JPH089972Y2 - Mounting device for solid-state image sensor - Google Patents

Mounting device for solid-state image sensor

Info

Publication number
JPH089972Y2
JPH089972Y2 JP1988072321U JP7232188U JPH089972Y2 JP H089972 Y2 JPH089972 Y2 JP H089972Y2 JP 1988072321 U JP1988072321 U JP 1988072321U JP 7232188 U JP7232188 U JP 7232188U JP H089972 Y2 JPH089972 Y2 JP H089972Y2
Authority
JP
Japan
Prior art keywords
solid
bracket
reference surface
state image
adjustment plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988072321U
Other languages
Japanese (ja)
Other versions
JPH01175068U (en
Inventor
雅恵 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP1988072321U priority Critical patent/JPH089972Y2/en
Publication of JPH01175068U publication Critical patent/JPH01175068U/ja
Application granted granted Critical
Publication of JPH089972Y2 publication Critical patent/JPH089972Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】 [産業上の利用分野] 本考案は固体撮像素子の取付装置、さらに詳しくは、
固体撮像素子をその受光面の傾きを調整自在な構成で取
付けられる固体撮像素子の取付装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a mounting device for a solid-state image sensor, and more specifically,
The present invention relates to a mounting device for a solid-state image sensor, in which the inclination of a light-receiving surface of the solid-state image sensor can be adjusted.

[従来の技術] 固体撮像素子を保持した保持部材と同保持部材を支持
するブラケット間にばね片を介在させ、調整ねじによっ
てばね片の弾撥習性に抗する方向にブラケットに対する
保持部材の位置調整を行うことにより固体撮像素子の位
置を調整できるようにした固体撮像素子の取付装置が知
られている(特開昭57-66428号公報参照)。
[Prior Art] A spring member is interposed between a holding member that holds a solid-state image pickup device and a bracket that supports the holding member, and a position of the holding member with respect to the bracket is adjusted by an adjusting screw in a direction that opposes the elasticity of the spring member. There is known a mounting device for a solid-state image pickup device in which the position of the solid-state image pickup device can be adjusted by performing the above (see JP-A-57-66428).

[考案が解決しようとする課題] しかし、上記取付装置では、ブラケットに設けられた
ばね片の弾撥習性により、保持部材はブラケットに対し
て近付く方向に付勢されるようにしているために、ばね
片係止用の溝等を有する複雑な形状となっている。この
ため組立ての作業性も良くないものとなっている。
[Problems to be Solved by the Invention] However, in the above-described mounting device, the spring is provided in the bracket so that the holding member is biased in the direction toward the bracket due to the elastic repellency of the spring piece. It has a complicated shape with a groove for one side locking. Therefore, the workability of assembling is also poor.

本考案の目的は、このような問題点に鑑み、構成が簡
単で、しかも組立て作業性も良好な固体撮像素子の取付
装置を提供することにある。
In view of the above problems, an object of the present invention is to provide a mounting device for a solid-state image pickup device, which has a simple structure and has good assembling workability.

[課題を解決するための手段および作用] 本考案の固体撮像素子の取付装置は、固体撮像素子
(1)の受光面の傾きを該固体撮像素子の保護枠(2)
を保持するブラケット(7)に設定された標準面(7e)
に対して調整自在にした固体撮像素子の取付装置におい
て、固体撮像素子と一体となって移動自在な調整板(1
4)と、この調整板(14)を上記基準面(7e)から離間
する方向に付勢する付勢部材(板ばね16)と、上記基準
面(7e)に設けられ、上記調整板(14)が付勢部材(板
ばね16)の付勢力によって、その回動支点部が上記基準
面から離間する方向へ移動することを該回動支点部と係
合することによって規制すべく上記ブラケット(7)の
基準面(7e)との相対位置が固定されるようにして移動
不能に設けられた回動支点位置規制部材と、上記付勢部
材(板ばね16)の付勢力に抗して上記調整板(14)を支
持し、回動支点を中心に互いに異なる方向に上記調整板
(14)を回動調整可能な2つの調整部材(調整ビス15a,
15b)と、を具備したことを特徴とする。
[Means and Actions for Solving the Problem] In the mounting device for a solid-state image sensor according to the present invention, the inclination of the light-receiving surface of the solid-state image sensor (1) is protected by the protective frame (2) of the solid-state image sensor.
Standard surface (7e) set on the bracket (7) that holds the
In the mounting device of the solid-state image sensor that is adjustable with respect to the solid-state image sensor, the adjustment plate (1
4), an urging member (leaf spring 16) for urging the adjusting plate (14) in a direction away from the reference surface (7e), and the adjusting plate (14e) provided on the reference surface (7e). ) By the urging force of the urging member (plate spring 16), the bracket (to prevent the rotation fulcrum part from moving in the direction away from the reference plane by engaging with the rotation fulcrum part). 7) The rotation fulcrum position regulating member which is immovably provided so that the relative position to the reference surface (7e) is fixed, and the urging force of the urging member (leaf spring 16) is resisted. Two adjustment members (adjustment screws 15a, which support the adjustment plate (14) and can adjust the rotation of the adjustment plate (14) in different directions about the rotation fulcrum.
15b) and are provided.

[実施例] 第1〜3図に示すように、固体撮像素子1は額縁形状
の保護枠2に保持されている。この保持枠2は、図示さ
れない取付手段により固体撮像素子1を一体的に保持し
ているが、例えば、この保持枠として略L字形状に形成
された2つの枠部材を固体撮像素子1の外周にばね部材
を用いて取り付ける構成としてもよい。この固体撮像素
子1を保持した保持枠2は、額縁形状のブラケット7
に、支持ピン8,9,10および板ばね11,12を介して支持さ
れている。
[Example] As shown in Figs. 1 to 3, the solid-state imaging device 1 is held by a frame-shaped protective frame 2. The holding frame 2 integrally holds the solid-state image pickup device 1 by a mounting means (not shown). For example, two frame members formed in a substantially L shape as the holding frame are provided on the outer periphery of the solid-state image pickup device 1. A spring member may be used for the attachment. The holding frame 2 holding the solid-state imaging device 1 includes a frame-shaped bracket 7
It is supported via support pins 8, 9, 10 and leaf springs 11, 12.

すなわち、保持枠2の周囲において、ブラケット7の
矩形状の空間部13は保持枠2の外形よりもやや大きく形
成されていて、第2図中、保護枠2の左側面とブラケッ
ト7との間の隙間には、ブラケット7に対して保護枠2
を右方向に付勢するための板ばね11が介在され、保護枠
2の右側面にはブラケット7に螺合して取り付けた支持
ピン8の先端が当接して保護枠2を水平な左右方向Xに
対する位置を規制している。また、保護枠2の下側面と
ブラケット7との間の隙間には、ブラケット7に対して
保護枠2を上方向に付勢するための板ばね12が介在さ
れ、保護枠2の上側面にはブラケット7に螺合して取り
付けた2本の支持ピン9,10の先端が当接して保護枠2を
垂直な上下方向Yに対する位置を規制している。従っ
て、ブラケット7に対する支持ピン8の螺合の度合を調
整することにより、保護枠2に一体の固体撮像素子1の
左右方向Xの位置調整を行うことができ、また、ブラケ
ット7に対する支持ピン9,10の螺合の度合を調整するこ
とにより、固体撮像素子1の上下方向Yの位置調整を行
うことができ、さらに、ブラケット7に対する支持ピン
9と支持ピン10との螺合の度合を適宜に異ならせること
により、固体撮像素子1を光軸Oを中心とする回転方向
θに対して回動調整することができる。
That is, in the periphery of the holding frame 2, the rectangular space portion 13 of the bracket 7 is formed to be slightly larger than the outer shape of the holding frame 2, and between the left side surface of the protection frame 2 and the bracket 7 in FIG. Protective frame 2 against bracket 7
A leaf spring 11 for urging the protective frame 2 to the right is interposed, and the tip end of a support pin 8 screwed and attached to the bracket 7 abuts on the right side surface of the protective frame 2 to move the protective frame 2 in the horizontal left-right direction. The position with respect to X is regulated. In addition, a leaf spring 12 for urging the protective frame 2 upward with respect to the bracket 7 is interposed in the gap between the lower side surface of the protective frame 2 and the bracket 7, and The ends of the two support pins 9 and 10 screwed onto the bracket 7 come into contact with each other to regulate the position of the protective frame 2 in the vertical vertical direction Y. Therefore, by adjusting the degree of screwing of the support pin 8 with respect to the bracket 7, the position of the solid-state imaging device 1 integrated with the protective frame 2 in the left-right direction X can be adjusted, and the support pin 9 with respect to the bracket 7 can be adjusted. The position of the solid-state image pickup device 1 in the vertical direction Y can be adjusted by adjusting the degree of screwing of the support pins 9 and 10, and the degree of screwing of the support pin 9 and the support pin 10 with respect to the bracket 7 can be appropriately adjusted. The solid-state imaging device 1 can be rotationally adjusted with respect to the rotation direction θ about the optical axis O.

また、第2図中、ブラケット7の左側および下側の各
枠部は互いに反対方向に僅かに延出し、同延出部の背面
にそれぞれねじ孔7a,7bが形成されている。これらのね
じ孔7a,7bが形成されているブラケット7の背面は基準
面7e(第4図参照)とされている。
In addition, in FIG. 2, the left and lower frame portions of the bracket 7 slightly extend in opposite directions, and screw holes 7a and 7b are formed on the back surfaces of the extended portions, respectively. The rear surface of the bracket 7 in which these screw holes 7a and 7b are formed is a reference surface 7e (see FIG. 4).

ブラケット7の空間部13に上記固体撮像素子1を保持
した保護枠2を配置させるに際して、空間部13の前のブ
ラケット7の窓部7cを形成している前板部7dと上記保護
枠2との間に、上記保護枠2を後方向に付勢するための
板ばね16が介在されている。そして、この状態で上記基
準面7eに調整板14が対向して配置され、同調整板14は上
記ねじ孔7a,7bにそれぞれ調整ビス15a,15bを螺合させて
基準面7eに取り付けられている(第1,3,4図参照)。調
整板14には固体撮像素子1のリード端子1aを通すための
孔14aが設けられている。固体撮像素子1のリード端子1
aの先端は、例えば、電気回路基板17上に接続される
(第3図参照)。この調整板14は、上記調整ビス15a,15
bを適宜に調整することにより、同調整部分において基
準面7eからの離間距離の位置調整を行うことができる。
When arranging the protective frame 2 holding the solid-state image sensor 1 in the space 13 of the bracket 7, the front plate 7d forming the window 7c of the bracket 7 in front of the space 13 and the protective frame 2 are A leaf spring 16 for biasing the protective frame 2 in the rearward direction is interposed between the two. Then, in this state, the adjusting plate 14 is arranged to face the reference surface 7e, and the adjusting plate 14 is attached to the reference surface 7e by screwing the adjusting screws 15a and 15b into the screw holes 7a and 7b, respectively. (See Figures 1, 3 and 4). The adjusting plate 14 is provided with a hole 14a for passing the lead terminal 1a of the solid-state image pickup device 1. Lead terminal 1 of solid-state image sensor 1
The tip of a is connected to, for example, the electric circuit board 17 (see FIG. 3). The adjusting plate 14 is provided with the adjusting screws 15a, 15 described above.
By adjusting b appropriately, the position of the distance from the reference surface 7e can be adjusted in the adjustment portion.

ところで、ブラケット7の、正面から見て左下の背面
側の隅部には、第2〜5図に示すように、調整板14の一
隅部14bを挾み込んでこれを支持し規制するためのアー
チ状の係合部18が設けられている。この第2〜5図等か
らも既に明らかなとおり、アーチ状の係合部18は、ブラ
ケット7の基準面7eとの相対位置が固定されるようにし
て移動不能になされている。そこで、調整板14の一隅部
14bを係合部18に挾み込んだ状態で、上述の如くに上記
調整板14をブラケット7の基準面7eに対して調整ビス15
a,15bを用いて取り付けると、調整板14の基準面7eから
の離間距離は、調整ビス15a,15bの位置においてはねじ
孔7a,7bに対する調整ビス15a,15bの螺合の度合により変
化するが、係合部18の位置においては一定距離に規制さ
れる。
By the way, as shown in FIGS. 2 to 5, at a corner of the bracket 7 on the lower left side when viewed from the front, as shown in FIGS. 2 to 5, one corner 14b of the adjusting plate 14 is sandwiched to support and regulate it. An arch-shaped engaging portion 18 is provided. As is clear from FIGS. 2 to 5, the arch-shaped engaging portion 18 is immovable so that the relative position of the bracket 7 to the reference surface 7e is fixed. Therefore, one corner of the adjustment plate 14
As described above, the adjusting plate 14 is adjusted with respect to the reference surface 7e of the bracket 7 with the adjusting screw 15 in the state where the engaging member 18 is sandwiched by the adjusting plate 15.
When mounted using a and 15b, the distance from the reference surface 7e of the adjusting plate 14 changes depending on the screwing degree of the adjusting screws 15a and 15b with respect to the screw holes 7a and 7b at the positions of the adjusting screws 15a and 15b. However, the position of the engaging portion 18 is restricted to a constant distance.

このため、第4図に示すように、一方の調整ビス15a
を調整するとき、係合部18の位置と他方の調整ビス15b
の位置とを結ぶ直線Lxを回動中心として、調整板14が基
準面7eに対して前後に傾き、他方の調整ビス15bを調整
するとき、係合部18の位置と上記一方の調整ビス15aの
位置とを結ぶ直線Lyを回動中心として、調整板14が基準
面7eに対して前後に傾く。この調整板14が移動すれば、
上記板ばね16により常時この調整板14の方向に付勢され
ている保護枠2に一体の固体撮像素子1も同様に移動す
る。従って、上記一方の調整ビス15a,15bを調整するこ
とにより、上記調整板14を介して保護枠2に一体の固体
撮像素子1の受光面の、基準面7eに対する傾きを調整す
ることができる。
Therefore, as shown in FIG. 4, one adjustment screw 15a
Position of the engaging portion 18 and the other adjusting screw 15b
When the adjusting plate 14 tilts back and forth with respect to the reference surface 7e about the straight line Lx connecting the position of the position of the engaging portion 18, the position of the engaging portion 18 and the adjusting screw 15a of the one side when adjusting the other adjusting screw 15b. The adjusting plate 14 tilts back and forth with respect to the reference plane 7e with the straight line Ly connecting the position of and as the center of rotation. If this adjustment plate 14 moves,
The solid-state image pickup device 1 integrated with the protective frame 2 which is constantly urged in the direction of the adjusting plate 14 by the leaf spring 16 also moves. Therefore, the inclination of the light receiving surface of the solid-state image sensor 1 integrated with the protective frame 2 via the adjusting plate 14 with respect to the reference surface 7e can be adjusted by adjusting the one adjusting screw 15a, 15b.

なお、上記係合部18は、同部分の回転支点位置がなる
べく変化しないように、直線Lxと直線Lyとが交叉する一
点において、調整板14の一隅部14bを規制することが望
ましいので、例えば、第6図(A),(B)に示すよう
に、直線Lxと直線Lyとが交叉する一点に突起28aを有す
る係合部28を用いるとともに、上記調整板14にも上記突
起28aに嵌り合う凹部14cを形成するようにしてもよい。
また、その他、第7図(A),(B)に示すように、調
整板14の隅部14bを閉塞して覆う形状の係合部38として
もよく、或いは、第8図に示すように、上記係合部18の
中間を切り欠いた形状の係合部48としてもよい。
Incidentally, the engaging portion 18, it is desirable to regulate one corner portion 14b of the adjusting plate 14 at a point where the straight line Lx and the straight line Ly intersect so that the rotation fulcrum position of the same portion does not change as much as possible. As shown in FIGS. 6 (A) and 6 (B), an engaging portion 28 having a protrusion 28a at a point where the straight line Lx and the straight line Ly intersect is used, and the adjusting plate 14 is also fitted to the protrusion 28a. You may make it form the recessed part 14c which fits.
Alternatively, as shown in FIGS. 7A and 7B, the engaging portion 38 may be shaped so as to close and cover the corner 14b of the adjusting plate 14, or as shown in FIG. The engaging portion 48 may be formed by cutting out the middle of the engaging portion 18.

[考案の効果] 以上述べたように本考案によれば、従来装置に較べて
構成が非常に簡単であり、しかも組立ての作業性も極め
て良好である。
[Advantages of the Invention] As described above, according to the present invention, the configuration is very simple as compared with the conventional device, and the workability of assembling is also very good.

【図面の簡単な説明】[Brief description of drawings]

第1図は、本考案の一実施例を示す固体撮像素子の取付
装置の組立斜視図、 第2図は、上記取付装置の一部を断面とした正面図、 第3図は、上記第2図中のIII-III線に沿って切断した
断面図、 第4図は、上記取付装置の背面図、 第5図は、上記第4図中のV−V線に沿って切断した断
面図、 第6図(A)および(B)は、係合部の他の例を示すた
めの要部の背面図およびそのVI-VI線に沿って切断した
断面図、 第7図(A)および(B)は、係合部のさらに他の例を
示すための要部の背面図およびそのVII-VII線に沿って
切断した断面図、 第8図は、係合部の別の例を示すための要部の背面図で
ある。 1……固体撮像素子 7……ブラケット 7e……基準面 14……調整板 15a,15b……調整ビス(2つの調整部材) 16……板ばね(付勢部材) 18,28,38,48……係合部(回動支点位置規制部材)
FIG. 1 is an assembled perspective view of a mounting device for a solid-state image pickup device showing an embodiment of the present invention, FIG. 2 is a front view of a part of the mounting device in section, and FIG. A cross-sectional view taken along line III-III in the drawing, FIG. 4 is a rear view of the mounting device, and FIG. 5 is a cross-sectional view taken along line V-V in FIG. 6 (A) and 6 (B) are a rear view of a main portion for showing another example of the engaging portion and a cross-sectional view taken along line VI-VI thereof, FIGS. 7 (A) and (A). B) is a rear view of a main part for showing still another example of the engaging part and a sectional view taken along line VII-VII thereof. FIG. 8 shows another example of the engaging part. It is a rear view of the main part of. 1 …… Solid-state image sensor 7 …… Bracket 7e …… Reference surface 14 …… Adjustment plate 15a, 15b …… Adjustment screw (two adjustment members) 16 …… Leaf spring (biasing member) 18,28,38,48 ...... Engagement part (rotation fulcrum position regulating member)

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】固体撮像素子の受光面の傾きを該固体撮像
素子の保護枠を保持するブラケットに設定された標準面
に対して調整自在にした固体撮像素子の取付装置におい
て、 固体撮像素子と一体となって移動自在な調整板と、 この調整板を上記基準面から離間する方向に付勢する付
勢部材と、 上記基準面に設けられ、上記調整板が付勢部材の付勢力
によって、その回動支点部が上記基準面から離間する方
向へ移動することを該回動支点部と係合することによっ
て規制すべく上記ブラケットの基準面との相対位置が固
定されるようにして移動不能に設けられた回動支点位置
規制部材と、 上記付勢部材の付勢力に抗して上記調整板を支持し、回
動支点を中心に互いに異なる方向に上記調整板を回動調
整可能な2つの調整部材と、 を具備したことを特徴とする固体撮像素子の取付装置。
1. A mounting device for a solid-state imaging device, wherein a tilt of a light-receiving surface of the solid-state imaging device is adjustable with respect to a standard plane set on a bracket for holding a protective frame of the solid-state imaging device. An adjustment plate that is movable integrally and a biasing member that biases the adjustment plate in a direction away from the reference surface, and the adjustment plate that is provided on the reference surface, and the adjustment plate is biased by the biasing member. Immobilized so that the relative position of the bracket to the reference surface is fixed in order to prevent the rotation fulcrum portion from moving in the direction away from the reference surface by engaging with the rotation fulcrum portion. A rotation fulcrum position restricting member provided on the base plate, the adjustment plate supported against the urging force of the urging member, and the rotation adjustment of the adjustment plate in different directions about the rotation fulcrum. Equipped with two adjusting members Mounting device of a solid-state imaging device according to claim.
JP1988072321U 1988-05-30 1988-05-30 Mounting device for solid-state image sensor Expired - Lifetime JPH089972Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988072321U JPH089972Y2 (en) 1988-05-30 1988-05-30 Mounting device for solid-state image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988072321U JPH089972Y2 (en) 1988-05-30 1988-05-30 Mounting device for solid-state image sensor

Publications (2)

Publication Number Publication Date
JPH01175068U JPH01175068U (en) 1989-12-13
JPH089972Y2 true JPH089972Y2 (en) 1996-03-21

Family

ID=31297493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988072321U Expired - Lifetime JPH089972Y2 (en) 1988-05-30 1988-05-30 Mounting device for solid-state image sensor

Country Status (1)

Country Link
JP (1) JPH089972Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002077699A (en) * 2000-08-31 2002-03-15 Mitsubishi Electric Corp Solid-state imaging device, holding / optical axis tilt adjustment unit for solid-state imaging device, imaging position adjustment unit for solid-state imaging device, and imaging device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
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JP4372152B2 (en) * 2004-03-17 2009-11-25 株式会社日本政策投資銀行 Imaging position adjusting mechanism and photographing apparatus
JP5439929B2 (en) * 2009-04-23 2014-03-12 株式会社ニコン Imaging device

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JPS5967950U (en) * 1982-10-26 1984-05-08 シャープ株式会社 Semiconductor image sensor mounting device

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JP2002077699A (en) * 2000-08-31 2002-03-15 Mitsubishi Electric Corp Solid-state imaging device, holding / optical axis tilt adjustment unit for solid-state imaging device, imaging position adjustment unit for solid-state imaging device, and imaging device

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