JPH09102709A - Forming method for microstrip antenna - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease the production processes and to improve mass productivity of a microstrip antenna by adding a patch and ground to both variable and fixed molds of an injection molding metallic mold respectively and forming the electrodes on both sides of a dielectric substrate concurrently with the injection molding of the substrate. SOLUTION: A movable board 9 unified with a movable metallic mold part 10 slides on a guide 12 toward an arrow C, and the part 10 engages with a stationary metallic mold part 8 and is locked at the outer circumference of the part 8 to form a molding space 13. Thus an elastic member 8b is compressed by a degree equal to the movement of a guide pin 8a caused by the pressure of the part 10. The member 8b is also compressed by a degree equal to the movement of a guide pin 10a caused by the pressure of the part 8. In such a constitution, an injection molding device 11 is produced for molding a microstrip antenna. Then the synthetic resin to be fused is supplied into the space 13 formed in both parts 8 and 10 from the device 11. Thus a dielectric substrate is unified with a patch 1, a ground 2 and a feeding pin 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001]

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for molding a microstrip antenna used for mobile communication and portable radio.

[0003]

[0002]

[0004]

2. Description of the Related Art Conventionally, there is a microstrip antenna shown in FIG. 6 as a high frequency antenna used for mobile communication and portable radio.

FIG. 6 is a schematic sectional view of a conventional microstrip antenna.

In the figure, in a conventional microstrip antenna, a patch 102 made of a thin metal conductor plate and a ground 103 are made of a dielectric material such as a rectangular sintered ceramic substrate having a constant dielectric constant and a predetermined thickness. The electrodes are closely attached to both surfaces of the substrate 101 to form electrodes.

[0007]

A feeding pin 105 made of a conductive material such as metal is electrically connected to the patch 102 at a feeding point 106 on the patch 102 as shown in FIG.
It penetrates through the dielectric substrate 101 and is arranged on the side of the ground 103. The ground 103 is electrically isolated from the power supply pin 105 and is grounded to the ground 104.

[0008]

Further, the electrodes of the conventional microstrip antenna have been formed by the following various forming methods.

One is a printing method, in which a conductive paint in which a conductive material such as silver or copper is mixed in a resin binder is screen-printed on the surface of a sintered ceramic substrate which is a dielectric substrate. After that, the resin binder is burned off at a high temperature to form a metal film.

The other is a plating method, which is a method in which the surface of a sintered ceramic substrate, which is a dielectric substrate, is subjected to a conductive treatment with a conductive paint, and then a copper plating film is formed in the plating layer.

The other is a method of sticking a metal foil, which is a method in which an adhesive is thinly applied to the surface of a sintered ceramic substrate which is a dielectric substrate, and a copper foil or the like is stuck.

[0012]

Further, in the conventional power feeding pin 105, after the electrode is formed by the method described above, the patch 1 in which a hole of a predetermined size is preliminarily formed at a position corresponding to the power feeding point 106.
No. 02, the dielectric substrate 101, and the ground 103, and was soldered and fixed to the patch 102.

[0013]

The conventional microstrip antenna is formed and constructed as described above, and when a radio wave arrives at the microstrip antenna, the end of the patch 102 and the ground 1 are connected.
The domain wall 03 serves as a domain wall and acts as a resonator, and the eigenmode is excited in the dielectric substrate 101 and supplied to a receiver (not shown) connected to the power feed pin 105.

[0014]

In recent years, the diversification of information has advanced, and GPS (Glob) using satellite radio waves is used as a communication means used in automobiles and the like.
The demand for the Al Positioning System is increasing. Although a small microstrip antenna is suitable for such communication means, as described above, after the dielectric substrate is generated as in the conventional case, the electrodes are formed on both surfaces of the dielectric substrate, and then the feeding pin is formed. The microstrip antenna using the method of inserting it, soldering it, and fixing it has many manufacturing steps and cannot meet various demands in terms of mass productivity and cost.

[0015]

[0008]

[0016]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and provides a method for forming a microstrip antenna having a small number of manufacturing steps and good mass productivity.

[0017]

[0009]

[0018]

According to the first aspect of the present invention,
In the method for forming a microstrip antenna, which is constructed by sandwiching both sides of a flat plate-shaped dielectric with a radiation conductor and a ground conductor, and attaching a feeding line that supplies power to the feeding point on the radiation conductor. The conductor is fixedly arranged at a predetermined interval in the injection molding die, and the dielectric is formed by injecting molten synthetic resin into the molding space formed at the predetermined interval so as to be in close contact with the radiation conductor and the ground conductor. It is characterized by being done.

[0019]

The invention according to claim 2 is the method for molding a microstrip antenna according to claim 1,
The radiation conductor is characterized in that a feeder line is attached to the radiation conductor, and the radiation conductor is arranged and fixed in the injection molding die.

[0020]

[0011]

[0021]

The present invention is constructed as described above.
According to the invention described above, the movable side and the fixed side of the injection molding die are provided with patches and grounds, respectively,
Since the electrodes are formed on both sides of the dielectric substrate at the same time as the injection molding of the dielectric substrate, it is possible to perform the process of forming the dielectric substrate and the process of forming the patch and the ground on both sides of the dielectric substrate at the same time. , The number of manufacturing steps is reduced, and mass productivity is improved.

[0022]

According to the second aspect of the present invention, the patch provided on the movable side or the fixed side of the injection molding die is provided with the power feeding line in advance at the power feeding point, and the dielectric substrate is injection molded. At the same time, since the electrodes are formed on both sides of the dielectric substrate, in addition to the step of forming the dielectric substrate and the steps of forming the patch and the ground on both sides of the dielectric substrate, the power supply line is also used in the dielectric substrate and the ground. Since the process of inserting and fixing in the same can be performed at the same time, the number of manufacturing processes is reduced and mass productivity is improved.

[0023]

[0013]

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a schematic view of a microstrip antenna formed by using the method for forming a microstrip antenna according to the present invention. FIG. 1 (a) is a top view and FIG. 1 (b) is a bottom view. It shows the view from.

In FIG. 1, the patch 1 is about 27 mm ×
A rectangular copper plate having a rectangular dimension of 28 mm and a thickness of 0.3 mm, a plurality of (four in FIG. 1) cut and raised portions 1a and a plurality of (four in FIG. 1) holes of a predetermined size. 1
b is provided.

The ground 2 is about 30 mm × 30 m.
A rectangular copper plate having a rectangular dimension of m and a thickness of 0.3 mm, a plurality of (four in FIG. 1) cut-and-raised portions 2a and a plurality of (four in FIG. 1) holes having a predetermined size. 2b is provided.

[0028]

A feeding point 4 which is a predetermined position of the patch 1
In, the conductive feed pin 5 is provided substantially perpendicular to the patch 1 and is fixedly connected to the patch 1 so as to be conductive.

The dielectric substrate 3 is made of a plastic resin having PPS (polyphenylene sulfide) as a base material, and the patch 1 and the ground 2 are formed in close contact with each other by injection molding described later. Further, 6 is a hole formed in the ground 2 into which a nozzle of a gate is inserted when performing injection molding described later.

[0030]

FIG. 2 is a sectional view taken along the arrow A in FIG. 1 (a). As can be seen from FIG. It is formed by the method according to.

[0031]

Next, a method of forming the microstrip antenna according to the present invention will be described below with reference to FIGS.

FIG. 3 is a schematic view of an injection molding apparatus used for molding the microstrip antenna according to the present invention.

As shown in the figure, the injection molding apparatus includes a fixed mold part 8 integrally mounted on a fixed platen 7, a movable mold part 10 integrally mounted on a movable platen 9, and an injection mold. The movable mold part 10 is provided with a device 11 and a movable platen 9 is a guide 1.
2 is slidably provided in the direction of arrow B in FIG.

[0034]

FIG. 4 is a schematic sectional view of a main part of an injection molding apparatus used for molding the microstrip antenna according to the present invention.

The fixed mold portion 8 is provided with guide pins 8a as shown in the figure at a plurality of positions, and each of them is biased and held by the elastic member 8b so as to project on the fixed mold portion 8. . Similarly, guide pins 10a are also provided on the movable mold part 10 at a plurality of locations different from the guide pins 8a, and each elastic member 10b urges the movable mold part 10 to project on the movable mold part 10. Retained.

[0036]

Therefore, the movable platen 9 provided integrally with the movable mold part 10 slides on the guide 12 in the direction of arrow C in FIG. The molding space 13 is formed by engaging and locking at the outer peripheral portion. In this case, the elastic member 8b is compressed by the amount of movement of the guide pin 8a pushed by the movable mold part 10. Further, the elastic member 10b is compressed by the amount of the guide pin 10a being pushed and moved by the fixed mold portion 8.

[0037]

The injection molding apparatus used for molding the microstrip antenna according to the present invention is configured as described above, and molding is performed by a synthetic resin that melts from the injection apparatus 11 by the movable mold section 10 and the fixed mold section 8. By injecting into the space 13, the dielectric substrate 3 is integrally formed with the patch 1, the ground 2, and the feeding pin 5.

[0038]

Next, the dielectric substrate 3 of the microstrip antenna of the present invention is formed into a patch 1 using an injection molding device.
A state in which the ground 2 and the power supply pin 5 are integrally molded will be described.

First, in a state in which the movable mold part 10 is separated from the fixed mold part 8, as shown in FIG. 4, the gland 2 is previously attached to the concave part of the fixed mold part 8 prior to molding.
At this time, since the plurality of holes 2b formed in the gland 2 are formed in accordance with the positions and the cross-sectional shapes of the plurality of guide pins 8a protruding from the fixed mold part 8, the holes 2b can be stably attached. .

[0040]

Similarly, in a state in which the movable mold section 10 is separated from the fixed mold section 8, as shown in FIG. Attach the patch 1 to which 5 is fixed. At this time, the plurality of holes 1b provided in the plurality of movable mold parts 10 formed in the patch 1 are formed according to the positions and cross-sectional shapes of the plurality of guide pins 10a protruding from the movable mold part 10. Therefore, it can be installed stably.

[0041]

Next, the movable mold part 10 is slid on the guide 12 in the direction of the arrow C in FIG. 4 and engaged with the fixed mold part 8 to form the molding space 13.

In this case, the plurality of guide pins 8a maintain their positions until they come into contact with the patch 1 approaching integrally with the movable mold part 10, but the tip end of the guide pin 8a is patch 1. Since the movable mold part 10 is pushed by the movable mold part 10 after being contacted with the fixed mold part 8, the fixed mold part 8 is held by the fixed mold part 8 until the peripheral part of the movable mold part 10 is locked to form a molding space. Move in the retracted direction.

[0043]

Further, since the guide pin 8a is constantly urged toward the movable mold part 10 by the elastic member 8b, the patch 1 is moved to the movable mold part 10 while the movable mold part 10 moves. Also, the patch 1 is pressed against the movable mold part 10 even after the movable mold part 10 moves while being clamped by the elastic force of the elastic member 8b and the movable mold part 10 is locked with the fixed mold part 8 to form the molding space 13. Attach and maintain. Therefore, the patch 1 can be in close contact with the movable mold portion 10 even after the molding space 13 is formed, and can maintain a predetermined position.

[0044]

Similarly, a plurality of guide pins 10a are provided.
Maintains its relative position to the movable mold part 10 until it contacts the ground 2 mounted on the fixed mold part 8. However, after the tip of the guide pin 10a contacts the ground 2, Since it is pushed by the fixed mold part 8, the movable mold part 8 is retracted in the movable mold part until the fixed mold part 8 and the peripheral part of the movable mold part 10 are locked to form a molding space. Mold part 1
Move the position relative to 0.

[0045]

The guide pin 10a is made up of the elastic member 10
Since it is always urged in the direction of the fixed mold part 8 by b, the guide pin 10 is kept moving while the movable mold part 10 moves.
a is an elastic member 10b including the ground 2 together with the fixed mold portion 8.
It moves while being sandwiched by the elastic force of, and even after being locked with the fixed mold part 8, the gland 2 is pressed and fixed to the fixed mold part 8. Therefore, the ground 2 is the molding space 1
Even after the formation of 3 is adhered to the fixed mold portion 8,
The predetermined position can be maintained.

[0046]

Next, the injection device 11 moves in the direction of the arrow D in FIG. 4 and is inserted into the guides 14 and 15 provided in the central portions of the fixed platen 7 and the fixed die part 8, and the central portion of the injection device 11 is inserted. After the nozzle 16 formed in the portion and the nozzle 18 that is connected to the gate 17 provided in the center of the fixed mold portion 8 are connected to each other, the PPS that is the material of the dielectric substrate 3 is heated and melted. It is injected from the nozzle 16 into the molding space 13 to fill the molding space 13 without any gap. At this time, since the gland 2 and the patch 1 are closely fixed to the fixed mold part 8 and the movable mold part 10 by the guide pins 10a and 8a, respectively, their positions are maintained.

[0047]

Therefore, the PPS fills the ground 2 and the cut-and-raised portions 1a, 2a provided in the patch 1 and the power feeding pin 5 without a gap. Next, the injected PPS is cooled for a predetermined time, and the dielectric substrate 3 is formed in a shape along the shape of the molding space 13. Further, the PPS holds the cut-and-raised parts 1a, 2a and the power feeding pin 5 due to thermal contraction during cooling, so that the ground 2 and the patch 1 are tightly fixed to both surfaces of the dielectric substrate 3, and the dielectric substrate 3, The patch 1, the ground 2, and the power feeding pin 5 are integrally formed. After the dielectric substrate 3 is formed, the cooled PPS is separated near the junction between the nozzle 16 and the nozzle 18.

[0048]

Next, by separating the movable mold part 10 from the fixed mold part 8, the movable mold part 10 is pulled out from the dielectric substrate 3 on which the guide pins 8a and 10a are formed, the patch 1 and the ground 2, and the dielectric substrate. A molded product in which the 3, patch 1, ground 2, and power feeding pin 5 are integrally formed is taken out.

[0049]

Here, since the integrally formed molded product is molded along with the shape along the gate 17, the microstrip antenna is formed by separating the molded product after taking it out from the molding device. .

Since the microstrip antenna is formed by the above method, the step of attaching the patch and the ground on the dielectric substrate and the step of inserting the power supply pin into the dielectric substrate and the ground and fixing the same are performed on the dielectric substrate. This can be performed at the same time as the step of forming a microstrip antenna, which improves the mass productivity of the microstrip antenna.

[0051]

In this embodiment, the ground is provided with a plurality of cut-and-raised portions so as to be integrally molded with the dielectric substrate so as to be in close contact with each other. However, as shown in FIG. A cutout portion 19 is formed in a part of the rising portion in the periphery and integrally formed so that the cutout portion 19 is filled with the material of the dielectric substrate when the dielectric substrate is formed. You may do it.

In this embodiment, the case of forming the microstrip antenna used for reception has been described, but the present invention may be applied to the case of forming the microstrip antenna used for transmission.

[0053]

[0031]

[0054]

Since the present invention is configured as described above, according to the invention of claim 1, the movable side and the fixed side of the injection molding die are provided with the patch and the ground respectively in advance, and the dielectric is formed. Since the electrodes are formed on both sides of the dielectric substrate at the same time as the injection molding of the substrate, the step of forming the dielectric substrate and the steps of forming the patch and the ground on both sides of the dielectric substrate can be performed simultaneously. The number of steps is reduced and mass productivity is improved.

[0055]

According to the second aspect of the present invention, the patch provided on the movable side or the fixed side of the injection mold has a feed line attached to the feed point in advance, and the dielectric substrate is injection-molded. At the same time, since the electrodes are formed on both sides of the dielectric substrate, in addition to the step of forming the dielectric substrate and the steps of forming the patch and the ground on both sides of the dielectric substrate, the power supply line is also used in the dielectric substrate and the ground. Since the process of inserting and fixing in the same can be performed at the same time, the number of manufacturing processes is reduced and mass productivity is improved.

[Brief description of the drawings]

FIG. 1 is a schematic view of a microstrip antenna formed by using the method for forming a microstrip antenna according to the present invention.

FIG. 2 is a schematic cross-sectional view showing a main part of a microstrip antenna formed by using the method for molding a microstrip antenna according to the present invention.

FIG. 3 is a schematic view of an injection molding apparatus used for molding a microstrip antenna according to the present invention.

FIG. 4 is a schematic sectional view of a main part of an injection molding apparatus used for molding a microstrip antenna according to the present invention.

FIG. 5 is a schematic cross-sectional view showing a main part of a microstrip antenna formed by using another method for forming a microstrip antenna according to the present invention.

FIG. 6 is a schematic sectional view of a conventional microstrip antenna.

[Explanation of symbols]

 1-patch 1a-cut-raised part 1b-hole 2-ground 2a-cut-raised part 2b-hole 3-dielectric Substrate 4 ... Feed point 5 ... Feed pin 6 ... Hole 7 ... Fixed plate 8 ... Fixed mold part 8a ... Guide pin 8b・ ・ ・ Elastic member 9 ・ ・ ・ Movable plate 10 ・ ・ ・ Movable mold part 10a ・ ・ ・ Guide pin 10b ・ ・ ・ Elastic member 11 ・ ・ ・ Injection device 12 ・ ・ ・ Guide 13 ・・ ・ ・ Molding space 14 ・ ・ ・ ・ Guide 15 ・ ・ ・ ・ ・ ・ Guide 16 ・ ・ ・ ・ Nozzle 17 ・ ・ ・ ・ Gate 18 ・ ・ ・ ・ Nozzle 19 ・ ・ ・ ・ ・ ・ Notch

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] November 8, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Detailed description of the invention

[Correction method] Change

[Correction contents]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for molding a microstrip antenna used for mobile communication and portable radio.

[0002]

2. Description of the Related Art Conventionally, there is a microstrip antenna shown in FIG. 6 as a high frequency antenna used for mobile communication and portable radio. FIG. 6 is a schematic sectional view of a conventional microstrip antenna. In the figure, the conventional microstrip antenna is a patch 1 made of a thin metal conductor plate.
02 and the ground 103 are closely attached to both surfaces of a dielectric substrate 101 composed of a rectangular sintered ceramic substrate or the like having a constant dielectric constant and a predetermined thickness to form electrodes. There is.

A feeding pin 105 made of a conductive material such as metal is electrically connected to the patch 102 at a feeding point 106 on the patch 102 as shown in FIG.
It penetrates through the dielectric substrate 101 and is arranged on the side of the ground 103. The ground 103 is electrically isolated from the power supply pin 105 and is grounded to the ground 104.

Further, the electrodes of the conventional microstrip antenna have been formed by the following various forming methods. One is a printing method, in which a conductive paint in which a conductive material such as silver or copper is mixed in a resin binder is screen-printed on the surface of a sintered ceramic substrate that is a dielectric substrate, Is a method of forming a metal film by burning away the resin binder. The other is a plating method, which is a method in which the surface of a sintered ceramic substrate, which is a dielectric substrate, is subjected to a conductive treatment with a conductive paint, and then a copper plating film is formed in the plating layer. And for one thing,
This is a method of applying a metal foil, which is a method of applying an adhesive thinly on the surface of a sintered ceramic substrate, which is a dielectric substrate, and attaching a copper foil or the like.

Further, in the conventional power feeding pin 105, after the electrode is formed by the method described above, the patch 1 in which a hole of a predetermined size is preliminarily formed at a position corresponding to the power feeding point 106.
No. 02, the dielectric substrate 101, and the ground 103, and was soldered and fixed to the patch 102.

The conventional microstrip antenna is formed and constructed as described above, and when a radio wave arrives at the microstrip antenna, the end of the patch 102 and the ground 1 are connected.
The domain wall 03 serves as a domain wall and acts as a resonator, and the eigenmode is excited in the dielectric substrate 101 and supplied to a receiver (not shown) connected to the power feed pin 105.

In recent years, the diversification of information has advanced, and GPS (Glob) using satellite radio waves is used as a communication means used in automobiles and the like.
The demand for the Al Positioning System is increasing. Although a small microstrip antenna is suitable for such communication means, as described above, after the dielectric substrate is generated as in the conventional case, the electrodes are formed on both surfaces of the dielectric substrate, and then the feeding pin is formed. The microstrip antenna using the method of inserting it, soldering it, and fixing it has many manufacturing steps and cannot meet various demands in terms of mass productivity and cost.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and provides a method for forming a microstrip antenna having a small number of manufacturing steps and good mass productivity.

[0009]

According to the first aspect of the present invention,
In the method for forming a microstrip antenna, which is constructed by sandwiching both sides of a flat plate-shaped dielectric with a radiation conductor and a ground conductor, and attaching a feeding line that supplies power to the feeding point on the radiation conductor. The conductor is fixedly arranged at a predetermined interval in the injection molding die, and the dielectric is formed by injecting molten synthetic resin into the molding space formed at the predetermined interval so as to be in close contact with the radiation conductor and the ground conductor. It is characterized by being done.

The invention according to claim 2 is the method for molding a microstrip antenna according to claim 1,
The radiation conductor is characterized in that a feeder line is attached to the radiation conductor, and the radiation conductor is arranged and fixed in the injection molding die.

[0011]

The present invention is constructed as described above.
According to the invention described above, the movable side and the fixed side of the injection molding die are provided with patches and grounds, respectively,
Since the electrodes are formed on both sides of the dielectric substrate at the same time as the injection molding of the dielectric substrate, it is possible to perform the process of forming the dielectric substrate and the process of forming the patch and the ground on both sides of the dielectric substrate at the same time. , The number of manufacturing steps is reduced, and mass productivity is improved.

According to the second aspect of the present invention, the patch provided on the movable side or the fixed side of the injection molding die is provided with the power feeding line in advance at the power feeding point, and the dielectric substrate is injection molded. At the same time, since the electrodes are formed on both sides of the dielectric substrate, in addition to the step of forming the dielectric substrate and the steps of forming the patch and the ground on both sides of the dielectric substrate, the power supply line is also used in the dielectric substrate and the ground. Since the process of inserting and fixing in the same can be performed at the same time, the number of manufacturing processes is reduced and mass productivity is improved.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1A and 1B are schematic views of a microstrip antenna formed by using the method for forming a microstrip antenna according to the present invention. FIG. 1A is a top view and FIG. 1B is a bottom view. The figure is shown. In FIG. 1, the patch 1 is about 27 mm × 2
A rectangular copper plate having a rectangular dimension of 8 mm and a thickness of 0.3 mm, a plurality of (four in FIG. 1) cut-and-raised portions 1a and a plurality of (four in FIG. 1) holes having a predetermined size. 1b
Is provided. Also, the ground 2 is about 30 mm ×
A rectangular copper plate having a rectangular dimension of 30 mm and a thickness of 0.3 mm, a plurality of (four in FIG. 1) cut-and-raised portions 2a and a plurality of (four in FIG. 1) holes having a predetermined size. Two
b is provided.

A feeding point 4 which is a predetermined position of the patch 1
In, the conductive feed pin 5 is provided substantially perpendicular to the patch 1 and is fixedly connected to the patch 1 so as to be conductive. The dielectric substrate 3 is made of a plastic resin whose base material is PPS (polyphenylene sulfide),
The patch 1 and the ground 2 are formed in close contact with each other by injection molding described later. Further, 6 is a hole formed in the ground 2 into which a nozzle of a gate is inserted when performing injection molding described later.

FIG. 2 is a sectional view taken along the arrow A in FIG. 1 (a). As can be seen from FIG. It is formed by the method according to.

Next, a method of forming the microstrip antenna according to the present invention will be described below with reference to FIGS. FIG. 3 is a schematic view of an injection molding apparatus used for molding the microstrip antenna according to the present invention. As shown in the figure, the injection molding apparatus includes a fixed mold part 8 integrally mounted on a fixed platen 7, a movable mold part 10 integrally mounted on a movable platen 9, and an injection device 11. The movable mold part 10 is provided so that the movable platen 9 can slide on the guide 12 in the direction of arrow B in FIG.

FIG. 4 is a schematic sectional view of a main part of an injection molding apparatus used for molding the microstrip antenna according to the present invention. The fixed mold portion 8 is provided with guide pins 8a as shown in the figure at a plurality of positions, and each of them is biased and held by the elastic member 8b so as to project on the fixed mold portion 8. Similarly, guide pins 10a are also provided on the movable mold part 10 at a plurality of locations different from the guide pins 8a, and each elastic member 10b urges the movable mold part 10 to project on the movable mold part 10. Retained.

Therefore, the movable platen 9 provided integrally with the movable mold part 10 slides on the guide 12 in the direction of arrow C in FIG. The molding space 13 is formed by engaging and locking at the outer peripheral portion. In this case, the elastic member 8b is compressed by the amount of movement of the guide pin 8a pushed by the movable mold part 10. Further, the elastic member 10b is compressed by the amount of the guide pin 10a being pushed and moved by the fixed mold portion 8.

The injection molding apparatus used for molding the microstrip antenna according to the present invention is configured as described above, and molding is performed by a synthetic resin that melts from the injection apparatus 11 by the movable mold section 10 and the fixed mold section 8. By injecting into the space 13, the dielectric substrate 3 is integrally formed with the patch 1, the ground 2, and the feeding pin 5.

Next, the dielectric substrate 3 of the microstrip antenna of the present invention is formed into a patch 1 using an injection molding device.
A state in which the ground 2 and the power supply pin 5 are integrally molded will be described. First, in a state in which the movable mold part 10 is separated from the fixed mold part 8, as shown in FIG. 4, the ground 2 is attached to the concave part of the fixed mold part 8 in advance prior to molding.
At this time, since the plurality of holes 2b formed in the gland 2 are formed in accordance with the positions and the cross-sectional shapes of the plurality of guide pins 8a protruding from the fixed mold part 8, the holes 2b can be stably attached. .

Similarly, in a state in which the movable mold section 10 is separated from the fixed mold section 8, as shown in FIG. Attach the patch 1 to which 5 is fixed. At this time, the plurality of holes 1b provided in the plurality of movable mold parts 10 formed in the patch 1 are formed according to the positions and cross-sectional shapes of the plurality of guide pins 10a protruding from the movable mold part 10. Therefore, it can be installed stably.

Next, the movable mold part 10 is slid on the guide 12 in the direction of the arrow C in FIG. 4 and engaged with the fixed mold part 8 to form the molding space 13. In this case, the plurality of guide pins 8a are brought closer to the movable mold part 10 integrally with the patch 1
The position of the guide pin 8a is maintained until it comes into contact with, but after the tip of the guide pin 8a comes into contact with the patch 1, it is pushed by the movable mold part 10, so that the fixed mold part 8 and the movable mold part are 10
It moves in the direction of retracting into the fixed mold part 8 until the peripheral part is locked and a molding space is formed.

Further, since the guide pin 8a is constantly urged toward the movable mold part 10 by the elastic member 8b, the patch 1 is moved to the movable mold part 10 while the movable mold part 10 moves. Also, the patch 1 is pressed against the movable mold part 10 even after the movable mold part 10 moves while being clamped by the elastic force of the elastic member 8b and the movable mold part 10 is locked with the fixed mold part 8 to form the molding space 13. Attach and maintain. Therefore, the patch 1 can be in close contact with the movable mold portion 10 even after the molding space 13 is formed, and can maintain a predetermined position.

Similarly, a plurality of guide pins 10a are provided.
Maintains its relative position to the movable mold part 10 until it contacts the ground 2 mounted on the fixed mold part 8. However, after the tip of the guide pin 10a contacts the ground 2, Since it is pushed by the fixed mold part 8, the movable mold part 8 is retracted in the movable mold part until the fixed mold part 8 and the peripheral part of the movable mold part 10 are locked to form a molding space. Mold part 1
Move the position relative to 0.

The guide pin 10a is made up of the elastic member 10
Since it is always urged in the direction of the fixed mold part 8 by b, the guide pin 10 is kept moving while the movable mold part 10 moves.
a is an elastic member 10b including the ground 2 together with the fixed mold portion 8.
It moves while being sandwiched by the elastic force of, and even after being locked with the fixed mold part 8, the gland 2 is pressed and fixed to the fixed mold part 8. Therefore, the ground 2 is the molding space 1
Even after the formation of 3 is adhered to the fixed mold portion 8,
The predetermined position can be maintained.

Next, the injection device 11 moves in the direction of the arrow D in FIG. 4 and is inserted into the guides 14 and 15 provided in the central portions of the fixed platen 7 and the fixed die part 8, and the central portion of the injection device 11 is inserted. After the nozzle 16 formed in the portion and the nozzle 18 that is connected to the gate 17 provided in the center of the fixed mold portion 8 are connected to each other, the PPS that is the material of the dielectric substrate 3 is heated and melted. It is injected from the nozzle 16 into the molding space 13 to fill the molding space 13 without any gap. At this time, since the gland 2 and the patch 1 are closely fixed to the fixed mold part 8 and the movable mold part 10 by the guide pins 10a and 8a, respectively, their positions are maintained.

Therefore, the PPS fills the ground 2 and the cut-and-raised portions 1a, 2a provided in the patch 1 and the power feeding pin 5 without a gap. Next, the injected PPS is cooled for a predetermined time, and the dielectric substrate 3 is formed in a shape along the shape of the molding space 13. Further, the PPS holds the cut-and-raised parts 1a, 2a and the power feeding pin 5 due to thermal contraction during cooling, so that the ground 2 and the patch 1 are tightly fixed to both surfaces of the dielectric substrate 3, and the dielectric substrate 3, The patch 1, the ground 2, and the power feeding pin 5 are integrally formed. After the dielectric substrate 3 is formed, the cooled PPS is separated near the junction between the nozzle 16 and the nozzle 18.

Next, by separating the movable mold part 10 from the fixed mold part 8, the movable mold part 10 is pulled out from the dielectric substrate 3 on which the guide pins 8a and 10a are formed, the patch 1 and the ground 2, and the dielectric substrate. A molded product in which the 3, patch 1, ground 2, and power feeding pin 5 are integrally formed is taken out.

Here, since the integrally formed molded product is molded along with the shape along the gate 17, the microstrip antenna is formed by separating the molded product after taking it out from the molding device. . Since the microstrip antenna is formed by the above method, the step of attaching the patch and the ground on the dielectric substrate and the step of inserting the power supply pin into the dielectric substrate and the ground and fixing the same form the dielectric substrate. This can be performed at the same time as the process, which improves the mass productivity of the microstrip antenna.

In this embodiment, the ground is provided with a plurality of cut-and-raised portions so as to be integrally molded with the dielectric substrate so as to be in close contact with each other. However, as shown in FIG. A cutout portion 19 is formed in a part of the rising portion in the periphery and integrally formed so that the cutout portion 19 is filled with the material of the dielectric substrate when the dielectric substrate is formed. You may do it. Although the present embodiment has described the case of the method of molding the microstrip antenna used for reception, the present invention may be used for the method of molding the microstrip antenna used for transmission.

[0031]

Since the present invention is configured as described above, according to the invention of claim 1, the movable side and the fixed side of the injection molding die are provided with the patch and the ground respectively in advance, and the dielectric is formed. Since the electrodes are formed on both sides of the dielectric substrate at the same time as the injection molding of the substrate, the step of forming the dielectric substrate and the steps of forming the patch and the ground on both sides of the dielectric substrate can be performed simultaneously. The number of steps is reduced and mass productivity is improved.

According to the second aspect of the present invention, the patch provided on the movable side or the fixed side of the injection mold has a feed line attached to the feed point in advance, and the dielectric substrate is injection-molded. At the same time, since the electrodes are formed on both sides of the dielectric substrate, in addition to the step of forming the dielectric substrate and the steps of forming the patch and the ground on both sides of the dielectric substrate, the power supply line is also used in the dielectric substrate and the ground. Since the process of inserting and fixing in the same can be performed at the same time, the number of manufacturing processes is reduced and mass productivity is improved.

Claims (2)

[Claims] 1. A method for forming a microstrip antenna, which is constructed by sandwiching both sides of a flat plate-shaped dielectric with a radiation conductor and a ground conductor and attaching a power supply line for supplying power to a power supply point on the radiation conductor. In the above, the radiation conductor and the ground conductor are fixedly arranged at a predetermined interval in an injection molding die, and the dielectric is formed by injection molding molten synthetic resin into a molding space formed at the predetermined interval. A method for forming a microstrip antenna, which is formed in close contact with the radiation conductor and the ground conductor. 2. The microstrip antenna according to claim 1, wherein the radiation conductor is fixedly arranged in the injection mold with the feeder line attached. Molding method.