TW299464B - - Google Patents
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- Publication number
- TW299464B TW299464B TW85109232A TW85109232A TW299464B TW 299464 B TW299464 B TW 299464B TW 85109232 A TW85109232 A TW 85109232A TW 85109232 A TW85109232 A TW 85109232A TW 299464 B TW299464 B TW 299464B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor wafer
- polishing
- polishing cloth
- contact area
- fixed disk
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims description 61
- 235000012431 wafers Nutrition 0.000 claims description 57
- 239000004065 semiconductor Substances 0.000 claims description 53
- 239000004744 fabric Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 10
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19898195A JPH0911112A (ja) | 1995-06-30 | 1995-06-30 | 半導体ウェハの研磨方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW299464B true TW299464B (fr) | 1997-03-01 |
Family
ID=16400139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW85109232A TW299464B (fr) | 1995-06-30 | 1996-07-29 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0911112A (fr) |
| TW (1) | TW299464B (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10196115B4 (de) | 2000-04-24 | 2011-06-16 | Sumitomo Mitsubishi Silicon Corp. | Verfahren zum Polieren eines Halbleiterwafers |
| JP2010042508A (ja) * | 2009-11-25 | 2010-02-25 | Shin-Etsu Chemical Co Ltd | 研磨方法 |
| DE102010013520B4 (de) * | 2010-03-31 | 2013-02-07 | Siltronic Ag | Verfahren zur beidseitigen Politur einer Halbleiterscheibe |
-
1995
- 1995-06-30 JP JP19898195A patent/JPH0911112A/ja active Pending
-
1996
- 1996-07-29 TW TW85109232A patent/TW299464B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0911112A (ja) | 1997-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |