JPH0911112A - 半導体ウェハの研磨方法 - Google Patents

半導体ウェハの研磨方法

Info

Publication number: JPH0911112A
Authority: JP; Japan
Prior art keywords: semiconductor wafer; polishing; polishing cloth; surface plate; contact area
Prior art date: 1995-06-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP19898195A

Other languages

English (en)

Japanese (ja)

Inventor

Takafumi Hajime

啓文一

Toshiji Sashitani

利治指谷

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumco Techxiv Corp

Original Assignee

Komatsu Electronic Metals Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-06-30

Filing date

1995-06-30

Publication date

1997-01-14

1995-06-30 Application filed by Komatsu Electronic Metals Co Ltd filed Critical Komatsu Electronic Metals Co Ltd

1995-06-30 Priority to JP19898195A priority Critical patent/JPH0911112A/ja

1996-07-29 Priority to TW85109232A priority patent/TW299464B/zh

1997-01-14 Publication of JPH0911112A publication Critical patent/JPH0911112A/ja

Status Pending legal-status Critical Current

Links

238000005498 polishing Methods 0.000 title claims abstract description 78
239000004065 semiconductor Substances 0.000 title claims abstract description 67
239000004744 fabric Substances 0.000 claims abstract description 50
238000007517 polishing process Methods 0.000 claims abstract 2
238000000034 method Methods 0.000 claims description 15
229910001651 emery Inorganic materials 0.000 abstract 1
235000012431 wafers Nutrition 0.000 description 56
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
239000006061 abrasive grain Substances 0.000 description 4
230000000694 effects Effects 0.000 description 3
238000011084 recovery Methods 0.000 description 3
238000004140 cleaning Methods 0.000 description 2
230000006866 deterioration Effects 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
239000003643 water by type Substances 0.000 description 1

Landscapes

Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Polishing Bodies And Polishing Tools (AREA)

JP19898195A 1995-06-30 1995-06-30 半導体ウェハの研磨方法 Pending JPH0911112A (ja)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
JP19898195A JPH0911112A (ja)	1995-06-30	1995-06-30	半導体ウェハの研磨方法
TW85109232A TW299464B (fr)	1995-06-30	1996-07-29

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP19898195A JPH0911112A (ja)	1995-06-30	1995-06-30	半導体ウェハの研磨方法

Publications (1)

Publication Number	Publication Date
JPH0911112A true JPH0911112A (ja)	1997-01-14

Family

ID=16400139

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP19898195A Pending JPH0911112A (ja)	1995-06-30	1995-06-30	半導体ウェハの研磨方法

Country Status (2)

Country	Link
JP (1)	JPH0911112A (fr)
TW (1)	TW299464B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2001082354A1 (fr) *	2000-04-24	2001-11-01	Sumitomo Mitsubishi Silicon Corporation	Procédé de fabrication d'une plaquette de semi-conducteur
JP2010042508A (ja) *	2009-11-25	2010-02-25	Shin-Etsu Chemical Co Ltd	研磨方法
JP2011216887A (ja) *	2010-03-31	2011-10-27	Siltronic Ag	半導体ウェハの両面研磨のための方法

1995
- 1995-06-30 JP JP19898195A patent/JPH0911112A/ja active Pending
1996
- 1996-07-29 TW TW85109232A patent/TW299464B/zh not_active IP Right Cessation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2001082354A1 (fr) *	2000-04-24	2001-11-01	Sumitomo Mitsubishi Silicon Corporation	Procédé de fabrication d'une plaquette de semi-conducteur
US7589023B2 (en)	2000-04-24	2009-09-15	Sumitomo Mitsubishi Silicon Corporation	Method of manufacturing semiconductor wafer
US8283252B2 (en)	2000-04-24	2012-10-09	Sumitomo Mitsubishi Silicon Corporation	Method of manufacturing semiconductor wafer
JP2010042508A (ja) *	2009-11-25	2010-02-25	Shin-Etsu Chemical Co Ltd	研磨方法
JP2011216887A (ja) *	2010-03-31	2011-10-27	Siltronic Ag	半導体ウェハの両面研磨のための方法

Also Published As

Publication number	Publication date
TW299464B (fr)	1997-03-01

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