解放される。ここで、完成した複合型光学素子は
基材と金型の中心軸にずれが生じていないので、偏芯精
度が極めて良好である。If the contact member is continuously raised, as shown in FIG. 5, the composite optical element 6 in which the base material 2 and the resin layer 3 are integrated from the mold 1 easily and instantly is obtained. It is peeled off. At this time, the compressive stress accumulated inside the resin layer until now is released. Here, since the completed composite optical element has no deviation between the central axes of the base material and the mold, the eccentricity accuracy is extremely good.
【0022】本実施例の製造方法によると、基材の外周
部を保持して基材と金型の中心軸を一致させる方法を用
いて、偏芯精度が極めて高い複合型光学素子を得ること
ができる。According to the manufacturing method of this embodiment, a composite optical element having extremely high decentering accuracy can be obtained by using the method of holding the outer peripheral portion of the base material and aligning the central axes of the base material and the mold. You can
【0023】(実施例2)まず、図6に示すように両面
が凸面のガラス製の基材12の成形面に紫外線硬化型樹
脂5を必要量吐出する。ここで、基材2は成形面の曲率
半径が50mm、非成形面の曲率半径が30mm、外径
が20mmであり、基材2の側面には幅2mm、深さ1
mmのv型溝12aが中心軸に対して軸対称形状になる
ように設けられている。また、基材は図16および図1
7に示す方法で保持されている。(Embodiment 2) First, as shown in FIG. 6, a required amount of ultraviolet curable resin 5 is discharged onto the molding surface of a glass base material 12 having convex surfaces on both sides. Here, the base material 2 has a molding surface having a radius of curvature of 50 mm, a non-molding surface having a curvature radius of 30 mm, and an outer diameter of 20 mm, and the base material 2 has a side surface with a width of 2 mm and a depth of 1 mm.
The mm-shaped v-shaped groove 12a is provided so as to have an axially symmetrical shape with respect to the central axis. Further, the base material is shown in FIG. 16 and FIG.
It is held by the method shown in FIG.
【0024】次に、図7に示すように所望の樹脂層表面
を形成するための光学面11aを有し、光学面11aの
直径が18mmで、且つ、中心軸が基材12の中心軸と
同一で上下動自在に保持された金型11を下降させ基材
12に近づけることにより樹脂5を広げ、樹脂5が所望
の厚さの樹脂層13を形成する位置で金型11の下降を
停止する。ここで、樹脂層13の中心軸上の厚さは0.
12mm、有効直径Dは17mmであり、樹脂層13の
最外周部は有効直径Dより外側に到達しており、且つ、
金型11の光学面11aの外側には到達していない。ま
た、中心軸からの距離をxとすると、中心軸に平行な方
向の樹脂層の厚さt(x)はおおむね0.12+0.0
2xである。Next, as shown in FIG. 7, it has an optical surface 11a for forming a desired resin layer surface, the diameter of the optical surface 11a is 18 mm, and the central axis is the central axis of the substrate 12. The same mold 11 that is held vertically movable is lowered to approach the base material 12 to spread the resin 5, and the mold 11 is stopped at the position where the resin 5 forms a resin layer 13 having a desired thickness. To do. Here, the thickness of the resin layer 13 on the central axis is 0.
12 mm, the effective diameter D is 17 mm, the outermost peripheral portion of the resin layer 13 reaches the outside of the effective diameter D, and
It has not reached the outside of the optical surface 11a of the mold 11. When the distance from the central axis is x, the thickness t (x) of the resin layer in the direction parallel to the central axis is approximately 0.12 + 0.0.
2x.
【0025】次に、基材2の下方より不図示の手段によ
り紫外線を樹脂層全面に照射して樹脂層13の硬化を開
始する。ここで、紫外線の照射時間を40sec とする
と、樹脂の収縮量が最も大きいのは中心軸から8.5m
mの位置であり、その位置における中心軸に平行な方向
の樹脂の硬化収縮量(積算値)は図8に示すように10
sec で7.5μm,20sec で9μm,30sec で9.
7μm,40sec で10μmとなることが実験により求
められた。Next, ultraviolet rays are applied to the entire surface of the resin layer from below the base material 2 by means not shown to start curing of the resin layer 13. Here, when the irradiation time of ultraviolet rays is 40 seconds, the largest shrinkage amount of the resin is 8.5 m from the central axis.
At the position m, the curing shrinkage amount (integrated value) of the resin in the direction parallel to the central axis at that position is 10 as shown in FIG.
7.5 μm in sec, 9 μm in 20 sec, and 9 in 30 sec.
It was experimentally determined that the thickness becomes 7 μm and 10 μm in 40 seconds.
【0026】そこで、エネルギーの照射中は図8に示し
た樹脂の硬化収縮量を常に打ち消すように金型を基材の
方向に接近させる。すると、樹脂層外周部において基材
側面と芯出し部材に摩擦が発生することなく基材と金型
が相対的に接近するので、基材と金型の中心軸がずれる
ことはない。ただし、この時点では樹脂層の収縮量が少
ない部分において樹脂層を圧縮する力が発生しているこ
とになる。そして、エネルギーの照射が完了した時点で
は金型11、基材12および樹脂層13が一体となった
密着体が形成されている。Therefore, during the irradiation of energy, the mold is moved toward the substrate so as to always cancel out the curing shrinkage amount of the resin shown in FIG. Then, since the base material and the mold are relatively close to each other without causing friction between the side surface of the base material and the centering member in the outer peripheral portion of the resin layer, the center axes of the base material and the mold are not displaced. However, at this time point, the force for compressing the resin layer is generated in the portion where the shrinkage amount of the resin layer is small. Then, when the energy irradiation is completed, a contact body in which the mold 11, the base material 12, and the resin layer 13 are integrated is formed.
【0027】次に、図9に示すように予め基材12の側
面の外周部に設けられており、先端部14aが基材の側
面のv型溝12aを反転した形状の剥離用の部材14を
中心軸に対して接近させ、剥離用の部材の先端部14a
を基材の側面のv型溝12aに接触させる。ここで、剥
離用の部材14の位置は剥離用の部材の先端部14aが
基材の側面のv型溝12aに挿入可能なように調整され
ているものとする。次に、密着体を上昇させると、基材
12の側面のv型溝12aの剥離用の部材14が接触す
る部分にまず荷重が集中し、その後、荷重が基材全体に
分散する。Next, as shown in FIG. 9, the peeling member 14 is provided in advance on the outer periphery of the side surface of the base material 12, and the tip portion 14a has a shape in which the v-shaped groove 12a on the side surface of the base material is inverted. The tip end 14a of the peeling member
Is contacted with the v-shaped groove 12a on the side surface of the base material. Here, the position of the peeling member 14 is adjusted so that the tip portion 14a of the peeling member can be inserted into the v-shaped groove 12a on the side surface of the base material. Next, when the contact body is raised, the load is first concentrated on the portion of the side surface of the base material 12 where the peeling member 14 of the v-shaped groove 12a contacts, and then the load is dispersed over the entire base material.
【0028】ここで、密着体の上昇を続けると図10に
示すように容易、且つ、瞬時に金型11より基材12と
樹脂層13とが一体となった複合型光学素子16が剥離
される。このとき、今まで樹脂層内部に蓄積されていた
圧縮応力は解放される。ここで、完成した複合型光学素
子は基材と金型の中心軸にずれが生じていないので、偏
芯精度が極めて良好である。Here, if the contact member is kept raised, as shown in FIG. 10, the composite type optical element 16 in which the base material 12 and the resin layer 13 are integrated is easily separated from the mold 11 instantly. It At this time, the compressive stress accumulated inside the resin layer until now is released. Here, since the completed composite optical element has no deviation between the central axes of the base material and the mold, the eccentricity accuracy is extremely good.
【0029】本実施例の製造方法によると、基材の外周
部を保持して基材と金型の中心軸を一致させる方法を用
いて、偏芯精度が極めて高い複合型光学素子を得ること
ができる。According to the manufacturing method of this embodiment, a composite optical element having extremely high decentering accuracy is obtained by using the method of holding the outer peripheral portion of the base material so that the central axes of the base material and the mold coincide with each other. You can
【0030】(実施例3)まず、図11に示すように成
形面が凹面で非成形面が凸面のガラス製の基材22の成
形面に紫外線硬化型樹脂5を必要量吐出する。ここで、
基材22は成形面の曲率半径が90mm、非成形面の曲
率半径が25mm、外径が20mmであり、基材22の
成形面の最外周部には中心軸に対して垂直で半径方向の
幅が1mmの端面22aが基材の中心軸に対して軸対称
形状になるように設けられている。また、基材は図16
および図17に示す方法で保持されている。(Embodiment 3) First, as shown in FIG. 11, a required amount of the ultraviolet curable resin 5 is discharged onto the molding surface of a glass substrate 22 having a concave molding surface and a convex non-molding surface. here,
The base material 22 has a forming surface having a radius of curvature of 90 mm, a non-forming surface having a radius of curvature of 25 mm, and an outer diameter of 20 mm. The outermost peripheral portion of the forming surface of the base material 22 is perpendicular to the central axis in the radial direction. The end surface 22a having a width of 1 mm is provided so as to have an axially symmetrical shape with respect to the central axis of the base material. In addition, the base material is shown in FIG.
And held by the method shown in FIG.
【0031】次に、図12に示すように所望の樹脂層表
面を形成するための光学面21aを有し、光学面21a
の直径が18mmで、且つ、中心軸が基材22の中心軸
と同一で上下動自在に保持された金型21を下降させ基
材22に近づけることにより樹脂5を広げ、樹脂5が所
望の厚さの樹脂層23を形成する位置で金型21の下降
を停止する。ここで、樹脂層23の中心軸上の厚さは
0.05mm、有効直径Dは17mmであり、樹脂層2
3の最外周部は有効直径Dより外側に到達しており、且
つ、基材22の端面22a上および金型21の光学面2
1aの外側には到達していない。また、中心軸からの距
離をxとすると、中心軸に平行な方向の樹脂層の厚さt
(x)はおおむね0.05+0.025xである。Next, as shown in FIG. 12, an optical surface 21a for forming a desired resin layer surface is provided.
Has a diameter of 18 mm, and the central axis is the same as the central axis of the base material 22 and is vertically held so that the mold 21 is lowered and brought close to the base material 22 to spread the resin 5, and the resin 5 is desired. The lowering of the mold 21 is stopped at a position where the resin layer 23 having a thickness is formed. Here, the thickness of the resin layer 23 on the central axis is 0.05 mm and the effective diameter D is 17 mm.
The outermost peripheral portion of 3 reaches the outside of the effective diameter D, and is on the end surface 22a of the base material 22 and the optical surface 2 of the mold 21.
It has not reached the outside of 1a. Further, when the distance from the central axis is x, the thickness t of the resin layer in the direction parallel to the central axis is
(X) is approximately 0.05 + 0.025x.
【0032】次に、基材22の下方より不図示の手段に
より紫外線を樹脂層全面に照射して樹脂層23の硬化を
開始する。ここで、紫外線の照射時間を50sec とする
と、樹脂の収縮率が最も大きいのは中心軸からの距離が
8.5mmの位置であり、その位置における中心軸に平
行な方向の樹脂の硬化収縮量(積算値)は図13に示す
ように10sec で10μm,20sec で12.5μm,
30sec で14μm,40sec で14.6μm,50se
c で15μmとなることが実験により求められた。Next, ultraviolet rays are applied to the entire surface of the resin layer from below the base material 22 by means not shown to start curing of the resin layer 23. Here, assuming that the irradiation time of ultraviolet rays is 50 seconds, the largest shrinkage rate of the resin is at the position where the distance from the central axis is 8.5 mm, and the curing shrinkage amount of the resin in the direction parallel to the central axis at that position. As shown in FIG. 13, the (integrated value) is 10 μm for 10 seconds, 12.5 μm for 20 seconds,
14sec in 30sec, 14.6μm in 40sec, 50se
It was experimentally determined that c was 15 μm.
【0033】そこで、エネルギーの照射中は図13に示
した樹脂の硬化収縮量を常に打ち消すように金型を基材
の方向に接近させる。すると、樹脂層外周部において基
材側面と芯出し部材に摩擦が発生することなく基材と金
型が相対的に接近するので、基材と金型の中心軸がずれ
ることはない。ただし、この時点では樹脂層の収縮量が
少ない部分において樹脂層を圧縮する力が発生している
ことになる。そして、エネルギーの照射が完了した時点
では金型21、基材22および樹脂層23が一体となっ
た密着体が形成されている。Therefore, during the irradiation of energy, the mold is moved toward the substrate so as to always cancel out the curing shrinkage amount of the resin shown in FIG. Then, since the base material and the mold are relatively close to each other without causing friction between the side surface of the base material and the centering member in the outer peripheral portion of the resin layer, the center axes of the base material and the mold are not displaced. However, at this time point, the force for compressing the resin layer is generated in the portion where the shrinkage amount of the resin layer is small. Then, when the energy irradiation is completed, a contact body in which the mold 21, the base material 22, and the resin layer 23 are integrated is formed.
【0034】次に、図14に示すように密着体を上昇さ
せると、予め基材22の端面22aの一部の上方に設け
られていた剥離用の部材24が基材22の端面22aと
面接触する。ここで、剥離用の部材24の下部は基材2
2の端面22aと平行な平面24aが形成されている。
そして、基材22の端面22a上の剥離用の部材の平面
24aが接触した部分にまず荷重が集中し、その後、荷
重が基材全体に分散する。Next, as shown in FIG. 14, when the contact member is raised, the peeling member 24 previously provided above a part of the end surface 22a of the base material 22 and the end surface 22a of the base material 22 are brought into contact with each other. Contact. Here, the lower portion of the peeling member 24 is the base material 2
A flat surface 24a parallel to the second end surface 22a is formed.
Then, the load is first concentrated on a portion of the end surface 22a of the base material 22 where the flat surface 24a of the peeling member is in contact, and thereafter, the load is dispersed over the entire base material.
【0035】ここで、密着体の上昇を続けると、図15
に示すように、容易、且つ、瞬時に金型21より基材2
2と樹脂層23とが一体となった複合型光学素子26が
剥離される。このとき、今まで樹脂層内部に蓄積されて
いた圧縮応力は解放される。ここで、完成した複合型光
学素子は基材と金型の中心軸にずれが生じていないの
で、偏芯精度が極めて良好である。Here, if the contact body is continuously raised, FIG.
As shown in FIG.
The composite optical element 26 in which 2 and the resin layer 23 are integrated is peeled off. At this time, the compressive stress accumulated inside the resin layer until now is released. Here, since the completed composite optical element has no deviation between the central axes of the base material and the mold, the eccentricity accuracy is extremely good.
【0036】本実施例の製造方法によると、基材の外周
部を保持して基材と金型の中心軸を一致させる方法を用
いて、偏芯精度が極めて高い複合型光学素子を得ること
ができる。According to the manufacturing method of this embodiment, a composite optical element having extremely high decentering accuracy can be obtained by using the method of holding the outer peripheral portion of the base material so that the central axes of the base material and the mold coincide with each other. You can
【0037】[0037]
【発明の効果】本発明の製造方法によると、樹脂層に硬
化収縮が発生しても、金型と基材の中心軸にずれを生じ
させることなく、偏芯精度が高い複合型光学素子を製造
することができる。According to the manufacturing method of the present invention, even if the resin layer undergoes curing shrinkage, a composite type optical element having a high eccentricity accuracy does not occur in the center axes of the mold and the base material. It can be manufactured.
【図1】本発明の実施例1による複合型光学素子の製造
方法を工程順に説明するための図である。FIG. 1 is a diagram for explaining a method of manufacturing a composite optical element according to Example 1 of the present invention in the order of steps.
【図2】本発明の実施例1による複合型光学素子の製造
方法を工程順に説明するための図である。2A and 2B are views for explaining the method of manufacturing the composite optical element according to the first embodiment of the present invention in the order of steps.
【図3】実施例1における紫外線照射時間と樹脂の硬化
収縮量との関係を示すグラフである。FIG. 3 is a graph showing a relationship between an ultraviolet irradiation time and a curing shrinkage amount of a resin in Example 1.
【図4】本発明の実施例1による複合型光学素子の製造
方法を工程順に説明するための図である。4A to 4D are views for explaining the method of manufacturing the composite optical element according to Example 1 of the present invention in the order of steps.
【図5】本発明の実施例1による複合型光学素子の製造
方法を工程順に説明するための図である。5A and 5B are views for explaining the method of manufacturing the composite optical element according to the first embodiment of the present invention in the order of steps.
【図6】本発明の実施例2による複合型光学素子の製造
方法を工程順に説明するための図である。FIG. 6 is a diagram for explaining a manufacturing method of the composite optical element according to Example 2 of the present invention in the order of steps.
【図7】本発明の実施例2による複合型光学素子の製造
方法を工程順に説明するための図である。FIG. 7 is a drawing for explaining the manufacturing method of the composite optical element according to Example 2 of the present invention in the order of steps.
【図8】実施例2における紫外線照射時間と樹脂の硬化
収縮量との関係を示すグラフである。FIG. 8 is a graph showing a relationship between an ultraviolet irradiation time and a curing shrinkage amount of a resin in Example 2.
【図9】本発明の実施例2による複合型光学素子の製造
方法を工程順に説明するための図である。FIG. 9 is a drawing for explaining the manufacturing method of the composite optical element according to Example 2 of the present invention in the order of steps.
【図10】本発明の実施例2による複合型光学素子の製
造方法を工程順に説明するための図である。FIG. 10 is a drawing for explaining the manufacturing method of the composite optical element according to Embodiment 2 of the present invention in the order of steps.
【図11】本発明の実施例3による複合型光学素子の製
造方法を工程順に説明するための図である。FIG. 11 is a diagram for explaining a manufacturing method of the composite optical element according to Example 3 of the present invention in the order of steps.
【図12】本発明の実施例3による複合型光学素子の製
造方法を工程順に説明するための図である。FIG. 12 is a drawing for explaining the manufacturing method of the composite optical element according to Embodiment 3 of the present invention in the order of steps.
【図13】実施例3における紫外線照射時間と樹脂の硬
化収縮量との関係を示すグラフである。FIG. 13 is a graph showing the relationship between the ultraviolet irradiation time and the curing shrinkage amount of resin in Example 3.
【図14】本発明の実施例3による複合型光学素子の製
造方法を工程順に説明するための図である。FIG. 14 is a drawing for explaining the manufacturing method of the composite optical element according to Embodiment 3 of the present invention in the order of steps.
【図15】本発明の実施例3による複合型光学素子の製
造方法を工程順に説明するための図である。FIG. 15 is a diagram for explaining a manufacturing method of the composite optical element according to Example 3 of the present invention in the order of steps.
【図16】本発明を原理的に説明するための正面図であ
る。FIG. 16 is a front view for explaining the principle of the present invention.
【図17】本発明を原理的に説明するための平面図であ
る。FIG. 17 is a plan view for explaining the principle of the present invention.
1 金型 1a 光学面 2 基材 2a 端面 3 樹脂層 4 剥離用の部材 4a 平面 5 紫外線硬化型樹脂 6 複合型光学素子 11 金型 11a 光学面 12 基材 12a v型溝 13 樹脂層 14 剥離用の部材 14a 先端部 16 複合型光学素子 21 金型 21a 光学面 22 基材 22a 端面 23 樹脂層 24 剥離用の部材 24a 平面 26 複合型光学素子 51 金型 51a 光学面 52 基材 53 樹脂層 53a 樹脂層表面 54 芯出し部材 D 有効直径 DESCRIPTION OF SYMBOLS 1 Mold 1a Optical surface 2 Base material 2a End surface 3 Resin layer 4 Separation member 4a Plane 5 UV curable resin 6 Composite optical element 11 Mold 11a Optical surface 12 Base material 12a V-shaped groove 13 Resin layer 14 For peeling Member 14a tip part 16 composite type optical element 21 mold 21a optical surface 22 base material 22a end face 23 resin layer 24 member for peeling 24a flat surface 26 composite type optical element 51 mold 51a optical surface 52 base material 53 resin layer 53a resin Layer surface 54 Centering member D Effective diameter
Claims (1)
樹脂を供給し、所望の樹脂層表面を形成するための光学
面を有する金型と基材とを相対的に接近させることによ
り樹脂を押圧して広げ金型と基材との間に所望の樹脂層
を形成した後、エネルギーの照射により樹脂層を硬化さ
せ、その後、硬化した樹脂層と金型を剥離する複合型光
学素子の製造方法において、エネルギー照射中における
樹脂の硬化収縮による基材の変形量が最も大きい位置で
の基材の変形を打ち消すように金型と基材を光軸に平行
な方向に相対的に接近させることを特徴とする複合型光
学素子の製造方法。1. A resin is provided by supplying an energy-curable resin to the surface of an optical element substrate and bringing a mold having an optical surface for forming a desired resin layer surface and the substrate relatively close to each other. Manufacture of a composite optical element in which a desired resin layer is formed between a mold and a base material by pressing and expanding, and then the resin layer is cured by irradiation of energy, and then the cured resin layer and the mold are separated. In the method, the mold and the base material are relatively brought close to each other in a direction parallel to the optical axis so as to cancel the base material deformation at the position where the base material deformation amount due to curing shrinkage of the resin during energy irradiation is the largest. And a method for manufacturing a composite optical element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25914094A JPH0899367A (en) | 1994-09-29 | 1994-09-29 | Manufacture of compound optical element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25914094A JPH0899367A (en) | 1994-09-29 | 1994-09-29 | Manufacture of compound optical element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0899367A true JPH0899367A (en) | 1996-04-16 |
Family
ID=17329888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25914094A Pending JPH0899367A (en) | 1994-09-29 | 1994-09-29 | Manufacture of compound optical element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0899367A (en) |
-
1994
- 1994-09-29 JP JP25914094A patent/JPH0899367A/en active Pending
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